200828358 - 九、發明說明： ' 【發明所屬之技術領域】 · 本發明涉及-種電子元件，尤其涉及一種安裝 元件及其製造方法。 包路板上之小型電子 【先前技術】 亦被應用到非積體電路之電子元件中，如電容、電感 =:構 美國第6,593,840號專刺4易+τ、士蹲_ /、棋栀々丨l®寺。 該絕緣太元件，其包括—絕緣本體， u有兩個㈣、電子元件收容空間及位於彳義上之引腳 槽。引腳槽設置有固持裝置，持裝置包括至少 = 收交娣夕供#二垃 ϋ视用以/咸小端子 之㈣面彳，。該電子元件還包括位於絕緣本體收容空 組件，電子組件分別包括複數引線，其中各引線延伸至一引 = 引腳槽分別收容一引腳端子，其中弓1腳端子包括_爽持部，這種1 設置使得夾持部將引腳端子緊緊固定在各端子槽中並與引線形成紐連 接。 然，此觀子元件之結構_，在製造過程巾相«本較高、生纽 率低，並且由於各電子組件之引線非常細小，在其組裝時與引腳端子干 涉連接，故容易產生斷裂，不能確保產品質量。 另外，在前述美國第6,593,84〇號專利之背景技術(如該專利之圖3、 4所示）f亦龄了-種結獅似之f子树，該電子元聽括由侧壁及 頂壁圍成-收容㈣之本體部，複㈣丨腳端子分別注塑成型於兩側壁 上，安裝於收容空間之電子組件具有複數引線，各引線分別纏繞於延伸 出側壁底面之相應之引腳端子上，然後經過浸錫焊接以使引腳端子與電 子組件之引線形成電性連接。 6 200828358 然，以上這種電子元件於製造過程中，由於引線需要浸錫焊接到w 端子上，相應增加製造成本，並且於大量生產時，不能確保產品質旦_ 產品生產優良率低，因此有必要設計一種電子元件克服以上缺點。 【發明内容】 有鑒於上述内容，有必要提供一種製造成本低、生產效率言、 口〇 峰 產優良率良好之電子元件及其製造方法。200828358 - IX. Description of the invention: 'Technical field to which the invention pertains» The present invention relates to an electronic component, and more particularly to a mounting component and a method of manufacturing the same. Small electronic circuit on the road board [prior art] is also applied to electronic components of non-integrated circuits, such as capacitors and inductors =: US 6,658,840 special thorns 4 easy +τ, gentry _ /, chess丨l® Temple. The insulating member includes an insulating body, u has two (four), an electronic component receiving space, and a pin slot on the UI. The pin slot is provided with a holding device, and the holding device includes at least = 收 供 供 供 供 二 二 二 二 / / / / / / 咸 咸 咸 咸 咸 咸 咸 咸 咸 咸 咸 咸 咸 咸The electronic component further includes an empty component disposed in the insulative housing, wherein the electronic component respectively includes a plurality of leads, wherein each of the leads extends to a lead pin slot to respectively receive a pin terminal, wherein the bow pin terminal includes a sluice portion. 1 The setting is such that the clamping portion tightly fixes the pin terminals in the respective terminal slots and forms a new connection with the leads. However, the structure of the viewing element _, in the manufacturing process, the paper is relatively high, the production rate is low, and since the leads of the electronic components are very small, they are interfered with the pin terminals during assembly, so that breakage is likely to occur. Can not ensure product quality. In addition, the background art of the aforementioned U.S. Patent No. 6,593,84, (as shown in Figures 3 and 4 of the patent) f is also aged - a lion-like sub-tree, the electronic element is included in the side wall and The top wall encloses a body portion of the housing (four), and the plurality of (four) foot terminals are respectively injection molded on the two side walls, and the electronic components mounted in the receiving space have a plurality of lead wires, and the lead wires are respectively wound around the corresponding pin terminals extending from the bottom surface of the side wall. Upper, then immersion soldering to electrically connect the pin terminals to the leads of the electronic components. 6 200828358 However, in the manufacturing process of the above electronic components, since the leads need to be immersed and soldered to the w terminal, the manufacturing cost is increased accordingly, and in mass production, the quality of the product cannot be ensured _ the product production rate is low, so It is necessary to design an electronic component to overcome the above disadvantages. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electronic component having a low manufacturing cost, a high production efficiency, and a good peak yield.
