200829092 九、發明說明： 【發明所屬之技術領域】 本發明關於一種電路板，尤其涉及一種具有良好彎折 性能之軟性印刷電路板。 【先前技術】 軟性印刷電路板（Flexible Printed Circuit Board，FPCB)200829092 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board, and more particularly to a flexible printed circuit board having good bending properties. [Prior Art] Flexible Printed Circuit Board (FPCB)
由於具有輕、薄、短、小以及可彎折之特點而被廣泛應用 於手機專電子產品中，用於不同電路之間之電性連接。而 手機等電子產品，特別係折疊手機與滑蓋手機，對於軟性 印刷電路板彎折性能之要求非常高。 傳統軟性印刷電路板彎折區域之設計通常係採用大銅 面設計，如圖1所示。軟性印刷電路板彎折區域10包括訊 號線區域12與接地線區域14,該訊號線區域12佈設複數 條訊號線121，該接地線區域14佈設接地線141，接地線 141為大銅面，即該接地線區域14之銅所占面積與該接地 線區域14總面積之比率為1〇〇%，並充分環繞於訊號線ι21 周圍區域，以實現訊號傳送之電磁干擾屏蔽。惟，採用此 種彎折區域設計，當軟性印刷電路板於彎折時，由於接地 線141為大銅面，其彎折時產生應力較大，且無法分散， 從而導致接地線141容易斷裂。而且用作接地線ι41之大 面積銅箱越厚，其彎折產生之應力就越大，從而導致接地 線141更容易發生斷裂。此時，訊號線ι21會受到接地線 141斷裂之影響，彎折應力會繼續向訊號線區域12擴散， 200829092 / =而導致訊號線m發生斷裂。故，傳統軟性印刷電路板 •讀區域10通常只具有5_7萬次彎折次數，已遠遠不能滿 足目前手機，特別係折疊手機與滑蓋手機，對軟性印刷電 路板至少8-10萬次彎折次數之要求。 為了提升軟性印刷電路板之f折次數，通常方法係於 f性印刷電路板之製作材料上進行改良與㈣，以選擇更 薄之材料來改善軟性印刷電路板之彎折性能。惟，材料之 •改良與替換通常需要耗費較長時間，同時亦會導致軟性印 刷電路板製作成本偏高。 【發明内容】 有鑑於此’提供-種具有良好彎折性能之軟性印刷電路 板，以適應電子產品對軟性印刷電路板彎折次數之要求，同 時有效降低製作成本實屬必要。 以下以實施例說明一種軟性印刷電路板。 所述軟性印刷電路板包括彎折部，該彎折部具有接地 _線佈線區域，該接地線佈線區域具有均勻分佈之複數個銅 區，且該複數個銅區於該接地線佈線區域形成圖案化分佈。 所述軟性印刷電路板包括彎折部，該彎折部具有接地 線佈線區域，該接地線佈線區域具有均勻分佈之複數個銅 區，且該複數個銅區所佔面積之和與該接地線區域總面積 之比率大於0且小於100%。 相對於先前技術，所述軟性印刷電路板之優點在於： 通過使接地線佈線區域具有均勻分佈複數個銅區，且該複 數個銅區於該接地線佈線區域形成圖案化分佈，有助於應 200829092 -力分政，並有效減小軟性電路板彎折時所產生之應力，防 ^止接地線與訊號線斷裂，從而提升軟性印刷電路板彎折性 能，增加軟性印刷電路板彎折次數，同時節約軟性印刷電 路板製作成本。 【實施方式】 下面結合附圖對本技術方案實施例提供之軟性印刷電 路板作進一步說明。 私 請參閱圖2,實施例一提供之軚性印刷電路板2〇，該軟 矚性印刷電路板20係單層結構印刷電路板。請結合參閱圖3, 該軟性印刷電路板20由基材層22與銅導電層24組成。該軟 性印刷電路板20具有彎折部26,其可沿彎折線261彎折。該 彎折部26具有第一邊緣262與第二邊緣263。該彎折部加包 括訊號線佈線區域27與接地線佈線區域28。訊號線佈線區 域27與接地線佈線區域28位於同—銅導電層24，接地線佈 線區域28圍繞訊號線佈線區域27。本實施例中，於軟性印 鲁刷電路板20之彎折部26包括兩個接地線佈線區域28，該兩 個接地線佈線區域28分別位於訊號線佈線區域27兩側，並 分別靠近彎折部26之第一邊緣262與第二邊緣263。銅導電 層24於訊號線佈線區域27形成複數條訊號線241，於接地線 佈線區域28形成均勻分佈之複數個銅區，且該複數個銅區 於該接地線佈線區域28形成圖案化分佈。該複數個銅區所 占面積之和與接地線佈線區域28總面積之比率大於〇且小 於100%，優選地，為30%〜60%，亦即接地線佈線區域28 之殘銅率為30%〜60%。均勻分佈於接地線佈線區域28之複 200829092 /數個銅區作為地線接地，同時亦屏蔽了對訊號線241傳送訊 •號之電磁干擾。接地線佈線區域28之複數個銅區均勻分佈 形成之圖案可以根據需求製作成多種樣式。 請參閱圖4,實施例一提供之軟性印刷電路板2〇彎折部 26之第一種接地線佈線區域28之複數個銅區分佈形成之圖 案。接地線佈線區域28之複數個銅區包括複數條相互平行 之第一銅線區281與複數條相互平行之第二銅線區282，該 複數條第一銅線區281與複數條第二銅線區282相互交叉形 成網格狀。優選地，該第一銅線區281向彎折部26第一邊緣 262延伸之延長線a與第二銅線區282向彎折部加第一邊緣 262延伸之延長線b之夾角卢1為3〇〜8〇度。本實施例中，夾 角/5 :為60度，且該複數條第一銅線區281與複數條第二銅 線區282均分別呈等間距排列。複數條第一銅線區281與複 數條第二銅線區282所占面積之和與接地線佈線區域28總 面積之比率大於0且小於1〇0%，優選地，為3〇%〜6〇%。 _ 凊參閱圖5 ’實施例一提供之軟性印刷電路板20彎折部 26之第二種接地線佈線區域28的複數個銅區分佈形成之圖 案。接地線佈線區域28之複數個鋼區為複數個圓形銅區 283，該圓形銅區283均勻分佈於接地線佈線區域28。該圓 形銅區283之直徑為〇·5〜2.0毫米。該複數個圓形銅區283可 呈多行規則均勻排列於接地線佈線區域28，亦可呈任何不 規則排列’只要圓形銅區283均勻分佈於接地線佈線區域28 即可。本實施例中，該複數個圓形銅區283呈多行規則均勻 排列於接地線佈線區域28。複數個圓形銅區283所占面積之 200829092 ;和與接地線佈線區域28總面積之比率大於0且小於100%， 優選地，為30%〜60%。 請參閱圖6，實施例一提供之軟性印刷電路板20彎折部 26之第三種接地線佈線區域28之複數個銅區分佈形成之圖 案。接地線佈線區域28之複數個銅區為複數個條形銅區 284，該條形銅區284均勻分佈於接地線佈線區域28。該條 形銅區284之寬邊寬度為0.1〜0.5毫米。該複數個條形銅區 284可呈規則均勻排列於接地線佈線區域28,亦可呈任何不 #規則排列，只要條形銅區284均勻分佈於接地線佈線區域28 即可。本實施例中，該複數個條形銅區284呈多行規則均勻 排列於接地線佈線區域28，且每個條形銅區284之長邊都與 彎折部26之彎折線261相垂直。當然，每個條形銅區284之 長邊亦可都與彎折部26之彎折線261相平行。複數個條形銅 區284所占面積之和與接地線佈線區域28總面積之比率大 於0且小於100%，優選地，為30%〜60%。 φ 請參閱圖7,實施例二提供之軟性印刷電路板30。該軟 性印刷電路板30係多層印刷電路板，其包括單面覆銅基板 31與雙面覆銅基板32。本實施例中，該第一覆銅基板31為 單層單面覆銅基板，該第二覆銅基板32為單層雙面覆銅基 板32。該單面覆銅基板31包括第一基材層311與第一銅導電 層312。該雙面覆銅基板32包括第二基材層321以及設於第 二基材層321兩面之第二銅導電層322及第三銅導電層 323。該單面覆銅基板31之第一銅導電層312與雙面覆銅基 板32之第二銅導電層322通過膠合層33壓合形成多層軟性 200829092 印刷電路板30,第三銅導電層323為其最外層銅導電層。 請參閱圖8，該軟性印刷電路板30具有彎折部36，其可 沿彎折線361彎折，該彎折部36具有第一邊緣362與第二邊 緣363。