200829093 九、發明說明·· 【發明所屬之技術領域】 本發明係關於一種印刷雷敗 I刺弘路板，特別是一種電磁能隙結 具该電磁能隙結構之多層印刷電路板。 【先前技術】 隨著電路設計日趨高谏、」M& , 疋小脰檟、低電壓等趨勢發展，印刷 電路板上’接地彈跳雜訊（Ground Bounce N〇ise; gb稱地 _訊）效應«統的影響愈加顯著’相對地，抑制地彈雜 應於高頻數位電路設計上變得重要且必須。習知技術提出^ 種方法應用於印刷電路板中，以抑制地彈雜訊效應。其方法= 有於雜訊源四周增設綠合電容，以形成電容牆保護；或者是， 在電源平_切#卜矩形狹縫，以形成隔離的效果等等。 傳統在多層電路板中，為了抑制電源層與接地層之間的地彈 主要方式是加絲合電容於電源層與接地層之間。但是加 絲=額方式將會因為料效電_躲，制其有效頻 ΐ計==應?高紐位電路設計上，朝向更高速、更高頻的 座接JS、啸岭彻魏㈣結縣抑制高紐的電源層 •舁接地層之間的地彈雜訊。 和 之一―、結構主要有下列轉方H源層切割設計 ^ W列式訊號層隔絕設計。然而，在電源層切割設計上，由 =切_層，晴造缝大的麵損失，並且由於訊號 =㈣電源層，亦會微幅影_訊號本身的品質。而在矩 轉列式_層_設計上，f倾鼓的贼層，，相當浪 200829093 費佈線空間。 【發明内容】 _ 雲於以上的問題，本發明的主要目的在於提供—種電刺 結構及具該電磁能隙結構之多層印刷電路板，藉以解決先^ 所揭露之地彈雜訊抑制的問題。 因此’為達上述目的，本發明所揭露之電磁能隙結構，白括 接地平面、導電區塊及連通柱。 ^ ☆ 導電區塊概1矩形，具有中心端及導電走線。此導雷 微狀’且自中心端向外擴展。其中，導躲塊的邊長相 電區塊的場旋鋒、導電走線的線寬與導電走線間的線距。 一導電區塊設置於接地平靣的上方，且透過連触連接至導電 區塊的中心端與接地平面。 〒^ 於導電區塊的上方可設置有一電源平面。 此電磁能隙結構可應用於多層電路板 地層之間的地_訊。 桃—都_電源層與接 導電區塊設置於-訊號層上，接地平面設置於接地声上，而 連通柱則貫穿訊號層以連接導電區塊與接地層靖^ 塊與接地層上之接地平面）。 -接¥包£ 其中，於訊號層上可設置-個導電區塊，或是設置多個呈矩 心M，购咖，之連通柱 源平上村設奸麵層，而_上職置有電 6 200829093 綜合上述，本發明除了可達到地彈雜訊抑制，亦能節省電磁 能隙結構所需之佈線空間，且能更彈性設計所需抑制之特定^率 ^ 雜訊。 有關本發明的特徵與實作，茲配合圖示作最佳實施例詳細說 明如下。 【實施方式】· 以下舉出具體貫施例以誶細說明本發明之内容，並以圖示作 _ 為輔助說明。說明中提及之符號係參照圖式符號。 弟1圖」’係為根據本發明一貫施例之電磁能隙έ士才盆， 包括·接地平面Π0、導電區塊120及連通技。 導電區塊120設置於接地平面110的上方，兩者之間以連通， 往130连接，連通柱130的結構係為貫穿導通孔（viah〇le)結構。 請再參照「第2圖」，導電區塊120具有一中心端122及一 導電走線124。其中導電走線124呈螺旋狀，且自中心端122向 φ 外擴展。連通柱130則係連接至接地平面11〇與中心端丨9〇，在 此5連通柱130為貫穿導通孔（Viahole)結構，而中心端η]亦 為空心結構但卻與連通枉130電性導通。 此導電區塊120概呈矩形。其中，導電區塊12〇的邊長d相 應於導電區塊120的螺旋匝數、導電走線124的線寬w與導電走 線124間的線距3 (即，s部份係為切割開的部份，以形成導雷走 線124)。在一實施例中，導電區塊120與導電走線124的關係式 可如下列公式：d = (2N+l)w+2Ns，其中d係代表導電區塊12〇的 邊長、N係代表導電區塊120的螺旋匝數、w係代表導電走線ι?4 7 200829093 的線寬，而S係代表導電走線124間的線距。 以導電區塊120的螺旋錄為i區㈣）為例（如第2圖 所示），其導電區塊⑽的邊長d係等於3倍之導電走線124的： 寬w加上2倍之導電走線124間的線距s。 .、、 以導電區塊120的螺旋隨為2 E (N=2)為例（如「第3 圖」=示）’其導電區塊120的邊長d係等於5倍之導電走線124 的線寬w加上4倍之導電走線124間的線距s。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Prior Art] With the trend of high circuit design, "M&, "small", low voltage, etc., the grounding bounce noise (Ground Bounce N〇ise; gb) «The influence of the system becomes more and more significant." Relatively, it is important and necessary to suppress the ground-shattering in the design of high-frequency digital circuits. Conventional techniques have proposed a method for application in a printed circuit board to suppress ground bounce noise effects. The method is as follows: a green capacitor is added around the noise source to form a capacitor wall protection; or, the power source is flat _cut #b rectangular slit to form an isolation effect and the like. Conventionally, in a multilayer circuit board, in order to suppress the ground bounce between the power supply layer and the ground layer, the main method is to apply a wire capacitance between the power supply layer and the ground layer. However, the wire feeding method will be based on the material efficiency _ hiding, the effective frequency meter == should be? High button circuit design, towards the higher speed, higher frequency seating JS, Xiaoling Chewei (four) knot The county suppresses the grounding noise between the power layer of the high button and the ground layer. And one of the -, the structure mainly has the following