200824992 九、發明說明： •【發明所屬之技術領域】 _ 本發明係關於一種包裝盒，尤其係關於用於運送玻璃 基板之包裝盒。 【先前技術】 隨著數位科技的發展，液晶顯示產品已廣泛地應用在 日常生活的各個層面中。對於液晶顯示模組而言，玻璃基 板所扮演的角色好比是半導體產業中的晶圓，因此，液晶 顯示器產業對玻璃基板有較高的包裝及運輸要求。 玻璃是一種脆性材料，當受到外力碰撞或是掉落地面 時，很容易破裂以致於不能使用。而在製作液晶顯示面板 的過程中，玻璃基板的運送問題至關重要。在玻璃基板的 運送過程中，其易受震動、化學污染等影響造成對玻璃基 板之破壞，且當玻璃基板與包裝物發生摩擦而產生靜電感 應時’玻璃基板内部的電路會受到破壞。 先前技術之玻璃基板運送主要是將玻璃基板層疊放置 i在包裝盒中，並由隔板分隔每個玻璃基板以運送。:種先 前技術所揭示之玻璃基板包裝構造如圖i所示，該包裝構造 1係將有複數玻璃基板11疊合形成之疊合體13收容於一包 裝盒15内。 該玻璃基板11可以為液晶玻璃基板、電漿顯示用玻璃 基板及一般玻璃基板，同時還可以用來運送背光板、彩色 濾光板等。以該玻璃基板11為液晶玻璃基板為例，在該液 晶玻璃基板的邊緣區域通常設置有液晶密封口、薄膜電晶 7 200824992 體引腳、積體電路晶片及軟性電路板等重要元件，在運送 t過程中，需要避免受到外力撞擊以及相互摩擦造成對上述 重要元件的損壞。 該疊合體13係由該複數液晶玻璃基板層疊設置，且每 二相鄰液晶玻璃基板之間夾設一緩衝片材12，該緩衝片材 12係採用一種具較高抗靜電特性之高密度聚乙烯（HDPE， (C2H2)n)材質壓模成型製得。 該包裝盒15係採用樹脂發泡材料製成，其包括一盒體 151及一蓋體155，該盒體151與該蓋體155相互嵌套配合形 成一收容空間。 該盒體151包括一底部152及四個首尾連接之侧壁 153，該側壁153均垂直於該底部152設置，並配合該底部152 圍成一矩形無蓋收容空間。 該蓋體155同樣包括四個與該盒體151之側壁153相互 配合之侧壁15 6。 當採用該包裝盒15收容該疊盒體13時，首先提供該盒 體151 ;接著將該疊盒體13置於該盒體151内，並使該側壁 153抵接該疊盒體13之側面；然後蓋合該蓋體155，並使該 蓋體155之側壁156與該盒體151之侧壁153相互嵌套配合以 收容並固持該疊盒體13。 採用上述包裝構造1包裝用於運送之玻璃基板11，因為 採用樹脂發泡材料製成該包裝盒15具有緩衝性能佳、重量 輕及模具成本稍低的優點，雖然基本可以保證玻璃基板11 之安全運送，但是仍然存在如下缺陷： 8 200824992 首先，該包裝盒15只能對應某一種尺寸之玻璃基板 • 11 ’不能採用該包裝盒用於包裝其他較小尺寸之玻璃基板 11，如·當包裝盒15用於包裝玻璃基板11之尺寸為22英寸 時，則不旎用於包裝尺寸為19英寸之玻璃基板11，否則會 因為包裝盒15對玻璃基板11之固持不牢而降低玻璃基板n 在運送過程中之安全係數。同時，採用該包裝方式，每一 尺寸之玻璃基板11需要對應設計一種包裝盒15，需要重新 設計盒體151，更換包裝盒，故造成包裝成本增加。 【發明内容】 有鑒於上述内容，有必要提供一種可以兼容包裝多種 尺寸玻璃基板，且降低包裝成本之玻璃基板包裝盒。 一種玻璃基板包裝盒，其包括一盒體及至少一緩衝 件’該盒體具有一底部及複數側壁，該底部配合該複數侧 壁圍成一收容空間，該側壁内表面設置有複數卡槽，該缓 衝件具有複數卡榫，該卡榫與該卡槽對應嵌套設置。 相較於先前技術，上述用於運送玻璃基板之包裝盒， 藉由該緩衝件配合設於該侧壁内侧以改變該包裝盒之收容 空間之尺寸，以適應不同尺寸玻璃基板包裝需求，使得多 種尺寸之玻璃基板能夠共用包裝盒，靈活包裝，同時避免 重新設計包裝盒，有效降低包裝材料造成之成本。 【實施方式】 請一並參閱圖2、圖3,圖2係本發明採用包裝盒包裝玻 璃基板之第一種玻璃基板包裝構造立體分解示意圖，圖3 係圖2所示玻璃基板包裝構造立體組裝示意圖。該包裝構造 9 200824992 2包括一疊合體20及一包裝盒30(參閱圖3)。其中該疊合體 20包括層疊放置之一隔板22及二玻璃基板21。該包裝盒30 包括一盒體31、二緩衝件32及一蓋體33，該盒體31及該蓋 體33相互配合嵌套，並形成一容置空間。該疊合體20及該 緩衝件32收容於該盒體31與蓋體33形成之容置空間内。 該隔板22係一具緩衝功能之矩形平板，其夾設於該二 玻璃基板21之間，以避免相鄰玻璃基板21之間彼此發生摩 擦。該隔板22之輪廓大小與該玻璃基板21之大小基本相吻 合，形狀可以為平板形或者框形，且該隔板22與該玻璃基 板21接觸的表面具有可流通空氣之凹凸圖案，同時，該凹 凸圖案具有一定彈性，起到緩衝外力作用。 該盒體31包括四個内側壁311、一底部312及四個外侧 壁313。該四個外側壁313分別垂直於該底部312,該外側壁 313首尾依次連接，且配合該底部312圍成一矩形無蓋收容 空間，該内側壁311與該外侧壁313係一體成型，並高於該 外側壁313。該内侧壁311表面平行間隔設置有複數卡槽314 及複數突起315，該卡槽314與該突起315依次交替間隔。在 二相鄰内側壁311交匯處，分別設置有四個凹槽316。 該緩衝件32係一長條狀緩衝元件，其包括二相對侧面 321、322，其中一側面322表面設置有複數卡榫323及複數 卡槽324,該複數卡榫323及卡槽324平行間隔設置，該卡榫 323與該卡槽324依次交替間隔。該緩衝件32表面之卡榫323 與設於該盒體31内側壁311表面之卡槽314輪廓相一致；該 緩衝件32表面之卡槽324輪廓與設於該盒體31内側壁311表 200824992 面之突起3 15輪庸相一致。 該蓋體33係一矩形殼體，該蓋體33側壁具有一與該盒 體31内側壁311及外側壁313對應之階梯結構（圖未示），以 實現該盒體31與該蓋體33之嵌套配合。 在該包裝構造2中，該包裝盒30之盒體31及該緩衝件32 均係採用樹脂發泡材料構成，如作為聚稀烃系發泡體之高 密度聚乙烯、聚丙烯、低密度聚乙烯、乙烯-乙酸乙烯酯共 聚合物等。樹脂發泡材料係使含有發泡劑之聚烯烃系小球 或其一次發泡體填充於模具内，以一定溫度加熱而製造， 其發泡倍率控制在3〜30倍。該發泡方法可以採用低壓發泡 法，所以可以使用低成本之鋁型模具。樹脂發泡材料所形 成之各部份厚度，根據強度需求，以15〜100mm為適當。 且該盒體31内側壁311之卡槽314與該緩衝件32表面之卡榫 323可以採用同一模具製得，保證該包裝設計成本不會大幅 增加。 包裝盒30之盒體31及蓋體33發泡過程還可以採用含有 導電性聚合物或抗靜電性物質摻雜發泡之方法，獲得電阻 糸數為10〜10 Ωκπι之樹脂發泡材料’使得玻璃基板21 不會因產生之靜電而破壞玻璃基板21内部之電路。 在包裝過程中，首先將該二緩衝件32分別靠近該盒體 31之二相對内側壁311設置，且該緩衝件32之卡榫323收容 於該盒體31之卡槽314，該缓衝件32之卡槽324對應收容該 盒體31之突起315。 然後，將該疊合體20收容於該盒體31内，其中該疊合 11 200824992 體20之二相對側面抵接該盒體31之二相對内側面311，另二 相對側面分別抵接該二緩衝件32之側面321。 最後，將該蓋體33蓋合於該盒體31上，並使得該蓋體 33側壁之階梯狀結構對應與該盒體31之内側壁311及外側 壁313相對應配合。 在該包裝構造2中，該二緩衝件32可以靈活設置，不僅 可以靠近二相對内侧壁311設置，還可以靠近二相鄰内側壁 311上；根據玻璃基板尺寸之不同，還可以將該缓衝件32 之數量增加為三個或者四個。當該緩衝件32之數量增加為 三個時，其中二緩衝件32靠近該盒體31之一組相對内側壁 311設置，另一緩衝件32與夾於該組相對内側壁311間之一 侧壁311設置；當該緩衝件32之數量增加為四個時，每一缓 衝件32均靠近該内側壁311設置。 