於該軟性印刷電路板30之彎折部36，該彎折部36 具有訊5虎線佈線區域（圖未不）與接地線佈線區域3 8，訊 號線佈線區域位於内層銅導電層，即第一銅導電層312與第 二銅導電層322,第一銅導電層312與第二銅導電層322分別Due to its light, thin, short, small and bendable characteristics, it is widely used in mobile phone-specific electronic products for electrical connection between different circuits. Electronic products such as mobile phones, especially folding mobile phones and slider phones, have very high requirements for the flexural performance of flexible printed circuit boards. Traditional flexible printed circuit board bends are usually designed with a large copper design, as shown in Figure 1. The flexible printed circuit board bending area 10 includes a signal line area 12 and a ground line area 14. The signal line area 12 is provided with a plurality of signal lines 121. The ground line area 14 is provided with a grounding line 141. The grounding line 141 is a large copper surface. The ratio of the area occupied by the copper of the grounding wire region 14 to the total area of the grounding wire region 14 is 1%, and is sufficiently surrounded by the area around the signal line ι21 to achieve electromagnetic interference shielding for signal transmission. However, with such a bent region design, when the flexible printed circuit board is bent, since the grounding wire 141 is a large copper surface, stress is generated when it is bent, and it cannot be dispersed, so that the grounding wire 141 is easily broken. Moreover, the thicker the large-area copper case used as the grounding wire ι41, the greater the stress generated by the bending, which causes the grounding wire 141 to be more susceptible to breakage. At this time, the signal line ι21 will be affected by the breakage of the grounding wire 141, and the bending stress will continue to spread to the signal line region 12, and the signal line m will be broken by 200829092 / =. Therefore, the traditional flexible printed circuit board • reading area 10 usually only has 5-7 thousand times of bending times, which is far from satisfying the current mobile phone, especially the folding mobile phone and the sliding cover mobile phone, and at least 8-10 million bends on the flexible printed circuit board. The number of folds required. In order to increase the number of f-folds of a flexible printed circuit board, the usual method is to improve on the material of the f-type printed circuit board and (4) to select a thinner material to improve the bending performance of the flexible printed circuit board. However, the improvement and replacement of materials usually takes a long time, and at the same time, the manufacturing cost of the flexible printed circuit board is high. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a flexible printed circuit board having a good bending property to meet the requirements of the number of times the electronic product bends the flexible printed circuit board, and at the same time effectively reduce the manufacturing cost. A flexible printed circuit board will be described below by way of example. The flexible printed circuit board includes a bent portion having a ground-wire wiring region having a plurality of copper regions uniformly distributed, and the plurality of copper regions are patterned in the ground wiring region Distribution. The flexible printed circuit board includes a bent portion having a ground line wiring region having a plurality of copper regions uniformly distributed, and a sum of areas occupied by the plurality of copper regions and the ground line The ratio of the total area of the area is greater than 0 and less than 100%. Compared with the prior art, the flexible printed circuit board has the advantages that: by making the ground wire wiring area have a uniform distribution of a plurality of copper regions, and