conversion H source layer cutting design ^ W column signal layer isolation design. However, in the power layer cutting design, the surface loss is large by the =cut_layer, and the ground is large, and because of the signal=(four) power layer, the quality of the signal itself is also slightly affected. In the moment of the _ layer _ design, f thief layer, quite wave 200829093 fee wiring space. SUMMARY OF THE INVENTION The present invention is directed to providing a spur structure and a multilayer printed circuit board having the electromagnetic energy gap structure, thereby solving the problem of the ground noise suppression disclosed in the prior art. . Therefore, in order to achieve the above object, the electromagnetic energy gap structure disclosed in the present invention includes a ground plane, a conductive block and a connecting column. ^ ☆ The conductive block is roughly rectangular with a center end and conductive traces. This guide is slightly shaped and extends outward from the center end. Wherein, the side of the lead block is the phase of the field block, the line width of the conductive trace and the line distance between the conductive traces. A conductive block is disposed above the ground plane and connected to the ground plane of the conductive block through the contact. 〒^ A power plane can be placed above the conductive block. This electromagnetic energy gap structure can be applied to ground between layers of a multilayer circuit board. The peach-du_power layer and the conductive block are disposed on the signal layer, the ground plane is disposed on the grounding sound, and the connecting pillar runs through the signal layer to connect the conductive block to the ground layer and the grounding layer flat). - Pick up the package. Among them, you can set up a conductive block on the signal layer, or set a number of centroids M, buy a coffee, the connected column source Ping Shangcun set the rape face layer, and _ the upper position has electricity 6 In view of the above, the present invention can save the wiring space required for the electromagnetic energy gap structure, and can more flexibly design the specific suppression rate of the required noise. The features and implementations of the present invention are described in detail with reference to the preferred embodiments. [Embodiment] The following is a detailed description of the contents of the present invention, and is illustrated by the accompanying drawings. The symbols mentioned in the description refer to the schema symbols. The first embodiment of the present invention is an electromagnetic energy gap gentleman basin according to a consistent embodiment of the present invention, including a ground plane Π0, a conductive block 120, and a communication technique. The conductive block 120 is disposed above the ground plane 110. The two are connected to each other and connected to the 130. The structure of the connecting pillar 130 is a through-via structure. Referring again to FIG. 2, the conductive block 120 has a center end 122 and a conductive trace 124. The conductive traces 124 are spiral and extend outward from the central