相較於先前技術，採用該包裝盒30包裝該疊合體20， 藉由增加靠近該内侧壁311設置之緩衝件32以改變該包裝 盒30之收容空間大小，以滿足不同尺寸玻璃基板22之包裝 需要，增加包裝靈活度。 另，當待包裝玻璃基板之尺寸變小時，不需要重新設 計與該玻璃基板尺寸相對應之包裝盒，而是共用該包裝盒 30，同時增加不同數目缓衝件32即可，藉由該緩衝件32填 充待包裝玻璃基板21與内侧壁311之間間隙，使得該包裝盒 30配合該缓衝件32收容並固持該玻璃基板21，避免重新設 計新的包裝盒30，減少包裝材料浪費，降低成本。 請參閱圖4，係本發明採用包裝盒包裝玻璃基板之第 12 200824992 二種玻璃基板包裝構造立體分解示意圖。該包裝構造5與上 一實施方式之區別在於：該包裝構造5包括四個緩衝件52、 53、54、55，其中二緩衝件52、53靠近該盒體51之二相對 内侧壁511設置，另二緩衝件54、55則分別與該缓衝件52、 53疊合組合。 該緩衝件52之二相對側面521、522表面均設置有複數 卡槽524及複數卡榫523,且位於同一表面之卡槽524與卡榫 523間隔平行設置。其中位於側面522之卡榫523對應收容於 該内側壁511之卡槽514内，位於該緩衝件52之側面522之卡 槽524對應收容該缓衝件54之卡榫543。 該緩衝件53具有與缓衝件52相同之結構，並與該緩衝 件54組合後對稱設於另一内側壁511上，且卡合方式與該緩 衝件52、53與内侧壁511之卡合方式相同。 採用該種包裝構造5,可以進一步縮小該包裝盒之收容 空間，以適應玻璃基板尺寸較小之包裝，滿足共用包裝盒 包裝較小尺寸之玻璃基板。當然，根據實際產品之包裝需 要，可以增加緩衝件52、53之數量。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝 之人士，在援依本案發明精神所作之等效修飾或變化，皆 應包含於以下申請專利範圍内。 13 200824992 【圖式簡單說明】 圖1係一種先前技術之玻璃基板包裝構造立體示意圖。 圖2係本發明採用包裝盒包裝玻璃基板之第一種玻璃基板 包裝構造立體分解示意圖。 圖3係圖2所示之包裝構造包裝後之立體組裝示意圖。 圖4係本發明採用包裝盒包裝玻璃基板之第二種玻璃基板 包裝構造立體分解示意圖。 【主要元件符號說明】 包裝構造 2、5 卡槽 314 疊合體 20 突起 315 隔板 21 凹槽 316 玻璃基板 22 緩衝件 32、52、53、54、55 包裝盒 30 侧面 321、322、521、522 盒體 31 ^ 51 卡榫 323 、 523 内側壁 311 、 511 卡槽 324 、 524 底部 312 蓋體 33 外側壁 313 14200824992 IX. Description of the invention: • [Technical field to which the invention pertains] The present invention relates to a package, and more particularly to a package for transporting a glass substrate. [Prior Art] With the development of digital technology, liquid crystal display products have been widely used in various aspects of daily life. For liquid crystal display modules, the role of glass substrates is like wafers in the semiconductor industry. Therefore, the liquid crystal display industry has high packaging and transportation requirements for glass substrates. Glass is a brittle material that breaks easily when it is hit by an external force or falls to the ground. In the process of fabricating a liquid crystal display panel, the problem of transporting the glass substrate is crucial. During the transportation of the glass substrate, it is susceptible to damage to the glass substrate due to vibration, chemical contamination, etc., and when the glass substrate and the package are rubbed to generate an electrostatic sensation, the circuit inside the glass substrate is damaged. The prior art glass substrate transport is mainly by laminating glass substrates in a package, and each glass substrate is separated by a separator for transport. The glass substrate packaging structure disclosed in the prior art is shown in Fig. i. The packaging structure 1 is such that a stacked body 13 in which a plurality of glass substrates 11 are stacked is housed in a packaging box 15. The glass substrate 11 may be a liquid crystal glass substrate, a glass substrate for plasma display, or a general glass substrate, and may be used to transport a backlight, a color filter, or the like. Taking the glass substrate 11 as a liquid crystal glass substrate as an example, an important component such as a liquid crystal sealing port, a thin film transistor 7 200824992 body pin, an integrated circuit chip, and a flexible circuit board is usually provided in the edge region of the liquid crystal glass substrate. During the process, it is necessary to avoid damage to the above important components caused by external force impact and mutual