the plurality of copper regions form a patterned distribution in the ground wire wiring region, 200829092 -Strengthen the power, and effectively reduce the stress generated when the flexible circuit board is bent, prevent the grounding wire and the signal line from breaking, thereby improving the bending performance of the flexible printed circuit board and increasing the bending times of the flexible printed circuit board. At the same time, it saves the cost of manufacturing flexible printed circuit boards. [Embodiment] Hereinafter, a flexible printed circuit board provided by an embodiment of the present technical solution will be further described with reference to the accompanying drawings. Referring to FIG. 2, the flexible printed circuit board 2 is provided in the first embodiment, and the flexible printed circuit board 20 is a single-layer printed circuit board. Referring to FIG. 3, the flexible printed circuit board 20 is composed of a substrate layer 22 and a copper conductive layer 24. The flexible printed circuit board 20 has a bent portion 26 which is bendable along a bending line 261. The bent portion 26 has a first edge 262 and a second edge 263. The bent portion includes a signal line wiring region 27 and a ground line wiring region 28. The signal line wiring area 27 and the ground line wiring area 28 are located in the same-copper conductive layer 24, and the ground line wiring area 28 surrounds the signal line wiring area 27. In this embodiment, the bent portion 26 of the flexible printed circuit board 20 includes two ground line wiring regions 28, which are respectively located on both sides of the signal line wiring region 27 and are respectively close to the bend. The first edge 262 and the second edge 263 of the portion 26. The copper conductive layer 24 forms a plurality of signal lines 241 in the signal line wiring region 27, and forms a plurality of copper regions uniformly distributed in the ground line wiring region 28, and the plurality of copper regions are patterned in the ground line wiring region 28. The ratio of the area occupied by the plurality of copper regions to the total area of the ground line wiring region 28 is greater than 〇 and less than 100%, preferably 30% to 60%, that is, the residual copper ratio of the ground wiring region 28 is 30. %~60%. Evenly distributed in the grounding wire wiring area 28 200829092 / a number of copper areas are grounded as ground, and electromagnetic interference transmitted to the signal line 241 is also shielded. The plurality of copper regions of the ground wire wiring region 28 are uniformly distributed. The pattern formed can be formed into various patterns according to requirements. Referring to FIG. 4, the pattern of the plurality of copper regions of the first grounding wire wiring region 28 of the flexible printed circuit board 2, the bent portion 26 provided in the first embodiment is formed. The plurality of copper regions of the grounding wire routing region 28 include a plurality of first copper wire regions 281 parallel to each other and a plurality of second copper wire regions 282 parallel to each other, the plurality of first copper wire regions 281 and a plurality of second copper wires The line regions 282 intersect each other to form a grid shape. Preferably, the angle between the extension line a of the first copper wire region 281 extending toward the first edge 262 of the bent portion 26 and the extension wire b extending from the second copper wire region 282 to the bent portion plus the first edge 262 is 3〇~8〇 degrees. In this embodiment, the angle /5 is 60 