200816055 九、發明說明： 【發明所屬技術領域】 發明領域 本發明係有關一種不需接觸一外部裝置而與該裝置交 換資訊的 RFID (Radio—Frequency一Identification ;射頻識別) 襟籤，在嫻熟此技藝領域之人中，用於本發明之‘‘^^1〇標 錢”亦被稱作“一無線1C標籤，，。200816055 IX. OBJECTS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to an RFID (Radio-Frequency-Identification; Radio Frequency Identification) tag that exchanges information with an external device without contacting an external device. Among the people in the field, the ''^^1〇 standard money' used in the present invention is also referred to as "a wireless 1C tag,".
t先前技術3 發明背景 〇 近年來，不同的RFID標籤已被提出係以一讀取器與寫 入器所代表的一外部裝置藉由一無線電波不用接觸該外部 骏置來交換資訊(例如，見日本專利申請公報第2000-311226t Prior Art 3 BACKGROUND OF THE INVENTION In recent years, different RFID tags have been proposed to exchange information by an external device represented by a reader and writer by a radio wave without contacting the external device (for example, See Japanese Patent Application Gazette No. 2000-311226
埯、第2000_200332號及第2001-351082號）。如同這些RFID 榡籤的一種，提出一個具有一結構，其中用於無線電通訊 5 的一天線圖案與一電路晶片被裝設在一由塑膠或紙所製成 的基部薄片上。對於此類型的RFID標籤，不同的應用被設 計。例如，該RFID標籤被貼附至一物品等上以便與一外部 裝置交換有關該物品的資訊用以識別它們。 對於該等RFID標籤的應用，包含有一個其中一RFTD標 0 ^ 纖被貼附至其形狀係能容易改變的物品上，像衣服。在此 應用中，一個主要問題是，因該電路晶片不容易被彎折而 讀基部薄片容易被彎折該電晶體路晶片，該電路晶片受到 〜幫折應力’導致該電路晶片斷裂或剝落。傳統上，已提 出有技術其中包含圍繞該電路晶片之周圍的電路晶片係覆 5 200816055 盖有一硬加強構件以防止該RFID標籤之形狀改變到達圍繞 该電路晶片的周圍，因此減少施加至該電路晶片的一彎折 應力。 然而’隨著利用以上所述的加強構件等的如此技術， 该構件或此類的一端與該天線交叉並且一彎折應力係集中 在該交又點而導致該天線的破裂。 【發^明内容^】 發明概要 有鏗於上述，根據本發明，提供有一種!^^!)標籤，其 中對於該電路晶片的彎折應力被減少並且同時防止天線的 破裂。 根據本發明的該等RFID標籤中，一第一RFID標籤包 含：一基部；一延伸在該基部上用於通訊的天線；一電路 晶片，其係電性連接至該天線而且其經由該天線來執行無 線電通訊，一晶片加強構件，當該基部係配置為該RFID標 籤的一底部時，其覆蓋該電路晶片的至少周圍與至少該天 線一部分的二者中的至少上部分；及一覆蓋構件，其覆蓋 該基部、該天線、該電路晶片及該晶片加強構件，並且其 係比該晶片加強構件更具彈性。 2〇 根據本發明之第一RFID標籤，因為該電路晶片的一周 圍，其是執行無線電通訊的一關鍵成分，係覆蓋有該晶片 加強構件，對於該電路晶片的一彎折應力被減少。此外， 因為該晶片加強件的邊緣與該天線彼此相交的_部分係覆 蓋有一完全覆蓋該電路晶片與該晶片加強構件的可換的覆 200816055 蓋構件，所以抑制了在此部份之彎折應力的集中並因此防 止该天線的破裂。換言之，根據本發明的第一RFID標籤， 對於該電路晶片的一彎折應力被減少並且同時防止該天線 的破裂。此外，依照用於該晶片加強構件的材料之一範例， 5 一硬塑膠被作為例子。然而，在本發明的第一1^11)標籤中， 一覆盍有該晶片加強構件的範圍係僅限於該基部的一部 分。因此，典型上具有可撓性的基部在一由該晶片加強構 件所保護的區域之外允許一自由度。本發明的第 籤根據一物品，諸如該RFID標籤被貼附到的一件衣服之形 10狀變化來大概地改變形狀。另外，甚至在一種情況下其中 本發明的第一RFID標籤直接接觸使用者，因為kRFID標籤 係完全覆蓋有該具有可撓性之覆蓋構件，所以有可能防止 該硬的晶片加強構件直接接觸使用者。此外，本發明的第 一RFID標籤中，即使此RFID標籤係破裂，因為該覆蓋構件 15被提供，所以有可能防止該破裂的RFID標籤之碎片等傷宝 使用者。於是，本發明的第一RFID標籤中，給予了對使用 者的考慮以至於使用者在直接接觸貼附至該使用者穿戴上 的一物品之RFID標籤時可以不感到不舒服。 此處，本發明的第一RFID標籤中，一最佳範例是“該 20晶片加強構件不與該基部、該天線與該電路晶片接觸且其 被埋置於該覆蓋構件中”。 ' 根據該第一RFID標籤之此最佳範例，因為該晶片加強 構件不與該基部或其它成分接觸，所以諸如因該晶片加強 構件所產生之彎折應力的集中的情況被防止。 7 200816055 此外’本發明的第-RFID標籤中，另一個最佳範例是 “狐fID標籤更包含—底加強構件其被設置以致該底加強 構件與該晶片加強構件將該基部夹在中間，並且其被埋置 於該覆蓋構件中而不與該基部接觸，，。 5 根據該RFID標籤的此最佳範例，對於該電路晶片之保 ㈣因該底加強構件進-步改善。此外，因為此底加強構 件不與該基部接觸，所以有可能防止諸如因該晶片加強構 ^ 件所產生之彎折應力的集中之情況。 另外，根據本發明的該等RFID標籤中，一第二汉打〇標 1〇籤包含：一基部；一延伸在該基部上用於通訊的天線；_ 電路晶片，其係電性連接至該天線而且其經由該天線來執 仃無線電通訊；一晶片加強構件，當該基部係配置為該及耵^ 標籤的一底部時，其覆蓋該電路晶片的至少周圍與至少該 天線一部分的二者中的至少上部分；及一邊緣覆蓋構件， 15其覆蓋該晶片加強構件之邊緣的至少一部分，該部分其中 φ 該晶片加強構件的邊緣與該天線彼此相交，該邊緣覆蓋構 件係比該晶片加強構件構具彈性。 根據本發明的第二RFID標籤，因為該電路晶片的一周 圍，其是執行無線電通訊的一關鍵成分，係覆蓋有該晶片 - 2〇加強構件，對於該電路晶片的一彎折應力被減少。此外， 因為該晶片加強件的邊緣與該天線彼此相交的一部分係覆 蓋有該可撓的覆蓋構件，所以抑制了在此部份之彎折應力 的集中並防止該天線的破裂。換言之，同樣地藉由該本發 明的第二RFID標籤，對於該電路晶片的一彎折應力被減少 8 200816055 並且同時防止該天線的破裂。 此處，本發明的第一與第二RFID標籤中，一典型的範 例是該晶片加強構件僅覆蓋該電路晶片的一周圍與該天 線的一部分”。 ^ 5 根據該RFID標籤之此最佳範例，儘管該晶片加強構件 覆盍該電路晶片的一周圍以保護該電路晶片，在此電路晶 片上的開口空間使得該RFID變薄。 _ 此外，本發明的第一與第二rFID標籤中，另一個最佳 範例疋讀RFID標籤更包含一底加強構件其係設置以致該 10底加強構件與該晶片加強構件將該基部失在中間”。 根據該RFID標籤之此最佳範例，該電路晶片的保護係 因該底加強構件而進一步改良。 此外，根據本發明的一種RFID標籤製造方法包含步驟 有··一準備步驟，用於準備一鑲嵌物其包含一基部、一延 15伸在该基部上用於通訊的天線、一電路晶片其係電性連接 φ 至该天線且其經由該天線來執行無線電通訊、及一晶片加 強構件，當该基部係於一下側時，其覆蓋至少該電路晶片 、 的一周圍與至少在該基部之上面的天線之一部分；及一覆 盍步驟，用於覆蓋該鑲嵌物以致一間隔物係配置在該晶片 2〇加強構件的周圍，該間隔物係比該晶片加強構件更具彈 並且邊鑲嵌物與該間隔物係被複數由相同如該間隔物 之材料製成且被加熱與加壓而結合的薄片構件夾在中間。 根據本發明的製造方法，其中對該電路晶片的一彎折 應力破減少且該天線的破裂被防止的RnD標籤能被容易地 9 200816055 製造。另外’經由該覆蓋程序其中該間隔物係配置在該晶 片加強構件的周圍且然後該鑲嵌物與該間隔物係被複數薄 片構件失在中間，可是該RFID標籤的形狀被弄平。 此外，有關根據本發明的RFID標籤製造方法，為了避 5免冗餘的說明僅說明一基本範例。然而，根據本發明之製 造方法包含對應上述之RFID標籤的範例之不同範例以及此 範例。 如以上所述，根據本發明，其中對該電路晶片的一彎 折應力被減少並且同時防止該天線的破裂的RFH)標籤能被 10 獲得。 