TW200812126A - LED, manufacturing method thereof, and light source produced by the LED - Google Patents

Abstract

The invention relates to an LED. The base has a main body, which is made by material with high heat conductivity and high light transparency, and is provided with an accommodation space opening upside. The body embeds at least two connection pins electrically connected outside and the space has at least one LED chip dissipating heat appropriately through the high heat-conductivity and high light-transparency main body. The LED can be assembled with a fixed plate to form an LED light source. The invention further discloses a manufacturing method of the LED, including material, mold, semi-sintering, electroplating, air protection, complete sintering, crystalline, wiring, plastic encapsulation, and etc.

Description

200812126 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode, and more particularly to a light-emitting diode using a highly thermally conductive and highly transparent pedestal; the present invention further relates to a light-emitting diode The method of making, in particular, a method of using a high thermal conductivity and high light transmission pedestal LED illuminator. [Prior Art]

Since the light-emitting diode (LED) chip is more efficient in energy application than conventional light bulbs or fluorescent lamps, it is small in size and more flexible in manufacturing and provides a wider range of applications. With the advent of white light-emitting diode chips, the proportion of illuminators made of these light-emitting diode chips in the illuminator market has been increasing year by year, which is quite a trend to replace traditional light bulbs or fluorescent light illuminators. According to the fifteenth figure, an exploded perspective view of an existing light-emitting diode illuminator is disclosed, which includes at least one light-emitting diode and a fixed plate, wherein: the light-emitting diode includes: a pedestal ( 8 0 ), comprising a body (8!) composed of a plastic material or a resin material, having a top surface and a back surface, the body (81) forming an accommodation space opening to the top surface, Further comprising: a heat conducting element (813), the heat conducting element (8") is composed of a metal-specific heat conductive material, which is embedded in the body (81)... and more: a guide: a form of a sheet; the heat conducting element ( 813) has a top, :: to the center of the bottom of the accommodating space, and has a bottom end connected to the back of the body (81) and formed into a flat shape; 200812126 two pins (82), which are buried In the base body (81), and extending from the accommodating space of the body (8 1 ), for power connection; a light-emitting diode chip (83), which is bonded by silver glue And the like is disposed on the top end of the heat conduction element (8 1 3 ), and the wafer (83) is set by The wires (8 3 2 ) and the like respectively electrically connect the electrodes to the second pins (82) 1 to be electrically connected to obtain the required electric energy; the light-emitting diode chip (83) and the wiring (8 3) 2) the structure is sealed by a transparent silicone as a protective layer to seal the wafer (83) and the wiring (83 2 2); when the wafer (83) is energized to generate heat, the heat can be borrowed The heat conduction element (8 i 3 ) conducts heat dissipation. θ is formed by a metal having a light-emitting diode system disposed on a fixed plate (9 〇 ), and a light-emitting diode illuminator. The fixing plate (9 〇 ) comprises a plate body (9 1 ) composed of a temple heat material, the plate body (Q 1 )

a surface and a back surface; the surface of the plate body (9 i) is provided with an insulating material (9 2 ); the insulating material (92) is opposite to the heat element of the pedestal (8 〇) 1 3) The bottom end is provided with a connection hole (9 2 1 ) to allow the heat conducting element (8 i 3) to be thermally connected to the board via the connection hole (9 2 1 ) of the insulating material (92) a body (q, ,, y, 丄), such that the heat generated by the wafer (83) can be derived from the heat conducting element (813) to the board (91) for heat dissipation; the insulating material (9 2 ) The conductive material (9 3 ) is respectively disposed opposite to the two pins (8 2 ), and the conductive material (9 3 ) is formed to match the legs of the pins r 0 ^, X , 8 2 ) 200812126 (9 3 1 ) 'The wafer (83) is supplied with electrical energy by electrically connecting the pins (8 2 ) to the outside via the conductive material (9 3 ). At present, in addition to the aforementioned white light emitting diodes, high-power light-emitting diodes have been developed and produced in practical stages. However, since the structure of the above-mentioned light-emitting diode is designed in combination with a light-emitting diode wafer having a relatively small power, it is not suitable for use with a high-power light-emitting diode wafer. When a high-power light-emitting diode chip having a power greater than 〇.5f or even up to iw is used for the existing light-emitting diode structure, it is not impossible to properly dissipate a high-power light-emitting diode wafer by the above-mentioned heat-conducting element. The heat generated during the time, which has the weakness of the structure of the light-emitting diode in the political heat, will further cause the high-power light-emitting diode wafer to effectively improve the heat-dissipating effect by increasing the heat-transfer element. Due to the structure of the existing light-emitting diode, the body (8 1 ) of the base (80) is made of plastic material or resin material in combination with the production method, and the thermal conductivity of the materials is poor, which hinders heat conduction or The heat is dissipated, so that the heat generated by the light-emitting diode chip (83) is completely blocked by the body (8 1 ), so that the heat energy required to be diverged is continuously concentrated when the light-emitting diode chip (83) is energized and illuminated. In the case of high-power wafer illuminating, the concentrated heat can bring the temperature to a high temperature of 400 degrees Celsius; as a result, not only the illuminating diode chip (83) is not properly operated due to heat, but the luminescence effect is seriously degraded. The service life of the chip (83) has also been greatly shortened, which not only has a negative impact on product quality, but also increases manufacturing costs and lowers the market's competitiveness. In addition, high-power LED chips are expensive. Being hot and not fully exerting its effectiveness will increase the burden of manufacturing costs. 6 200812126 Causes unnecessary waste. County & pen

The heart and the sputum are within the target range of the existing equipment for producing the light-emitting diodes. 'In any case, the heat-conducting element (8丄3) is enlarged, and the body (8 1) material is unfavorable for heat dissipation, which can provide The heat dissipation effect U catches up with the heat generation rate, so the conventional use of plastic material or resin material as the base (gQ) too #, , "ϋ J) body (8 1 ) has the light-emitting diode helmet method to solve the heat problem. Furthermore, the body (8 1 ) composed of a plastic material or a resin material is inferior in heat and has a low light transmittance, so that the wafer (8 3 ) disposed in the space of the body (8 1 ) is in a space (8 3 ) It can only emit light toward the top surface, and the side surface does not emit effective light, so that the illumination angle of the existing light-emitting diode is severely limited, so that the light-emitting diode has only the top surface light without the 1 light discomfort & The omnidirectional illumination uses make its related applications very limited. In addition, since the existing equipment for producing the light-emitting diode is mostly manufactured by a technique of continuous stamping, a bracket (not shown) is used, and then the body (8 i ) composed of the aforementioned plastic material or resin material is used. The pedestal (80) is formed by a technique of surface mount design (SMJ) on the support, and it is difficult to replace other materials at will with the production method. Moreover, the molds (not shown) used are not only expensive, but the modification of the mold structures is not only quite difficult, but also the cost of the modification is extremely large, so it is difficult to make corresponding changes according to the order. For example, the above-mentioned light-emitting diode system uses two pins (8 2 ) for use with a wafer (8 3 ). If it is desired to change a plurality of low-power wafers to produce a light-emitting diode and need to adopt a multi-pin structure, it is bound to be The establishment of a production line from scratch is an unbearable cost burden for producers. Moreover, it can be seen from the foregoing that the existing light-emitting diode illuminator is connected to the plate body (9 1 ) of the fixing plate (9 )) by the bottom end of the heat-conducting 7L piece (8 1 3). Since the bottom end of the heat conducting element (8丄3) and the fixing plate (90) are required for the surface adhesion design (SMD), the plane is connected to the plane, and it is difficult to achieve a completely close state. , resulting in incomplete heat dissipation. It is described that the existing light-emitting body is limited by structure, material, production mode, etc., and it is difficult to use high-power light-emitting diode crystal #, which cannot effectively dissipate heat, has no side light, is limited by production methods, and is difficult to change design. The shortcomings of cost and low efficiency need to be improved. SUMMARY OF THE INVENTION The main object of the present invention is to provide a light-emitting diode. The main purpose of the present invention is to provide a light-emitting diode, which (IV) has effective heat dissipation, has side light, is easy to change design, and is capable of high efficiency in consideration of cost. .