end 122 to φ. The connecting post 130 is connected to the ground plane 11 〇 and the center end 丨 9 〇, where the 5 connecting post 130 is a through hole (Viahole) structure, and the center end η] is also a hollow structure but is electrically connected to the 枉 130 Turn on. The conductive block 120 is substantially rectangular. The side length d of the conductive block 12 相应 corresponds to the number of spiral turns of the conductive block 120 , the line width w of the conductive trace 124 and the line distance 3 between the conductive traces 124 (ie, the s portion is cut open) Part to form a lightning guide 124). In an embodiment, the relationship between the conductive block 120 and the conductive trace 124 can be as follows: d = (2N+l)w+2Ns, where d represents the side length of the conductive block 12〇, and the N system represents The number of spiral turns of the conductive block 120, w represents the line width of the conductive trace ι?4 7 200829093, and S represents the line spacing between the conductive traces 124. Taking the spiral of the conductive block 120 as the i-zone (4) as an example (as shown in FIG. 2), the side length d of the conductive block (10) is equal to three times the conductive trace 124: width w plus 2 times The line spacing s between the conductive traces 124. Taking the spiral of the conductive block 120 as 2 E (N=2) as an example (such as "3rd figure" = shown), the side length d of the conductive block 120 is equal to 5 times the conductive trace 124. The line width w plus the line spacing s between the conductive traces 124 of four times.
、於此雖僅以螺旋隨為1臣和2臣為例，然本發明並不以此 為限，可配=實際需求，調整導塊㈣贿數為件音_ " 於導電區塊12〇的上方可設置有一電源平面14〇，:二 圖」所示。 如弟4 ’且此電容效 120與接地平 導電區塊120與接地平面n〇形成—電容效應 應的電容值相應料祕塊创的面積及導電區塊 面Π0的距離h。於此，其等效電容值大小如下： 一匕yS 一—^ ，其中C1係為導電區塊120與接地平面11〇之 h 4、以系為介電常數、A係代表導電區塊12〇的面_〜屯谷值‘、 導電區塊120與接地平面no的距離。 ϋ代衣 導電區塊120與電源平面140亦會形成一雷 夕應的黾谷值相應於導電區塊120的面積及導泰 " 1/!π , 、、雙區塊 120 鱼雷 源千面140的距離。於此，其等效電容值大小如下· /、包 C2 = W會 其中C2係為導電區塊120與電源平面HQ之間 , · 的等效電容值、 200829093 的面積，而h係代表導電 44係為常數、d係代表導電區塊12〇 區塊120與電源平面140的距離。 小如下： 的等==12rG與連通柱13G形成—電感效應，且此電感效應 的寻“細目應於連通柱⑽的長度。於此，其等效電感值大 ，其中L係為導電區塊12〇與連_ 13〇之間的等效電感值，而Although this is only an example of a spiral with 1 Chen and 2 Chen, the invention is not limited to this, and can be matched with the actual demand, and the adjustment block (4) the number of bribes is _ " in the conductive block 12 A power plane 14〇 can be placed above the 〇, as shown in the second figure. For example, the capacitance effect 120 and the ground plane conductive block 120 are formed with the ground plane n〇—the capacitance value of the capacitor is corresponding to the area created by the material block and the distance h of the conductive block surface Π0. Here, the equivalent capacitance value is as follows: 匕 yS - - ^ , where C1 is the conductive block 120 and the ground plane 11 h h 4 , the system is the dielectric constant, and the A system represents the conductive block 12 〇 The surface _~ 屯谷值', the distance between the conductive block 120 and the ground plane no. The conductive layer 120 and the power plane 140 of the ϋ 衣 亦 亦 亦 亦 亦 亦 亦 相应 相应 相应 相应 相应 相应 相应 相应 & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & 140 distance. Here, the equivalent capacitance value is as follows: /, the package C2 = W, where C2 is the equivalent capacitance value between the conductive block 120 and the power plane HQ, · the area of 200829093, and the h system represents the conductive 44 It is a constant, and d is the distance between the conductive block 12〇 block 120 and the power plane 140. The following is as follows: The equal == 12rG forms an inductive effect with the connecting post 13G, and the "seeking" of the inductive effect is due to the length of the connecting column (10). Here, the equivalent inductance value is large, wherein the L system is a conductive block. The equivalent inductance between 12〇 and _ 13〇, and
h係代表導電區塊120與電源平® 140的距離（即，連 的長度）。 此電磁能隙結構可應用於—多層電路板上，以抑制電源層與 接地層之間的地彈雜訊。 曰/、 翏第5圖」，係、為根據本發明一實施例之電磁能隙結構， 包括：導電區塊120、連通柱130、接地層15〇及訊號層⑽。 於圖示中雖騎製-訊號層⑽，然本發明並不以此為限， 可配合實際需求而於接地層15G上設置有—層或多層訊號層 160 ’而導電區塊120則位於其中一訊號層16〇上，並透過連Z 130貫穿訊號層160而連接導電區塊12〇與接地層15〇 (即，連通 柱130連接導電區塊120與接地層15〇上之接地平面）。 ^ 其中，參照「第2圖」、「第3圖」與「第5圖」，每一導電 區塊120具有-中，122及—導電走線124。其中導電走線^ 呈螺旋狀，且自中心端m向外擴展。連通柱13〇分別對應於導 電區塊120 ’其貫穿訊號層160，以連接所對應之導電區塊^的 中心端122與接地層150。在此，連通柱13〇為貫穿導通孔 200829093 hole)結構，而中心端m亦為空心結構但卻與連通柱13〇電性 導通。 其中，於訊號層160上可設置一個導電區塊12〇，或是毁置 多個呈矩形排列之導電區塊120，如「第6圖」所示。 於導電區塊120的上方可設置有一電源層17〇，如「第7圖」 所示。其中，電源層17〇上設置有電源平面。 ϋ 此外，由於電路板上難免有許多訊號走線18〇穿梭其中 於=現月況中，讀會降低其過遽雜訊的致果。而本發嗎可 :==㈣導電區塊12°中間讓出，，可以軌銳 s θ J二縣私列之多個導電區塊120的中間穿越，如「第 圖」所不，但是對其過濾雜訊的 此螺旋形έ士槿栌卜曰另又釗太大的彩響。 麵電路坂的佈線影響甚鉅。 卜曰巧偁 要相對變大，請參照7=^要=趣麵雜訊所需的面積也 隙結構與本發明之蹂 i圖」邱為裸板、習知之矩形狀電磁能 9圖」可發現，在=姻能隙結構的S21模擬示意圖。由「第 的雜訊頻率可以比傳統習狀電磁能隙結構可以抑制 Ν〜2螺方疋狀電磁能隙社構又匕 磁也隊結構低报多。其中 的辭更低，而螺旋狀電磁磁能隙結構所能抑制 更能提供較大的電感，且電較於矩雜電磁能隙結構 t。因此’要過濾相同頻率的· 4 C2)卻不會受到太大的影 用較小的佈線面積來達到所需二:狀電磁能隙結構可以使 之特疋頰率雜訊。請參照表1， 200829093 電磁㈣結構厚度154mm，％=44，間隙寬度（卿widh) =0.4mm，如下： 表1 類型 —^一 率 (GHz) 尺寸 (mm) 縮小尺 寸（％) 連通 柱直徑 (mm) 連通 柱南度 (mm) ----------- FBW 矩形 2.3 12x12 - 0.8 0.77 58.8% N=1 23 7·2χ7·2 40% 0,8 0.77 38.5% N=2 23 3.6x3.6 70% 0.8 0.77 31.6% 由上表1可知，傳統矩形類型的矩形陣列式訊號層隔絕設計The h series represents the distance between the conductive block 120 and the power supply level 140 (i.e., the length of the connection). This electromagnetic energy gap structure can be applied to a multilayer circuit board to suppress ground bounce noise between the power supply layer and the ground plane.电磁/, 翏 FIG. 5 is an electromagnetic energy gap structure according to an embodiment of the invention, comprising: a conductive block 120, a connecting pillar 130, a ground layer 15 and a signal layer (10). Although the present invention is not limited thereto, the present invention is not limited thereto, and a layer or a plurality of signal layers 160' may be disposed on the ground layer 15G in accordance with actual needs, and the conductive block 120 is located therein. A signal layer 16 is connected to the ground layer 15A through the Z 130 through the signal layer 160 (ie, the communication pillar 130 is connected to the ground plane on the conductive layer 120 and the ground layer 15). ^ Referring to "2nd drawing", "3rd drawing" and "5th drawing", each conductive block 120 has - center, 122 and - conductive traces 124. The conductive traces ^ are spiral and extend outward from the center end m. The connecting pillars 13A correspond to the conductive block 120' respectively penetrating the signal layer 160 to connect the center end 122 of the corresponding conductive block and the ground layer 150. Here, the connecting post 13 is a through hole 200829093 hole) structure, and the center end m is also a hollow structure but electrically connected to the connecting post 13 . Wherein, a conductive block 12A may be disposed on the signal layer 160, or a plurality of conductive blocks 120 arranged in a rectangular shape may be disposed, as shown in FIG. A power layer 17〇 may be disposed above the conductive block 120, as shown in FIG. Wherein, the power plane 17 is provided with a power plane. ϋ In addition, because there are inevitably many signal traces on the circuit board, it will inevitably reduce the noise caused by the noise. And the hair can be: == (4) The conductive block is allowed to pass in the middle of 12°, and it can be traversed in the middle of the plurality of conductive blocks 120 in the private column of the county, as shown in the figure, but The spiral-shaped gentleman who filters the noise is also too loud. The wiring of the surface circuit is very influential.曰 曰 曰 相对 相对 , , , , , , , 7 7 7 7 7 7 7 7 7 7 7 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣 趣It is found that the S21 simulation diagram is in the =gap structure. From the "the first noise frequency can be suppressed than the traditional electromagnetic energy gap structure can suppress the Ν~2 螺 疋 电磁 电磁 电磁 电磁 电磁 电磁 社 社 社 社 也 也 也 也 也 也 也 也 也 也 也 也 。 。 。 。 。 。 。 。 。 。 。 The magnetic energy gap structure can suppress the larger inductance, and the electric energy is smaller than the magnetic electromagnetic gap structure t. Therefore, '4 C2 of the same frequency is filtered, but it does not suffer from too much shadow. The area to achieve the required two: electromagnetic energy gap structure can make it special cheek rate noise. Please refer to Table 1, 200829093 electromagnetic (four) structure thickness 154mm, % = 44, gap width (qing widh) = 0.4mm, as follows: Table 1 Type-^ rate (GHz) Dimensions (mm) Reduced size (%) Connecting column diameter (mm) Connecting column south (mm) ----------- FBW Rectangle 2.3 12x12 - 0.8 0.77 58.8% N=1 23 7·2χ7·2 40% 0,8 0.77 38.5% N=2 23 3.6x3.6 70% 0.8 0.77 31.6% As can be seen from Table 1, the rectangular array signal layer isolation design of the traditional rectangular type
其過濾效果FBW (Frequence Band Width，理論上愈大愈好）雖然 旱交大（：58·8%)，但其所佔的钸線面積亦較大，而本發明的螺旋狀 隙枯構於％方疋凼數Ν為1 Β牙其整體佈線面積縮小勒％，且 效率卻僅減少m3% (58路35.5%)，其整體效率優於傳統的矩 形陣列式訊號層隔絕設計；而於螺旋£触為2時，效率又會更 佳。 曰人 如此-來，本發明除了可達到地彈雜訊抑制，亦能節省電磁 能隙結構所需樣較間，錢更雜鮮邮抑制之特定頻率 雜訊。 雖然本發明赠述讀岭施例聽如上，料鱗用以限 定本發明，姉勵像辟者，衫輯、發 内，當可作些許之更動與潤飾， ^ . 匕本钱明之專利保護範圍須視 本說明書_之t料概_所界定麵準。 ⑽，、視 200829093 【圖式簡單說明】 第】圖係為根據本發明第 圖； 貧 電> 第2圖係為於根據本發明之奮 一實施例之俯視圖； 礤把隙結構中， 第3圖係為於根據本發明 二實施例之俯視圖； 泉結構中， 弟4圖係為根據本發明第一鸯^ 圖； 、釔例之電石兹能 「構之截面 導電區塊之第 導電區塊之第 以及 除結構之戴面 弟5圖係為根據本發明第—染 卜 男、施例之口D 第β圖1系為板據本發明第二實施你 1¾路板之截面圖； 第7圖係為根據本發明第三每》 I刷电路板之俯視圖； 第8圖係為根據本發料之印刷電路板之截面圖； 男、知例之印刷電路板之俯視圖；The filtering effect FBW (Frequence Band Width, theoretically the greater the better), although the drought is large (: 58.8%), it also has a larger area of the squall line, and the helical gap of the present invention is in %. The square 疋凼 is 1 Β tooth, its overall wiring area is reduced by 5%, and the efficiency is only reduced by m3% (58 way 35.5%), its overall efficiency is better than the traditional rectangular array signal layer isolation design; When the touch is 2, the efficiency will be better. This is the case. In addition to the ground noise suppression, the present invention can also save the electromagnetic frequency gap structure required, and the specific frequency noise of the money is suppressed. Although the present invention is given to the above-mentioned examples, the scales are used to define the invention, and it is recommended that the creators, shirts, and hairs can make some changes and refinements, ^. According to the definition of this manual _ t material _ defined. (10), and 200829093 [Simplified description of the drawings] The first diagram is a diagram according to the present invention; the lean electricity> FIG. 2 is a plan view of an embodiment according to the present invention; 3 is a plan view according to a second embodiment of the present invention; in the spring structure, the figure 4 is the first figure according to the present invention; and the electric stone of the example can "conduct the first conductive area of the conductive block of the section The figure of the block and the figure 5 of the structure are the cross-sectional view of the 13⁄4 way board according to the second embodiment of the present invention according to the first section of the present invention. Figure 8 is a plan view of a third printed circuit board according to the present invention; Figure 8 is a cross-sectional view of a printed circuit board according to the present invention; a plan view of a printed circuit board of a male or a known example;
第9圖係為裸板、矩形狀電磁能隙結構與螺旋狀電磁能隙結 構的S21模擬示意圖。 【土要元件符號說明】 110 120 122, 124. 130, 接地平面 導電區塊 中心端 導電走線 連通柱 電源平面 12 140. 200829093 150·.····.....................…接地層 160………----------....………·訊號層 170.. ....·....................................................................電源層 180.. .............................訊號走線 d..................................導電區塊的邊長 s..................................導電走線間的、線5巨 W···------------------------------導電疋線的線览Figure 9 is a schematic diagram of the S21 simulation of a bare-plate, rectangular electromagnetic gap structure and a helical electromagnetic energy gap structure. [Description of Symbols for Soil Elements] 110 120 122, 124. 130, Conductor Traces at the Center of Conductive Blocks on the Ground Plane Power Supply Plane 12 140. 200829093 150·.····.......... .............. Grounding layer 160.........----------............. Signal layer 170.. ........ .................................................. ..............Power layer 180.................................. Line d..................................The length of the conductive block s....... ........................... between the conductive lines, the line 5 giant W···---------- --------------------Line diagram of conductive lines