degrees, and the plurality of first copper line regions 281 and the plurality of second copper line regions 282 are respectively arranged at equal intervals. The ratio of the sum of the area occupied by the plurality of first copper line regions 281 and the plurality of second copper line regions 282 to the total area of the ground line wiring regions 28 is greater than 0 and less than 1〇0%, preferably, 3〇%~6 〇%. </ RTI> Referring to FIG. 5, a pattern of a plurality of copper regions of the second ground line wiring region 28 of the bent portion 26 of the flexible printed circuit board 20 provided in the first embodiment is formed. The plurality of steel regions of the ground wire wiring region 28 are a plurality of circular copper regions 283 which are evenly distributed in the ground wire wiring region 28. The diameter of the circular copper region 283 is 〇·5 to 2.0 mm. The plurality of circular copper regions 283 may be evenly arranged in a plurality of rows in the ground line wiring region 28, or may be arranged in any irregular arrangement as long as the circular copper regions 283 are evenly distributed in the ground wiring region 28. In this embodiment, the plurality of circular copper regions 283 are uniformly arranged in a plurality of rows in the ground line wiring region 28. The ratio of the area of the plurality of round copper regions 283 to 200829092; and the total area of the ground line wiring region 28 is greater than 0 and less than 100%, preferably 30% to 60%. Referring to FIG. 6, the pattern of the plurality of copper regions of the third ground line wiring region 28 of the bent portion 26 of the flexible printed circuit board 20 is provided. The plurality of copper regions of the ground line wiring region 28 are a plurality of strip-shaped copper regions 284, and the strip-shaped copper regions 284 are evenly distributed in the ground line wiring region 28. The strip-shaped copper region 284 has a width of 0.1 to 0.5 mm. The plurality of strip-shaped copper regions 284 may be uniformly arranged in the grounding wire wiring region 28, or may be arranged in any regular arrangement, as long as the strip-shaped copper regions 284 are uniformly distributed in the grounding wire wiring region 28. In this embodiment, the plurality of strip-shaped copper regions 284 are evenly arranged in a plurality of rows on the ground line wiring region 28, and the long sides of each of the strip-shaped copper regions 284 are perpendicular to the bending line 261 of the bent portion 26. Of course, the long sides of each strip-shaped copper region 284 may also be parallel to the bend line 261 of the bent portion 26. The ratio of the area occupied by the plurality of strip-shaped copper regions 284 to the total area of the ground line wiring regions 28 is greater than 0 and less than 100%, preferably 30% to 60%. φ Referring to FIG. 7, the flexible printed circuit board 30 provided in the second embodiment. The flexible printed circuit board 30 is a multilayer printed circuit board comprising a single-sided copper-clad substrate 31 and a double-sided copper-clad substrate 32. In this embodiment, the first copper-clad substrate 31 is a single-layer single-sided copper-clad substrate, and the second copper-clad substrate 32 is a single-layer double-sided copper-clad substrate 32. The single-sided copper clad substrate 31 includes a first substrate layer 311 and a first copper conductive layer 312. The double-sided copper clad substrate 32 includes a second base material layer 321 and a second copper conductive layer 322 and a third copper conductive layer 323 