圖式簡單說明 第1圖是一顯示根據本發明之RF1D標籤的一第一實施 例之概要圖； 第2圖是一顯示根據本發明iRFID標籤的一第二實施 15 例之概要圖； 弟3圖是一顯示根據本發明之RFID標籤的一第三實施 例之概要圖； 第4圖是一顯示根據本發明之r π d標籤的一第四實施 例之概要圖； 20 第5圖是一流程圖，其顯示一種用於製造第4圖所示之 第四實施例的RFID標籤400的RFID標籤製造方法作為根據 本發明的RFID標籤製造方法的一示範實施例； 第6圖是一顯示第5圖所示之流程圖中的準備步驟（步 驟110)之細節圖； 10 200816055 第7圖是㉝示第5圖所示之流程圖中的覆蓋步驟（步 驟120)細節之圖； 第8圖疋顯不根據本發明之RFID標籤的一第五實施 例之概要圖； 5 第9圖是一圖，親一 顯不一用於製造第8圖所示之RFID標籤 900的RFID標籤製造方法； 第1〇圖疋一顯示根據本發明之RFID標籤的一第六實 施例之概要圖；埯, 2000_200332 and 2001-351082). As with one of these RFID tags, a structure is proposed in which an antenna pattern for a radio communication 5 and a circuit chip are mounted on a base sheet made of plastic or paper. For this type of RFID tag, different applications are designed. For example, the RFID tag is attached to an item or the like to exchange information about the item with an external device to identify them. For the application of such RFID tags, one of the RFTD tags is attached to an article whose shape can be easily changed, like clothes. In this application, a major problem is that the read wafer is easily bent by the base wafer due to the fact that the circuit wafer is not easily bent, and the circuit wafer is subjected to a "folding stress" causing the circuit wafer to be broken or peeled off. Conventionally, there has been proposed a technique in which a circuit chip cover 5 around the periphery of the circuit wafer is included with a hard reinforcement member to prevent the shape of the RFID tag from changing to the periphery of the circuit wafer, thereby reducing application to the circuit chip. A bending stress. However, with such a technique using the reinforcing member or the like described above, one end of the member or the like crosses the antenna and a bending stress is concentrated at the intersection to cause breakage of the antenna. SUMMARY OF THE INVENTION In view of the above, according to the present invention, there is provided a label of a ^^!) in which bending stress for the circuit wafer is reduced and at the same time, cracking of the antenna is prevented. In the RFID tag according to the present invention, a first RFID tag includes: a base; an antenna extending on the base for communication; and a circuit chip electrically connected to the antenna and via the antenna Performing radio communication, a wafer reinforcing member, when the base is configured as a bottom portion of the RFID tag, covering at least an upper portion of at least a periphery of the circuit wafer and at least a portion of the antenna; and a covering member, It covers the base, the antenna, the circuit wafer, and the wafer reinforcement member, and is more elastic than the wafer reinforcement member. 2. According to the first RFID tag of the present invention, since the circuit chip is a key component for performing radio communication, it is covered with the wafer reinforcing member, and a bending stress for the circuit wafer is reduced. In addition, since the edge of the wafer reinforcement and the portion where the antenna intersect each other are covered with a replaceable covering 200816055 cover member that completely covers the circuit wafer and the wafer reinforcing member, the bending stress in this portion is suppressed. The concentration and thus the rupture of the antenna is prevented. In other words, according to the first RFID tag of the present invention, a bending stress for the circuit wafer is reduced and at the same time the crack of the antenna is prevented. Further, according to an example of a material for the wafer reinforcing member, a hard plastic is taken as an example. However, in the first 11) label of the present invention, the extent to which the wafer reinforcing member is covered is limited to only a part of the base. Thus, a typically flexible base allows for a degree of freedom outside of the area protected by the wafer reinforcement member. The first sign of the present invention approximates the shape in accordance with an article, such as a shape change of a piece of clothing to which the RFID tag is attached. In addition, even in a case where