In order to achieve the foregoing main object, the technical means adopted by the present invention is such that the light-emitting body includes: the earth seat includes a body composed of a heat-conducting and high-light-transmitting material, which is formed with a space open to the top surface. a space; at least two pins embedded in the base body, and electrically connected to the outside from the accommodating space to obtain a power supply; at least one of the body wafers is disposed on the body And the θ θ film is electrically connected to the electrode to the at least the foot to obtain the required electric energy; the illuminating diode chip and the structure of the illuminating diode chip and its 8 200812126 are connected to the pin #±, 杀 ta μ ^ "Hunting--transparent" as a protective layer covers the current wafer and its electrical connection to the pin's surname, and the structure is used to protect the effect. When the 曰Η is energized to generate heat, The heat + 2, the sundial can be caused by the above-mentioned body conduction composed of a highly thermally conductive and highly transparent material. ^ ^ J is suitable for effective heat dissipation, and because the body has high light transmittance, 曰n. , f U is not only facing the top surface of the day, but also illuminating the side with the day to achieve all-round illumination. effect. Another object of the present invention is to provide a method for producing the above-described light-emitting diode. Cheng Tai ^ achieves the technical means adopted by the foregoing objects of the present invention. When the foregoing structure is a thermally conductive and highly transparent material-glass material, the method for manufacturing the light-emitting diode includes the following steps: Providing glass powder and at least two pins, heat conductive elements; 铸 Mold: designing a body according to the required body size, shape, etc.; semi-sintering: semi-sintering the glass powder to form the body; electric ore and plug-in : The foregoing heat conducting component and the pin are recorded, and the plated, several heat conducting components and (4) are placed on the mold corresponding to the position of the body; < Gas protection and complete sintering: the semi-sintered body is matched with the aforementioned mold = complete sintering, the body, the heat conductive element and the pin-body forming, i, providing inert gas for gas protection during sintering; and it may further comprise a step of electroplating to facilitate electrical connection of the pin; The light-emitting diode chip is disposed in the body accommodating space. Preferably, the heat-conducting element has a first end of the 200812126 connected to the accommodating space. The light-emitting diode chip is disposed on the first end; wire bonding: electrically connecting the electrodes of each chip to the corresponding pins; sealing: covering the wafer and the electrical connection thereof by using a silicone protective layer To play a protective role; $ to make Shi Xijiao effective curing, 1 can be baked in the oven for a short time until the silicone curing. Moreover, when the foregoing system adopts high thermal conductivity such as high thermal conductivity and high light transmission plastic, high thermal conductivity and high light transmission pc material or high thermal conductivity and high light transmission acrylic material (Acryl). When the high light-transmissive plastic is formed, the method for manufacturing the light-emitting diode comprises the following steps: providing material: providing high thermal conductivity and high light-transmissive plastic and at least two pins, and further providing a heat-conducting component; The body size, shape, etc. are designed and manufactured to make a body; wherein the body can be combined with the at least two legs and the like to form a barb shape for fixing the components; _ Die casting · the high thermal conductivity and high light transmission plastic Die-casting to form the body; electroplating and inserting: the above-mentioned heat-conducting element and the pin are plated with nickel, and the plated, heat-conducting heat-conducting element and the pin are placed and fixed at a predetermined position of the body, and can be formed by the body The shape of the barb is used to strengthen the relative position between the heat conducting component and the pin and the body, so that the body, the heat conducting component and the pin body are formed; and a glue step may be included to strengthen the Bonding between the heat-conducting element and the body and the pin; solid crystal: the light-emitting diode chip is disposed in the body accommodating space 10 200812126, preferably the heat-conducting element has - communicates with the foregoing accommodating a terminal, wherein the light-emitting diode chip is disposed on the first end: the connecting line of the .. The electrodes of each chip are respectively connected with the corresponding pins to form an electrical sealing glue: the protective layer of the time-covering rubber covers the foregoing structure In order to play a protective role; in order to make Shi Xijiao efficient m: the box is baked for a short time to bake ' until the silicone gel is cured. According to the above, the present invention can provide a light-emitting diode, which can effectively dissipate heat, has side light, is easy to change design, and can be considered to be capable of high performance. In addition, the present invention can also provide/provide the light-emitting diode: Method to effectively manufacture the light-emitting diode. [Embodiment] The embodiments of the present invention are described below in conjunction with the drawings. The embodiments are intended to be illustrative of the embodiments of the invention, and are not intended to limit the invention. Referring to the first drawing, a side cross-sectional view of a first embodiment of the present invention is disclosed. A first embodiment of the present invention includes a base (1 〇) including a body made of a highly thermally conductive and highly transparent material, the body (1 1 ) having a top surface and a back surface and forming a top surface Each space of the surface opening (1 1 2 ); in the embodiment, the high thermal conductivity and high light transmissive material is a glass material. At least two pins (1 2 ) are embedded in the body (1 i ) of the base (1 )), and the pins (1 2 ) are from the housing space of the body (1 1 ) 11 200812126 ( In 1 1 9 , # , , 2 Z ), the sub-outward extension power supply connection. Just to say the body (there is at least - the light emitting two (112) bottom is provided with s ° - Japanese (1 3), in this embodiment Γ ρ, φ, the first diode chip (1 3), The system is fixed with silver glue (not shown) to accommodate the bottom space of the bottom body (1 1 ) (1 ί 2 ) Christine #8) to 〉, with two electrodes (not shown), two steps To the electrical connection two::: (four) two pins (1)) ... into - electrical connection: then: ?:: body wafer (1 3) and their chat (") 3) to play a protective effect. "The guarantee layer of the Bao Da layer (13 2 = the light-emitting diode of the example can be additionally combined with a fixed plate (not shown), and the mouth of the mouth constitutes a light-emitting diode. ^ ^ ^ $ There is a metal material composed of a hot material, and the surface of the plate body is provided with a π to the surface of the surface and a bottom plate; the body of the base (T ^ 忒, ,, 巴, · 彖 枓 relative In the above version I 1 1) is the face between the Department of the Department of the ancient. With the gentleman Μ / where you sigh a connection hole (not shown), h body (1 1) can be insulated by the board #, you乂4 ☆ The bamboo heart reverses the connection of the hole heat to the body, so that the light-emitting diode crystal passes through the broken glass body (J 2 }, except for the body (1 " two is emitted in the air, The heat is dissipated by the special body to the plate body; a conductive sub-sector is formed on the two legs (丄2), the coffin, and the Jd J, respectively. Pin 2 2) pin 2) via the conductive (four) foot <, from the pin (: LV private material department to external electrical connection to obtain power. This embodiment uses the plural in addition to the foregoing In addition to the photodiode 12 200812126 3 ), it is also possible to provide only the embodiment of the accommodating space of the main body (1 1 ), and the polar body wafer can be used. A light emitting diode chip (1 3 ) (112) at the bottom, and when the single-use power is 0.5W or less, and the light is generated by the light-emitting light, the high-heat-conducting and high-transmission glass material is far superior to the heat dissipation effect of the plastic material or the resin material. Even if no additional heat conducting element (not shown) is used, in the present embodiment, the generated heat can be efficiently radiated by the body (1 1 ) formed of the glass material as described above. The body (glass) composed of the glass material has high light transmittance, so that the light of the wafer (13) is not only emitted toward the top surface, but also passes through the body of high transmittance (丄" Achieving a full range of illumination effects. The plurality of light-emitting diode chips (i 3 ) simultaneously emit light, and the result of the addition of the light-emitting effect is comparable to that of a single high-power light-emitting diode chip (1 3 ). Example change The body of the susceptor (11) is made of a hot and highly transparent glass material, and the manufacturing method thereof is different from the manufacturing method of the existing luminescent diode, and the mold (not shown) is not only combined with the clothing. Different from the fixtures used in the case of the light-emitting diode, the cost of the mold of the present embodiment is far lower than that of the existing mold for manufacturing the light-emitting diode, and thus is not subject to various manufacturing methods of the existing light-emitting diode. Restrictions, measurable order requirements and cost, can be changed to create different numbers of wafers, with different numbers of pins, one pole, or the size of the pedestal. Therefore, designs are designed in a variety of sizes and shapes. The relevant options are all 13 200812126 with considerable freedom. Fossils ^^成<Environmental protection perspective, "Materials are mainly made of...:" will not be made of plastic materials or resin materials, and:: 〇 〇 多 多 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二The second embodiment of the present invention is similar to the above-mentioned susceptor (2 Π, , 汽 例 , 同样 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 晶片 晶片 晶片 晶片 晶片 晶片 晶片(2 1, 2 from the light-emitting diode J) and as a protective layer of the stone film (9 q Q,

