TW200818378A - Substrate transferring apparatus and high speed substrate processing system using the same - Google Patents

Abstract

There are provided a substrate transferring apparatus for continuously loading/unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity and a substrate processing system using the same. The substrate transfer apparatus is installed in the transfer chamber and transfers substrates between first and second process chambers which is positioned lateral sides of the transfer chamber and a load rock chamber. The substrate transfer apparatus includes a driving unit to supply a rotational force, a spindle connected to the driving unit, first swivel plate arms to load/unload substrate to/from first process chamber, and second swivel plate arms to load/unload substrate to/from second process chamber. Since substrates before and after being processed are rapidly exchanged during the simultaneous or continuous process of plural substrates, processing rate increases and overall productivity can be increased.

Description

200818378 ' (1) EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to a substrate transfer apparatus and a substrate processing system, and more particularly to a substrate transfer for continuously loading/unloading a plurality of substrates in/from a processing chamber Equipment to reduce the time it takes to transport substrates and improve productivity. And the invention relates in particular to a substrate processing system using the apparatus. [Prior Art] Recently, a cluster system capable of simultaneously processing a plurality of substrates is generally used in a substrate processing system for manufacturing a liquid crystal display, a plasma panel display, and a semiconductor device. A cluster system generally refers to a multi-chamber type substrate processing system, and the processing system includes a transfer robot (or processor) and a plurality of substrate processing modules disposed around the transfer robot. The Φ cluster system consists of a transfer chamber and a transport robot that is free to rotate in the transfer chamber. A processing chamber for performing a process for processing a substrate is installed beside the transfer chamber. This cluster system processes a plurality of substrates simultaneously or continuously performs various processes to increase the amount of substrate processed. In order to increase the amount of substrate processed, a plurality of substrates are simultaneously processed in a single processing chamber to increase the amount of substrate processed per unit time. Although a plurality of substrates are simultaneously (or continuously) processed in a single processing chamber, the substrates before and after the processing are not efficiently exchanged in the processing chamber, resulting in a loss of time. -4 - 200818378 . (2) Furthermore, when the conventional cluster system includes a hexagonal transfer chamber (basically including four processing chambers and a load lock chamber), the area occupied by the transfer chamber Therefore, the area of the cluster system and the width of the entire cluster system (which is important for the configuration of the cluster system in the production line) are increased, which is greater than the desired width and size of the vacuum system required to maintain the vacuum state of the transfer chamber, resulting in increased equipment costs. And placement costs. In addition, the area of the transfer chamber increases more as the number of chambers is set to increase. φ Therefore, there is a need for a substrate processing system capable of simultaneously (or continuously) processing a plurality of substrates and capable of efficiently exchanging pre-process and post-process substrates in a processing chamber to process a plurality of substrates. SUMMARY OF THE INVENTION The present invention therefore provides a substrate transfer apparatus and a substrate processing system using the same, which have a configuration in which a substrate is efficiently processed therein. The present invention also provides a substrate transfer apparatus and a substrate #processing system using the same, which can reduce the time taken to transport the substrate and improve productivity. The present invention also provides a substrate transfer apparatus and a substrate processing system using the same, which has a small system area. The present invention also provides a substrate transfer apparatus and a substrate processing system using the same, which have a configuration capable of reducing the processing time spent therein. The present invention also provides a substrate transfer apparatus and a substrate processing system using the same, which has a configuration in which the utilization of the processing chamber can be improved. The present invention also provides a substrate transfer apparatus and a substrate processing system using the same, which have significantly reduced system area and system width. -5- 200818378 (3) The present invention also provides a substrate transfer apparatus and a substrate processing system using the same, which reduces an unnecessary volume area to minimize equipment cost and installation cost. The present invention also provides a substrate processing system that efficiently utilizes the spatial layout within a semiconductor fabrication facility. The present invention also provides a substrate processing system that reduces the number of processing modules corresponding to one transfer robot to improve throughput. The present invention also provides a substrate processing system including a substrate transfer apparatus having a small drive area. According to an exemplary embodiment, the present invention provides an apparatus for transporting a substrate for transporting a substrate between a load lock chamber and first and second processing chambers to process a plurality of substrates. The apparatus includes: a driving unit for supplying a rotational force; at least one spindle coupled to the driving unit; a plurality of first rotating plate arms for loading/unloading the substrates to the first processing chamber; and a plurality of second rotating plates An arm to load/unload the substrates to the second processing chamber. Preferably, 'each of the temples and the other ones of the rotary arm include: at least one swivel arm for loading an unprocessed substrate; and at least one for unloading the processed substrate Rotary plate arm. Preferably, the first swivel arm and the second swivel arm are mounted separately, and the main shaft includes at least two different main shafts that rotate independently. Preferably, the drive unit includes at least one drive unit that supplies a rotational force via the at least two different main shafts. Preferably, the first first slewing arm and the second slewing arm are -6-200818378. (4) each comprising a horseshoe end effector and a support having an upper side, the end effector comprising An opening on the open side, the edge of the substrate being positioned to the upper side. Preferably, the end effector includes an inlet path through which an end effector of an atmospheric pressure transfer robot disposed in the lock lock chamber enters and exits to transmit and receive the substrates. According to another illustrative embodiment, the present invention provides a substrate processing system that uses an apparatus for transporting a substrate. The system comprises: a first processing chamber comprising at least two substrate support tables; a second processing chamber comprising at least two substrate support tables; a transfer chamber, the substrate transfer device being disposed in the transfer chamber; a first substrate inlet formed in the Between the first processing chamber and the transfer chamber; a second substrate inlet formed between the second processing chamber and the transfer chamber; and a third substrate inlet formed between the transfer chamber and the exterior; Receiving, by the substrate transfer device, the unprocessed substrates from the outside through the third substrate inlet, and transmitting the processed substrates to the outside, so that the unprocessed substrates are transferred to the first Or the second processing chamber, and the processed substrates processed in the first or second processing chamber are transferred to the outside via the third substrate inlet. Preferably, the substrate processing system further includes a load lock chamber coupled to the third substrate inlet, wherein the load lock chamber includes an atmospheric pressure transfer robot to transport the substrates at the atmospheric pressure. Preferably, the substrate processing system further includes a cooling chamber to cool the processed substrates discharged through the third substrate inlet. Preferably, the first and second processing chambers comprise a plasma chamber, and the plasma treatment is performed in the plasma chamber of the 1818378. (5). Preferably, the first processing chamber includes a plasma chamber in which plasma processing is performed, and the second processing chamber includes a cooling chamber to cool the processed substrate that has been heated. Preferably, the substrate processing system further includes a fourth substrate inlet formed between the transfer chamber and the other outer portion, and the substrate transfer device receives the unprocessed substrates from the outside via the third substrate inlet, and The φ-processed substrates are transferred to the outside via the fourth substrate inlet. Preferably, the base 1 system further includes a load lock chamber coupled to the fourth substrate inlet, and the load lock chamber includes an atmospheric pressure transfer robot to transport the substrates at the atmospheric pressure. Preferably, the substrate processing system further includes a cooling chamber to cool the processed substrates discharged through the fourth substrate inlet. In accordance with another illustrative embodiment, the present invention provides an apparatus for transporting a substrate for transport between a load lock chamber and a process chamber. • The substrate is transported indoors to process a plurality of substrates. The apparatus includes a transfer member interspersed and disposed on an edge of the transfer chamber; and the plurality of transfer members simultaneously receive a plurality of substrates provided to a standby position of the transfer chamber via the load lock chamber to transfer the plurality of substrates to the substrate On the upper side of the support table, the substrate support tables are respectively disposed in the processing chambers, and the plurality of transfer members respectively receive the substrates from the upper sides of the substrate support tables to collectively transfer the substrates to the standby position of the transfer chamber . Preferably, each of the transmission members comprises: a drive unit for supplying a rotational force; two spindles connected to the drive unit; and a plurality of back-8-200818378. (6) a rotary arm to The substrates are loaded onto/unloaded from the corresponding substrate support stations. Preferably, each of the swivel plate arms includes: a swivel plate arm for loading an unprocessed substrate; and a swivel plate arm for unloading the processed substrate. Preferably, each of the swivel plate arms includes a horseshoe end effector and a support having an upper side, the end effector package having a Φ opening having an open side, the edge of the substrate being positioned to the upper side. Preferably, the transmission members are deployed such that the end effectors of the rotary plate arms are positioned on the upper sides of the corresponding substrate support tables, and the transmission members are folded such that the rotary plate arms The end effectors align a single alignment line in an upright orientation at the standby position of the transfer chamber. In accordance with another illustrative embodiment, the present invention provides a substrate transfer apparatus disposed within a transfer chamber for transporting a substrate between a load lock chamber and a process chamber to process a plurality of substrates. The substrate transfer apparatus includes: a plurality of spindles disposed on edges of the transfer chamber to be spaced apart from each other; a drive unit to supply driving force to the plurality of spindles; and a plurality of rotary plate arms respectively disposed on the plurality of spindles The substrates are loaded into/to the corresponding processing chambers/the substrates are unloaded from the corresponding processing chambers. Preferably, each of the rotary plate arms includes a horseshoe end effector and a support having an upper side, the end effector including an opening having an open side, the edge of the substrate being positioned to the upper side, and the rotation The end effectors of the plate arms are pivoted to the upper side of the corresponding substrate support table, and at the standby position of the transfer chamber, a single alignment line is aligned in the upright direction. 200818378. (7) Preferably each of the swivel plate arms comprises at least two antenna rod type extendable plate arms. Preferably, each of the swivel plate arms is turned back to the substrate support table at the standby position of the transfer chamber, and the extendable swivel plate arms are retracted step by step to enable the end effect The device is located on the upper side of the substrate support table. According to another illustrative embodiment, the present invention provides a substrate processing system. The substrate processing system includes: a transfer chamber in which the substrate transfer device is disposed; and first and second processing chambers connected to the lateral side of the transfer chamber via the first and second inlets, and including two substrate support tables The substrate transport apparatus includes four transport members disposed at edges of the transport chamber to be spaced apart from each other; wherein the transport members are deployed to simultaneously receive a standby position from the outside to the transport chamber a fourth substrate, and transmitting the four substrates to an upper side of the four substrate supporting stages disposed in the first and second processing chambers, and deploying the transmitting members to respectively receive the substrates from the upper side of the four substrate supporting table And transferring the substrates to the standby position of the transfer chamber, respectively. Preferably each of the transmission chambers comprises: a drive unit for supplying a rotational force; two spindles coupled to the drive unit; and a plurality of rotary plate arms for loading the substrates onto the substrate support tables / Unloading the substrates from the substrate support stations. Preferably, each of the swivel plate arms comprises a horseshoe end effector and a support having an upper side, the end effector comprising an opening having an open side, the edge of the substrate being positioned to the upper side, and the turning Transmission structure -10- 200818378 " (8), such that the end effectors of the slewing plate arms are swiveled to the upper side of the corresponding substrate support table, and aligned in the upright direction at the standby position of the transfer chamber Preferably, each of the swivel plate arms comprises at least two antenna rod type extendable plate arms. Preferably, the substrate processing system further comprises a load lock chamber connected via a third substrate inlet To the front side of the transfer chamber, wherein the load lock chamber package φ comprises an atmospheric pressure transfer robot for transporting the substrates at the atmospheric pressure. Preferably, the front side of the transfer chamber has the shape of the third inlet inwardly concave Preferably, the substrate processing system further comprises a cooling chamber located in the load lock chamber to cool the processed substrate discharged to the load lock chamber via the third substrate inlet. Preferably, the first and second processing chambers comprise a plasma chamber in which plasma processing is performed. According to another illustrative embodiment, the present invention provides a substrate processing system, the system comprising: The first processing chamber includes a substrate