the first RFID tag of the present invention directly contacts the user, since the kRFID tag is completely covered with the flexible covering member, it is possible to prevent the hard wafer reinforcing member from directly contacting the user. . Further, in the first RFID tag of the present invention, even if the RFID tag is broken, since the covering member 15 is provided, it is possible to prevent the broken RFID tag from being broken or the like. Thus, in the first RFID tag of the present invention, consideration is given to the user that the user may not feel uncomfortable when directly contacting the RFID tag attached to the article worn by the user. Here, a preferred example of the first RFID tag of the present invention is "the 20 wafer reinforcing member is not in contact with the base, the antenna is in contact with the circuit wafer and is embedded in the covering member". According to this preferred example of the first RFID tag, since the wafer reinforcing member is not in contact with the base or other components, the concentration of bending stress caused by the wafer reinforcing member is prevented. 7 200816055 Further, in the first RFID tag of the present invention, another preferred example is that the "fox fID tag further includes a bottom reinforcing member which is disposed such that the bottom reinforcing member and the wafer reinforcing member sandwich the base, and It is buried in the covering member without contacting the base, 5 according to this preferred example of the RFID tag, the protection of the circuit chip is further improved by the bottom reinforcing member. The bottom reinforcing member is not in contact with the base portion, so it is possible to prevent a concentration such as a bending stress generated by the wafer reinforcing member. Further, in the RFID tag according to the present invention, a second Han snoring The label 1 includes: a base; an antenna extending on the base for communication; a circuit chip electrically connected to the antenna and via which the radio communication is performed; a wafer reinforcing member The base is configured to cover at least a portion of at least a periphery of the circuit wafer and at least a portion of the antenna when the bottom portion of the substrate is disposed; and an edge cover structure And covering at least a portion of an edge of the wafer reinforcing member, wherein the portion φ the edge of the wafer reinforcing member and the antenna intersect each other, the edge covering member being more elastic than the wafer reinforcing member. The RFID tag, because a peripheral portion of the circuit wafer, which is a key component for performing radio communication, is covered with the wafer - 2 〇 reinforcing member, a bending stress is reduced for the circuit chip. Further, because the wafer A portion of the edge of the reinforcing member and the antenna intersecting each other is covered with the flexible covering member, thereby suppressing concentration of bending stress at the portion and preventing cracking of the antenna. In other words, by the present invention The second RFID tag has a bending stress of the circuit chip reduced by 8 200816055 and at the same time prevents cracking of the antenna. Here, a typical example of the first and second RFID tags of the present invention is the wafer reinforcement. The member covers only a portion of the circuit wafer and a portion of the antenna." According to this preferred embodiment of the RFID tag, although the wafer reinforcing member covers a periphery of the circuit wafer to protect the circuit wafer, the open space on the circuit wafer causes the RFID to be thinned. In addition, in the first and second rFID tags of the present invention, another preferred example of reading the RFID tag further comprises a bottom reinforcing member disposed such that the 10 bottom reinforcing member and the wafer reinforcing member are in the middle of the base According to this preferred example