Block (9 rv, 乂 ύ ύ d ); but 兮 I in addition to the high thermal conductivity and high light transmittance of the glass material 掣 X soil capacity / W / U Ι τ r; T clothing and the right two (212) ontology (21" Bu, in addition to - guide: (2 1 3), the heat-conducting element (2 1 3) # ά人m,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The bottom end of the body (2 1 ) has a first end connected to the back side of the accommodating space (2丄2), and has a second end, connected to the body (2 1 The wafer (23) is disposed on the first end of the heat conducting element (2). As described above, since the structure of the present invention is less limited by the production method*1 Γ^ ι The second end of the heat-conducting element (2 1 3 ) can be formed into a flat shape suitable for 矣%.& surface-adhesive design (SMD), and can also be formed into a rod shape suitable for sling or other suitable for further application. The following is a cross-sectional view of another embodiment of the second embodiment of the present invention. Typically, the light-emitting diode is combined with a fixed plate (25) to form a nine-two pole. The illuminator; wherein the fixing plate (25) comprises a heat-conducting plate body (26) of 20081212, which is provided with an insulating material (?7) on the plate body (2 6 ) The material (# I 2 7) has a conductive material (9 1). The conductive material is in the state of $ / , and is shaken at a suitable position to form a pin to be connected to the aforementioned pin (2 2 ). ;, Tian Ben η know that the fixed plate is installed (the heat-conducting plate (2 6 ) of the fixed plate (2 5, 0; , Ζ 5) can be described as a heat-conducting element (2 " Corresponding to the hole position of the Ζ 1 3 ) (2 6 丄), and the guide member (2 1 3 ) is formed into a rod shape and is inserted in the hole position (2 6 1 ) to achieve Excellent heat dissipation effect. 'In this embodiment, the heat-absorbing and south-transparent glass material body (2 1 ) and the v-heat element (2 1 q, 隹 - 13) are taken into the lamp to dissipate heat. When the wafer (2 3 ) is energized and illuminating, the amount of enthalpy generated by the illuminating light can be circumscribed by the ancient 4l ^ ..., and is efficiently conducted to dissipate heat. Further, as described above, as a protective layer, Shijiaojiao - 彡LJJ 3) Approximation In an embodiment, the amount of the ruthenium-emitting diode chip (23) and the pin (22) can be used in the amount of electricity, and the structure can also be used in a large amount of tantalum (2 3 3 ), not only兮,+,变# The essay reaches the coverage effect, and the space (2 1 2) of the main body (2 1 ) is 埴, the life is full, and the shi 胶 (2 q 3 ) is slightly convex. The occlusion space (2 1 2 ) is outside the opening of η yz to provide a concentrating effect. Furthermore, in this embodiment, as in the first, for example, a plurality of light-emitting body wafers or a single light-emitting body wafer may be employed. m Please refer to the fourth figure, which discloses the present invention. The embodiment of the side of the moon, the example of the side profile, and the third embodiment of the present invention are the same as the former 15 200812126. In this embodiment, the m", ... a small amount of Shijiao (2 3 3) And a cover body (3 1 ) covering the opening of the main body (2 1 ) receiving space (2 1 2 ), and a cover (3 1 ) on the top surface of the main body (20). The body (3 1 ) is made of a glass material of a hot and high light transmission, which has a surface disk, a dangerous surface, and a cavity (3 12) formed therein. The cavity (3Ί9, with a (3 1 2) on the bottom surface of the cover (31), is shaped to correspond to the accommodation of the body (2 1 )*

The opening (212) is opened, and the cover body (31) is combined with the body (the surface of the cover body (3 1 ) is formed into a convex shape such that the cover body (3 1 ) is at the surface thereof Formed as a structure similar to a convex lens. When using the embodiment, the light emitted by the light-emitting diode chip (23) toward the top surface passes through the cover (? 7 π ^ dry body (31) surface, borrowed The structure of the convex lens can reduce the light-emitting angle and play a condensing effect, and is particularly suitable for illuminating a part such as an exhibit (not shown), or for illuminating jewelry, etc. The first hand, the difference object (not shown) is applied to provide a better display effect. When the embodiment is matched with a high-power light-emitting diode chip (2 3 ), the material can be made as described above. In addition to the good lighting effect, the heat generated by the energization and illuminating can also be properly dissipated by the body (2 work) and the cover (3 work) made of the high thermal conductivity and high light transmittance glass material. And the space of the body (21) (HU virtual cavity of the military body (31) The convection of the gas in 312) contributes to the conduction of the generated heat, so that the heat can be more evenly transmitted to the body (2 1 ) and the cover (3 1 ), thereby enhancing the heat dissipation effect. 16 200812126 In this embodiment, a plurality of illuminant wafers or a single illuminant wafer can also be used. Please refer to the fifth drawing 'a side cross-sectional view showing a fourth embodiment of the present invention. The fourth embodiment of the present invention is the same as the foregoing The second embodiment is different in that the embodiment uses a smaller amount of silicone (2 3 3 ), and a cover on the top surface of the body (21) of the base (20) is provided to cover the body 1 ) The space (2 1 2 ) is open and the light transmittance is lower than that of the glass (41). The light shielding body (4 1 ) is made of a plastic material or a frosted glass material, and the light transmittance is low. The light-shielding effect can be exerted; the size of the light-shielding body (4 is corresponding to the top surface of the body (2 i ), and can cover the opening of the body (2) space (2 1 2); the light-shielding body ) is combined with the body (2 1 ) to block or attenuate light there. Furthermore, this embodiment can also be used a plurality of illuminant wafers or a single illuminant wafer. When using the embodiment, when the light emitted from the illuminating diode chip (23) toward the top surface passes through the top surface of the opaque body, The light-shielding body (4 1 ) blocks or weakens, so that the top surface is not emitted on the top surface: the second light, or the light emitted from the top surface is weakened, so that the top surface light is dimmed from the side surface, and thus the new light is provided. The light effect, the body to carry out a wider use; for example, as shown in the fifth figure, the invention is broad: the extreme example is to use a light-shielding body which can moderately reduce the top surface light, so that only the weakness and then the brightness similar to the side light is observed. Make this real two: first reduce the percentage of the case to form 17 200812126

Degree of lighting. It can be seen from the above that the present invention can provide a light emitting diode capable of

System, so it is possible to consider the cost,

High efficiency is achieved by placing single or multiple light-emitting diodes. Referring to the sixth drawing, a flowchart of the light-emitting diode system according to the fifth embodiment of the present invention is disclosed. A fifth embodiment of the present invention is a method of fabricating a light-emitting diode for fabricating the light-emitting diode of the second embodiment. The tanning method sequentially includes providing material (5 1 ), mold (52), semi-sintering (5 3 ), electroplating and combination (5 4 ), gas protection and complete sintering (5 5 ), solid crystal (5 7 ), Steps such as wire bonding (5 8 ) and sealing rubber (5 9 ), if you want to use the surface adhesive design (SMD) installation method or a fixed plate (not shown), you can further add a chat (6 1) and the steps of installing the fixing plate (62) are as follows. 1. Providing materials (5 1 ) Please refer to the second figure. The materials provided in this step include broken glass powder (not shown), thermal conductive element (213) and at least two (2 2 ). In the example, the glass powder is made of granulated glass 1), the heat conducting element (