本發明之電子元件包括絕緣本體、至少一電子組件以及複數 子，該絕緣本體包括至少一側壁及一收容空間，側壁具有一底面，泰 組件收容於所述絕緣本舰容空_，各電子組件分別具有複數^子 引腳端子分職定於所述側壁上。各？|腳端子包括位於絕緣本體外二 接部、固定於絕緣本體㈣上之@持部及㈣持部延伸出側壁之: 部’其中連接部與侧壁之底面平行並與電子組件引線相連The electronic component of the present invention includes an insulative housing, at least one electronic component, and a plurality of sub-assemblies, the insulative housing includes at least one side wall and a receiving space, the side wall has a bottom surface, and the Thai component is received in the insulating inner space _, each electronic component Each of the plurality of sub-pin terminals is assigned to the side wall. each? The foot terminal includes an outer portion of the insulating body, a holding portion fixed to the insulating body (4), and (4) a holding portion extending from the side wall: a portion where the connecting portion is parallel to the bottom surface of the side wall and connected to the lead of the electronic component
本發明之電子元件之製造方法，包括提供—個絕緣本體，其包括々小 一個側壁及—收容空間，_具有-底面，複_腳端子-體成型;:所 述侧壁上，刻腳端子包括位於所述絕緣本體外之焊接部、固定於所述 側壁之固持部及由_延伸_之_，該連接部與所述側壁底 面電子組件，其包括複數引線，將所述電子組件安裝於所述 絕緣本體收容空間内，並髂夂51城\ ~ 所述電子組件之引線與所刻㈣子進行=^^子連接雜接’將 請，本㈣訂林U丨㈣仅雜軸絕緣本體之 大巾料低生產成本’並提高生產鱗 【實施方式】 200828358 請-併參閱第-圖及第二圖，本創作電子元件咖係—種小 模扼流圈模組，當然這種結構亦可以應用於其他電子讀中，_ 件刚包括複數引腳端子2分別_於絕緣本體〗長度方向轉= Π上；絕緣本體！亦包括寬度方向相對之兩側壁12、一頂壁 = ==收獅托件3齡㈣啸裝於絕= 14内，4子組件3具有―®職齡31及纏繞於磁芯 31上之線圈32。The manufacturing method of the electronic component of the present invention comprises: providing an insulative body comprising a small sidewall and a receiving space, having a bottom surface, a complex-foot terminal body molding; and a sidewall terminal The invention includes a soldering portion located outside the insulating body, a holding portion fixed to the sidewall, and an electronic component of the sidewall portion, the connecting portion and the sidewall bottom surface, including a plurality of leads, and mounting the electronic component The insulative housing accommodating space, and 髂夂 51 city \ ~ the lead of the electronic component and the engraved (four) sub-^^^ sub-connections will be invited, this (four) order forest U 丨 (four) only miscellaneous axis insulation body The cost of the large towel is low and the production scale is increased. [Embodiment] 200828358 Please-see also the first and second figures. The electronic component of this creation is a small-mode choke module. Of course, this structure is also Can be applied to other electronic readings, _ pieces just include the complex pin terminal 2 respectively _ in the insulating body 〗 〖Longitudinal direction = Π; insulative body! Also includes two sidewalls 12 opposite to each other in the width direction, a top wall === lion cradle 3rd age (four) whistle in the absolute = 14, 4 sub-assembly 3 has a "® age 31" and a coil wound around the magnetic core 31 32.
♦請一併參閱第二圖及第三圖，引腳端子2設有用以與電路板(未圖示) 4連接之直角形焊接部21、固定於絕緣本體！側壁“之固持部^以 及與電子組件3線圈32電性連接之連接部23，該連接部23與固持部^ 垂直且延伸幻職u之底面⑽之外並與之平行，轉部η可以與底 面則緊貼(請參閱第二圖），當'然，固持部22也可以繼續延伸一段距離 使得連接部23與底面110形成—定距離之空隙(請參閲第现，從而給 電子組件3之引線320於引腳端子2上繞制提供空間。連接部23具有與 焊接部21、固持部22寬度相同之主體部231及由主體部231 一側垂直 知伸之知接堂232。當引腳端子2固定於絕緣本體1上時，各引腳端子2 ” 位於π亥引腳化子2與相鄰引腳端子2形成之空隙位置處，當 然’該焊接臺232還可以繼續延伸只要其不與相鄰端子2之連接部23相 接觸Ρ可由此％子組件3線圈32之複數引線320可以很方便之與各引 腳端子2搭接。 請參閱第四圖，於製造過程中，首先將從料帶衝壓成型之引腳端子2 通過注塑成贱其他細方式固定於絕緣本體1上；然後將製造好之電 子、且彳1 3女衣到絕緣本體1之凹槽14中，此時也可以將粘膠等固定物質 (未圖不)填充到電子組件3周圍之空隙中以將電子組件3固定；同時，將 200828358 各線圈32之所有引線320放置到相應之引腳端子2空隙中，以使引線 320與引腳端子2之連接部23搭接，亦可以先將引線32〇在固持部22 進行、％制後與連接部23搭接(萌'參閱第五圖）此時也可以借助於點膠將引 、’泉320準確定位；最後將該組裝好之電子元件1〇〇送到焊接設備進行熱 熔焊接，電子組件3之引線320熱熔焊接到引腳端子2之焊接臺232上。♦Please refer to the second and third figures together. The pin terminal 2 is provided with a right-angled soldering portion 21 for connection to a circuit board (not shown) 4, and is fixed to the insulating body! a retaining portion of the side wall and a connecting portion 23 electrically connected to the coil 32 of the electronic component 3, the connecting portion 23 being perpendicular to the holding portion and extending beyond the bottom surface (10) of the illusion u, and the rotating portion η can be The bottom surface is in close contact (please refer to the second figure). When the holder 22 can continue to extend a distance, the connecting portion 23 forms a gap with the bottom surface 110 (refer to the present invention, thereby giving the electronic component 3 The lead wire 320 is wound around the pin terminal 2. The connecting portion 23 has a body portion 231 having the