of the RFID tag, the protection of the circuit chip is further improved by the bottom reinforcing member. Further, an RFID tag manufacturing method according to the present invention includes the steps of a preparation step for preparing An inlay includes a base, an extension 15 extending over the base for communication, a circuit chip electrically connecting φ to the antenna and performing radio communication via the antenna, and a wafer reinforcement member, When the base is attached to the lower side, it covers at least one portion of the circuit wafer, and at least one portion of the antenna above the base; and a covering step for covering the inlay such that a spacer is disposed The wafer 2 is surrounded by a reinforcing member, the spacer is more elastic than the wafer reinforcing member, and the edge inlay and the spacer are plurally identical. A sheet member made of a material and heated and pressurized is sandwiched. According to the manufacturing method of the present invention, a bending stress of the circuit wafer is reduced and the RnD label of the antenna is prevented from being broken. Manufactured easily 9 200816055. Further 'via the overlay program wherein the spacer is disposed around the wafer reinforcement member and then the inlay and the spacer are offset by a plurality of sheet members, but the shape of the RFID tag Further, with regard to the RFID tag manufacturing method according to the present invention, only a basic example will be described in order to avoid redundancy avoidance. However, the manufacturing method according to the present invention includes different examples of the examples corresponding to the above-described RFID tag and This example. As described above, according to the present invention, an RFH) label in which a bending stress of the circuit wafer is reduced and at the same time preventing cracking of the antenna can be obtained by 10. Fig. 1 is a display A schematic view of a first embodiment of an RF1D tag in accordance with the present invention; and FIG. 2 is a second representation of an iRFID tag in accordance with the present invention 15 is a schematic view showing a third embodiment of an RFID tag according to the present invention; and FIG. 4 is a fourth embodiment showing a r π d tag according to the present invention. FIG. 5 is a flow chart showing an RFID tag manufacturing method for manufacturing the RFID tag 400 of the fourth embodiment shown in FIG. 4 as an exemplary implementation of the RFID tag manufacturing method according to the present invention. 6 is a detailed view showing a preparation step (step 110) in the flowchart shown in FIG. 5; 10 200816055 FIG. 7 is a cover step (step) in the flowchart shown in FIG. 120) FIG. 8 is a schematic view showing a fifth embodiment of an RFID tag not according to the present invention; 5 FIG. 9 is a view showing the same as shown in FIG. RFID tag manufacturing method of RFID tag 900; FIG. 1 is a schematic view showing a sixth embodiment of an RFID tag according to the present invention;
第11圖是一圖， 口 顯不一用於製造第10圖所示之RFID標 10籤1000的RFID標籤製造方法； 第12圖疋一顯示根據本發明之RFID標籤的一第七實 施例之概要圖； 第13圖疋一圖，顯示該製造第12圖所示之RFID標籤 1100的RFID標籤製造方法的覆蓋步驟之細節； 15 第14圖是一顯示根據本發明之RFID標籤的一第八實 施例之概要圖；及 第15圖是一圖，顯示該製造第14圖所示之RFID標籤 1200的RFID標籤製造方法的覆蓋步驟之細節。Figure 11 is a diagram showing an RFID tag manufacturing method for manufacturing the RFID tag 10 tag 1000 shown in Fig. 10; and Fig. 12 shows a seventh embodiment of the RFID tag according to the present invention. FIG. 13 is a view showing details of the steps of covering the RFID tag manufacturing method of the RFID tag 1100 shown in FIG. 12; FIG. 14 is an eighth diagram showing the RFID tag according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 15 and FIG. 15 are views showing details of the steps of covering the RFID tag manufacturing method of the RFID tag 1200 shown in FIG.