provided on both surfaces of the second base material layer 321 . The first copper conductive layer 312 of the single-sided copper-clad substrate 31 and the second copper conductive layer 322 of the double-sided copper-clad substrate 32 are pressed together by the glue layer 33 to form a multilayer flexible 200829092 printed circuit board 30, and the third copper conductive layer 323 is Its outermost copper conductive layer. Referring to Figure 8, the flexible printed circuit board 30 has a bent portion 36 that is bendable along a bend line 361 having a first edge 362 and a second edge 363. In the bent portion 36 of the flexible printed circuit board 30, the bent portion 36 has a signal line area (not shown) and a ground line wiring area 3, and the signal line wiring area is located in the inner layer copper conductive layer, that is, the first a copper conductive layer 312 and a second copper conductive layer 322, the first copper conductive layer 312 and the second copper conductive layer 322 respectively
用於形成複數條訊號線（圖未示）。接地線佈線區域38位於 最外層銅導電層，即第三銅導電層323,其從彎折部36之第 一邊緣362延伸至第二邊緣363’該第三銅導電層3 23用於於 接地線佈線區域3 8形成均勻分佈之複數個銅區，且該複數 個銅區於該接地線佈線區域38形成圖案化分佈。該接地線 佈線區域38的複數個銅區所占面積之和與接地線佈線區域 38總面積之比率大於〇且小於1〇〇%，優選地，為3〇%〜， 亦即接地線佈線區域38之殘銅率為30%〜60%。均勻分佈於 鲁接地線佈線區域38之複數個銅區作為地線接地，同時亦屏 蔽了對第一銅導電層312及第二銅導電層322中訊號線傳送 訊號之電磁干擾。此外，單面覆銅基板31與雙面覆銅基板 32還可為多層覆銅基板，以具有更多内層銅導電層，從而 設置更多訊號線佈線區域。 本實施例中，接地線佈線區域38之複數個銅區包括複 數條相互平行之第—銅線區381與複數條相互平行之第二 銅線區繼’該複數條第一銅線區381與複數條第二銅線區 才互又叉开v成、'周袼狀。優選地，該第一鋼線區⑻向彎 11 200829092 -折部36第一邊緣362延伸之延長線c與第二銅線區382向彎 折部36第一邊緣362延伸之延長線d之夾角召2為3〇〜80度。 本實施例中，夾角/3 2為60度，且該複數條第一銅線區381 與複數條第二銅線區382均分別呈等間距排列。複數條第一 銅線£ 3 81與複數條弟二銅線區3 8 2所占面積之和與接地線 佈線區域38總面積之比率大於〇且小於loo%，優選地，為 30%〜60%。 此外’接地線佈線區域3 8之複數個銅區分佈形成之圖 案亦可根據需求製作成其它多種樣式。請參閱圖9,接地線 佈線區域38之複數個銅區為複數個圓形銅區383，該圓形銅 區383均勻分佈於接地線佈線區域38。該圓形銅區3幻之直 徑為0·5〜2.0毫米。該複數個圓形銅區383可呈規則均勻排 列於接地線佈線區域38，亦可呈任何不規則排列，只要圓 形銅區383均勻分佈於接地線佈線區域％即可。本實施例 中，該複數個圓形銅區383呈多行規則均勻排列於接地線佈 線區⑽。複數個圓軸區383所占面積之和與接地線佈線 &域38總面積之比率大於〇且小於1〇〇%，優選地，為 30%〜60%。請參閱圖1Q，接地線佈線區域对之複數個銅區 ==條形銅區3δ4，該條形銅區3δ4均勻分佈於接地線 、本域38。該條形銅區384之條形寬度為ΟΡΟ 5毫米。 =數=銅區取可呈規則均句排列於接地線佈線區 於接地職彡―384均勻分佈 區賴多行規則均勻排列於接地線佈線區 12 200829092 形銅區384之長邊都與彎折邱 1 /、弓鄉哔36之彎折線361相垂直。者 然，母個條形銅區384之長邊 田 仗逭亦可都與彎折部36的彎折線 361相平订。複數個條形銅區384所太而并 ^ ^ 所占面積之和與接地線佈 線區域38總面積之比康女分^ n 檟之比羊大於0且小於100%，優選地，為 30%〜60%。 上述軟性印刷電路板2G與3G之優點在於··通過使該 接地線佈線區域具有均勾分佈之複數個銅區，且該複數個 鲁銅區於該接地線佈線區域形成圖案化分佈，有助於應力分 散，並有效減小軟性電路板.f折時所產生之應力，防止接 地線與訊號線斷裂，從而提升軟性印刷電路板彎折性能， 2加軟性印刷電路板料讀，同時節錄性印刷電路板 製作成本。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟’以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝 _之人士，在援依本案發明精神所作之等效修飾或變化，皆 應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係現有軟性印刷電路板彎折區域示意圖。 圖2係實施例一提供之軟性印刷電路板佈線結構示意 圖。 圖3係實施例一提供之軟性印刷電路板之基板組成結構 不意圖。 圖4係實施例一提供之軟性印刷電路板彎折部之第一種 13 200829092 _佈線不意圖。 圖5係實施例一提供之軟性印刷電路梅彎折部之第二種 佈線不意圖。 圖6係實施例一提供之軟性印刷電路板彎折部之第三種 佈線不意圖。 圖7係實施例二提供之軟性印刷電路板之基板組成結構 示意圖。 圖8係實施例二提供之軟性印刷電路板彎折部之第一種 外銅導電層佈線不意圖。 圖9係實施例二提供之軟性印刷電路板彎折部之第二種 外銅導電層佈線示意圖。 圖10係實施例二提供之軟性印刷電路板彎折部之第三 種外銅導電層佈線示意圖。 【主要元件符號說明】 彎折區域 10 訊號線區域 12 訊號線 121 接地線區域 14 接地線 141 軟性印刷電路板 20、30 彎折部 26、36 彎折線 261 、 361 第一邊緣 262,362 第二邊緣 263 、 363 訊號線佈線區域 27 接地線佈線區域 28、38 訊號線 241 基材層 22 銅到電層 24 第一銅線區 281 、 381 第二銅線區 282 、 382 圓形銅區 283 、 383 條形銅區 284 > 384 單面覆銅基板 31 200829092 第一基材層 311 第一銅導電層· 312 膠合層 33 雙面覆銅基板 32 第二基材層 321 第二銅導電層 322 第三銅導電層 323Used to form a plurality of signal lines (not shown). The ground wire routing region 38 is located on the outermost copper conductive layer, that is, the third copper conductive layer 323, which extends from the first edge 362 of the bent portion 36 to the second edge 363'. The third copper conductive layer 323 is used for grounding. The line