friction. The laminated body 13 is formed by laminating the plurality of liquid crystal glass substrates, and a buffer sheet 12 is interposed between each two adjacent liquid crystal glass substrates, and the buffer sheet 12 is formed by a high density poly with high antistatic property. Ethylene (HDPE, (C2H2)n) is obtained by compression molding. The package 15 is made of a resin foam material, and includes a case body 151 and a cover body 155. The case body 151 and the cover body 155 are nested with each other to form a receiving space. The box body 151 includes a bottom portion 152 and four end-to-end side walls 153. The side walls 153 are disposed perpendicular to the bottom portion 152 and cooperate with the bottom portion 152 to form a rectangular coverless receiving space. The cover 155 also includes four side walls 166 that cooperate with the side walls 153 of the case 151. When the package 15 is used to receive the stacked body 13, the case 151 is first provided; then the stacked case 13 is placed in the case 151, and the side wall 153 abuts the side of the stacked case 13 Then, the cover 155 is closed, and the side wall 156 of the cover 155 and the side wall 153 of the case 151 are nested with each other to receive and hold the stacked body 13. The above-mentioned packaging structure 1 is used to package the glass substrate 11 for transportation, because the packaging material 15 is made of a resin foaming material, which has the advantages of good cushioning performance, light weight, and slightly lower mold cost, although the safety of the glass substrate 11 can be basically ensured. Shipping, but still has the following defects: 8 200824992 First of all, the box 15 can only correspond to a certain size of the glass substrate • 11 ' can not be used to package other smaller size glass substrates 11, such as · when the box 15 When the size of the packaging glass substrate 11 is 22 inches, it is not used for packaging the glass substrate 11 having a size of 19 inches, otherwise the glass substrate n may be lowered because the packaging box 15 is not firmly adhered to the glass substrate 11. Safety factor in the process. At the same time, according to the packaging method, the glass substrate 11 of each size needs to be correspondingly designed with a packaging box 15, and the box body 151 needs to be redesigned to replace the packaging box, thereby causing an increase in packaging cost. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a glass substrate package that can be compatible with packaging a plurality of size glass substrates and reduce packaging costs. A glass substrate packaging box comprising a box body and at least one buffering member. The box body has a bottom portion and a plurality of side walls. The bottom portion cooperates with the plurality of side walls to define a receiving space, and the inner surface of the side wall is provided with a plurality of card slots. The buffer member has a plurality of cassettes, and the cassette is nested corresponding to the card slot. Compared with the prior art, the above-mentioned packaging box for transporting a glass substrate is disposed on the inner side of the side wall by the buffering member to change the size of the receiving space of the packaging box to meet the packaging requirements of different sizes of glass