【實施方式;J 20 較佳實施例之詳細說明 根據本發明之示範實施例將參考該等附圖來說明。 首先，根本發明之RFID標籤的一第一實施例將被說 明。 第1圖是一顯示根據本發明之RFID標籤的一第一實施 11 200816055 例之概要圖。 第1圖的部分(a)中，一RFID標籤100的頂視圖，根據本 發明之RFID標籤的第一實施例係顯示以該RFID標氧1〇〇的 内部結構被看穿的一狀態。第1圖的部分(b)中，該RFID標 5籤10〇的縱向橫截面被顯示。 弟1圖所示之RFID標藏100係假設被貼附至使用者穿 戴的一物品，諸如其形狀能容易被改變的衣服。該RFID標 籤100具有一結構其中一鑲後物11 〇係覆蓋有一橡膠覆蓋構 件120，該鑲嵌物110包含一形成有一 PET薄膜的基部ιη、 10 一延伸在该基部111上用於通訊的天線112、一電路晶片112 其係電性連接至該天線112用於經由該天線112來執行無線 電通訊、及一由纖維加強樹脂製成的晶片加強構件丨丨4其覆 蓋該電路晶片113的周圍。此外，該電路晶片H3係電性連 接至該天線並且藉由以一黏著劑113a膠合而被固定至該基 15部111。另外，如第1圖所示，該晶片加強構件114係設在該 基部111上以至該晶片加強構件114使該電路晶片u3住在 其中，並藉由以一熱固黏著劑115膠合而被固定至該基部 111上。此外，此熱固黏著劑115亦被施加以填充該晶片加 強構件114與該電路晶片113之間的空隙。此處，該基部 20 m、該天線112、該電路晶片113、該晶片強構件1M、該 鑲嵌物110及該覆蓋構件120分別是根據本發明之基部、天 線、電路晶片、晶片強構件、鑲嵌物及覆蓋構件之範例。 例如，當該RFID標籤1〇〇被貼附至一件衣服時，藉由 將該電路晶片113的周圍覆蓋有以一硬材料，一纖維加強樹 12 200816055 脂形成的晶片加強構件來防止該件衣服的形狀變化影響該 電路晶片113本身或該電路晶片113的周圍。結果，該電路 晶片113本身、該電路晶片113與該天線112之間的一連接部 分獲該電路晶片113與該基部丨11之間的一膠合部分係防止 5 被毀壞而破裂。 此處，該RFID標籤100中，被該晶片加強構件114所保 護的一區域被限制到在該電路晶片n3附近的一區域。因 此，以聚酯薄摩所形成且因此具有可撓的基部ιη允許由該 晶片加強構件所保護之區域外的一寬範圍自由度。此外， 10如以上所述，該RFID標籤100係覆蓋有該由一可撓性橡膠製 成的覆蓋構件120。為此，因為該黏著劑115與該天線112彼 此交叉的一部分係覆蓋有該可撓的覆蓋構件12〇,所以此交 叉部分中的一彎折應力之集中被抑制並且因此防止了該天 線112的破裂。換言之，第1圖所示的RFID標籤1〇〇對於該電 15 路晶片的一彎折應力被減少並且同時該天線的破裂。 此外，此RFID標籤100根據一貼附有該rfid標籤1〇〇 的物品諸如一件衣服的形狀改變來改變在一廣泛區域的形 狀’除了由該晶片加強構件114所保護的電路晶片113的周 圍以外。另外，因為此RHD標籤1〇〇係完全覆蓋有該可撓的 20覆蓋構件12〇，所以甚至在此!^1〇標籤1〇〇直接接觸使用者 的情況下，防止了該硬的晶片加強構件1丨4直接接觸該使用 者。此外，即使此RFID標籤100係破裂，因為配置有該完全 覆蓋此RFID標籤1〇〇之覆蓋構件120，所以防止了該破裂的 標籤之碎片傷到使用者。換言之，第1圖所示之RFID標籤100 13 200816055 係配置以致由於考慮到使用者，此RFID標籤1 〇〇禁得住粗糙 的環境。 接著，根據本發明的一第二實施例將被說明。 第2圖是一顯示根據本發明之RFID標籤的第二實施例 5 之概要圖。 第2圖的部分(a)中，—RFID標籤3〇〇的一頂視圖，根據 本發明之RFID標籤的第二實施例，係顯示在該^^仍標籤 200的一内部結構被看穿的一狀態。第2圖的部分(b)中，此 RFID標戴200的一縱向橫截面被顯示。 10 此外，第2圖中，等於上述第1圖所示的第一實施例之 元件係給予相同如第1圖中的參考文字。在下文中，這些元 件的冗餘說明將被省略。 此實施例之RFID標籤200中，一鑲嵌物21〇包含一晶片 加強構件211，其形狀係異於該第一實施例的晶片加強構件 15的形狀。第2圖所示之鑲嵌物210與晶片加強構件211分別對 應根據本發明的銀欲物與晶片加強構件之範例。 該晶片加強構件211具有一結構係第！圖所示之第一實 施例的晶片加強構件之頂部分被去掉以便打開在該電路晶 片113上面的空間。同樣地，此晶片加強構件211中，防止 20 了該RFID標籤200的一形狀變化影響該電路晶片113的一周 圍。此外，因為該黏著劑115的邊緣與該天線12彼此交叉的 -部分係覆蓋有該可撓的錢構件12〇，該天線112的破裂 被防止。另外’在_電路晶片113上面的開口空間因一對應 該晶片加強構件114的除去頂部之部分而使111711)標籤2〇〇更 14 200816055 薄0 如此，第2圖所示之RFID標籤200被配置以致該rfid標 籤200係變薄同時保護該電路晶片且防止該天線的破裂如 同於該第一實施例的RFID標籤100。 5 接著，根據本發明之RFID標籤的一第三實施例將被說 明。 第3圖是一顯示根據本發明之RFID標籤的第三實施例 之概要圖。 第3圖的部分(a)中，一RFID標籤300的一頂視圖，根據 10 本發明之RFID標籤的第三實施例，係顯示在該RnD標籤 300的一内部結構被看穿的一狀態。第3圖的部分作）中，此 RFID標戴300的一縱向橫截面被顯不。 此外，同樣地在第3圖中，等於上述第1圖所示的第一 實施例之元件係給予相同如第1圖中的參考文字。在下文 15 中，這些元件的冗餘說明將被省略。 此實施例之RFID標籤300中，一鑲嵌物310包含一等於 該第二實施例之晶片加強構件211的晶片加強構件311、及 一底加強構件312，其係配置以致該晶片加強構件311與底 加強構件312將該基部111夾在中間並且係有關該基部111 2〇 而彼此對立設置。第3圖所示之鑲嵌物210與晶片加強構件 311分別對應根據本發明的鑲嵌物與晶片加強構件之範 例。此外，該底加強構件312對應根據本發明之底加強構件 的一範例。 同樣地對於該晶片加強構件311，該底加強構件312係 15 200816055 由纖維加強樹脂製成並且藉由等於該黏著劑1丨5將該晶 片加強構件3 Π膠合在該基部1Π上的熱固黏著劑11 $之膠 a而被固定在該基部丨丨丨的底部。另外，此實施例中，該底 加強構件312具有相同如該晶片加強構件$ η之形狀，除了 5 一用於容置該電路晶片113之開口並未被提供。 第3圖所示的RFID標籤300係配置以致該電路晶片的 保護係由此底加強構件312而被加強，同時保有上述該第二 實施例中達到的防止該天線等的破裂。 接著，根據本發明的RFID標籤之第四實施例將被說 10 明。 第4圖是一顯示根據本發明之RFID標籤的第四實施例 之概要圖。 第4圖的部分⑷中’一RFID標籤彻的一頂視圖，根據 本發明的RFID標藏之第四實施例係顯示在該rfid標籤彻[Embodiment] J 20 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Exemplary embodiments according to the present invention will be described with reference to the drawings. First, a first embodiment of the radically invented RFID tag will be explained. Fig. 1 is a schematic view showing an example of a first embodiment 11 200816055 of an RFID tag according to the present invention. In part (a) of Fig. 1, a top view of an RFID tag 100, according to a first embodiment of the RFID tag of the present invention, shows a state in which the internal structure of the RFID tag is seen through. In part (b) of Fig. 1, the longitudinal cross section of the RFID tag 10 is displayed. The RFID tag 100 shown in Figure 1 is assumed to be attached to an item worn by the user, such as a garment whose shape can be easily changed. The RFID tag 100 has a structure in which an inlay 11 is covered with a rubber covering member 120. The inlaid 110 includes a base portion formed with a PET film, and an antenna 112 extending over the base portion 111 for communication. A circuit chip 112 is electrically