wiring region 38 forms a plurality of copper regions uniformly distributed, and the plurality of copper regions form a patterned distribution in the ground wiring region 38. The ratio of the area occupied by the plurality of copper regions of the ground line wiring region 38 to the total area of the ground wiring region 38 is greater than 〇 and less than 1〇〇%, preferably, 3〇%~, that is, the ground wiring area The copper residual rate of 38 is 30%~60%. The plurality of copper regions evenly distributed in the grounding wire routing region 38 are grounded as ground wires, and also shield electromagnetic interference signals transmitted from the signal lines in the first copper conductive layer 312 and the second copper conductive layer 322. In addition, the single-sided copper-clad substrate 31 and the double-sided copper-clad substrate 32 may also be a multi-layer copper-clad substrate to have more inner copper conductive layers, thereby providing more signal line wiring regions. In this embodiment, the plurality of copper regions of the ground wire routing region 38 include a plurality of mutually parallel first copper wire regions 381 and a plurality of second copper wire regions parallel to each other following the plurality of first copper wire regions 381 and A plurality of second copper wire regions are mutually reciprocated and v-shaped, 'circumferential shape. Preferably, the angle between the extension line c of the first steel wire region (8) extending toward the first edge 362 of the bend 11 200829092 - the fold portion 36 and the extension line d of the second copper wire region 382 extending toward the first edge 362 of the bent portion 36 Call 2 for 3〇~80 degrees. In this embodiment, the angle /3 2 is 60 degrees, and the plurality of first copper line regions 381 and the plurality of second copper line regions 382 are respectively arranged at equal intervals. The ratio of the sum of the area of the plurality of first copper wires £3 81 and the plurality of brothers and two copper wires 3 8 2 to the total area of the ground wire wiring regions 38 is greater than 〇 and less than loo%, preferably 30% to 60% %. In addition, the pattern formed by the distribution of the plurality of copper regions of the grounding wire wiring region 38 can be made into other various patterns according to requirements. Referring to FIG. 9, the plurality of copper regions of the ground wiring region 38 are a plurality of circular copper regions 383 which are evenly distributed in the ground wiring region 38. The diameter of the circular copper zone 3 is 0. 5 to 2.0 mm. The plurality of circular copper regions 383 may be uniformly arranged in the grounding wire wiring region 38, and may be arranged in any irregular arrangement as long as the circular copper regions 383 are evenly distributed in the grounding wire wiring region%. In this embodiment, the plurality of circular copper regions 383 are evenly arranged in a plurality of rows in the ground wire wiring region (10). The ratio of the area occupied by the plurality of circular axis regions 383 to the total area of the ground wire wiring & field 38 is greater than 〇 and less than 1%, preferably 30% to 60%. Referring to FIG. 1Q, the grounding wire wiring area is opposite to the plurality of copper regions == strip copper region 3δ4, and the strip copper region 3δ4 is evenly distributed on the grounding line and the local domain 38. The strip-shaped copper region 384 has a strip width of ΟΡΟ 5 mm. = number = copper area can be ruled in the grounding line wiring area in the grounding position - 384 uniform