supporting table; a second processing chamber includes a substrate supporting table; a transfer chamber, the substrate transfer device is disposed in the transfer chamber; and a first substrate inlet is formed in the transfer chamber and the outside a second substrate inlet formed between the first processing chamber and the transfer chamber; and a third substrate inlet formed between the second processing chamber and the transfer chamber; and the substrate transfer device via The first substrate inlet receives the unprocessed substrates from the outside, and transmits the substrates that have been processed -11 - 200818378 . (9) to the outside, so the substrate transfer device will have received the Processing the substrate to the first or second processing chamber via the second or third substrate inlet, and receiving the processed substrates processed in the first or second processing chamber, and via the first substrate Preferably, the substrate processing system further includes a load lock chamber coupled to the first substrate inlet, wherein the load lock chamber includes an atmospheric pressure transfer robot to transmit the atmospheric pressure at the atmospheric pressure Preferably, at least one of the first and second processing chambers comprises a plasma chamber. Preferably, at least one of the first and second processing chambers comprises a cooling chamber. Preferably, the first Preferably, at least one of the first and second processing chambers includes an alignment chamber. Preferably, the substrate transfer apparatus includes: a drive unit for supplying a rotational force; at least one spindle coupled to the drive unit; and a plurality of first swings; Loading the substrates to/from the first processing chamber to unload the substrates; and a plurality of second rotating plate arms to load the substrates to/from the second processing chamber Unload the substrates. Preferably, the first swivel arm and the second swivel arm are mounted separately, and the main shaft includes at least two different main shafts that rotate independently. Preferably, the drive unit includes at least one drive unit that supplies a rotational force via the at least two different main shafts. Preferably, each of the first slewing arm and the second slewing arm comprises a horseshoe end effector and a support having an upper side, the end -12-200818378, (10) end effector comprising An opening having an open side, the edge of the substrate being positioned to the upper side. Preferably, the end effector includes an inlet path through which an end effector of an atmospheric pressure transfer robot disposed in the lock lock chamber enters and exits to transmit and receive the substrates. According to another illustrative embodiment, the present invention provides a substrate processing system. The substrate processing system comprises: a load lock chamber comprising an indexing disk, φ wherein the plurality of carriers are disposed in front of the indexing plate; and a plurality of processing groups disposed on the rear side of the load lock chamber and stacked in a multi-layer manner And one of the plurality of processing groups includes: a first transfer chamber, the first substrate transfer device is disposed in the first transfer chamber; and the first and second processing chambers are connected to the first transfer via the first and second inlets a lateral side of the chamber, and including two substrate support tables, and the other of the plurality of processing groups includes: a second transfer chamber, the second substrate transfer device is disposed in the second transfer chamber; and the first and second alignment chambers Connected to the lateral side of the second transfer chamber via the first and second inlets and including a two φ substrate aligner. Preferably, the first transmission members are unfolded to simultaneously receive four substrates provided in a standby position of the first transmission chamber, and the four substrates are transferred to four disposed in the first and second processing chambers. The upper sides of the substrate support stages are folded and the first transfer members are folded to receive the substrates on the upper side of the four substrate support stages, and each of the substrates is transferred to the standby position of the first transfer chamber. Preferably, the second transmission members are unfolded to simultaneously receive the four substrates provided in the standby position of the second transmission chamber, and the four substrates are transmitted to -13, 18,378,378 (11). At least two substrate aligners in the first and second alignment chambers, and the second transmission members are folded to receive the aligned substrates of the at least two substrate aligners, and each of the aligned substrates Transfer to the standby position of the second transfer chamber. Preferably, the other of the plurality of processing groups includes: a third transfer chamber, the third substrate transfer device is disposed in the third transfer chamber; and a cooling chamber connected to a side of the third transfer chamber via the first inlet, To cool at least one base plate. Preferably, each of the first, second, and third substrate transfer devices includes: a drive unit to supply a rotational force; at least one spindle coupled to the drive unit; and a plurality of rotating plate arms, Mounted to the spindle at different heights and positioned at a corresponding height relative to the spindle. Preferably, each of the swivel plate arms includes a horseshoe end effector and a support having an upper side, the end effector including an opening having an open side, the edge of the substrate being positioned to the upper side, and the transfer is reversed The device Φ is such that the end effectors of the swivel plate arms are in the corresponding positions, and the single alignment line is aligned in the upright direction at the waiting position of the first, second, and third transfer chambers. Preferably, the first substrate transfer device includes a plurality of rotary plate arms for simultaneously receiving a plurality of substrates provided at a standby position of the first transfer chamber, and transmitting the substrates to the first and second processing chambers Waiting on the upper side of the substrate support table to receive the substrates on the upper side of the substrate support table, and transferring the substrates to be collectively transferred to the standby position of the first transfer chamber. Preferably, each of the substrate aligners comprises: a rotating clamp-14-200818378. (12) a head for loading the substrate; an inductor 'to detect the substrate loaded on the rotating chuck Aligning; and a lifter to adjust the height of the rotary chuck according to the height of the rotary arm. Preferably, the load lock chamber includes an atmospheric pressure transfer robot for transporting the substrates at atmospheric pressure. Preferably, the first and second processing chambers comprise a plasma chamber to perform a plasma treatment. Preferably, the load lock chamber comprises a dual-arm type atmospheric pressure transmission robot having four end effectors for taking out four substrates at a time from the carrier and transmitting the four substrates to the first a transfer chamber or the second transfer chamber; and each of the first and second transfer chambers includes a third substrate inlet, the substrates entering and exiting from the load lock chamber via the third substrate inlet, and The alignment enables the substrates to be transported when the atmospheric pressure transfer robot moves down. [Embodiment] The present invention may be embodied in various forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided as an example of the invention. In the drawings, δ exaggerates the thickness of layers and regions for the sake of clarity. A detailed description of well-known functions and constructions which obscure the subject matter of the present invention will be omitted. Hereinafter, a substrate transfer apparatus and a substrate processing system using the same according to the present invention will be more fully described with reference to the accompanying drawings in which preferred embodiments of the present invention are shown. -15- 200818378 (13) Embodiment 1 FIG. 1A is a view illustrating a configuration of a substrate processing system according to a first embodiment of the present invention, and FIG. 1B is a plan view illustrating a substrate processing system of FIG. 1 with reference to FIG. The substrate processing system includes first and second 500, 600, and transfer chambers 400 disposed in the first and second processing chambers 500, 600. The indexing plate 100 is disposed before the load lock chamber 200. The plurality of carriers 110 are mounted in the indexing plate 100. The indexing plate 100 is referred to as a φ front end module (hereinafter referred to as EFEM) and, in some cases, a load lock chamber. If desired, the load lock chamber 200 can include 3 〇 用以 to cool the processed substrate. The load lock chamber 200 includes an atmospheric manipulator 210 that operates at atmospheric pressure. The atmospheric pressure transmitting robot 210 transmits the substrate between the transfer chamber indexing discs 100. The atmospheric pressure transmitting machine is operated to transport the substrate W between the carrier 110 and the transfer chamber 40 0 . The large transfer robot 210 is executed by a robot including a two-arm configuration, and φ has four end effectors for taking out four substrates from the carrier 1 1 to place the substrates in the transfer chamber 400. Atmospheric pressure transmission machinery can rise and fall. The various types of dual-arm type manipulators used in the general semiconductor manufacturing process and the present embodiment of the present invention can be used as an atmospheric manipulator 210. For example, a robot having various configurations can be used. A robot having a blade type arm and an eight-piece substrate W is handled by one arm, and a robot having four or more arms, and a combination of the above-described robots. Each of the substrate support stages 520, 522, 620, 622 is divided into a front end, a rear end, and a general overall view of the first and second processing chambers 500, 600. The surface between the processing chambers, which includes the cooling chamber pressure transmission 40 0 and the hand 210 gas pressure, the construction W, and the hand 210 robot pressure transmission, for example, including the other path -16-200818378. (14 ). The paths are paths in which the rotary plate arms of the substrate transfer apparatus 800 rotate. 〇 The first and second process chambers 500, 600 include a plasma source such as a vacuum chamber to perform a predetermined plasma processing process. The first and second processing chambers 500, 600 can be constructed to perform various substrate processing operations. For example, the first and second processing chambers 500, 600 may be an ashing chamber for removing photoresist using a plasma, a chemical vapor deposition (CVD) chamber for depositing an insulating layer, for etching in an insulating layer A hole or opening to form an etch chamber of an interconnect configuration, a physical vapor-deposition (PVD) chamber for depositing a barrier layer, or a physical vapor deposition chamber for depositing a metal layer. The substrate W processed by the substrate processing system of the present embodiment of the present invention is generally a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. In order to perform all the processes required to completely fabricate an integrated circuit or wafer, a complex processing system may be required, not only the substrate processing system of the present embodiment of the present invention. However, in order to clarify the invention, the ordinary constructions known to those skilled in the art are omitted. The substrate processing system of this embodiment of the present invention includes a centrally located transfer chamber 400 and first and second processing chambers 500, 600 respectively disposed on lateral sides of the transfer chamber 400. At least two substrate support tables 520, 522, 620, 622 are disposed in the first and second processing chambers 500, 600, respectively. The transmission module 400 includes a substrate transfer device 800. A first substrate inlet 510 is formed between the transfer chamber 400 and the first process chamber 500, and a second substrate inlet 610 is formed between the transfer chamber 400 and the second process chamber 600. A third substrate inlet 410 is formed between the transfer chambers 400 and -17-610, 200818378, (15) load lock chambers 200. The first to third substrate inlets 510, 410 are opened or closed by a slit valve (not shown). The exchange of the substrate in the transfer chamber 400 before and after processing, the pressure transfer robot 210 is performed at atmospheric pressure, wherein the first substrate inlets 510, 610 are closed and the third substrate inlet 410. On the other hand, the exchange of the substrate between the first and second processes, 600 and the transfer chamber 400 before and after the process is performed by the substrate transfer device row, and is performed in a vacuum state, wherein the third substrate inlet 410 is first and The two substrate inlets 5 1 0, 6 1 0 are opened. Fig. 2 is a view showing a substrate transfer apparatus provided in a transfer chamber. Referring to Fig. 2, the substrate transfer apparatus 800 includes a plurality of rotary plate arms 810 for providing a rotary unit 840, a single spindle 83 0 connected to the drive unit 840, and a spindle 830. The plurality of swivel arm 8 1 0 includes a plurality of first swivel arms and a complex swivel arm. The first swivel plate arms are used to load the substrate on the first chamber 5 or unload the substrate from the first processing chamber 500; the first plate arms are used to load the substrate on the second processing chamber 600, or The first chamber 00 unloads the substrate. The first and second swivel arms are alternately arranged. The first and second swivel arms are continuously configurable. The plurality of swivel plates can be divided into a loading arm 82A and an unloading arm 822. In this case, 8 2 2 is preferably configured to be lower than the loading arm 820. The loading arms 8 2 〇 and 8 22 are paired, and in the embodiment as shown, eight arms are arranged in four pairs. As illustrated in Fig. 1B, the plurality of swivel arms 8i are fan-shaped and can be swung, raised, and lowered. The loading arm 82 is closed by the atmosphere and the second opened chamber 500 8 00 is closed. The perspective force is driven and the number of installations is the second one. However, the arm 810 unloading arm unloading arm swivel plate is unfolded into an unloading arm -18- 200818378 (16) 8 2 2 Paired for operation. Although not shown in the drawings, the drive unit 840 includes an electric motor for generating a rotational force and a gear combination for transmitting the generated rotational force to the main shaft 83 0 to cause the plurality of swing arm 810 to perform desired work. . Accordingly, the plurality of swivel plate arms 810 are mounted to the main shaft 830, and as illustrated in Fig. 1B, the swivel plate arms 81 1 are symmetrically flared into a fan shape and are folded at different rotation radii of the transfer chamber 400. φ Figure 3 illustrates an example of a substrate transfer apparatus having upper and lower portions that are independently driven. Referring to Fig. 3, a substrate transfer apparatus 800 of another embodiment includes lower and upper spindles 830a, 830b and lower and upper drive units 840a, 840b. A loading arm 820 and an unloading arm 822 are mounted to the lower main shaft 83 0 a and the upper main shaft 830b, respectively. The lower and upper drive units 840a, 840b drive the lower and upper spindles 830a, 830b, respectively. Here, both the lower and upper spindles 830a, 830b are preferably aligned with the same axis. Fig. 4 is a perspective view illustrating the configuration of a swivel plate arm. Referring to Fig. 4', a plurality of rotary plate arms 810 disposed in the substrate transfer apparatus 800 include a horseshoe end effector 8 1 2 and a plurality of support portions 8 1 4 . The end effector 820 includes an opening 8 1 3 having an open side. The edge of the substrate is positioned on the upper side of the support portions 814. An opening 8 1 3 is provided to allow the lift pins disposed within the substrate table to enter and exit. The end effector 8 1 2 has an inlet path 8 1 5 '. The end effector 212 of the atmospheric pressure transfer robot 210 enters or exits via the inlet path 815. The swivel plate arm 810 can have other forms of modification within the scope of the invention. 