connected to the antenna 112 for performing radio communication via the antenna 112, and a wafer reinforcing member 4 made of fiber-reinforced resin covers the periphery of the circuit wafer 113. Further, the circuit wafer H3 is electrically connected to the antenna and is fixed to the base portion 115 by being glued with an adhesive 113a. In addition, as shown in FIG. 1, the wafer reinforcing member 114 is disposed on the base portion 111 such that the wafer reinforcing member 114 holds the circuit wafer u3 therein and is fixed by gluing with a thermosetting adhesive 115. To the base 111. Further, the thermosetting adhesive 115 is also applied to fill the gap between the wafer reinforcing member 114 and the circuit wafer 113. Here, the base 20 m, the antenna 112, the circuit wafer 113, the wafer strength member 1M, the inlay 110, and the covering member 120 are respectively a base, an antenna, a circuit wafer, a wafer strong member, and a mosaic according to the present invention. Examples of objects and covering members. For example, when the RFID tag 1 is attached to a piece of clothing, the piece of the circuit wafer 113 is covered with a wafer reinforcing member formed of a hard material, a fiber reinforced tree 12 200816055 grease, to prevent the piece. The shape change of the clothes affects the circuit chip 113 itself or the periphery of the circuit wafer 113. As a result, a portion of the connection between the circuit chip 113 itself, the circuit chip 113 and the antenna 112, and a bonding portion between the circuit wafer 113 and the base portion 11 prevents the 5 from being broken and broken. Here, in the RFID tag 100, an area protected by the wafer reinforcing member 114 is restricted to an area in the vicinity of the circuit wafer n3. Thus, a wide range of degrees of freedom outside of the area protected by the wafer stiffening member is formed by the polyester foil and thus having a flexible base. Further, as described above, the RFID tag 100 is covered with the covering member 120 made of a flexible rubber. For this reason, since a portion of the adhesive 115 and the antenna 112 crossing each other is covered with the flexible covering member 12A, the concentration of a bending stress in the intersecting portion is suppressed and thus the antenna 112 is prevented. rupture. In other words, the bending stress of the RFID tag 1 第 shown in Fig. 1 for the electric circuit is reduced and at the same time the antenna is broken. Further, the RFID tag 100 changes the shape of a wide area in accordance with the shape change of an article to which the RFID tag 1 is attached, such as a piece of clothing, except for the periphery of the circuit wafer 113 protected by the wafer reinforcing member 114. other than. In addition, since the RHD label 1 is completely covered with the flexible 20 covering member 12, the hard wafer reinforcement is prevented even in the case where the label 1 is directly in contact with the user. The member 1丨4 directly contacts the user. Further, even if the RFID tag 100 is broken, since the covering member 120 completely covering the RFID tag 1 is disposed, the broken label is prevented from being damaged to the user. In other words, the RFID tag 100 13 200816055 shown in Fig. 1 is configured such that the RFID tag 1 can withstand a rough environment due to the user. Next, a second embodiment according to the present invention will be explained. Fig. 2 is a schematic view showing a second embodiment 5 of the RFID tag according to the present invention. In part (a) of Fig. 2, a top view of the RFID tag 3A, according to a second embodiment of the RFID tag of the present invention, is shown in an internal structure in which the internal structure of the tag 200 is seen through. status. In part (b) of Fig. 2, a longitudinal cross section of the RFID marking 200 is shown. Further, in Fig. 2, the elements of the first embodiment shown in Fig. 1 are given the same reference numerals as in Fig. 