same width as the solder portion 21 and the holding portion 22, and a body 232 that is perpendicularly defined by the body portion 231 side. When the terminal 2 is fixed on the insulative housing 1, each pin terminal 2" is located at a gap position formed by the π-hai pin 2 and the adjacent pin terminal 2. Of course, the soldering station 232 can continue to extend as long as it is not In contact with the connecting portion 23 of the adjacent terminal 2, the plurality of leads 320 of the coil 32 of the sub-assembly 3 can be easily overlapped with the respective pin terminals 2. Referring to the fourth figure, in the manufacturing process, first From the lead terminal 2 of the strip forming by injection molding贱 other fine manners are fixed on the insulative housing 1; then the manufactured electronic and 彳1 3 women's clothing is placed into the recess 14 of the insulative housing 1, and at this time, a fixing substance such as glue (not shown) may be filled. Go to the space around the electronic component 3 to fix the electronic component 3; at the same time, place all the leads 320 of each of the coils 32 of 200828358 into the gaps of the corresponding pin terminals 2 so that the connection portion 23 of the lead 320 and the pin terminal 2 For the lap joint, the lead wire 32 can be firstly smashed on the holding portion 22, and after the % system is made to overlap with the connecting portion 23 (see the fifth figure). At this time, the lead and the 'spring 320 can be accurately positioned by means of dispensing; Finally, the assembled electronic component 1 is sent to a soldering apparatus for hot-melt soldering, and the lead 320 of the electronic component 3 is heat-welded to the soldering station 232 of the pin terminal 2.
於本創作中採用之熱熔焊接係一種放熱熔接，它利用放熱反應時產生 超高熱來完成熔接之一種方法。熱熔焊接反應速度非常快，僅幾秒就可 以元成焊接，產生熱量極高可以有效之傳導至熔接部位，使其熔爲一體， 形成分子結合，它無須其他任何熱能。將熱熔焊接應用於電子元件之製 k上，不需要使用焊錫f，並且焊點之電氣及機械性能良好、產品生產 優良率良好，適應於大規模自動化生產，成本低。 綜上所述，本創作確已符合發明專利之要件，纽法提"請專利。 惟，以上所述者健本發明之較佳實施方式，本發明之範圍並不以上述 實施方式為限，舉凡·本案技藝之人士援依本發明之精神所作之等效 修飾或、交化，皆應涵蓋於以下專利申請範圍内。 【圖式簡單說明] 第一圖係本創作電子元件之立體圖。 第二圖係本創作電子元件之另—立體圖。 一 j f廷子元件之引腳端子之放大立體圖。 第四圖係本_電子元件之元件平®組裝圖。 第五圖係本創作電子元件H關，w巾顧潔僅示咅出 子組件之⑽雜轉接則丨㈣子上。 ，、〜出 【主要元件符號說明】 電子元件 侧壁 100 絕緣本體 11 側壁 1 12 200828358 頂壁 13 底面 110 焊接部 21 連接部 23 焊接臺 232 圓環狀磁芯 31 引線 320 收容槽 14 引腳端子 2 固持部 22 主體部 231 電子組件 3 線圈 32The hot-melt welding used in this creation is an exothermic fusion method which utilizes an exothermic reaction to produce ultra-high heat to complete the fusion. The hot melt welding reaction speed is very fast, and it can be welded in only a few seconds. The heat generated is extremely high and can be effectively transmitted to the welded portion to be melted into one body to form a molecular bond, which does not require any other heat energy. The application of hot-melt welding to the manufacturing of electronic components does not require the use of solder f, and the electrical and mechanical properties of the solder joints are good, the product production rate is good, and it is suitable for large-scale automated production with low cost. In summary, this creation has indeed met the requirements of the invention patent, Newfat " patent. However, the above-mentioned preferred embodiments of the present invention are not limited to the above-described embodiments, and those skilled in the art will be able to modify or modify the equivalents according to the spirit of the present invention. All should be covered by the following patent applications. [Simple description of the drawing] The first figure is a perspective view of the electronic components of the present creation. The second picture is another perspective view of the electronic component of the creation. An enlarged perspective view of the pin terminal of a j fteen sub-component. The fourth figure is the assembly diagram of the component of the electronic component. The fifth picture shows the electronic component H of the creation, and the w towel is only shown on the (10) miscellaneous transfer. ,, and [Output of main component symbols] Electronic component sidewall 100 Insulating body 11 Side wall 1 12 200828358 Top wall 13 Bottom surface 110 Welded portion 21 Connecting portion 23 Soldering station 232 Ring core 31 Lead 320 Storage slot 14 Pin terminal 2 holding portion 22 main body portion 231 electronic component 3 coil 32
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