5A to 5E are views continuously illustrating the substrate transfer apparatus performing substrate exchange -19-200818378 • (17) operations. Referring first to FIG. 5A, as indicated by an arrow S10, in a state where the first and second substrate inlets 5 1 0, 6 1 0 are closed, when the third substrate inlet 410 is opened, the unprocessed substrate (before processing) The substrate) W1 is transferred to the substrate transfer device 800. When the transfer substrate W1 is completed, the third substrate inlet 410 is closed, and the transfer chamber 400 is converted into the same vacuum state as the inside of the first and second processing chambers 500, 600. Of course, the pump system for the vacuum state is provided in the system of this embodiment of the present invention, but it is omitted for convenience of φ. Next, as shown by an arrow S20 in Fig. 5B, when the lift pins of the plurality of support stages 520, 522, 620, 622 rise, the processed substrate W2 is lifted to a predetermined height. To accommodate this operation, the first and second substrate inlets 510, 610 are opened. At this time, the raised lift pins of the front substrate support table 520 are relatively lower in height than the lift pins of the rear substrate support tables 522, 622. Therefore, the loading arm 820 for loading/unloading does not interfere with the lift pin. φ Continuing, as shown by an arrow S30 in Fig. 5C, the loading arm 820 and the unloading arm 822 of the substrate transfer apparatus 8 are symmetrically rotated in pairs and expanded into a fan shape. At this time, the processed substrate W1 is transferred from the lift pin to the unloading arm 822. Continuing, as indicated by an arrow S40 in Fig. 5D, when the processed substrate W1 is transferred, the unloading arm 822 returns to the starting position of the transfer chamber 400. As indicated by the arrow S 50, the lift pin is again raised to receive the unprocessed substrate W2 from the loading arm 820. As indicated by arrow S60 in Figure 5E, the loading arm 820 also returns to the starting position of the transfer chamber 400. At the same time, the first and second substrate inlets 510-20-200818378. (18), 610 are again closed. As indicated by an arrow S70, the lift pins are lowered to place the unprocessed substrate W2 on the substrate supporting tables 520, 522, 620, and 622. The transfer chamber 400 is switched to the atmospheric pressure state, and the third substrate inlet 410 is opened. The atmospheric pressure transfer robot 210 of the load lock chamber 200 receives the processed substrate W1 from the unloading arm 822 and exits from the transfer chamber 400, as indicated by the arrow S 8 0 in Fig. 5E. The continuous operations S10 to S80 of the φ exchange substrate are continuously and simultaneously performed in a range in which the front work and the post work do not interfere with each other to minimize the time required to exchange the substrates. It will be appreciated that jobs S10 and S80 are performed simultaneously during repeated substrate exchange operations. In other words, the exchange of the substrate is performed between the transfer chamber 400 and the load lock chamber 200, whereby the processed substrate unloaded by the previous operation is exchanged with the pre-processed substrate to be loaded at the same time. The unloaded processed substrate W1 is transferred to the cooling chamber 300 by the atmospheric pressure transmitting robot φ 210, and is cooled to be stacked in the carrier 110. Although the cooling chambers 300 of this embodiment of the present invention are separately provided, if the transfer chamber 400 performs the function of cooling, the separated cooling chambers 300 may be omitted. In other embodiments, one of the first and second processing chambers 500, 600 can be considered a cooling chamber. For example, the first processing chamber 500 can be regarded as a plasma chamber, and the second processing chamber 600 can be regarded as a cooling chamber. In this case, the first processing chamber 500 performs the plasma processing of the substrate ' and the substrate transfer device 800 transfers the processed substrate from the first processing chamber 500 to the second processing chamber 600 for cooling. The cooled substrate can be transferred from the second processing chamber 600 to the load lock - 21 - 200818378 • (19) The chamber 200. Therefore, according to the substrate processing system of this embodiment of the present invention, in order to simultaneously process a plurality of substrates, the first and second processing chambers 500, 600 are arranged in parallel, and the transfer chamber 400 is provided in the first processing chamber 500 and the second processing chamber. Between 600. The substrate transfer device 800 is arranged to enable rapid exchange of substrates in the structure so that many substrates can be processed simultaneously and quickly. In this embodiment, a total of four substrates can be simultaneously processed and exchanged in one process in each of the two substrate φ plates in the first and second processing chambers 500, 600. The substrate processing system of the present invention can be exemplified by an alternative embodiment described below with an example of a substrate transfer apparatus using two drive shafts. Referring to Figure 6, the substrate transfer apparatus 800 can be divided into left and right portions that are independently driven. In other words, the swivel plate arm of the first process chamber 500 for transporting the substrate and the swivel plate arm of the second process chamber 600 for transporting the substrate are detachably driven. Φ As illustrated in FIG. 7A, the above-described constructed substrate transfer apparatus includes first and second spindles 830a, 83b separated from each other, and first and second drive units 840a, 840b that independently drive the first and second main axes. . Furthermore, as shown in FIG. 7B, the above-described constructed substrate transfer apparatus may include first to fourth spindles 83 0a-8 3 0d to be driven divided into upper and lower portions, and first to fourth drive units 840a-840d. . In addition, as illustrated in FIGS. 8 , 9A , 9B , in other embodiments, the substrate transfer apparatus may be modified to include four or eight spindles 8 3 0 a- 8 3 0 d (or 83 0a- 83 0h ), and Four or eight drive units 840a-840d (or 840a--22-

200818378 . (20) 840h). Therefore, the substrate transfer apparatus 800, the main shaft, and the driving unit of the first and second processing chambers 500, 600 may have a swashable arm that is detachably driven to load and unload the base. FIG. 1 is the first aspect of the present invention. 2 is a substrate processing diagram of the second embodiment, and FIG. 11 is a substrate reference diagram illustrating a substrate transfer device. The substrate processing of the second embodiment of the present invention is the same as that of the first embodiment, and is further included on the rear side. The load lock chamber 2~5Ό of the force transfer robot 260 and the fourth substrate inlet 420 are formed in the transfer chamber 400 and the rear 250. In the substrate processing system, the unprocessed substrate is loaded and the processed substrate is unloaded to the back side. The rear load lock here includes a cooling chamber 300 for cooling the substrate. The fading S 1 3 0 in Fig. 11 indicates the flow of the substrate and the processed substrate in one step of the substrate transfer apparatus. 1 and 2 are views showing a substrate decoration example of an embodiment of the present invention. As illustrated in FIG. 12, the first and second processing chambers 500 include four substrate support stages 520-526, and 620-626, and the 38's may include corresponding 16 rotary plate arms. Further, as shown in Fig. 2, there is a second processing chamber 600, and without the first processing chamber 500, the apparatus 800 can include eight rotating plate arms. At least one of the various embodiment boards is provided for the transmission base. The system view of the flow view system, including the atmospheric pressure ί disk 1 50. This: the load lock chamber is on the front side, and the fixed chamber 250 can take the head S100 to perform the unprocessed: the repair of the system, the 600 board transmission device 13 is shown, and the substrate processing i is used for the cooling base - 23- 200818378 - (21) The cooling chamber 300 of the board corresponds to the number of substrates to be processed. Although the substrate processing system of the present invention is described as including a single layer processing chamber in the above embodiment, the plurality of processing chambers and the transfer chamber may be constructed in multiple layers. In a multi-layered configuration, the substrate transfer device disposed within the transfer chamber can be driven independently or simultaneously. [Embodiment 3] Fig. 14 is a view showing an overall configuration of a substrate processing system according to a third embodiment of the present invention, and Fig. 15 is a plan view of the substrate processing system of Figs. Referring to Figures 14 and 15, the substrate transfer apparatus of this embodiment of the present invention includes first and second processing chambers 1500, 1 600, and a transfer chamber 1400 disposed therebetween. The indexing plate 1100 is disposed in front of the load lock chamber 1200, and the plurality of carriers 1110 are mounted in the index plate 1100. The indexing disk 1100 is referred to as a device front module (hereinafter referred to as EFEM) and, in some instances, includes a load lock chamber. If desired, the load lock chamber 1 200 can include a cooling chamber • 1 300 to cool the processed substrate. The load lock chamber 1 200 includes an atmospheric pressure transfer robot 1 2 1 0 operating at atmospheric pressure. The atmospheric pressure transfer robot 1 2 1 0 transfers the substrate between the transfer chamber 1400 and the indexing plate 1100. The atmospheric pressure transfer robot 1 2 1 0 is operated to transfer the substrate W between the carrier 1 1 1 0 and the transfer chamber 1 400. The atmospheric pressure transfer robot 1210 is executed by a robot including a two-arm configuration having four end effectors for taking out four substrates W from the carrier 1 1 1 , and placing the substrates in the transfer chamber 1400 Inside. The atmospheric pressure transmission robot 1210 can rise and fall. General Semiconductor Manufacturing System -24- 200818378 ^ (22) The various manipulators used in the process and the dual-arm type manipulator of the present embodiment of the present invention can be used as the atmospheric pressure transmission robot 1210. For example, a robot having various configurations such as a robot having a blade type arm and processing eight base plates W with one arm, a robot including four or more arms, and a combination of the above-described robots can be used. Each of the substrate support stages 1 520, 1 522, 1 620, 1 622 is disposed on the front end, the rear end, and the φ path of the first and second processing chambers 1500, 1 600, respectively. These paths are paths in which the swivel plate arms of the substrate transport apparatus 1 800 are rotated. The first and second processing chambers 1 500, 1 600 include a plasma source 70 such as a vacuum chamber to perform a predetermined plasma processing process. The first and second processing chambers 1 00, 1 600 can be constructed to perform various substrate processing operations. For example, the first and second processing chambers 1 500, 1 600 may be an ashing chamber for removing photoresist using plasma, a chemical vapor deposition (CVD) chamber for depositing an insulating layer, for The insulating layer engraves the opening or opening to form an etch chamber of the interconnect structure, a physical vapor deposition (PVD) chamber for depositing the barrier layer, or a physical vapor deposition chamber for depositing the metal layer. The substrate W processed by the substrate processing system of the present embodiment of the present invention is generally a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. In order to perform all the processes required to completely fabricate an integrated circuit or wafer, a complex processing system may be required, not only the substrate processing system of the present embodiment of the present invention. However, in order to clarify the invention, the ordinary constructions known to those skilled in the art are omitted. The substrate processing system of this embodiment of the present invention includes a centrally located -25-200818378 (23) transfer chamber 1400, and first and second processing chambers 1500, 1600 respectively disposed on lateral sides of the transfer chamber 1 400. . At least two substrate support tables mo, 1522, 1620, 1622 are disposed in the first and second processing chambers 1500, 160, respectively. The transmission module 1400 includes a substrate transfer device 1 8 〇 0. A first substrate inlet 1510 is formed between the transfer chamber 1400 and the first process chamber 15A, and a second substrate inlet 1610 is formed between the transfer chamber 14 00 and the second process chamber 1600. A third substrate inlet 1410 is formed between the transfer chamber _ 1 400 and the load lock chamber 1 200. The first to third substrate inlets 1510, 1610, 1410 are opened or closed by a slit valve (not shown). In particular, the front side 1 402 of the transfer chamber 1400 has a shape in which the third inlet 1410 is concave. According to this configuration feature, since the inner area of the transfer chamber 140 is reduced, the size of the vacuum system required to maintain the transfer chamber 1 400 in a vacuum state can be small. The process and the exchange of the processed substrate in the transfer chamber 1400 are performed by the atmospheric pressure transfer robot 1210 under atmospheric pressure, wherein the first and second substrate inlets 1 5 1 0, 1 6 1 0 are turned off. And the third substrate inlet 1 4 1 〇 is opened. On the other hand, the exchange of the substrate between the first and second processing chambers 1500, 1 600 and the transfer chamber 1400 before and after the processing is performed by the substrate transfer apparatus 1 800 and is performed in a vacuum state in which the third substrate is introduced. The 141 turns are closed and the first and second substrate inlets 1510, 1610 are opened. Fig. 16 is a perspective view illustrating a substrate transfer apparatus disposed in a transfer chamber. 