1. In the following, redundant descriptions of these elements will be omitted. In the RFID tag 200 of this embodiment, an inlay 21 〇 includes a wafer reinforcing member 211 having a shape different from that of the wafer reinforcing member 15 of the first embodiment. The inlay 210 and the wafer intensifying member 211 shown in Fig. 2 correspond to examples of the silver object and the wafer reinforcing member according to the present invention, respectively. The wafer reinforcing member 211 has a structural system! The top portion of the wafer reinforcing member of the first embodiment shown in the figure is removed to open the space above the circuit wafer 113. Similarly, in the wafer reinforcing member 211, a shape change of the RFID tag 200 is prevented from affecting the circumference of the circuit wafer 113. Further, since the edge of the adhesive 115 and the portion where the antenna 12 cross each other are covered with the flexible money member 12, the breakage of the antenna 112 is prevented. In addition, the 'opening space on the _ circuit wafer 113 is 111711 due to the portion of the wafer reinforcing member 114 that is removed from the top.) The label 2 is further 14 200816055 thin 0. Thus, the RFID tag 200 shown in FIG. 2 is configured. The rfid label 200 is thinned while protecting the circuit wafer and preventing the antenna from being broken as in the RFID tag 100 of the first embodiment. 5 Next, a third embodiment of the RFID tag according to the present invention will be explained. Fig. 3 is a schematic view showing a third embodiment of the RFID tag according to the present invention. In part (a) of Fig. 3, a top view of an RFID tag 300, according to a third embodiment of the RFID tag of the present invention, shows a state in which an internal structure of the RnD tag 300 is seen through. In the portion of Fig. 3, a longitudinal cross section of the RFID tag 300 is shown. Further, in the same manner, in Fig. 3, the elements of the first embodiment shown in Fig. 1 are given the same reference numerals as in Fig. 1. In Figure 15 below, redundant descriptions of these components will be omitted. In the RFID tag 300 of this embodiment, an inlay 310 includes a wafer reinforcing member 311 equal to the wafer reinforcing member 211 of the second embodiment, and a bottom reinforcing member 312 configured such that the wafer reinforcing member 311 and the bottom The reinforcing members 312 sandwich the base portion 111 and are disposed opposite to each other with respect to the base portion 111. The inlay 210 and the wafer intensifying member 311 shown in Fig. 3 correspond to the examples of the inlay and the wafer intensifying member according to the present invention, respectively. Further, the bottom reinforcing member 312 corresponds to an example of the bottom reinforcing member according to the present invention. Similarly, for the wafer reinforcing member 311, the bottom reinforcing member 312 is made of fiber-reinforced resin and the heat-adhesive bonding of the wafer reinforcing member 3 to the base 1 is achieved by being equal to the adhesive 1丨5. The glue 11 of the agent 11 is fixed to the bottom of the base. Further, in this embodiment, the bottom reinforcing member 312 has the same shape as the wafer reinforcing member $n except that an opening for accommodating the circuit wafer 113 is not provided. The RFID tag 300 shown in Fig. 3 is arranged such that the protection of the circuit chip is reinforced by the bottom reinforcing member 312 while preserving the rupture of the antenna or the like which is achieved in the second embodiment described above. Next, a fourth embodiment of the RFID tag according to the present invention will be described. Fig. 4 is a schematic view showing a fourth embodiment of the RFID tag according to the present invention. In a part (4) of Fig. 4, a top view of an RFID tag, a fourth embodiment of the RFID tag according to the present invention is displayed on the rfid tag