The size of the body (2 1 ); || 1 3) for manufacturing the pedestal (20), and the size, shape, etc. of the body (22) body (2 1 ) 18 200812126 The pins (2 2 ) are all made of a thermally conductive metal material, and the heat conducting elements (2丄3) are formed in a rod shape. In addition to the political plaque, the above-mentioned glass powder can be made of sodium-dancing glass powder, and the enamel is made of electronic graded glass powder. The glass powder is sintered to form a glass material having high thermal conductivity and high light transmittance. Second, the mold (5 2 ) This step is based on the required body (2 work) size, shape, etc. to design the mold (not shown) to shape the body (21), and plan the body in the mold (2 1) A through hole (not shown) through which the heat conducting element (2) 3 and the pin (2 2) are pierced is provided. In this embodiment, the mold is made of a graphite plate. 3. Semi-sintering (5 3 ) The glass frit is semi-sintered to form the body (2丄). In the present embodiment, the wax burning process is carried out in advance to obtain a clean body (2 1 ). 4. Plating and combination (54) Since the glass material of the body (2 1) and the metal material of the heat conducting element (2丄3) and the pin (2 2) respectively have different expansion coefficients, in order to avoid being subjected to the body (2) 1), the thermal expansion element (2 1 3 ) and the pin (2 2 ) have different degrees of thermal expansion affecting the glass breakage, in this step, the heat conducting component (2 1 3 ) and the pin (22) are nickel plated, And the nickel-plated heat conducting component (21 3) and the pin (22) are placed on the fixture to correspond to the through hole of the body (2 1 ). In addition to the aforementioned nickel plating method, the heat conducting element (2 1 3) and the pin (22) are plated in the same manner as the nickel plating method described above, and the nickel is first plated with nickel, followed by copper plating followed by silver plating for subsequent operation. industry. In this embodiment, after nickel plating, copper is plated 2 microns and silver plated. V. Gas protection is completely sintered (5 5 ) The semi-sintered body (2 1 ) is completely sintered in cooperation with the aforementioned mold, so that the body (24), the heat conducting member (213) and the pin (22) are formed, and During the sintering process, gas protection is adopted to avoid the melting of the metal components such as the heat conduction element (3) and the pin (2 2 ) or severe oxygen: In the present example, the complete sintering process is carried out in a furnace for 30 minutes at a temperature of & degree and gas is protected by an inert gas commonly used in the art. In addition, after the completion of the above-mentioned complete sintering process, the electric charge (5 5 a) will be applied to the pin (2 2 ), and the conductivity of the pin (2 2 ) is enhanced by electroplating to facilitate the connection. The foot (2 2 ) is electrically connected. The electric ship in this step is mainly a metal such as nickel, silver or copper. Φ 八, solid crystal (5 7 ), the body (2 1 ) has an accommodating space (2 丄 2 ), and the foregoing:, 兀 (2 1 3) has - communicates to the aforementioned accommodating space ( 2 1 2) The first end of the bottom center. In this step, the light-emitting diode chip (23) is disposed at the first end of the heat-conducting element (2丄3); the present embodiment: adopts eight 15-mil light-emitting diode chips (23) The embodiment is characterized in that 8 wafers (23) are bonded to the first end of the heat conducting element (2 1 3 ) by silver glue (not shown). Nine, the line (5 8) 20 200812126 line (not shown) pin (2 2 ) ' so that each crystal by the wire in this step is the use of a plurality of electrodes (2 3) Establish an electrical connection. X. Sealing glue (5 9 ) In this step, silicone rubber (2 ? q, $ , ι, a, 匕d 3 ) is used as a protective layer to protect at least one 曰 film (23) and wiring structure; Secondly, it can be used in conjunction with the demand of the order or the consideration of a, and the use of a smaller amount of Shixijiao ur 9 Q Λ , /2 3 3 ) covers the crystal (2 3 ) and the wiring temple structure, or adopts the age of guests. ! The silicone (2 3 3 ) is filled in the accommodating space (2丄2) of the main body (2 1 ). Also: to: the glue is effectively cured 'can be used in the oven after baking, the two or two short-day bake roasting to make the silicone rubber curing element into the sealing step can be made the above-mentioned I---- Light-emitting diode 0 XI, folding foot (6 1 ) If the shape of the light diode is required, not shown)

The hair is mounted by a surface mount design (SMD) method in which the aforementioned pins (22) are bent to be suitable to fit a surface mount design (SMD) operation such as a foot position (a relative structure such as a figure) The shape of the fixing plate (6 2 ) is suitable for the convenience of the subsequent application, and the light emitting diode can be combined with a fixing plate to form a light emitting diode illuminator; The fixing plate comprises a heat conducting plate body provided with an insulating material, and the insulating material is provided with a conductive material formed with a matching pin (2 2 ) to open the pin (2 2 ) > Electrically connected, and the heat conducting plate body of the fixing plate is formed 21 200812126 has a hole position (not shown) corresponding to the heat conducting element (2 1 q ^ , , π , zi · 3 ) for the heat conducting element (213 ) The first - Di ~ From the "1 heart" is set in the hole, to achieve a better heat dissipation effect. Please refer to the brother's seven maps' disclosure of this day, Chu, every smart +1 Mingdi six A flow chart of a light-emitting diode system according to the embodiment of the present invention. The sixth embodiment of the present invention is a method for fabricating a light-emitting diode. The method is used for manufacturing the above-mentioned light-emitting diode. The manufacturing method includes a supply material (71), a mold (72), a die-casting (73), a plating and a combination (7 4 ), and a solid crystal (57). Steps such as wire bonding (5 8 ) and sealing rubber (5 9 ), if you want to use the surface adhesive design (SMD) installation method or a fixed plate (not shown), you can further add the folding foot (6). i) and the steps of installing a fixing plate (6 2 ); in addition to providing materials (7 1 ), mold (7 2 ), die casting (7 3 ), and plating and combination (7 4 ), etc. In the same manner as the above-mentioned fifth embodiment, the steps of providing the different materials (7 1), * molds (72), pressures (7 3), and plating and combination (74) are as follows. Providing material (7 1 ) The materials provided in this step include high thermal conductivity and high light transmission plastic (not shown), heat conducting element (2 13) and at least two pins (2 2 ), in this embodiment In this example, the high thermal conductivity and high light transmission plastic can be made of materials such as high thermal conductivity and high light transmission plastic (Plastic), PC material or acrylic material (Acryl). The body (2 2 ) of the base (20); the size of the heat conducting element (2 1 3), and the size 22 of the pin (2 2) 200812126 and the number are the same as the size and shape of the body (2!) In this embodiment, the heat conducting element and the pin (2 2 ) are both made of a thermally conductive metal material and the heat conducting element (2 i 3 ) is formed into a rod shape. 7 2) This step is to design a mold (not shown) according to the size, shape, etc. of the body (21) required to shape the body (2 1 ), and plan the body (2 1 ) in the mold. The through-holes of the heat-conducting element leg (1)) (not shown in the figure; body: 1:) can be formed by the components of the at least two legs (2 2) to fix the components (213) ( 22) The shape of the barb (not shown). 3. Die Casting (7 3 ) The above-mentioned high thermal conductivity and high light transmissive plastic is die-cast to form the body (21); 4. Electroplating and combination (74) The foregoing is referred to as element f 9 1 Q, ·〇: M / 守... 1 1 1 1 13) and the pin (22) are plated according to the method disclosed in the fifth embodiment, and the nickel-plated heat-conducting element (2 1 3 ) and the pin (2 2) are placed and fixed on The position of the body (2 1 ) is the same as that of the main body (2丄), and the relative position between the heat-conducting element such as the squid shape and the pin and the body is formed by the body. The heat conducting element is integrally formed with the pin. In the present embodiment, the steps of providing the material Xiao (7 1 ), the mold (7 2 ), the ^ scale ^ 73 ), and the electric recording and the combination ( 7 4 ) are different from the aforementioned fifth embodiment, Since the material properties of the fifth and sixth embodiments of the present invention are different, in the present embodiment, the pressure (_3) 23 200812126 of the body (2 1 ) and the two steps of electroplating and combination (7 4 ) are formed. Muir corresponds to the first ten 笪 之 之 烧结 ( ( 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应Ife * ^ ^ r ο 1 λ ι has a little glue step (7