substrates, so that various The size of the glass substrate can share the package, flexible packaging, and avoid redesigning the package, effectively reducing the cost of packaging materials. [Embodiment] Please refer to FIG. 2 and FIG. 3 together. FIG. 2 is a perspective exploded view showing the first glass substrate packaging structure of the packaging glass substrate according to the present invention, and FIG. 3 is a three-dimensional assembly of the glass substrate packaging structure shown in FIG. schematic diagram. The package construction 9 200824992 2 includes a stack 20 and a package 30 (see Figure 3). The stacked body 20 includes a separator 22 and two glass substrates 21 stacked. The package 30 includes a box body 31, two buffer members 32, and a cover body 33. The box body 31 and the cover body 33 are nested with each other to form an accommodation space. The stacked body 20 and the cushioning member 32 are housed in the accommodating space formed by the casing 31 and the lid body 33. The spacer 22 is a rectangular flat plate having a buffer function interposed between the two glass substrates 21 to prevent friction between adjacent glass substrates 21. The shape of the partition plate 22 is substantially the same as the size of the glass substrate 21, and the shape of the partition plate 22 may be a flat plate shape or a frame shape, and the surface of the partition plate 22 contacting the glass substrate 21 has a concave and convex pattern capable of circulating air, and The concave-convex pattern has a certain elasticity and functions as a buffer external force. The casing 31 includes four inner side walls 311, a bottom portion 312, and four outer side walls 313. The four outer side walls 313 are respectively perpendicular to the bottom portion 312. The outer side walls 313 are connected end to end, and the bottom portion 312 is formed into a rectangular uncovered receiving space. The inner side wall 311 is integrally formed with the outer side wall 313 and is higher than The outer side wall 313. A plurality of slots 314 and a plurality of protrusions 315 are disposed in parallel with the surface of the inner sidewall 311. The slots 314 and the protrusions 315 are alternately spaced. At the intersection of the two adjacent inner side walls 311, four recesses 316 are respectively provided. The buffering member 32 is a long strip-shaped cushioning member, and includes two opposite side faces 321 and 322. One of the side faces 322 is provided with a plurality of latching pockets 323 and a plurality of latching slots 324. The plurality of latching tabs 323 and the latching slots 324 are arranged in parallel. The cassette 323 and the card slot 324 are alternately spaced in sequence. The latch 323 on the surface of the buffer member 32 conforms to the contour of the slot 314 provided on the surface of the inner wall 311 of the casing 31; the contour of the slot 324 on the surface of the buffer member 32 and the side wall 311 of the casing 31 are shown in 200824992 The face of the protrusion 3 15 rounds are consistent. The cover body 33 is a rectangular housing. The side wall of the cover body 33 has a stepped structure (not shown) corresponding to the inner side wall 311 and the outer side wall 313 of the box body 31 to realize the box body 31 and the cover body 33. Nested