17A to 17D are perspective views respectively illustrating first to fourth transfer members of the substrate transfer apparatus. Referring to Figs. 15 through 17D, the substrate transfer apparatus 1800 includes first to -26-200818378. (24) Four transfer members 1810a, 1810b, 1810c, 1810d which are dispersedly disposed at the edge of the transfer chamber 1400. The first to fourth transfer members 1810a, 1810b, 1810c, 1810d receive four substrates to the standby position via the third substrate inlet 1 4 10 (see FIG. 18A), and transmit the four substrates to the first and the first The upper sides of the substrate support stages 1 520, 1 522, 1 620, 1 622 in the two processing chambers 1500, 1 600; the first to fourth transfer members 18 10a, 1810b, 18 10c, 181 0d and receiving the substrate support table Each of the substrates on the upper side of 1 520, 1 522, 1 620, 1 622 is collectively transmitted to the standby position 〇 first to fourth transmission members 1810a, 1810b, 1810c, 1810d of the transfer chamber 1400. Each of them includes a drive unit 丨 8 3 用于 for providing a rotational force, a spindle 1 820 connected to the drive unit 1 8 3 0 , and two rotary plate arms 1840, 1850 mounted on the spindle 1 820. The two swivel arms 1840, 1850 can be divided into a loading arm 1840 and an unloading arm 1850. In this example, the unloading arm 1850 is preferably positioned lower than the loading arm 1840. As exemplified, the substrate transfer device 1 800 includes eight rotary plate arms 1 8 4 0, 1 8 5 0 for a total of four pairs. As illustrated in Figure 18A, the swivel plate arms 1 840, 1 8 50 can be swung, raised, and lowered to move between the standby position and the distracted position. At the standby position, the swivel plate arms 1 8 4 0, 1 8 5 0 are aligned in the upright direction into a single alignment line for receiving the substrate and transport substrate from the atmospheric pressure robot 1210 to the atmospheric pressure robot 1210. At the dispersed position, the swivel plate arms 1 840, 1 8 50 are unfolded on the dispersed substrate support table. The loading arm 1 840 and the unloading arm 1 850 operate in pairs. -27- 200818378 . (25) The first transfer member 1810a includes two swivel plate arms 1840, 1850 for loading the substrate on the substrate support table 1 62 2 of the second process chamber 1600 at the standby position/from the substrate support table 1 622 Unload the substrate. The second transfer member 18 10b includes two swivel plate arms 1 840, 1 850 for loading the substrate on/from the substrate support table 1 620 of the second process chamber 1 600 at the standby position. The third transfer member 1 810c includes two revolving plate arms 1 840, 180 0 to load the substrate on/from the substrate support table 1 520 of the first process chamber φ 1 500 at the standby position. The fourth transfer member 18 8d includes two turns: the flap arms 1 840, 1 8 50 to load the substrate on/from the substrate support table 1522 of the first process chamber 1500 at the standby position. On the other hand, the first to fourth transfer members 1810a, 1810 b, 18 10c, 1810d have different heights to prevent the first to fourth transfer members 1810a, 1810b, 1810c, 1810d from colliding with each other when they are gathered at the standby position. And the first to fourth transmission members 1 8 1 0a, 1 8 1 Ob, 1 8 1 0c, φ 1 8 1 0d may be alternately or continuously arranged. Although not shown in the drawings, the drive unit 1830 includes an electric motor for generating a rotational force and a gear assembly for transmitting the generated rotational force to the main shaft 1 8 2 0, so that the rotary plate arm 1 8 4 0, 1 8 5 0 Execute the desired job. Accordingly, the swivel plate arms 1840, 1850 are mounted to the main shaft 1820, and as illustrated in Figures 15, 17A-17D, the swivel plate arms 1 840, 1 850 are symmetrically unfolded and collapsed at different rotational radii of the transfer chamber 14 〇〇. In other words, the first and fourth transfer members 181a, 181, 〇d are rotated symmetrically with each other, and the second and third transfer members 1810b, 181c are rotated symmetrically with each other. -28- 200818378. (26) As illustrated in Figures 17A-17D, the swivel plate arms 1 840, 1 8 50 of the first to fourth transfer members 1810a, 1810b, 1810c, 1810d comprise a horseshoe end effector 1 842 and a plurality Support portion 1 844. The end effector 1842 includes an opening 1 843 having an open side. The edges of the substrate are positioned on the upper side of the support portions 1 844. An opening 1 843 is provided to allow the lift pins disposed within the substrate table to enter and exit. The end effector 1 842 has an inlet path 1 845 to which the end effector 1212 of the atmospheric pressure transfer robot 1210 enters or exits via φ. The swivel plate arms 1840, 1850 can have other forms of modification within the scope of the invention. The substrate processing system of the present invention can be modified by the following alternative embodiments. Figures 19, 20 are views illustrating an example of a transfer member 1810a' having an extendable plate arm. Referring to Figures 19 and 20, the swivel plate arm 1 840' includes first to third extendable plate arms 1841-1, 1841-2, 1841-3 of the antenna mast type. The first extendable φ plate arm 1841-1 is a part that is coupled to the main shaft 1820, the second extendable plate arm 1841-2 is a part that extends from the first extendable plate arm 1841-1, and the third extendable plate arm 1841- 3 is a part that extends from the second extendable plate arm 1841-2 and has one end connected to the end effector 1 8 42. As illustrated in Fig. 20, the transfer member 1810a5 having the above-described substrate transfer apparatus 1 800 is operated such that each of the swivel plate arms 1 840, from the standby position of the transfer chamber 1800a, to the substrate support table 1522, 152 0, 1622, respectively , 1620 revolution. Then, the extendable plate arms 1841-1, 1841-2, 184 are retracted step by step so that the end effector 1 842 is positioned on the substrate -29-200818378. (27) The upper side of the support table. In other words, the transfer member 18 1 0a' is swung in a state of contracting the extendable plate arms 1841-1, 184 1-2, 1841-3 to reduce the radius of rotation, and is stretched so that the end effector 1842 is positioned on the substrate support table. As exemplified in Fig. 20, due to such an extendable configuration, the radius of rotation of the transport member 1810a' of the substrate transport apparatus 1 800 can be reduced, so that the overall area of the transport chamber can also be reduced. 18A-18D are views for continuously exemplifying a substrate transfer operation performed by a substrate transfer apparatus. Referring first to FIG. 18A, as indicated by an arrow S110, in a state where the first and second substrate inlets 1 5 1 0, 1 6 1 0 are closed, when the third substrate inlet 1410 is opened, the unprocessed substrate is transferred. To the substrate transfer device 1800. When the transfer of the substrate is completed, the third substrate inlet 1410 is closed, and the transfer chamber 1400 is converted into the same vacuum state as the inside of the first and second processing chambers 1500, 1600. Of course, the pump system for the vacuum state is provided in the system of this embodiment of the invention, but is omitted for convenience. _ Next, when the lift pins (not shown) of the plurality of support tables 1 520, 1 522, 1 620, 1622 rise, the processed substrate is lifted to a predetermined height. To cooperate with this operation, the first and second substrate inlets 1510, 1610 are opened. At this time, the height of the raised lift pin is different from the position of the corresponding transfer member to which the substrate is transported. Therefore, the rotation of the swivel plate arms 1 840, 185 用于 for loading/unloading does not interfere with the lift pins. Continuing, as indicated by an arrow S120 in FIG. 18B, the swivel plate arms 1 840, 1 8 50 of the first to fourth transfer members 1810a-1810d of the substrate transfer apparatus 1 800 are respectively directed to the respective substrate support tables. The upper side turns and -30- 200818378 • (28) Expand. At this time, the processed substrate is transferred from the lift pins to the unloading arms 1 8 5 0 of the first to fourth transfer members 1810a to 1810d. Continuing, as indicated by arrow S130 in Fig. 18C, when the processed substrate is transferred, the unloading arm 1 850 returns to the central standby position of the transfer chamber 1400 as the starting position. The lift pin is again raised to receive the unprocessed substrate from the loading arm 1 840. As indicated by arrow S140 in Figure 18D, the loading arm 1840 also returns to the starting position of the transfer chamber 1 400. At the same time, the first and second substrate inlets φ 1 5 1 0, 1 6 1 0 are again turned off. The lift pins are lowered to place the unprocessed substrates on the substrate support tables 1520, 1522, 1620, and 1622. The transfer chamber 1 400 is switched to the atmospheric pressure state, and the third substrate inlet 1 4 1 0 is opened. The atmospheric pressure transfer robot 1210, which is loaded with the lock chamber 1 200, receives the processed substrate from the unloading arm 1 850 and exits from the transfer chamber 1 400, as indicated by the arrow S 1 50 in Fig. 18D. The continuous operations S 1 1 0 to S 1 50 of the exchange substrate are performed continuously and simultaneously in a range, and the front work and the post work do not interfere with each other in the area to exchange the time required for the substrate. minimize. It will be appreciated that jobs S 1 1 0 and S 1 50 are simultaneously executed during repeated substrate exchange operations. In other words, the exchange of the substrates is performed between the transfer chamber 1 400 and the load lock chamber 1 200, whereby the processed substrates unloaded by the previous operations are exchanged with the pre-process substrates to be simultaneously loaded. The unloaded processed substrate is transferred to the cooling chamber 1300 by the atmospheric pressure transfer robot 1210 and cooled to be stacked in the carrier 1110. Although the cooling chamber 3300 of this embodiment of the present invention is separately provided, if the transfer chamber 1400 performs the function of cooling, the separate cooling - 31 - 200818378 may be omitted. (29) The chamber 1300. In other embodiments, one of the first and first 600 can be considered a cooling chamber. Example $1 1 500 is taken as a plasma chamber, and in the case of the second processing chamber 1600, the first processing chamber 1500 performs the substrate transfer device 1 800 to cool the processed substrate from the first to the second processing chamber 1 600 . The cooled chamber 1 600 is transferred to the load lock chamber 1 200. φ Therefore, the plurality of substrates are simultaneously processed in accordance with the embodiment of the present invention, the first and second processing chambers are disposed, and the transfer chamber 1 400 is disposed between the first processing chambers 1 600. The substrate transfer device is set to 1800 to exchange substrates quickly so that they can be processed simultaneously and quickly. In this embodiment, two substrates are provided in each of the first and second processing chambers, and a total of four substrates can be replaced at one. φ Although the substrate processing system of the present invention described includes a single layer processing chamber, the plural may be formed into a plurality of layers. In a multi-layer construction, it is provided in transmission, which can be driven independently or simultaneously. Fourth Embodiment Fig. 21 is a view showing a configuration of a body of a fourth embodiment of the present invention. 22A-22C are diagrams illustrating a substrate diagram in which the first, second, and third processing groups are exemplified in the second processing chamber 1 500, and the first processing chamber can be used as a cooling chamber. In this plasma processing, and the substrate-processing chamber 1500 transfer substrate can be exchanged from the second plate processing system for 1500, 1600 parallel [1500 and second processing enables quick exchange of many substrates 1500 in this structure ^ 1600 in the process of simultaneous processing and communication, in the processing chamber and transmission chamber of the above embodiment, the plan view 21 of the whole processing system of the indoor substrate transfer device substrate processing system. -32- 200818378. (30) Referring to Figures 21 through 22C, the substrate processing system of this embodiment of the present invention includes a load lock chamber 2200 and first, second, and second processing groups a, b, c. The first, second, and third process groups a, b, and c are disposed on the rear side of the load lock chamber 22 00 and are stacked in a multi-layered manner. The indexing plate 2100 is disposed in front of the load lock chamber 2200, and the plurality of carriers 2110 are mounted in the index plate 2100. The indexing plate 2100 is referred to as a device front end module (hereinafter referred to as EFEM_), and in some cases is meant to include a load lock chamber. The load lock chamber 2200 includes an atmospheric pressure transfer robot 2210 that operates at atmospheric pressure. The atmospheric pressure transmitting robot 2210 transfers the substrate between the first, second, and third transfer chambers 2400a, 2400b, 2400c and the indexing disk 2100 respectively corresponding to the processing group. The atmospheric pressure transfer robot 22 10 is executed by a robot including a double arm configuration having four end effectors for taking out four substrates W from the carrier 2210 and placing the substrates into the first layers of the layers, The second and third transfer chambers 24 00a, 24 0 0b, and φ 24 00c. The atmospheric pressure transmission robot 2210 can ascend and descend. The various manipulators used in the general semiconductor manufacturing process and the dual-arm type manipulator of the present embodiment of the present invention can be used as the atmospheric pressure transmitting robot 2210. For example, a robot having various configurations such as a robot having a blade type arm and processing eight substrates W with one arm, a robot including four or more arms, and a combination of the above-described robots can be used. As illustrated in Fig. 21 to Fig. 2C, the first, second, and third processing groups a, b, and c are stacked in a multi-layered manner. The first processing group a located in the first layer includes first and second processing chambers 2500a, 25 00b to simultaneously process four substrates; -33- 200818378. (31) Second processing group b in the second layer The first and second alignment chambers 2600a, 2600b are included for the unprocessed substrate; the third processing group c positioned at the uppermost layer includes a cooling chamber 2700 to cool the processed substrate. Thus, in the substrate processing system 2010 of this embodiment of the invention, and in plan view, the alignment chamber is arranged to overlap the cooling chamber in the processing chamber, enabling a reduction in the overall bottom region of the substrate processing system. Therefore, the manufacturing cost of the clean room can be reduced, and the atmospheric pressure can be eliminated during the transfer of the substrate from the second transfer chamber 2400b to the φ first transfer chamber 2400a and the transfer of the substrate from the first transfer chamber 2400a to the third transfer-transfer chamber 2400c. The direction of the force manipulator 2210 changes the operation. Furthermore, since the transmission distance is short, the substrate can be quickly transferred. Referring to FIG. 22A, the first processing group a in the first layer includes the first and second processing chambers 2500a, 2500b, and the first disposed therebetween. The transfer chamber 2400° each has two substrate support stations 2 5 20, 25 22 disposed at the front end and the rear end of the first and second processing chambers 2500a, 2500b, respectively, and at the first substrate transfer device 2800a On each revolution path of the swivel plate arm. The first and second processing chambers 25 00a, 2500b include a plasma source (not shown) such as a vacuum chamber to perform a predetermined plasma processing process. The first substrate inlet 2510a is formed between the first transfer chamber 24A and the first processing chamber 2500a, and the second substrate inlet 2510b is formed between the first transfer chamber 2400a and the second processing chamber 2500b. The third substrate inlet 2410 is formed between the first transfer chamber 2400a and the load lock chamber 2200. The first to third substrate inlets 25 1 0a, 25 1 Ob, and 24 1 0 are opened or closed by a slit valve (slit - 34 - 200818378 . (32) valve, not shown). The exchange of the substrate in the first transfer chamber 2400a before and after the treatment is performed by the atmospheric pressure transfer robot 2210 under atmospheric pressure, wherein the first and second substrate inlets 2510a, 2510b are closed, and the third substrate inlet 2410 is turn on. On the other hand, the exchange between the first and second processing chambers 2500a, 2500b and the first transfer chamber 2400a before and after the processing is performed by the first substrate transfer device 2800a, and φ is performed in a vacuum state, wherein The third substrate inlet 241 0 is closed and the first and second substrate inlets 2510a, 2510b are opened.