4a) 胶 by the joint between the body (21) and the heat conducting element (W and between the body (2 1 ) and the pin (2?, 夕 „3), 2), the body can be made (2 1), heat conduction... the effect of the combination between the appropriate amount (2 2 ). 1 3 ) and the pin. In addition, the convenience of the light-emitting diode produced in this embodiment can also make the light-eating Application "』7 must be a special body and a one-light LED illuminator; in the meantime, the combination of the people from the composition of the apricots, such as the grasp of the ancestors, is similar to the above-mentioned 笫" The method can achieve better heat dissipation effect by connecting the heat-conducting plate body of the heat-conducting element five boards. It can be seen from the above that the present invention can also provide the light-emitting to effectively manufacture the light-emitting diode. In addition, please refer to the first figure, and each of the weaving Zhusho-Tian made the light-emitting diodes as in the first example of the above-mentioned method, which is used as the gripper in f, because it does not use heat-conducting components. , because, one (not shown in the figure) does not form a pair of 鐾赦 | | | | | | | | | | | | | | | | | | | | | | | |兀 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿 穿In addition, the body side of the seven-part embodiment of the above-mentioned fifth or sixth embodiment of the chrome ice-k _ 々 衣 造 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 关于 改变 改变 改变 改变24th and 12th generations with different shapes

= ^00). The body (100) has a central recess (1 0 1 ) in addition to an accommodating space ') for a low-power single-crystal light-emitting diode (not shown). Figure No) No setting, and has a jack (1 2 2) for the pin (not shown). The jack (1〇2) is formed with an opening in the receiving space (1 0 3) of the main body (1〇〇) and the bottom of the main body (i 〇〇), and a fixed connection is formed at each opening. The dispensing recess (1 0 2 1 ) ( 1 〇 2 2 ) for the foot can be used in the dispensing recess (1 0 2 1 ) after the embedded pin is placed in the jack (Work 2) (1 0 2 2) Point the gel to further secure the pins. Referring to the ninth to eleventh drawings, a side cross-sectional view of the body of the eighth embodiment of the present invention and a schematic view of the fixed light emitting diode chip on the heat conducting member are respectively disclosed. When the light-emitting diode of the present embodiment is manufactured by the method described in the fifth or sixth embodiment, the mold can be changed according to requirements to obtain a body (1 1 0/) having a different shape, and the body (1 1 〇) is Has an accommodation space (not labeled). The body (1 1 〇) of the embodiment is designed to be used with a heat conducting component (121) embedded in the body (110), so that it has not only a socket (1 i 3 ) for embedding the pin, but also a setting For a larger power LED chip (i 3 ]_) or a plurality of smaller power LED chips (1 2 2 ), the aforementioned heat conduction element (丄2 i ) is required, and the body (11〇) is used. A through hole (1 1 1 ) penetrating to the bottom of the body (1 1 0) is formed in the center of the bottom of the accommodating space for the aforementioned heat conducting element (1 2 1) to be inserted. The through hole (1 1 1) is formed at the bottom of the body (1 1 〇) 25 200812126 respectively with a dispensing recess for opening the foot) in the through hole (the step is fixed to the bottom of the bottom of the heat conducting component accommodating space) And the main body (1 1 Q) port ' is formed at each opening for reinforcing and fixing (not labeled), after embedding the heat conducting element (^ 2 ] 1 1 ), the gel is added to the dispensing concave point to advance ( 12 1) Referring to Figures 12 and 13, respectively, a side cross-sectional view and a perspective view of a body according to a ninth embodiment of the present invention are disclosed.

According to the method described in the fifth or sixth embodiment, when the rabbit photodiode of the present embodiment is made, it is possible to obtain a body of different shapes (1 4 Q) according to the demand. The body (丄4 q ) of the embodiment is formed on the outer peripheral wall to form a plurality of mountain-shaped convex (four) in the shape of a mineral tooth, which has an accommodating space (work 43), is matched with a heat conducting component, a few Vi41), and is matched with the pin. The jack (1 4 2 ). A series of 掂目, 4 B), is a heat-conducting element (not shown) with a convex ring (not shown), 右 is right wood) has a ridge (not shown) pin (Figure Not in the middle). In addition, the through hole ( , 丄 4 1 ) has a groove (1412) matching the component ring, and the heat conductive element is inserted into the through hole from the receiving space (143) of the body (140). (ι:1) is formed in a communication opening (143) to form a meandering opening (14, 4) having a slanted inner wall. On the other hand, each of the insertion holes (12) is also formed to match the aforementioned pin. a groove of the convex ring (丄4 2 and a connecting opening at the valley space (143) for facilitating the insertion of the pin into the insertion hole (1 4 2 ) (Ί 4 9 π 1 , , , , J , 丄 固定 fixed Fanggong is a professionally strengthened ^ ^ ^ ^ ^ ^ ^ ^ ^ &S; Shuanghe and k-lit electroplating and plug-in 4) (7 4) process (sixth and seven-figure reference) more favorable design, 26 200812126 provides a barbed fixed-effect 4, Γ 7 /1 system, while promoting the plating and plug-in (5 4) ( 7 4 ) process smoothly. Please refer to the fourteenth figure + ancient technology + secret The invention has a top view of a body of a ninth embodiment of the present invention, which is provided with a straight strip. In the present embodiment, the structure is formed on the inner peripheral wall of the through hole (i 4 i ). There are a number of straight strips (丄^元#ΛΛ ^ Λ, s 1 3 ), in order to facilitate the insertion of the electroplated thermal conductive element, and more suitable for the resurfacing, the main mouth, the mouth 疋. The structure of the observation tool can be found that the inner wall profile is formed into a gear stripe shape by having the aforementioned 4 1 3 ). Please refer to the fifteenth to eighteenth drawings. A perspective view of a seventh to a ninth embodiment: The seventh to ninth embodiments of the present invention can be implemented in different implementations in accordance with the illuminating diodes used for the purpose of obtaining the best implementation. Designing different mold cast bodies (1 〇〇) (1 1 0 ) (i 4 0 ). For the foregoing seventh embodiment, 'the seventh embodiment is implemented with a small-rate light-emitting diode wafer. Mainly 'so it only uses two pins

Ht), in most cases, is sufficient to supply the power required to illuminate a low power LED chip. A. Referring again to the ninth to tenth drawings, the eighth embodiment of the present invention has (4) a heat conducting element (121) and is mainly provided with a large power: a first diode chip (i 3 i ) or a majority A smaller power LED chip (1 2 2 ). In particular, the supply of a plurality of light-emitting diodes 2 2 ) ' uses four pins (丄i 4 ) to facilitate the wire ($ 8 ) 27 200812126 process (refer to the sixth and seventh figures). The first embodiment of the foregoing ninth embodiment, the effect and the plating and insertion 4 (54) to further enhance the fixed reference) convenience, as for its shape 4) A (different six and seven figures, n X ^ reveals the use of the sawtooth shape body ( 1 4 0 ), other shapes can also be changed..^ α, the shell is as bad as the sample, such as the column-shaped shape body known in this embodiment (Ganzi 1 1 4 0 a ) (18th figure Reference), which is formed on the outer circumference of the body (1 4 〇) to form a flange (not labeled),