fit. In the package structure 2, the casing 31 of the package 30 and the cushioning member 32 are both made of a resin foamed material, such as high density polyethylene, polypropylene, and low density polycondensation as a polyolefin foam. Ethylene, ethylene-vinyl acetate copolymer, and the like. In the resin foaming material, a polyolefin-based pellet containing a foaming agent or a primary foam thereof is filled in a mold and heated at a constant temperature, and the expansion ratio is controlled to be 3 to 30 times. The foaming method can employ a low pressure foaming method, so that a low cost aluminum mold can be used. The thickness of each part formed by the resin foamed material is suitably 15 to 100 mm depending on the strength requirement. Moreover, the card slot 314 of the inner side wall 311 of the casing 31 and the card 323 of the surface of the cushioning member 32 can be made by the same mold, so that the design cost of the package is not greatly increased. The foaming process of the casing 31 and the lid body 33 of the package 30 can also be carried out by a method of doping and foaming with a conductive polymer or an antistatic substance to obtain a resin foaming material having a resistance of 10 to 10 Ω κπ. The glass substrate 21 does not damage the circuit inside the glass substrate 21 due to the generated static electricity. In the packaging process, the two buffering members 32 are respectively disposed adjacent to the opposite inner side walls 311 of the casing 31, and the latch 323 of the buffering member 32 is received in the card slot 314 of the casing 31. The card slot 324 of the 32 corresponds to the protrusion 315 of the case 31. Then, the stacked body 20 is received in the casing 31, wherein the two opposite sides of the stacking body 11 200824992 abuts against the opposite inner side surfaces 311 of the casing 31, and the other opposite sides respectively abut the two buffers. Side 321 of piece 32. Finally, the cover body 33 is covered on the casing 31, and the stepped structure of the side wall of the cover body 33 is correspondingly matched with the inner side wall 311 and the outer side wall 313 of the casing 31. In the package structure 2, the two buffering members 32 can be flexibly disposed, and can be disposed not only adjacent to the two opposite inner side walls 311 but also adjacent to the two adjacent inner side walls 311; the buffering can also be performed according to the size of the glass substrate. The number of pieces 32 is increased to three or four. When the number of the buffer members 32 is increased to three, one of the two buffer members 32 is disposed adjacent to the inner side wall 311 of the one of the boxes 31, and the other buffer member 32 is sandwiched between the pair of opposite inner side walls 311. The wall 311 is disposed; when the number of the buffer members 32 is increased to four, each of the buffer members 32 is disposed adjacent to the inner side wall 311. Compared with the prior art, the package 20 is packaged by the package 30, and the cushioning member 32 disposed adjacent to the inner side wall 311 is added to change the size of the receiving space of the package 30 to meet the packaging of different sizes of the glass substrate 22. Need to increase packaging flexibility. In addition, when the size of the glass