The first and second processing chambers 2500a, 2500b can be constructed to perform various substrate processing operations. For example, the first and second processing chambers 500, 600 may be an ashing chamber for removing photoresist using plasma, a chemical vapor deposition (CVD) chamber for depositing an insulating layer, for etching in an insulating layer A hole or opening to form an etch chamber of an interconnect structure, a physical vapor deposition (PVD) chamber for depositing a barrier layer, or a physical vapor deposition chamber for depositing a metal layer. φ The substrate W processed by the substrate processing system of the present embodiment of the present invention is generally a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. In order to perform all the processes required to completely fabricate an integrated circuit or wafer, a complex processing system may be required, not only the substrate processing system of the present embodiment of the present invention. However, in order to clarify the invention, the ordinary constructions known to those skilled in the art are omitted. Referring to Figures 22B and 26, the second processing group b positioned in the second layer includes first and second alignment chambers 2600a, 2600b, and a second transfer chamber 2400b - 35 - 200818378 ^ (33) first disposed therebetween And the second alignment chambers 2600a, 2600b respectively include a rotary chuck that is disposed on each of the rotary paths of the rotary plate arms of the second substrate transfer apparatus 2800b. The first and second alignment chambers 2600a, 2600b are chambers that are aligned with the front substrate in the first and second processing chambers 25a, 2500b. And the first and second alignment chambers 2600a, 260 0b include a substrate aligner having a rotary chuck 2640, a detecting unit (ie, an inductor) 2650, and a height adjustment of the rotating chuck 2640 according to the φ height of the rotating plate arm. Lifter 2660. The substrate aligner can be configured such that when the substrate is placed on the rotary chuck 2640 such that the detection unit 2650 disposed on the side of the standby board detects the position of the substrate, the substrate aligner rotates the rotary chuck 2640. The detecting unit 2650 herein includes a charge coupled device (CCD) and a corresponding light source, and is used for detecting the position of the substrate. On the other hand, as shown in Fig. 26, according to the positions of the first and second swivel plate arms, the rotary collet 2640 of the first alignment chamber 2600b is disposed to be a collet 2 6 of the second alignment chamber 2 6 0 a. The position of 40 is still low. φ The first substrate inlet 2010a is formed between the first transfer chamber 2400a and the first alignment chamber 2600a, and the second substrate inlet 2610b is formed between the second transfer chamber 24 00b and the second alignment chamber 2600b. A third substrate inlet 2412 is formed between the second transfer chamber 2400b and the load lock chamber 2200. The first to third substrate inlets 2610a, 2610b, 2412 are opened or closed by a slit valve (not shown). Referring to Fig. 22C, the third processing group c positioned at the uppermost layer includes a third transfer chamber 2400c aligned to the second transfer chamber 2400b, and a cooling chamber 2700 disposed at the side thereof. The first substrate inlet 2710 is formed between the third transfer chamber - 36 - 200818378 ^ (34) 2400c and the cooling chamber 2700, and the third substrate inlet 2414 is formed between the third transfer chamber 2400c and the load lock chamber 2200. The first and third substrate inlets 2710, 2414 are opened or closed by a slit valve (not shown). As is known and need not be described in detail, the cooling chamber 2700 is a chamber for cooling the four substrates that have been processed by the first and second processing chambers. The cooling chamber must include a cooling station for placing the four substrates. The cooling chamber may further include a φ cooling gas supplier to supply cooling air to the substrate. Since the structure and method of cooling the substrate are well known and known to those skilled in the art, the structure and method are omitted. 23A to 23C are perspective views of first, second, and third substrate transfer apparatuses provided in the first, second, and third transfer chambers. First, referring to Fig. 23A, the first substrate transfer apparatus 2800a includes a drive unit 2840 for supplying a rotational force, a single spindle 2 830 connected to the drive unit 2840, and eight rotary plate arms 2810 mounted to the spindle 2830. φ The eight rotary plate arms 2 8 1 0 include a plurality of first rotary plate arms and a plurality of second rotary plate arms. The first rotary plate arms are used to load the substrate on the first processing chamber 2500a or to unload the substrate from the first processing chamber 2500a; the second rotary plate arms are used to load the substrate on the second processing chamber 2500b. Or unloading the substrate from the second processing chamber 25 00b. The first and second swivel plate arms are alternately arranged. However, the first and second swivel plate arms can be continuously arranged. The plurality of swivel plate arms 2810 can be divided into a loading arm 2820 and an unloading arm 2822. In this case, the unloading arm 2822 is preferably configured to be lower than the loading arm 2820. The loading arm 2 820 and the unloading arm 2822 are paired and, in the embodiment shown - 37-200818378.  (35) Set eight rotary arm arms into four pairs. As shown in Fig. 22A, the plurality of returning plate arms 2810 are fanned out and can be swung, raised, and lowered. The loading arm 2820 and the unloading arm 2822 are configured to operate in pairs. Although not shown in the drawings, the drive unit 2840 includes an electric motor for generating a rotational force and a gear assembly for transmitting the generated rotational force to the main shaft 2830 to cause the plurality of swivel arms 2810 to perform the desired operation. Therefore, the plurality of swivel plate arms 2810 are mounted on the main shaft ^ 283 0, and as illustrated by φ 22A, the swivel plate arms 2810 are symmetrically expanded into a fan shape, and are folded in different rotations of the first transfer chamber 2 4 0 0 a radius. While the substrate processing system of the present invention is described as including a single spindle, the substrate processing system can include a plurality of spindles disposed on the lateral sides of the spindle. Figure 23B is a perspective view illustrating a second substrate transfer apparatus provided in the second transfer chamber. Referring to FIG. 23B, the second substrate transfer apparatus 2800b is like a first substrate transfer device 2800a including a drive unit 2840 for providing a rotational force, a single spindle 2830 connected to the drive unit 2840, and four swings mounted on the spindle 2830. Plate arm 2 8 1 0. The second substrate transfer device 2 800b may include a plurality of drive units and spindles respectively coupled to the respective drive units such that the four rotary plate arms 2 8 1 0 are independently rotatable. The four swivel arm 2810 includes two first swivel arms and two second swivel arms. The first rotary plate arms are disposed on the lower side for loading the substrate on the first alignment chamber 26 00a or unloading the substrate from the first alignment chamber 2 600a; the second rotary plate arms are used to load the substrate Two alignment chambers -38- 200818378 .  (36) 2 600b, or unloading the substrate from the second alignment chamber 2600b. The first and second swivel plate arms are continuously arranged. However, the first and second swivel plate arms are alternately arranged. As illustrated in Fig. 26, the rotary chuck 2640 of the first alignment chamber 2600b is disposed lower than the rotary chuck 2640 of the second alignment chamber 2600a depending on the positions of the first and second rotary plate arms. Figure 23C is a perspective view of a second substrate transfer apparatus in which the τικ is disposed in the transfer chamber of the table 2. Referring to FIG. 23C, the third substrate transfer device 2800c is like a substrate transfer device 2800a, which includes a drive unit 2840 for providing a rotational force, a single spindle 2830 connected to the drive unit 2840, and mounted on Four turns plate arms 2810 of the main shaft 2830. The four rotary plate arms 2810 are used to load the substrate on the cooling chamber 27 or to unload the substrate from the cooling chamber 2700. Although not shown in the drawing, the first substrate transfer device may include upper and lower a spindle and a drive unit for driving the upper and lower spindles. Wherein, the loading arm 2820 and the unloading arm 2822 are respectively mounted to the upper main shaft and the lower main shaft Φ, and the driving unit has an upper driving unit and a lower driving unit. Figure 24 is a perspective view illustrating the configuration of a single swivel plate arm. Referring to Figure 24, a plurality of swivel plate arms 2810 disposed within first, second, and third substrate transfer devices 2800a, 2800b, 2800c include a horseshoe end effector 2812 and a plurality of support portions 2814. The end effector 2812 includes an opening 2 8 1 3 having an open side. The edges of the substrate are positioned on the upper side of the support portions 28 14 . An opening 2813 is provided to allow the lift pins disposed within the substrate table to enter and exit. End effector 28 1 2 has an inlet path 2815 to which end effector 2212 of atmospheric pressure transfer robot 210 enters or exits via -39-200818378, (37). The swivel plate arm 2810 can have other forms of modification within the scope of the invention. 25A to 25E are views continuously illustrating a first substrate transfer apparatus performing a substrate exchange job. Referring first to FIG. 25A, as indicated by an arrow S210, in a state where the first and second substrate inlets 2510a, 2510b are closed, when the third substrate inlet 24 1 is opened, the unprocessed substrate W2 is transferred to the substrate transfer φ device. 2800a. When the transfer substrate W2 is completed, the third substrate inlet 2410 is closed, and the first transfer chamber 2400a is converted into the same vacuum state as the inside of the first and second process chambers 25 0 0a, 25 00b. Of course, the pump system for the vacuum state is provided in the system of this embodiment of the present invention, but is omitted for convenience. Next, as shown by an arrow S220 in Fig. 25B, when the lift pins of the plurality of support stages 2520, 2 522 rise, the processed substrate W1 is lifted to a predetermined height. To match this operation, the first and second substrate inlets φ 2510a, 2510b are opened. At this time, the lifted pin of the front substrate support table 2520 is relatively lower in height than the lift pin of the rear substrate support table 2522. Therefore, the loading arm 2820 for loading/unloading does not interfere with the lift pins. Continuing, as shown by an arrow S23 0 in Fig. 25C, the loading arm 2 8 2 0 and the unloading arm 2 8 2 2 of the substrate transfer device 2800 are symmetrically rotated in pairs and expanded into a fan shape. At this time, the processed substrate W 1 is transferred from the lift pin to the unloading arm 2822. Continuing, as shown by an arrow S240 in Fig. 25D, when the processed substrate W1 is transferred, it is unloaded. Arm 2822 returns to the first -40-200818378.  (38) The starting position of the transfer chamber 2400a. As indicated by the arrow S2 50, the lift pin is again raised to receive the unprocessed substrate W2 from the loading arm 2820. As indicated by arrow S260 in Fig. 25E, the loading arm 2820 also returns to the starting position of the first transfer chamber 2400a. At the same time, the first and second substrate inlets 25 10, 25 10b are again closed. As indicated by arrow S2 70, the lift pins are lowered to place the unprocessed substrate W2 on the substrate support tables 2520, 2522. 第一 φ The first transfer chamber 2400a is switched to the atmospheric pressure state, and the third substrate inlet 2410. Was opened. As indicated by an arrow S280 in Fig. 25E, the atmospheric pressure transmitting robot 2210 of the load lock chamber 2200 receives the processed substrate W1 from the unloading arm 2822 and exits from the first transfer chamber 2400a. The continuous operations S210 to S280 of the exchange substrate are continuously and simultaneously performed in a range in which the front work and the post work do not interfere with each other to minimize the time required to exchange the substrates. It will be appreciated that jobs φ S210 and S280 are simultaneously executed during repeated substrate exchange operations. In other words, the exchange of the substrate is performed between the first transfer chamber 2400a and the load lock chamber 2200, whereby the processed substrate unloaded by the previous job is exchanged with the pre-process substrate to be loaded at the same time. 27A to 27C are views continuously illustrating a second substrate transfer apparatus performing a substrate exchange job. Referring first to Figure 27A, as indicated by arrow S210, when the third substrate inlet 2412 is open, the unprocessed substrate W1 is transferred to the substrate transfer device 28 00b. When the transfer of the substrate is completed, the third substrate inlets 2412 - 41 - 200818378 (39) are closed, and at the same time, the first and second substrate inlets 2610a, 2610b are opened. Continuing, as indicated by arrow S220 in Fig. 27B, one of the first swivel plate arms of the second substrate transfer device 2800b and one of the second swivel plate arms are symmetrically rotated and unfolded to place the substrate W 1 at Corresponding to the rotating chuck 2640. And returning to the home position as indicated by an arrow S230 in Fig. 27C. When the alignment of the substrates in the first and second alignment chambers 2600a, 2600b is completed, the alignment of the remaining two φ substrates is performed in a similar operation as described above. When the secondary alignment of the four substrates is completed, the robot 2210 is transported at atmospheric pressure, and the aligned substrates are transferred from the second transfer chamber 2400b to the first transfer chamber 2400a. The atmospheric pressure transfer robot 2210 can adjust the height immediately after the substrate is taken out from the second transfer chamber 2400b, and transfer the substrate from the second transfer chamber 2400b to the first transfer chamber 2400a. In other words, since the third substrate inlets 2410, 2420 of the first and second transfer chambers 2800a, 2800b are aligned with each other, the atmospheric pressure transfer robot 2210 can quickly transfer the substrate from the second transfer φ chamber 2400b to the first transfer chamber. 2400a without having to change direction. Meanwhile, the substrates processed in the first and second processing chambers 2500a and 2500b are transferred to the third transfer chamber 2400c by the atmospheric pressure transfer robot 22 1 0. In this operation, the atmospheric pressure transmitting robot 2210 can quickly transfer the substrate from the first transfer chamber 2400a to the third transfer chamber 2400c without changing the direction. The substrate is transferred to the cooling chamber 2700 by the third substrate transfer device 2800c provided in the transfer chamber 2400c, and is cooled in the cooling chamber 2700. The substrate is taken out by the atmospheric pressure transmission robot 2210 and accumulated in the carrier 2100. - 42 - 200818378 ^ (40) In this embodiment, since the first and second processing chambers 2500a, 2500b simultaneously process the four substrates W, 24 substrates W are simultaneously cooled in the cooling chamber 2700. However, the time required to cool the substrate can be longer than the time required to process the substrate. In this case, the cooling chamber 2700 can be disposed on the lateral side of the third transfer chamber 2400c because the overall efficiency is considered. The substrate processing system can be modified by the alternative embodiments described below. 