The change in shape 2 does not affect the advantages of this embodiment at all. It can also be used with four pins (1 4 4) when it is implemented in a light-emitting diode (not shown) or a plurality of smaller power LEDs (not shown). a) In addition to the above-mentioned implementation of the light-emitting diode itself, there are other different implementations when it is implemented in the n-light monolithic body with a fixing plate or other fixed components. Ming Cang read the nineteenth figure, revealing the three-dimensional embodiment of the tenth embodiment of the present invention

The tenth embodiment of the present invention adopts a continuous body (2 1 〇) having a plurality of accommodating spaces (2 16 ) for respectively providing a light-emitting diode wafer (2 1 4 ), and the body ( 2 1 〇) embedded chip-shaped pins (2 1 1 ) for power supply connection of the LED chips (2 1 4 ) and an external power source (not shown), and in the accommodating space ( 2 1 6) a large volume of heat conducting elements (2 1 5 ) are respectively disposed below for effectively dissipating the heat generated by the operation of the light emitting diode chips (2 1 4 ); (2 1 1 ) corresponding to each of the accommodating spaces (2 1 3 ) 28 200812126 extends into each of the accommodating spaces (213) to supply power to the electrodes of the illuminating diode chips (2 1 4 ). The heat conducting element (2 15) of the present embodiment can be further connected to an external heat sink, and is suitable for a closet lamp, an illumination lamp or the like which requires high power. A "three-dimensional view of the tenth embodiment of the present invention is disclosed. The eleventh embodiment of the present invention is similar to the foregoing tenth embodiment, except that the present embodiment is specifically directed to a low power light emitting diode chip (2' 2 4 ) and * is described in the tenth embodiment. The heat conducting element #, but the continuous body (220)' also has a plurality of accommodating spaces for separately arranging the light emitting diode chips (2 2 4 ), and embedding the sheets in the body (2 20) The pin (221) is connected to the low-power LED chip (2 2 4 ) and the external power source (not shown), wherein the chip pin (2 2 i ) corresponds to each other. The space (2 2 3 ) extends into each of the accommodating spaces (2 2 3 ) to supply power to the electrodes of the low-power LED chips (2 2 4 ). Since the body (2 2 0 ) is made of a material having high thermal conductivity and high light transmission, the heat generated by the low-power LED chip (2 2 4 ) can be obtained by the body (Μ 0 ). Thermal conductivity. In this embodiment, the low-power light-emitting diode (2 2 4 ) Μ heat is directly used by the body (2 2 m 邕 φ 乙 u), and is suitable for low-power closet lamps, nightlights, decorative lights, and the like. Please refer to the first drawing to disclose a perspective view of the present invention 0 Η ^ 1 LED chip. Twelfth embodiment omits 29 200812126 The twelfth embodiment of the present invention has a body (230) having a wide accommodating space (234), and the accommodating space (2 3 4) Formed into a square or other wide shape; and the body (230) is provided with a heat conducting element (23 1 1) located in the center of the receiving space (234) and a six-pin surrounding the heat conducting element (23 1 1) (2 3 2 ). In this embodiment, a red, green and blue light-emitting diode chip can be arranged for a decorative lamp or the like; and a plurality of white light-emitting diode chips can be used to enhance the brightness for use in a table lamp or the like.

A perspective view of a light emitting diode chip. According to a thirteenth embodiment of the present invention, the body (2 4 0 ) of the base of the plurality of light-emitting diodes is disposed on a large heat-dissipating rod (2 4 6 ), and the divergent: two “6” are formed to have a plurality of Straight square bar shape, in order to be equal to $ hot metal, g ... plane: not to mention the plural body (2 4 〇) can be divided into 4 1) and at least - 4 U) bury a thermal element (2 a pin (242), wherein the cymbal--from 1) is coupled with the aforementioned heat-dissipating rod (24R...the V-piece (24 and the aforementioned pin (2, 4, ocular to conduct heat therebetween; It can be completed, for example, as in the prior art, and has a heat-conducting element (two: connected to a power source. This embodiment is composed of a heat-dissipating structure composed of a body (2 4 heat-dissipating rods).

5 can challenge the big I I to replace the lighting of the current high-angle lighting, even & a, incandescent tube. Referring to Figure 23, a perspective view of a light emitting diode chip. The fourteenth embodiment of the present invention omits 30 200812126. The fourteenth embodiment of the present invention has a cylindrical metal member (2 5 6 ) having an opening which can be adapted to the actual use environment. The segments are connected to each other, but the segments are connected to each other, but are formed into different diameters; a fixed plate (2 5 7 ) is disposed at the opening of the tubular metal member (256), which is mainly printed. A printed circuit board (PCB) is provided for the plurality of bodies (25 〇), and each body (250) is embedded with at least two pins (252) and a heat conducting component (2 5 1 ). The heat conducting plate body (not shown in the twenty-third figure) of the fixing plate (257) can be connected to the heat conducting elements (251) of the body (250) for better heat dissipation. A plurality of high-power LED chips are disposed, and it is possible to achieve or even surpass the luminous effects of conventional lamps in a small number of generations. Specifically, the LED lamp having the structure of the embodiment can be replaced by a conventional lamp such as a car lamp. And other application areas. Referring to the twenty-fourth embodiment, a perspective view of a fifteenth embodiment of the present invention in which a light-emitting monopole wafer is omitted is disclosed. The fifteenth embodiment of the present invention has a body (27 〇), the body (270) has a wide accommodating space (273), and the accommodating work door (27 3 3) is divided into a plurality of a block of appropriate size, in each block (not labeled), a heat conducting element (2 7 1 ) located in the center of the block and at least two pins (2 7 2) surrounding the heat conducting element (2 7 1 ) are disposed The light-emitting diode chip is disposed on the heat-conducting element (2 7 1 ). If the embodiment of the light-emitting diode is used in conjunction with a low-power light-emitting diode chip (not shown), the heat-conducting element may not be used. 1) Directly 31 200812126, the LED chip is disposed in each block, and at least two pins (2 7 2 ) of the foregoing blocks are surrounded by the LED segments disposed in the blocks.曰曰 ... This A example is especially suitable for large-area illuminating screens or long strips of high-power light strips. It can be assembled as a module. For example, it can be assembled quickly and easily with the printed circuit board and assembled in a convenient manner. Also disclosed herein is a 2 χ 2 partition, but it can also be designed as a 2 X 3 or 3 χ 3 square partition, or a circular or circular shape. It will be apparent to those skilled in the art that the present invention does not depart from the scope and spirit of the invention. Although the present invention has been described in terms of the preferred embodiments of the present invention, it should be understood that the present invention should not be construed as being limited to the specific details. Different modifications that are obvious to those skilled in the art are also covered by the following patents. [Simplified Schematic] The first drawing is a side cross-sectional view of the first embodiment of the present invention. A side cross-sectional view of a second embodiment of the present invention. A third side view is a side cross-sectional view of a third embodiment of the present invention. 4 is a side cross-sectional view of a fourth embodiment of the present invention. The seventh embodiment of the fifth embodiment of the present invention is a flow chart of the light-emitting diode system according to the sixth embodiment. The eighth embodiment is a side cross-sectional view of the body of the seventh embodiment of the present invention. The ninth drawing is a cross-sectional side view of the body of the eighth embodiment of the present invention. Schematic diagram of a bulk wafer on a thermally conductive element. 11 is a schematic view showing another fixed light emitting diode chip on a heat conductive element according to an eighth embodiment of the present invention. FIG. 12 is a side sectional view of a body according to a ninth embodiment of the present invention. The present invention is a perspective view of a body of a ninth embodiment of the present invention. The fifteenth embodiment is a perspective view of a seventh embodiment of the present invention. Fig. 17 is a perspective view showing a ninth embodiment of the present invention using a sawtooth shape body. Fig. 18 is a perspective view showing a ninth embodiment of the present invention using a column type body. Fig. 20 is a perspective view of an eleventh embodiment of the present invention. The twenty-first embodiment is a perspective view of a twelfth embodiment of the present invention, which omits a light emitting diode wafer. 2 is a perspective view of a thirteenth embodiment of the present invention, which omits a light-emitting diode wafer. FIG. 23 is a perspective view of a fourteenth embodiment of the present invention, which omits the light-emitting diode crystal 33 200812126. A fifteenth embodiment of the present invention omits a perspective view of a light-emitting diode wafer. The twenty-fifth figure is an exploded perspective view of a light-emitting diode. [Main component symbol description] (1 0 0) body (1 0 2 ) Jack (1 0 2 2) Dispensing recess (1 0 4 ) Pin (110) Body (1 1 2 ) accommodating space (1 1 4 ) Pin (1 2 1) Heat-conducting element body wafer (1 3 ) Light-emitting diode chip body wafer (1 3 3 ) Silicone (1 4 0 a) body (1 4 1 1 ) 钵-shaped opening (1413) straight strip (1 4 2 1 ) 钵-shaped opening (1 4 3 ) accommodating Space (2 0 ) base (210) body (2 1 2 ) accommodation space (1〇) base (1 0 1 ) central recess _ (1 0 2 1 ) dispensing recess (1 0 3 ) (1 1 ) body (111) through hole (1 1 3 ) jack (1 2 ) pin (1 2 2 ) light two (1 3 1 ) light two (1 4 0 ) body (141) through hole ( 1 4 1 2 ) Groove (1 4 2 ) Jack (1 4 2 2 ) Groove (1 4 4 a ) Pin (21) Body (2 1 1 ) Pin 34 200812126 (2 1 3 ) Thermal Conductive Element (2 1 4) Light-emitting diode chip (215) Heat-conducting element (2 1 6 ) accommodating space (2 2 ) Pin (2 2 0 ) Body (2 2 1 ) Pin (2 2 3 ) accommodating space (2 2 4) light two Body wafer (2 3 ) LED chip (2 3 0 ) body (2 3 1 ) heat conducting element (2 3 2 ) pin (2 3 3 ) silicone (2 3 4 ) housing space (2 4 0 ) Main body (2 4 1) heat conducting element (2 4 2 ) pin (2 4 6 ) heat conducting column (25) fixing plate (250) body (2 5 1 ) heat conducting element (2 5 2 ) pin (2 5 6) Cylindrical metal components (2 5 7 ) Printed circuit board (2 6 ) Plate body (2 6 1 ) Hole position (2 7 ) Insulation material (2 7 0 ) Body (2 7 1 ) Heat-conducting element (2 7 2) Pin (2 7 3 ) accommodating space (2 8 1 ) Conductive material (3 1 ) Cover (312) Cavity (4 1 ) Light shield (5 1 ) Provide material (5 2 ) Mold (5 3 Semi-sintered (5 4 ) electroplating and combination (55) gas protection and complete sintering (55a) electroplating (5 7 ) solid crystal (5 8 ) wire (5 9 ) sealing (6 1 ) folding foot (6 2 ) Set the fixing plate (7 1 ) to provide material 35 200812126 (72) mold (73) die casting (7 4 ) plating and combination (7 4 a ) dispensing (8 0 ) pedestal (8 1 ) body (813) heat conducting element (82) Pin (8 3 ) Light-emitting diode chip (8 3 2 ) Wiring (90) Fixing plate (91) Plate body (92) Insulation material (921) Connecting hole • ( 9 3 ) Conductive material (9 3 1 ) Place