substrate to be packaged becomes small, it is not necessary to redesign the package corresponding to the size of the glass substrate, but the package 30 is shared, and a different number of buffer members 32 can be added by the buffer. The member 32 fills the gap between the glass substrate 21 to be packaged and the inner side wall 311, so that the package 30 fits and holds the glass substrate 21 with the buffer member 32, thereby avoiding redesigning the new package 30, reducing waste of packaging materials and reducing cost. Please refer to FIG. 4 , which is a perspective exploded view of the packaging structure of the second glass substrate of the 12th 200824992 of the present invention. The packaging structure 5 differs from the previous embodiment in that the packaging structure 5 includes four cushioning members 52, 53, 54, 55, wherein the two cushioning members 52, 53 are disposed adjacent to the opposite inner side walls 511 of the casing 51. The other buffer members 54, 55 are respectively combined with the buffer members 52, 53. The two opposite sides 521 and 522 of the buffer member 52 are provided with a plurality of card slots 524 and a plurality of latches 523, and the card slots 524 on the same surface are disposed in parallel with the cassettes 523. The latch 523 located on the side surface 522 is correspondingly received in the slot 514 of the inner side wall 511. The slot 524 of the side surface 522 of the buffer member 52 corresponds to the latch 543 for receiving the buffer member 54. The cushioning member 53 has the same structure as the cushioning member 52, and is combined with the cushioning member 54 to be symmetrically disposed on the other inner side wall 511, and the engaging manner is engaged with the cushioning members 52, 53 and the inner side wall 511. The same way. With this kind of packaging structure 5, the storage space of the packaging box can be further reduced to accommodate the packaging of a small glass substrate size, and the glass substrate of a smaller size of the common packaging package can be satisfied. Of course, the number of cushioning members 52, 53 can be increased depending on the packaging requirements of the actual product. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalently modified or changed in accordance with the spirit of the invention. All should be included in the scope of the following patent application. 13 200824992 [Simple description of the drawings] Fig. 1 is a perspective view showing a prior art glass substrate packaging structure. Fig. 2 is a perspective exploded view showing the packaging structure of the first glass substrate of the present invention using a packaging box for packaging a glass substrate. FIG. 3 is a schematic perspective view showing the assembled structure of the package structure shown in FIG. Fig. 4 is a perspective exploded view showing the packaging structure of a second glass substrate in which a glass substrate is packaged in a package. [Description of main component symbols] Packaging structure 2, 5 card slot 314 Superposed body 20 Projection 315 Separator 21 Groove 316 Glass substrate 22 Buffer member 32, 52, 53, 54, 55 Package side 30 Side faces 321, 322, 521, 522 Case 31 ^ 51 cassette 323 , 523 inner side wall 311 , 511 card slot 324 , 524 bottom 312 cover 33 outer side wall 313 14