28 is a view illustrating that the first alignment chamber 2600c and the second alignment chamber 2600d φ are respectively aligned with the substrate. As illustrated in Fig. 28, similar to the first and second processing chambers 2500a, 2500b, the first and second alignment chambers 2600c, 2600d can be constructed such that the two substrates are aligned within one chamber. W 29 is a front cross-sectional view illustrating the modification of the second treatment group. As illustrated in Fig. 29, in the modified second treatment group b', any of the first and second alignment chambers 2600a, 2600b is replaced by a cooling chamber 2700. When the second processing group b' is used, the third processing group can be omitted. As illustrated in Fig. 29, since the time for aligning the substrate is short, it is preferable to replace one chamber with a cooling chamber. In this case, the second and second substrate substrate transfer devices 2800d, 2800e must be disposed in the second transfer chamber 2400b. In other words, the second upper substrate transfer device 2800d is for transferring the substrate to be aligned, and the third lower substrate transfer device 2 800e is for transferring the substrate to be cooled. Here, since the second substrate transfer device 2800d transmits one substrate in this order, the drive unit preferably drives the rotary plate arms independently to transfer the substrate. As shown in Fig. 30, the substrate processing system of this embodiment of the present invention may include a single cooling chamber 2700. By removing the third treatment group c, the cooling chambers 2700 - 43 - 200818378 (41) are disposed on the upper side of the second treatment group b. The cooling chamber 2700 can include a table with four substrates placed simultaneously on the table. And four substrates are directly loaded in the cooling chamber 2700 by the atmospheric pressure transmitting robot 22 10 . Embodiment 5 Figure 3 is a plan view showing a substrate processing system of a fifth embodiment of the present invention. Referring to FIG. 3, the substrate processing system of this embodiment of the present invention includes first and second processing chambers 3 40 0, 3 4 1 0, a transfer chamber 3300 disposed between the first and second processing chambers 3400, 3410, And a load lock chamber 3200 disposed in front of the transfer chamber 3300. The indexing plate 3100 is disposed in front of the load lock chamber 3200, and the plurality of carriers 3110 are mounted in the index plate 3100. The indexing disk 3 10 0 is referred to as a device front end module (hereinafter referred to as EFEM), and in some cases is meant to include a load lock chamber. If desired, the substrate processing system can include a cooling chamber (not shown) for cooling the processed substrate. The load lock chamber 3200 includes an atmospheric pressure transfer robot 3210 that operates at atmospheric pressure. The atmospheric pressure transfer robot 3210 transfers the substrate between the transfer chamber 3300 and the indexing plate 3100. The atmospheric pressure transfer robot 3 2 1 0 is operated to transport the substrate W between the carrier 3 1 1 0 and the transfer chamber 3 300 . The atmospheric pressure transfer robot 3210 is executed by a robot including a two-arm configuration having four end effectors to take out two substrates W from the carrier 3 1 1 0 and immediately place the substrates in the transfer chamber Within 3 3 00. The atmospheric pressure transfer robot 3210 includes a track 3220 along which the atmospheric pressure transfer robot 32 moves laterally. General Semiconductor Manufacturing -44- 200818378 (42) The various manipulators used in the process and the dual-arm type machine of the present embodiment of the present invention can be used as the atmospheric pressure transmission robot 3210. The first and second processing chambers 3400, 3410 include vacuum chambers for performing a plasma process. Substrate support tables 3402, 3412 are respectively disposed on individual paths within the first and second processing chambers 3400, 3410. These paths are paths in which the rotary plate arms of the substrate transfer device 3 500 rotate. The first and second processing chambers 3400, 34 1 : can be constructed to perform various substrate processing operations. For example, the φth and second processing chambers 3400, 3410 may be an ashing chamber for removing photoresist using a plasma, a chemical vapor deposition (CVD) chamber for depositing an insulating layer, or for use in an insulating layer. The holes or openings are etched to form an etch chamber of interconnect construction, a physical vapor deposition (PVD) chamber for depositing a barrier layer, or a physical vapor deposition chamber for depositing a metal layer. The substrate W processed by the substrate processing system of the present embodiment of the present invention is generally a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. In order to perform all the processes required for the complete fabrication of the integrated circuit or wafer φ, a complex processing system may be required, not only the substrate processing system of the present embodiment of the present invention. However, in order to clarify the invention, the ordinary constructions known to those skilled in the art are omitted. The transfer chamber 3300 includes a transfer chamber 400 located at the center and first and second processing chambers 500, 600 respectively disposed at lateral sides of the transfer chamber 400. At least two substrate support tables 520, 522, 620, 622 are disposed in the first and second processing chambers 500, 610, respectively. The transmission module 400 includes a substrate transfer device 800. The transfer chamber 3 300 includes a substrate transfer device 3 500. First substrate inlet - 45 - 200818378 ^ (43) 33 10 is formed between the transfer chamber 3 3 00 and the load lock chamber 3200. A second substrate inlet 3 320 is formed between the transfer chamber 3 300 and the first processing chamber 3400. The third substrate inlet 33 00 is formed between the transfer chamber 33 00 and the second process chamber 3410. The first to third substrate inlets 3310, 3 320, 3 3 3 0 are opened or closed by a slit valve (not shown). The exchange of the substrate in the transfer chamber 3 00 before and after the treatment is performed by the atmospheric-pressure-force transmitter-arm 3210 under atmospheric pressure, wherein the second and φ third substrate inlets 3320, 3 3 3 0 are Closed, and the first substrate inlet 3310 is opened. On the other hand, the exchange between the first and second processing chambers 3400, 3410 and the transfer chamber 33 00 before and after the processing is performed by the substrate transfer device 3 500 and is performed in a vacuum state, wherein the first The substrate inlet 3310 is closed and the second and third substrate inlets 3320, 3330 are opened. Figure 3 is a perspective view illustrating a substrate transfer apparatus disposed in the transfer chamber of Figure 31. Referring to FIG. 32, the substrate transfer apparatus 3 500 includes a drive unit 3 5 4 0 for providing a rotational force φ, a single spindle 3 5 3 0 connected to the drive unit 3 5 4 0, and a complex swing mounted on the spindle 3 5 3 0 Plate arm 3 5 1 0. The plurality of swivel arms 3 5 1 〇 include two first swivel arms and two second swivel arms. The first rotary plate arms are used to load the substrate on the first processing chamber 3400 or to unload the substrate from the first processing chamber 3400; the second rotary plate arms are used to load the substrate on the second processing chamber 3400, Or unloading the substrate from the second processing chamber 3400. The first and second swivel plate arms are alternately arranged. However, the first and second swivel plate arms can be continuously arranged. The plurality of rotary plate arms 3 5 1 〇 can be divided into a loading arm 3 520 and an unloading arm 3 522. In this case, the unloading arm 3 522 is preferably -46-200818378 (44) configured to be lower than the loading arm 3 520. The loading arm 3 520 and the unloading arm 3 522 are paired, and in the embodiment as shown, four swivel arms are provided in two pairs. As illustrated in Fig. 31, the plurality of rotary plate arms 3 5 10 are expanded into a fan shape. Although not shown in the drawings, the drive unit 3 540 includes an electric motor for generating a rotational force and a gear assembly for transmitting the generated rotational force to the main shaft 3 5 3 0 so that the plurality of rotary plate arms 3 5 1 0 Execute the desired job. 0 Therefore, the plurality of rotary plate arms 3 5 1 0 are mounted on the main shaft 3 5 3 0, and as illustrated in FIG. 31, the rotary plate arms 3 5 1 0 are symmetrically expanded into a fan shape, and relative to the main shaft 3 5 3 0 Collapse. Fig. 3 3 illustrates an example of a substrate transfer apparatus having an upper drive unit and a lower drive unit that are separated from each other. Referring to Fig. 33, the substrate transfer apparatus 3 500a of this embodiment of the present invention includes lower and upper spindles 3 5 3 0a , 3 53 0b and lower and upper drive units 3 540a, 3 540b. The loading arm 3 5 20 and the unloading arm 3 522 are mounted to the lower main shaft ^ 3530a and the upper main shaft 3530b, respectively. The lower and upper drive units 3540a and 3540b drive the lower and upper spindles 3 5 3 0a and 3 53 0b, respectively. Here, both the lower and upper spindles 3 5 3 0a and 3 5 3 0b are preferably aligned with the same axis. Fig. 34 is a perspective view illustrating the configuration of the swivel plate arm. Referring to Fig. 34, a plurality of rotary plate arms 3 5 1 0 disposed in the substrate transfer apparatus 3500 include a horseshoe end effector 3 5 1 2 and a plurality of support portions 3 5 1 4 . The end effector 3 5 1 2 includes an opening 3 5 1 3 containing an open side. The edge of the substrate is positioned on the upper side of the support portions 3 5 1 4 . An opening 3 5 1 3 is provided to allow the lift pins disposed within the substrate table to enter and exit. The end effector -47- 200818378 _ (45) 3512 has an inlet path 3515 through which the end effector 3 5 1 2 of the atmospheric pressure transmission robot 3510 enters or exits. The swivel plate arm 3 5 1 0 may have other forms of modification within the scope of the invention. The substrate transfer apparatus of the present invention performs substrate transfer as described below. In a state where the second and third substrate inlets 3320, 3 3 3 0 are closed, when the first substrate inlet 3 3 1 〇 is opened, the unprocessed substrate w is transferred to the loading arm 3520 of the substrate transfer apparatus 3500. When the transfer of the substrate W is completed φ, the first substrate inlet 3310 is closed, and the transfer chamber 3 3 00 is converted into the same vacuum state as the inside of the first and second process chambers 3400, 3400. Of course, the pump system for the vacuum state is provided in the system of this embodiment of the present invention, but is omitted for convenience. Next, the treated substrate is placed on the substrate support table of the first and second processing chambers 3400 and 3410. When the lift pins of the support tables 3402, 3412 rise, the processed substrate W is lifted to a predetermined height. To match this operation, the second and third substrate inlets 3320, 3330 are opened. The loading arm 3 520 of the substrate φ transporting device 35 00 and the unloading arm 3522 are paired and fanned out. At this time, the processed substrate W is transported from the lift pin to the unloading arm 3522. After transporting the substrate W, the unloading arm 3 5 2 2 returns to the starting position of the transfer chamber 3 3 0 0 . The lift pin is again raised to receive the unprocessed substrate W. The loading arm 3 5 2 0 returns to the starting position of the transfer chamber 3 300. At the same time, the second and third substrate inlets 3 320, 3 3 3 0 are again closed. In conjunction with this operation, the lift pins are lowered to place the unprocessed substrate W on the substrate support table 3 4 0 2, 3412. Next, the transfer chamber 3300 is switched to the atmospheric pressure state, and -48-200818378 (46) the first substrate inlet 3310 is opened. The atmospheric pressure transfer robot 3210 of the load lock chamber 3200 receives the processed substrate W from the unloading arm 3 522 and exits from the transfer chamber 3400. The continuous operation of the exchange substrate is performed continuously and simultaneously over a range, and the front work and the post work do not interfere with each other in the area to minimize the time required to exchange the substrates. The exchange of the substrate before and after the processing is performed simultaneously by the base-board sale-transfer-setting fee φ 3 5 00 of the atmospheric pressure transmission robot 3210 and the transmission chamber 3 300. In other words, the exchange of the substrate is performed between the transfer chamber 3400 and the load lock chamber 3200, whereby the processed substrate that has been unloaded by the previous work is exchanged with the pre-processed substrate to be loaded at the same time. The unprocessed substrate W is accumulated in the carrier 3 1 1 0 by the atmospheric pressure transmitting robot 3 2 1 0. If the unloaded substrate W needs to be cooled, the substrate processing system may include a cooling chamber to cool the substrate. For this purpose, the cooling chamber can be located at the appropriate location in the substrate processing system. In other embodiments, one of the first and second φ processing chambers 3400, 3410 can serve as a cooling chamber. For example, the first processing chamber 3400 can be regarded as a plasma chamber, and the second processing chamber 3410 can be regarded as a cooling chamber. In this case, the first process chamber 3400 performs plasma processing of the substrate, and the substrate transfer device 3500 transfers the processed substrate from the first process chamber 3400 to the second process chamber 3410 for cooling. The cooled substrate can be transferred from the second processing chamber 3410 to the load lock chamber 3200. If the unprocessed substrate W needs to be aligned, the substrate processing system may further include a cooling chamber to cool the substrate. For this purpose, the alignment device can be placed in position within the substrate processing system. In other embodiments, -49-200818378^(47) one of the first and second processing chambers 3400, 3410 can be considered as an alignment device. For example, the first processing chamber 3400 can be regarded as a plasma chamber, and the second processing chamber 3410 can be used as an alignment device. In this case, before the first processing chamber 3400 performs the plasma processing of the substrate, the substrate transfer device 3 500 transfers the substrate in the second processing chamber 3410 to be aligned before processing, and the substrate is transferred to the first processing chamber 3400. To perform plasma processing. Therefore, according to the substrate processing system of the present invention, in order to simultaneously process a plurality of substrates for φ, the first and second processing chambers 3400, 3410 are arranged in parallel, and the transfer chamber 3300 is set in the first processing - Between chamber 3400 and second processing chamber 3410. The substrate transfer apparatus 800 is arranged to enable rapid exchange of substrates in this configuration so that the pre-processed and processed substrates can be simultaneously processed and quickly exchanged. Fig. 35 is a plan view showing a substrate processing system having a substrate driving apparatus which is driven separately, and Fig. 36 is a plan view showing a modification of the rotary arm. φ Referring to Fig. 35, the separately driven substrate transfer apparatuses 3 5 00a, 3 5 0 0 b are divided into left and right portions, which are independently driven and disposed in the transfer chamber 3 3 00. In other words, one substrate transfer device 305a transmits the substrate of the first process chamber 3400, and the other substrate transfer device 3500b transports the substrate of the second process chamber 340. Since the detailed structure of the substrate transfer apparatuses 35A0a, 3500b which are driven separately is the same as that shown in Figs. 32 and 33, the description thereof will be omitted. As illustrated in FIG. 36, the separately driven substrate transfer devices 3 500a, 3 500b may include L-shaped rotary plate arms 3510, -50-200818378 (48). FIG. 37 is a substrate process with a complex processing group. A plan view of the system. Referring to FIG. 37, the substrate processing system includes a plurality of processing groups 3 600, 3610, 3 620. The complex processing groups 3600, 3610, 3620 are similar to the structure illustrated in Figure 31, with the processing chambers in the center and the plasma processing chambers on the lateral sides of the processing chamber. Among the plurality of processing groups 3 