distribution area depends on the line rule evenly arranged in the grounding line wiring area 12 200829092 The long side of the copper area 384 is bent Qiu 1 /, the bow line 361 of the bow line 36 is vertical. However, the long side of the mother strip copper zone 384 may also be aligned with the bend line 361 of the bent portion 36. The ratio of the sum of the area of the plurality of strip-shaped copper regions 384 to the total area of the ground line wiring area 38 is greater than 0 and less than 100%, preferably 30%. ~60%. The above advantages of the flexible printed circuit boards 2G and 3G are that the plurality of copper regions are uniformly distributed in the ground line wiring region, and the plurality of copper regions are patterned in the ground wiring region, which facilitates The stress is dispersed, and the stress generated during the folding of the flexible circuit board is effectively reduced, and the grounding wire and the signal line are prevented from being broken, thereby improving the bending performance of the flexible printed circuit board, 2 adding soft printed circuit board material reading, and at the same time, de-recording Printed circuit board manufacturing costs. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be equivalently modified or changed in the spirit of the invention. , should be included in the scope of the following patent application. [Simple description of the drawing] Fig. 1 is a schematic view showing a bending region of a conventional flexible printed circuit board. Fig. 2 is a schematic view showing the structure of a flexible printed circuit board wiring structure provided in the first embodiment. Fig. 3 is a structural diagram of a substrate of a flexible printed circuit board provided in the first embodiment. 4 is a first type of flexible printed circuit board bent portion provided in the first embodiment. 13 200829092 _ wiring is not intended. Fig. 5 is a schematic view showing the second wiring of the flexible printed circuit of the soft printed circuit provided in the first embodiment. Fig. 6 is a view showing a third wiring of the flexible printed circuit board bent portion provided in the first embodiment. Fig. 7 is a schematic view showing the structure of a substrate of a flexible printed circuit board provided in the second embodiment. Fig. 8 is a schematic view showing the first outer copper conductive layer wiring of the flexible printed circuit board bent portion provided in the second embodiment. Fig. 9 is a schematic view showing the wiring of a second outer copper conductive layer of the flexible printed circuit board bent portion provided in the second embodiment. Fig. 10 is a schematic view showing the wiring of a third outer copper conductive layer of the flexible printed circuit board bent portion provided in the second embodiment. [Description of main component symbols] Bending area 10 Signal line area 12 Signal line 121 Grounding wire area 14 Grounding wire 141 Flexible printed circuit board 20, 30 Bending portion 26, 36 Bending line 261, 361 First edge 262, 362 Second edge 263 363 signal line wiring area 27 ground line wiring area 28, 38 signal line 241 base material layer 22 copper to electrical layer 24 first copper line area 281, 381 second copper line area 282, 382 round copper area 283, 383 Copper-shaped region 284 > 384 single-sided copper-clad substrate 31 200829092 first substrate layer 311 first copper conductive layer · 312 glue layer 33 double-sided copper-clad substrate 32 second substrate layer 321 second copper conductive layer 322 third Copper conductive layer 323
1515