36

Claims (1)

200812126 X. Patent application scope: 1 . A light-emitting diode comprising: a base comprising a body composed of a highly thermally conductive and highly transparent material, the body having a top surface and a back surface, and formed a receiving space of at least one opening; ^ to: a pin embedded in the base body and connected to the outside of the body from the receiving space of the body; to &gt; a light emitting diode chip, The light is disposed in the accommodating space of the body, and each of the wafers has at least two electrodes, and the at least one wafer is electrically connected to the electrodes to the at least two pins; the light emitting diode chip and the galvanic electrode are electrically connected to The structure of the pin is covered with a transparent stone as a protective layer. The light-emitting diode according to claim 1, wherein the light-emitting diode chip is disposed at the bottom of the housing space of the body. 3. The light-emitting diode according to claim 1, further comprising two heat-conducting elements, the heat-conducting element being composed of a heat-conducting material embedded in the body; the heat-conducting element having a first The terminal is connected to the center of the bottom of the valley space, and has a second end connected to the back of the body. The light-emitting diode chip is disposed on the first end of the heat-conducting element. For example, in the light-emitting diode according to the third aspect of the invention, the stone-filled gel fills the accommodating space of the body, and the silicone is slightly convex outside the opening of the accommodating space. 5) The light-emitting diode according to item 3 of the patent application, the base of the body of the base of the 2008 200812126 is only a female ^ ^ & a cover covering the opening of the body receiving space; The glass is made of a good material, and has a surface and a bottom surface, and a cavity is formed inside the cavity. The cavity is formed with an opening on the bottom surface of the cover. The accommodating space of the body is opened, and the cover is combined with the body. 6. The light-emitting diode according to claim 5, wherein the surface of the cover is formed into a convex shape and formed into a convex lens-like structure at the surface thereof. 7. The light-emitting diode of claim 3, wherein the base of the base is provided with a light-shielding body covering the opening of the body receiving space and having a lower transmittance than the glass. 8. The light-emitting diode according to item 7 of the patent application, which is made of a plastic material of the light-shielding system. 9. The light-emitting diode according to claim 7, wherein the light-shielding system is made of a frosted glass material. The light-emitting diode according to any one of claims 1 to 9, wherein the light-emitting diode chip is a j 5mi i light-emitting diode wafer. The illuminating polar body according to any one of claims 1 to 9, the uranium-emitting diode chip is an MR 16 light-emitting diode wafer. The illuminating diode according to any one of the preceding claims, wherein the body of the pedestal has at least two insertion holes for the pins to be embedded therein, wherein the insertion holes are in the accommodating space of the body The bottom of the body is respectively formed with an opening, and a small rubber recess is formed at each opening. 1 3 · The hair of any one of claims 3 to 9 of the patent application No. 3 to 9 2008, 200812126, the bottom of the bottom of the insertion hole for forming a through-light "one body" and the body of the base And a through hole formed in the receiving space of the body of the base to the bottom of the body; a recess is formed respectively with the bottom of the body; wherein the socket has an opening in the receiving space of the body, and a plastic body is formed at the opening The bottom portion is respectively formed with the hair of any one of the items, and each of the aforementioned pins has a through hole and a receiving space of the through hole, and a rubber recess is formed at each opening. 1 4 · The light-conducting element has a convex ring and a convex ring as claimed in the third to ninth light-emitting diodes of the patent application; _ the body of the base has at least two sockets for the buried pins, and the base is just described a central through hole is formed in the bottom of the receiving space of the body; the through hole has a groove matching the convex ring of the heat conducting element, and is opened at the joint; a circular opening having a slanted inner wall; each of the insertion holes is also formed with a groove matching the convex ring of the aforementioned pin, and a serpentine opening is formed in communication with the exciting space. 1 5 · 如 铀 内 内 内 内 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 请 内 内 内 内 内 内 内 内Ό For example, in the scope of patent application No. 14 A~W 7TQ-path f 'Chia Xuanben has a plurality of mountain-shaped protrusions on the outer peripheral wall of the body and has a sawtooth shape. 2. A light-emitting diode as described in claim 14 of the patent application. A flange is formed on the outer wall of the body. 1 8 - As described in any one of claims 1 to 9, the above-mentioned pin system is formed into a sheet shape. 1 9 . The illuminating diode of the illuminating diode according to any one of the items 1 to 9 of the patent scope is divided into a plurality of blocks, and at least one illuminating dipole is disposed in the block. The body wafer, and at least two pins. The light-emitting diode according to any one of the preceding claims, wherein the step further comprises a plurality of heat-conducting elements, and the housing space of the body is divided into a plurality of blocks in each area. The block is provided with at least one of the aforementioned heat conducting elements, at least - a light emitting diode disposed on the heat conducting element: a sheet, and at least two pins. A light-emitting diode illuminator comprising the light-emitting diode according to any one of claims 1 to 9 and a fixing plate; the fixing plate comprising a metal or the like a heat-conducting material having a surface and a bottom plate; the surface of the plate is provided with an insulating material: the insulating material is provided with a connecting hole at a back surface of the body of the base, and the body is connected The connecting hole of the insulating material is thermally connected to the plate body; the insulating material is respectively provided with a conductive material relative to the two pins, and the conductive material forms a pin that matches the pins. </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; a plate body, the plate body is provided with an insulating material=, and a conductive material is disposed on the insulating material, the conductive material forms a foot at a suitable position to form an electrical connection with the pin; and the fixing plate The hot plate body forms a hole position corresponding to the heat conduction element, and the heat conduction element is formed in a rod shape and penetrates through the hole position. 