600, 3610, 3 620, the first and third processing groups 3 6-00, 3-6: 20 face each other, and the second processing group φ 3610 is disposed on the rear side. An atmospheric pressure transfer robot 3210 positioned within the load lock chamber 3200 includes rails 3220 and 323 0 in a T configuration. The atmospheric pressure transfer robot 3210 moves along the tracks 3220, 3 23 0 to transfer the substrate between the re-distribution disk 3100 and the first to third process groups 3600, 3610, 3 620. The two processing chambers disposed in the first to third processing groups 3600, 3610, and 3620 may be chambers for performing plasma processing. Additionally, any of the processing chambers can be a cooling chamber or an alignment device. In other embodiments, both of the two processing chambers disposed in any of the first to third processing groups 3 600, 3610, 3 620 may be cooling chambers or alignment devices. Accordingly, at least one of the plurality of processing chambers disposed in the first through third processing groups 3 600, 3610, 3 620 can be a cooling chamber and/or at least one alignment device. As described above, according to the present invention, the substrates before and after the processing are quickly exchanged in the substrate processing system, and the plurality of substrates are simultaneously or continuously processed in the substrate processing system, thereby increasing the processing rate of the system and increasing the substrate. Overall productivity. Since the substrate transfer apparatus that simultaneously loads and unloads the substrate is provided, the processing chamber is very easy to perform processing of a plurality of substrates. With -51 - 200818378 (49), the time for transferring the substrate is reduced, so productivity is increased. Significantly reduce the area and width of the system' so that equipment costs and placement costs can be minimized. The processing chamber, alignment chamber, and cooling substrate chamber overlap each other&apos; to reduce the total bottom region of the substrate processing system. Therefore, the clean room can be narrower than the conventional one, and the cost of the air conditioner of the clean room can also be reduced. Furthermore, 'the transmission distance of the position for transferring the aligned substrate to the processing substrate is short, or the transmission distance from the processed substrate to the position of the cooling substrate is short φ, and it is not necessary to change direction, for example. Waiting for unnecessary operations' so that the time for transferring the substrate can be reduced and the yield of the substrate can be increased. The present invention has been described in terms of a preferred embodiment, but it is understood that the scope of the invention is not limited to the disclosed embodiments. Rather, the scope of the present invention is intended to include various modifications and modifications to the substrate transfer device and substrate processing system of the present invention, within the capabilities of those skilled in the art, using the presently known or future technologies and their equivalents. Alternative configuration. Therefore, the scope of the request should be interpreted in the broadest scope to cover all modifications and similar configurations of the φ section. BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the <RTIgt; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a view showing an overall configuration of a substrate processing system according to a first embodiment of the present invention; Fig. 1B is a plan view showing a substrate processing system of Fig. 1; -52- 200818378 (50) Fig. 2 is an illustration of a setting A perspective view of a substrate transfer apparatus in a transfer chamber. Fig. 3 illustrates an example of a substrate transfer apparatus having upper and lower portions that are independently driven; Fig. 4 is a perspective view illustrating a configuration of a swivel plate arm; Figs. 5A to 5E Is a view continuously illustrating that the substrate transfer apparatus performs a substrate exchange operation; φ FIG. 6 illustrates an example of a substrate transfer apparatus having two drive shafts; FIGS. 7A and 7B are diagrams of a modification of the example substrate transfer apparatus, There is a spindle and a driving unit which are divided into a right portion and a left portion; FIG. 8 is a view illustrating a substrate transfer device using four separate spindles. FIGS. 9A and 9B are modification examples of the substrate transfer device having a spindle and a driving unit. Figure 1 is a plan view of a substrate processing system in accordance with a second embodiment of the present invention; Figure 11 is a view showing the flow of a substrate transported by the substrate transfer device. Figure 12 and Figure 13 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 14 is a view showing an overall configuration of a substrate processing system according to a third embodiment of the present invention, and FIG. 15 is a plan view of the substrate processing system of FIG. Figure 16 is a perspective view of a substrate transfer apparatus disposed in a transfer chamber; -53- 200818378 (51) Figs. 17A to 17D are perspective views illustrating first to fourth transfer members of the substrate transfer apparatus; Figs. 18A to 18D Is a view sequentially illustrating a substrate exchange operation performed by the substrate transfer apparatus; FIG. 19 is a view illustrating a transfer member having an extendable plate arm; FIG. 20 is a view illustrating a modification of the substrate processing system, which is used with the FIG. FIG. 21 is a plan view showing an overall configuration of a substrate processing system according to a fourth embodiment of the present invention; FIG. 22A to FIG. 22C are plan views illustrating a substrate processing system, The first, second, and third processing groups are illustrated in FIG. 21; FIG. 23A is a perspective view illustrating the first substrate transfer device disposed in the first transfer chamber; and FIG. 23B is exemplified in the second transfer chamber. Fig. 23C is a perspective view illustrating a third substrate transfer apparatus provided in the third transfer chamber; Fig. 24 is a perspective view illustrating the configuration of the swivel plate arm; Figs. 25A to 25E are continuously FIG. 26 is a cross-sectional front view illustrating a second processing group; and FIGS. 27A to 27C are views continuously illustrating a second substrate transfer apparatus performing a substrate exchange operation; FIG. Is a plan view illustrating a modification of the second treatment group; -54- 200818378 .  [52] Figure 29 is a cross-sectional front view of another modification of the second treatment group of Example 75, wherein the alignment chamber and cooling are disposed on both sides; Figure 30 is a view illustrating a modification of the substrate processing system of the embodiment of the present invention; Figure 3 is a plan view showing a substrate processing system according to a fifth embodiment of the present invention; Figure 3 is a perspective view showing a substrate disposed in the transmission chamber of Figure 31; An example of a transmission device having an upper drive unit and a lower drive unit separated from each other; FIG. 34 is a perspective view illustrating a configuration of a swivel plate arm; and FIG. 35 is a substrate processing system exemplarily having no separate driven substrate transfer device Fig. 3 is a plan view illustrating a modification of the slewing plate arm, and Fig. 37 is a plan view showing a substrate processing system having a plurality of processing groups. [Description of main component symbols] 1〇〇: Indexing plate (equipment front-end module) 11 〇: Carrier 150: (rear) indexing plate 200: load lock chamber 2 1 0 : atmospheric pressure transmission robot 2 1 2 : End effector-55 - 200818378 (53) 250: (rear) load lock chamber 300: cooling chamber 400: transfer chamber 410: third substrate inlet 500: first processing chamber 5 1 0: first substrate inlet 520~ 526 : (front) substrate support table φ 522 : (rear) substrate support table 600 : second processing chamber 6 1 0 : second substrate inlet 620 to 626 : (front) substrate support table 622 : (re) substrate support table 7 0 〇: Plasma source 8 0 〇: Substrate transfer device 8 1 0 : Swing plate arm φ 8 1 2 : End effector 8 1 3 : Opening 8 1 4 : Support portion 8 1 5 : Entrance path 820 : Loading arm 822 : Unloading arm 830: Spindle 830a: Lower spindle (first spindle) 8 3 0b : Upper spindle (second spindle) -56- 200818378 (54) 8 3 0c : : Third spindle 8 3 0d : Fourth spindle 8 3 0e : fifth spindle 830f : sixth spindle 830g • • seventh spindle 8 3 Oh : eighth spindle 840 : drive unit wins 840a : lower drive unit (first drive unit) 840b: upper drive unit (second drive unit) 840c: third drive unit 840d: fourth drive unit 840e: fifth drive unit 840f: sixth drive unit 8 40g: seventh drive unit 8 4 Oh: Eight drive unit • 1100: indexing plate 1110: carrier 1200: load lock chamber 1210: atmospheric pressure transfer robot 1300: cooling chamber 1400: transfer chamber 1402: front side 1410: third substrate inlet 1500: first processing chamber - 57 - 200818378 (55) 1510 : First substrate inlet 1 5 20 : Substrate support table 1 5 22 : Substrate support table 1 6 00 : Second processing chamber 1610 : Second substrate inlet 1 6 2 0 : Substrate support table 1 6 22 : Substrate support table • 1700 : Plasma source 1 800 0 : Substrate transfer device 1 8 00a: Transfer chamber 1810a = First transfer member 18 10b : Second transfer member 18 10c : Third transfer member 1810d •• Four transmission members 1810a, 1 : Transmission members • 1820 : Main shaft 1 8 3 0 : Drive unit 1 8409 : Swing arm 1 840 : Loading arm (slewing arm) 1841-1 : First extendable arm Γ 841-2 : Second extendable plate arm 1841-3: third extendable plate arm 1 842 : end effector 1843 : opening 200818378 (56) 1 844 : support portion 1 8 4 5: inlet path 1 8 50 : unloading arm (swing plate arm) 2 0 1 0 : substrate processing system 2100 : indexing disk 2 1 1 0 : carrier 2200 : load lock chamber 0 2210 : atmospheric pressure transfer robot 2400a : first transfer chamber 2400b : second transfer chamber 2400c : third transfer chamber 2410 : Three substrate inlet 2412: third substrate inlet 2414: third substrate inlet 2500a: first processing chamber φ 2500b: second processing chamber 2510a: first substrate inlet 25 10b: second substrate inlet 2522: substrate support table 2600a: first Alignment chamber 2600b: second alignment chamber 2600c: first alignment chamber 2600d: second alignment chamber 2610a: first substrate inlet - 59 - 200818378 (57) 2610b: second substrate inlet 2640: rotary chuck 2640: rotary chuck 2650 : Detection unit 2660 : Lifter 2700 : Cooling chamber 27 10 : First substrate inlet wins 2800a : First substrate transfer device 2800b : Second substrate transfer device 2800d : Second substrate transfer device 2810 : Swing plate arm 2812 : End effect 2813 : Opening 2814 : Support 2815 : Inlet path • 2 8 20 : Loading arm 2 8 22 : Unloading arm 2 83 0 : Spindle 2 8 40 : Drive unit 3100 : Indexing plate 3 110 : Carrier 3 200 : Load lock chamber 3210 : Atmospheric Pressure Transfer Manipulator 3220: Track-60- 200818378 (58)

3 23 0 : Track 3 3 0 0 : Transmission chamber 3 3 1 0 : First substrate inlet 3 320 : Second substrate inlet 3 3 3 0 : Third substrate inlet 3400 : First processing chamber 3 4 0 2 : Substrate support Stage 3410: second processing chamber 3412: substrate support table 3 500: substrate transfer device 3 5 00a: substrate image over device 3 5 00a : substrate transfer device 3 5 1 0 : swivel plate arm 3 5 1 0 5 : ( L-shaped) swivel plate arm 3 5 1 2 : end effector 3 5 1 3 : opening 3 5 1 4 : support portion 3 5 1 5 : inlet path 3 520 : loading arm 3 522 : unloading arm 3 5 3 0: main axis 3 5 3 0b : Upper spindle 3 5 3 0 a : Lower spindle 3 5 4 0 : Drive unit 200818378 (59) 3 540b : Upper drive unit 3 5 4 0 a : Lower drive unit 3 600 : First processing group 3610 : Second processing group 3620 •• Third processing group S10: Arrow S20: Arrow • S30: Arrow S 4 0 : Arrow collar S50: Arrow S60: Arrow S70: Arrow S80: Arrow S100 z Arrow S1 10 = Arrow φ S120 = Arrow S 1 30 : arrow S210 : arrow S220 z arrow S23 0 : arrow S240 : arrow S25 0 = arrow S260 z arrow S270 : arrow 20081837 8 (60) S280: arrow a: first processing, 1 b: second processing, b ': second processing c: third processing 3 W2: (already in ij W1: (not in group 1) substrate ί Substrate

W : substrate

-63-

Claims (1)

200818378 ^ (1) X. Patent Application 1 1. An apparatus for transporting a substrate between a load lock chamber and first and second processing chambers for processing a plurality of substrates, comprising: a driving unit for supplying a rotational force; a spindle coupled to the drive unit; a plurality of first rotary plate arms 'to load/unload the substrates to the first processing chamber; and φ a plurality of second rotary plate arms to load/unload the substrates to the second Processing room. 2. The apparatus for transporting a substrate between a load lock chamber and a first and second processing chamber to process a plurality of substrates, as described in claim 1, wherein each of the first and second swivel arms One includes: loading at least one swivel arm to load an unprocessed substrate; and at least one unloading the swivel arm to unload the processed substrate. 3. The apparatus for transporting a substrate between a load lock chamber and a first φ and a second processing chamber to process a plurality of substrates, as described in claim 1, wherein the first slewing arm and the second The swivel plate arms are mounted separately and the main shaft includes at least two different main shafts that are independently rotated. 4. The apparatus for transporting a substrate between a load lock chamber and a first and second processing chamber to process a plurality of substrates as described in claim 3, wherein the driving unit comprises supplying a rotational force via the at least two different spindles At least one drive unit. 5. The apparatus for transporting a substrate between a load lock chamber and a first and second processing chamber to process a plurality of substrates as described in claim 2, which is -64-200818378, (2) Each of the swivel plate arm and the second swivel plate arms includes a horseshoe end effector and a support having an upper side, the end effector including an opening having an open side, the edge of the substrate being positioned to the upper side. 6. The apparatus for transporting a substrate between a load lock chamber and a first and second processing chamber to process a plurality of substrates, as described in claim 5, wherein the end effector includes an inlet path disposed in the load lock chamber The end effectors of the atmospheric pressure transfer robot enter and exit through the inlet path to transmit and receive the substrates. 7. A substrate processing system using the apparatus of the first aspect of the patent application for transporting a substrate, the system comprising: a first processing chamber comprising at least two substrate support tables; and a second processing chamber comprising at least two substrates a transfer chamber; the substrate transfer device is disposed in the transfer chamber; a first substrate inlet is formed between the first process chamber and the transfer chamber; φ a second substrate inlet is formed in the second process Between the chamber and the transfer chamber; and a third substrate inlet formed between the transfer chamber and the exterior; wherein the substrate transfer device receives the unprocessed substrates from the outside via the third substrate inlet, and Transmitting the processed substrates to the outside, so the unprocessed substrates are transferred to the first or second processing chamber, and the processed substrates processed in the first or second processing chamber Transmitting to the outside via the third substrate inlet. 