40 200812126 2 3 The light-emitting diode illuminator as described in claim 2, further having a cylindrical metal member having an opening which can be adapted to the needs of the actual use environment In the segment, the segments are connected to each other but formed into a cylinder diameter having a different size; the fixed plate is disposed at the opening of the tubular metal member. A light-emitting diode illuminator, comprising the light-emitting diode according to any one of claims 3 to 9, and a heat-dissipating rod formed to have a plurality of planes The straight bar shape is made of a metal having good heat conductivity, and the body of the plurality of bases of the light emitting diodes is disposed on each plane of the heat dissipation bar; the heat conducting elements embedded in the respective bodies are connected to the heat dissipation rod. The light-emitting diode illuminator as described in claim 24, wherein the metal-based aluminum metal having good heat conductivity is used. 2 6 · A method for producing a light-emitting diode illuminator, comprising: Providing materials: providing glass powder and at least two pins; the pins are made of a metal material that conducts heat; and a wide mold: designing a mold according to a required body size, shape, etc. to form a body, which is formed on the mold There is a through hole for the above-mentioned pin to be pierced; semi-sintering: the glass frit is semi-sintered to form the body; '^Electrical ore and combination: the aforementioned pins are plated with nickel, and the wires are pinned and placed in the mold. The upper part corresponds to the through hole of the body; and the first one: the version of the shyness and the total sintering: the semi-sintered body is matched with the above-mentioned molding die, and the whole is rotated, so that the assembly is integrated with the pin. Forming, a k for at least - inert gas for gas protection; 41 200812126; connected f · solid crystal: the front g. line the light-emitting diode &amp; sun and sun 5 placed in the body housing space for each wafer The electrodes are respectively electrically connected to the corresponding pins and the electric h. sealant: the silicone is used as a protective layer to cover the connected structure to play a protective role. 27. The method described in claim 26 , In. And the material provided in the step of providing the material comprises a heat-conducting element, and the glass powder is a granulated glass powder; b. forming a through hole for the heat-conducting element to be pierced on the mold; d. The heat-conducting element is galvanized, and the heat-conducting element finished by nickel plating is placed on the mold corresponding to the through hole of the body; f · the body has a housing space and the heat-conducting element is described The first light-emitting diode is connected to the bottom of the accommodating space, and the light-emitting diode wafer is disposed at the first end of the heat-conducting element. 2: The method of claim 27, wherein: a · glass powder and glass powder; b. the mold is made of graphite; f. The adhesive is disposed on the first end of the heat conducting element. The method described in claim 28, wherein the glass frit is an electronic grade soda lime glass powder. 3 〇 · The method described in claim 29, 42 200812126 C. The glass powder is processed by the weaving process before sintering. = The method of claim 3, wherein: d. The heat transfer element is added to the steel and the silver. 3 2 · As described in the patent application section (5), the method described in item 31, where: e. The complete sintering procedure is carried out in the furnace for 30 minutes at a temperature of 75 ° C. 3 .3 · As described in the patent application scope q ..., 祀固弟 3 2, in which: d · Describe the heat-conducting components and pins are copper-plated 2 microns, and silver plated 3 microns. 3 4 · The method of claim 3, wherein: h, the silicone is filled in the accommodating space of the main body. A method of manufacturing a light-emitting diode illuminator, comprising the method of any one of claims 2-7 to 3 4 Φ # s ύ 4, and further comprising the steps of: i folding : bending the aforementioned pin into a proper shape; j 'clothing' is fixed δ and then the plate. The light emitting diode illuminator further comprises a solid plate and a plate 4 solid plate including a heat conducting plate provided with an insulating material The insulating material is provided with a conductive material formed with a pin matching the pin, and the pin forms an electrical connection with the pin, and the heat conducting plate of the fixing plate is formed with a corresponding heat conducting component. In the hole position, the second end of the heat conducting element is disposed in the hole position. 3 6 · A method for manufacturing a light-emitting diode illuminator, comprising: a· providing material: providing high thermal conductivity and high light transmissive plastic and at least two pins; the pin is made of a thermally conductive metal material; b· Molding and designing and manufacturing the mold according to the required body size, shape, etc. 200812126 to open the v-molded body 'The mold is formed with a through hole for the above-mentioned pins to be pierced, · C • Die casting · High heat conductivity and high The light-transmissive plastic is die-casted to form d·plating and combination: the aforementioned pins are plated with nickel, and the nickel-plated finished teeth are placed on the puller corresponding to the body of the body &Forming; f. solid crystal • • setting the above-mentioned light-emitting diode chip; g· wire: : making the electrodes of each wafer correspond to each other; h. sealing glue: using silicone as a protective layer to cover the pins to establish electricity Connect the structure to protect it. The body is as described in claim 36, wherein: a. the material provided in the step of providing a material comprises a guiding element, the high thermal conductivity and high permeability material selected from the group consisting of High thermal conductivity and high light transmission plastic two la: tlc), high thermal conductivity and high light transmission pc material, high thermal conductivity and high light transmission acrylic material Ucry &quot; and its combination of groups." The mold is further formed with a through hole for the heat conducting component to be pierced. The first heat conducting component is plated with nickel, ^^^QL.I, and the nickel-plated thermally conductive element is placed on the plate corresponding to the through hole of the body. · f. The body has an accommodating space, which is connected to the center of the bottom of the accommodating space, and the 件 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 、 、 、 The first end of the heat-conducting element is: 44 200812126 3 8 The method of claim 3, wherein: f. The wafer is bonded to the first end of the heat-conducting element with silver glue. For example, the method described in claim 3, wherein c·the glass powder is before sintering The waxing process is carried out. 4 0. The method described in claim 39, wherein: d. the above-mentioned heat-conducting element is plated with steel and silver. 4 1 · As claimed in the fourth paragraph of the patent application The method of manufacturing, wherein: d) the heat conducting component and the pin are plated with steel of 2 micrometers and plated with silver of 3 micrometers. 4 2 · The method of claim 41, wherein: h· the gelatin filling In the accommodating space of the main body, the method for manufacturing the illuminating diode illuminator includes the method described in any one of the claims 7-7 to 4, and further includes the following steps: 1 Folding foot: bending the aforementioned pin into a proper shape; j) installing a fixing plate: the light emitting diode illuminator further includes a solid plate, the fixing plate includes a heat conducting material provided with an insulating material The plate body is provided with a conductive material formed with a pin matching the pin; the pin position: the pin is electrically connected, and the heat conducting plate body of the fixing plate has a corresponding heat conduction. The hole position of the element is set in the hole of the second end of the heat conducting element XI, FIG formula: such as hypophosphorous page 45