8. The substrate processing system of claim 7, further comprising -65 - 200818378 (3) a load lock chamber connected to the third substrate inlet, wherein the load lock chamber includes an atmospheric pressure transfer robot to The substrate processing system according to claim 7, further comprising a cooling chamber for cooling the processed substrates discharged through the third substrate inlet. The substrate processing system of claim 7, wherein the first and second processing chambers comprise a plasma chamber in which plasma processing is performed. The substrate processing system of claim 7, wherein the first processing chamber comprises a plasma chamber, a plasma treatment is performed in the plasma chamber, and the second processing chamber includes a cooling chamber to cool the The heated substrate is treated. The substrate processing system of claim 7, further comprising a fourth substrate inlet formed between the transfer chamber and the other outer portion, wherein φ the substrate transfer device passes from the outside via the third substrate inlet The unprocessed substrates are received and the processed substrates are transferred to the exterior via the fourth substrate inlet. The substrate processing system of claim 12, further comprising a load lock chamber connected to the fourth substrate inlet, wherein the load lock chamber includes an atmospheric pressure transfer robot to transmit the air pressure at atmospheric pressure Such as the substrate. 14. The substrate processing system of claim 13, further comprising a cooling chamber for cooling the processed substrates discharged through the fourth substrate inlet - 66-200818378 (4). 1 5 - an apparatus for transporting a substrate to transport a plurality of substrates in a transfer chamber between a load lock chamber and a processing chamber, comprising a transfer member interspersed and disposed on an edge of the transfer chamber; wherein the plurality of transfer members simultaneously receive Providing a plurality of substrates to a standby position of the transfer chamber via the load lock chamber to transfer the plurality of substrates to an upper side of the substrate support table, wherein the substrate support tables are respectively disposed in the 0 processing chambers, and the plurality of transfer members The substrates are respectively received from the upper sides of the substrate support stations to collectively transfer the substrates to the standby position of the transfer chamber. 1 6. The apparatus for transporting a substrate to transport a plurality of substrates in a transfer chamber between a load lock chamber and a processing chamber, as described in claim 15, wherein each of the transport members comprises: a drive unit for supplying a rotational force; two spindles coupled to the drive unit; and φ plurality of rotary plate arms for loading/unloading the substrates to/from the corresponding substrate support tables Substrate. 1 7 . The apparatus for transporting a substrate to transport a plurality of substrates in a transfer chamber between a load lock chamber and a processing chamber as described in claim 16 , each of the swing arm includes: a loading Rotating the plate arm to load the unprocessed substrate; and unloading the swivel plate arm to unload the processed substrate. 1 8 . The apparatus for transporting a substrate to transport a plurality of substrates in a transfer chamber between a load lock chamber and a processing chamber as described in claim 16 of the patent application, -67-200818378. (5) wherein the rotary arm Each of them includes a horseshoe end effector and a support having an upper side, the end effector including an opening having an open side, the edge of the substrate being positioned to the upper side. The apparatus for transporting a substrate in a transfer chamber between a loading gun chamber and a processing chamber to process a plurality of substrates, wherein the transport members are unfolded such that the rotary arm is The end effectors are located on the upper sides of the corresponding substrate support tables, and the transfer members are folded such that the end effectors of the rotary plate arms are in the standby position of the transfer chamber, Align a single alignment line in the upright direction. a substrate transfer apparatus disposed in a transfer chamber to transfer a substrate between a load lock chamber and a process chamber to process a plurality of substrates, the substrate transfer apparatus comprising: a plurality of spindles disposed on edges of the transfer chamber to each other Separating; a driving unit for supplying a driving force to the plurality of main shafts; and a plurality of rotating plate arms respectively disposed on the plurality of main shafts for rotating and φ loading the substrates to the corresponding processing chambers/from the The corresponding processing chamber unloads the substrates. The substrate transfer device provided in the transfer chamber according to claim 20, wherein each of the rotary plate arms includes a horseshoe end effector and a support portion having an upper side, the end effector including An opening on the open side, the edge of the substrate is positioned to the upper side, and the end effectors of the rotary plate arms are swung to the upper side of the corresponding substrate support table and in the standby position of the transfer chamber in the upright direction Align a single alignment line. 22. Substrate-68-200818378- (6) Transmission device as set forth in claim 20, wherein each of the slewing arms comprises at least two antenna-type extendable arms . 23. The substrate transfer apparatus disposed in the transfer chamber of claim 22, wherein each of the swivel plate arms is turned back to the substrate support table at a standby position of the transfer chamber, and the The extendable swivel plate arms are retracted step by step such that the end effectors are positioned on the upper side of the substrate support table. Φ 24. A substrate processing system comprising: - a transfer chamber, a substrate transport device - disposed within the transfer chamber; and first and second processing chambers connected to the transfer chamber via the first and second inlets a side, and comprising two substrate support tables; the substrate transfer device comprising four transfer members disposed at edges of the transfer chamber to be spaced apart from each other; wherein the transfer members are deployed to simultaneously receive the externally supplied to the Transferring four substrates of the standby position of the chamber, and transmitting the four substrates to the upper side of the four substrate support tables disposed in the first and second processing chambers of the φ, and unfolding the transmission members to respectively support from the four substrates The upper side of the stage receives the substrates and transmits the substrates to the standby position of the transfer chamber, respectively. The substrate processing system of claim 24, wherein each of the transfer chambers comprises: a drive unit for supplying a rotational force; a second spindle coupled to the drive unit; and a plurality of revolutions The plate arms are loaded onto/unloaded from/to the substrate support stations. -69- 200818378 (7) 26. Substrate processing according to claim 25, each of the rotary plate arms comprising a support portion of a horseshoe end effect side, the end effector comprising a plate having an open side An edge is positioned to the upper side and the transport members are pivoted such that the swivel plate arms are rotated into position on the upper side of the corresponding substrate support table, and in the standby position, the single alignment line is aligned in the upright direction. 0 27. The base of claim 24, wherein each of the swivel arms comprises at least two days of extension arm. 28. The invention as claimed in claim 24, wherein the load handling chamber further includes a load lock chamber connected to the front side of the transfer chamber via a third portion, wherein the load lock chamber includes a large robot to transmit under atmospheric pressure. These substrates. 29. The substrate processing φ as described in claim 28, the front side of the transfer chamber having the third inlet inwardly concave shape 30. The substrate processing as described in claim 28 includes cooling in the load lock chamber The chamber cools the processed substrate that is discharged through the port to the load lock chamber. 3 1. Substrate processing as described in claim 24 The first and second processing chambers contain a plasma chamber in which the plasma slurry is processed. A substrate processing system comprising: a load lock chamber comprising an indexing disk, wherein the plurality of load systems, wherein the device has an upper opening, the base end effector, the transfer processing chamber, the plate processing system line 1 The base substrate inlet gas pressure transmission system, wherein the crucible system further comprises a third substrate into the system, wherein the indoor execution appliance is disposed in front of the -70-200818378 (8) indexing disc; and the plurality of processing groups Provided on the rear side of the load lock chamber and stacked in a multi-layered manner, wherein one of the plurality of processing groups includes: a first transfer chamber in which the first substrate transfer device is disposed; and the first and the first a second processing chamber connected to the lateral side of the first transmission chamber via the first and second inlets, and comprising two substrate support stations, and the other of the plurality of processing groups includes: a second transfer chamber, the second substrate transfer The apparatus is disposed in the second transfer chamber; and the first and second alignment chambers are coupled to the lateral side of the second transfer chamber via the first and second inlets and include two substrate aligners. 3. The substrate processing system of claim 3, wherein the first transfer members are unfolded to simultaneously receive four substrates provided in a standby position of the first transfer chamber φ, and the four Transferring the substrate to an upper side of the four substrate support stages disposed in the first and second processing chambers, and merging the first transfer members to receive the substrates on the upper side of the four substrate support stages, and The substrate is transferred to the standby position of the first transfer chamber. 4. The substrate processing system of claim 32, wherein the second transmission members are deployed to simultaneously receive four substrates provided in a standby position of the second transmission chamber, and transmit the four substrates And at least two substrate aligners disposed in the first and second alignment chambers, and splicing the second transmission members to receive the alignment of the at least two substrate aligners - 71 - 200818378 (9) a substrate and transferring each of the aligned substrates to the standby position of the second transfer chamber. 35. The substrate processing system of claim 32, wherein the other of the plurality of processing groups comprises: - a third to third transfer chamber 'the third substrate transfer device is disposed in the third transfer chamber; and a cooling chamber, Connected to the side of the third transfer chamber via the first inlet, 0 to cool at least one of the substrates. 36. The substrate processing system of claim 35, wherein each of the first, second, and third substrate transfer devices comprises: a drive unit for supplying a rotational force; at least one spindle, connected To the drive unit; and a plurality of rotating plate arms mounted to the spindle at different heights and positioned at a corresponding height relative to the spindle. 37. The substrate processing system of claim 36, wherein each of the φ of the slewing arms comprises a horseshoe end effector and an upper side support, the end effector comprising an opening having an open side, The edge of the substrate is positioned to the upper side, and the transport device is rotated such that the end effectors of the rotary arm are in corresponding positions and in the waiting position of the first, second, and third transfer chambers, Align a single alignment line in the upright direction. The substrate processing system of claim 3, wherein the first substrate transfer device comprises a plurality of rotary plate arms to simultaneously receive a plurality of substrates provided at a standby position of the first transfer chamber, and The substrate is transferred to the upper side of the substrate support stages of the first and second processing chambers to receive the substrates on the upper side of the substrate support stages, and the substrates to be collectively transmitted are The substrate is transferred to the standby position of the first transfer chamber. The substrate processing system of claim 34, wherein each of the substrate aligners comprises: a rotating chuck to load the substrate; and an inductor to detect loading in the rotation a pair of the substrate on the chuck; and a lifter for adjusting the height of the rotary chuck according to the height of the swing arm. The substrate processing system of claim 32, wherein the load lock chamber comprises an atmospheric pressure transfer robot to transport the substrates at atmospheric pressure. The substrate processing system of claim 32, wherein the first and second processing chambers comprise a plasma chamber to perform a plasma treatment. The substrate processing system of claim 32, wherein the load lock chamber comprises a dual-arm type atmospheric pressure transmission robot having four end effectors for taking four substrates at a time from the carriers And transferring the four substrates to the first transfer chamber or the second transfer chamber; and each of the first and second transfer chambers includes a third substrate inlet, the substrates being passed from the load lock chamber The third substrate inlet enters and exits, and they are aligned with each other such that the substrate can be transported when the atmospheric pressure transfer robot moves down. 43. A substrate processing system having at least one processing group, the system - 73-200818378 (11) comprising: a first processing chamber including a substrate support table; and a second processing chamber including a substrate support table; a transfer chamber, the substrate transfer device being disposed within the transfer chamber; a first substrate inlet formed between the transfer chamber and the exterior; a second substrate inlet formed between the first processing chamber and the transfer chamber; a third substrate inlet formed between the second processing chamber and the transfer chamber; wherein the substrate transfer device receives the unprocessed substrates from the outside via the first substrate inlet, and transmits the Processing the substrate to the outside, so the substrate transfer device transmits the received unprocessed substrates to the first or second processing chamber via the second or third substrate inlet, and receives the first or second The processed substrates processed in the chamber are processed and transported to the outside via the first substrate inlet. Φ 44. The substrate processing system of claim 43, further comprising a load lock chamber coupled to the first substrate inlet, wherein the load lock chamber includes an atmospheric pressure transfer robot to transmit the pressure at atmospheric pressure Such as the substrate. 4. The substrate processing system of claim 43, wherein at least one of the first and second processing chambers comprises a plasma chamber. 46. The substrate processing system of claim 43, wherein at least one of the first and second processing chambers comprises a cooling chamber. 47. The substrate processing system of claim 43, wherein -74-200818378 (12) at least one of the first and second processing chambers comprises an alignment chamber. The substrate processing system according to any one of claims 43 to 47, wherein the substrate transfer device comprises: a driving unit for supplying a rotational force; at least one spindle coupled to the driving unit; Rotating the plate arm to load the substrates to/from the first processing chamber; and φ plurality of second rotating plate arms to load the substrates to/from the second processing chamber The second processing chamber unloads the substrates. The substrate processing system of claim 48, wherein the first swivel arm and the second swivel arm are separately mounted, and the main shaft includes at least two different main shafts that are independently rotated. The substrate processing system of claim 49, wherein the driving unit comprises at least one driving unit that supplies a rotational force via the at least two different main shafts. The substrate processing system of claim 43, wherein each of the first rotary arm and the second rotary plate arm comprises a horseshoe end effector and a support having an upper side, The end effector includes an opening having an open side to which an edge of the substrate is positioned. 5. The substrate processing system of claim 5, wherein the end effector comprises an inlet path through which an end effector of an atmospheric pressure transfer robot disposed in the load lock chamber enters and exits, The substrates are transmitted and received. -75-