15的一内部結構被看穿的一狀態。第4圖的部分(b)中，此RFID 標籤400的一縱向橫截面被顯示。 此外，同樣地在第4圖中，等於上述第丨圖所示的第一 只方&例之元件係給予相同如第1圖中的參考文字。在下文 中，這些元件的冗餘說明將被省略。 20 此實施例之RFID標籤400中，一鑲嵌物410包含一等於 該第二實施例之晶片加強構件211的晶片加強構件4ΐι '及 -底加強構件42G，其係配置以致該晶片加強構件4ΐι與底 加強構件420將該基部1U失在中間並且係有關該基部⑴ 而彼此對立設置。然而，企匕實施例的底加強構件42〇係不同 16 200816055 於上述第三實施例在於它是與該基部lu分開。此外，根據 此實施力的底加強構件既不是由相同該加強構件411的材 料製成也不具有相同如該加強構件411的形狀，而不像該第 二貫施例的底加強構件的。此實施例的第加強構件42〇係以 5 一具有彎折的可撓性且抑制擴大的塑膠薄片形成，該底加 強構件420具有一寬到足以保護一寬於該晶片加強構件411 之區域的形狀。一由一橡膠製成的覆蓋構件12〇延伸在該底 加強構件420與該基部111之間。第4圖所示之該鑲嵌物41〇 與該晶片加強構件411分別對應根據本發明之鑲嵌物與晶 10片加強構件之範例。此外，該底加強構件420對應根據本發 明的底加強構件之範例。 第4圖所示之此RFID標籤400係配置以致該電路晶片 的保護係由此底加強構件420而被加強同時保有相似於該 第三實施例之RFID標籤300該天線等的破裂的防止。 15 接著，根據本發明之RFID標籤製造方法的一實施例將 被說明。 以下’一種用於製造第4圖所示之第四實施例的rhD 標籤400的RFID標籤製造方法，作為根據本發明之RFID標 籤製造方法的一實施例，將被說明。此處，第4圖所示之元 20 件數字將被參考而無“第4圖”之說明。 第5圖是一流程圖，其顯示一種用於製造第4圖所示之 第四實施例的RFID標籤400的RFID標籤製造方法，作為根 據本發明之RFID標籤製造方法的一示範實施例。 由第5圖之流程圖所示之此RFID標籤製造方法包含一 17 200816055 用於準備該鑲嵌物410的準備步驟（步驟S110)、及—用於矜 蓋該鑲嵌物410的覆蓋步驟（步驟S120)。該準備步驟（步驟 S110)與該覆蓋步驟（步驟S120)分別對應根據本發明之準備 步驟與覆蓋步驟之範例。 5 首先，該準備步驟(步驟S110)將被說明。 第6圖是一顯示第5圖所示之流程圖中的準備步驟（步 驟110)細節之圖。 首先，此準備步驟(步驟S110)中，該電路晶片113係架 • 設在該基部111上，在形成有該天線112的表面上。因為架 10設此電路晶片丨13係廣為人知，所以此處詳細的說明將被省 略0 該電路晶片113被架設於步驟S111，並且然後_分配器 450將熱固黏耆g己憶體1 1 5施加至該基部1 1 1以致該電路晶 片被埋至於該熱固黏著劑115 (步驟S112)。接著，一架設工 15具500將該晶片加強構件411運載到正好在該電路晶片Π3 上面的一位置且將該晶片加強構件411放在該基部111上以 _ 至该電路晶片113被容置於該晶片加強構件411 (步驟 S113) °然後’ 一熱源600加熱該熱固黏著記憶體115以至於 - 該熱固黏著劑U5被硬化且該鑲嵌物400被完成（步驟S114)。 20 接著’第5圖所示之覆蓋步驟（步驟S120)將被說明。 第7圖是一顯示第5圖所示之流程圖中的覆蓋步驟（步 驟120)細節之圖。 此覆蓋步驟（步驟S120)中，覆蓋三件的RFID標籤400 在一個程序中被執行。 18 200816055 此覆蓋步驟(步驟S120)中，一按壓裝置700被使用。該 按壓裝置700的一按壓台71〇與一按壓頭42〇將要被按壓的 一目標夹在中間並加熱該目標。 在該鑲散物410在該準備步驟(步驟sn〇)中被獲得後， 5以下的一按壓與加熱程序（步驟S121)被執行如下。 首先，四個橡膠薄片121至124的一底橡膠薄片121被放 在該按壓台710上。該等膠薄片121至127形成一覆蓋該鑲嵌 物410的覆蓋構件120，上述的三件底加強構件42〇被排列在 該底橡膠薄片121上。隨後，該第二橡膠薄片122係覆蓋在 10该專二件的底加強構件420上。然後，該等三件的鑲後物410 被放置以致每一鑲嵌物與每一底加強構件分別將該橡膠薄 片420夾在中間並係彼此相對。 接著，該第三橡膠薄片123係覆蓋在該等三件的鑲嵌物 410上。此處，如第7圖所示，該第三橡膠薄片123係設有開 15 口分別將該晶片加強構件411容置於每一鑲嵌物410。此橡 膠薄片123被放置以致每一晶片加強構件411被容置於每一 開口中。此第三橡膠薄片對應根據本發明的間隔物之範 例。並且最後，該頂橡膠薄片124係覆蓋在該第三橡膠薄片 123 上。 20 於是，在該等四個橡膠薄片121至124、該底加強構件 420及該鑲嵌物410被放在該按壓台710上之後，該按壓頭 720下移到該頂橡膠薄片124上。然後，該按壓裝置400中， 該等四個橡膠薄片121至124、該底加強構件420及該鑲嵌物 410被該按壓台710與該按壓頭720夾在中間以便被壓並被 19 200816055 加熱。經由此按壓及加熱，該等四個橡膠薄片121至124被 合成一體以致用於三件RFID標籤400的該等底加強構件420 與該等鑲嵌物410被埋置在内部。然後，其中該等底加強構 件420與鑲嵌物410係覆蓋有該橡膠覆蓋構件12〇的一連串 5 三件RFID標籤400被形成。 跟隨步驟S121之程序，一切割器800下移在各個鑲嵌物 410之間來切割連續的rFId標籤400以便獲得三件分開的 RFID標籤 400 (步驟 S122)。 根據上述及第3圖所示之RFID標籤製造方法，是有可 10能容易製造具有一考慮到使用者禁得住粗糙環境的結構之 RFID標籤400。此外，在kRFID標籤製造方法中，於第7圖 所示之步驟S121中，上述第三橡膠薄片123，其係設有用於 容置該晶片加強構件之開口，被使用並且該晶片加強構件 411的周圍，其形成了該鑲嵌物41〇的凸出，係填充有此橡 15膠薄片123。於是，該RFID標籤400最後得到的形狀被弄平。 接著，根據本發明之RFID標籤的一第五實施例將被說 明。 第8圖是一顯示根據本發明之RFID標籤的第五實施例 之概要圖。 2〇 第8圖的部分⑷中，一RFID標籤_的一頂視圖，根據 本發明的RFID標籤之第五實施例係顯示在該RnD標籤_ 的内°卩〜構被看穿的一狀態。第8圖的部分(b)中，此RHD 標籤900的一縱向橫截面被顯示。 同樣地在帛5圖中，等於上述第1圖所示的第-實施例 20 200816055 之元件係給予相同如第1圖中的參考文字。在下文中，這些 元件的冗餘說明將被省略。 此實施例之RFID標籤900係不設有由一纖維加強樹脂 製成的晶片加強構件以及該覆蓋構件，其二者係設於第一 5到第四實施例全部。該電路晶片113係覆蓋有一硬式環氧樹 脂罐封材料901，並且其整個周邊係覆蓋有一可撓性橡膠黏 著劑902。此處，此硬式環氧樹脂罐封材料9〇1對應根據本 發明之晶片加強構件的一範例並且該可撓性橡膠黏著劑 902對應根據本發明之邊緣覆蓋構件的一範例。 10 此實施例的灯仍標籤900中，該電路晶片113係由該硬 式罐封材料901所保護。另外，因為對應根據本發明之“該 晶片加強構件的邊緣”的一範例之硬式環氧樹脂罐封材料 901的邊緣係完全覆蓋有包含此邊緣與該天線112互相交叉 的一部分之可撓性橡膠黏著劑9〇2，此部份中的一彎折應力 15的集中被抑制且因此該天線113的破裂被防止。換言之，同 樣地在第8圖所示之此RFID標籤9〇〇中，對於該電路晶片的 一、考折應力被降低並且同時該天線的破裂被防止。 接著，——種用於製造第8圖所示iRnD標籤900的方法 將被說明。此外，在此，第8圖所示之元件將被參考而無“第 20 8圖”的說明。 第9圖是一圖，顯示一用於製造第8圖所示之rFID標籤 900的RFID標籤製造方法。 此製造方法中’首先，該電路晶片113係裝設在該基部 111上，在該基部111表面上該天線112被形成（步驟S2〇1)。 21 200816055 因為裝設此電路晶片113係廣為人知，所以其詳細說明將被 省略。 步驟S201中，該電路晶片U3被裝設。然後，該分配器 450將該硬式熱固罐封材料901施加在該基部111中以致該 5 電路晶片113被埋於該硬式罐封材料9〇1中（步驟S202)。該熱 源600將該硬式熱固罐封材料9〇1加熱以硬化該硬式熱固罐 封材料901 (步驟S203)。然後，該熱源600將該可撓性熱固 黏著劑902覆蓋該硬式罐封材料9〇 1的一邊緣(步驟S204)。然 後，該熱元600將該可撓性熱固黏著劑9〇2加熱以硬化此可 10撓性熱固黏著劑9〇2，並且該RFID標籤900被完成（步驟 S205) 〇 經由一連串的這些程序，第8圖所示之RHD標籤900係 容易地製造。 接著，根據本發明之RFID標籤的一第六實施例將被說 15 明。 第10圖是一顯示根據本發明之111^〇標籤的第六實施 例之概要圖。 第10圖的部分(a)中，一RFID標籤1〇〇〇的一頂視圖，根 據本發明的RFID標籤之第六實施例係顯示在該RFm標籤 20 10(H)的-内部結構被看穿的_狀態。第_的部分⑻中， 此RFID標籤1000的-縱向橫截面被顯示。 此外’第1G圖中’等於上述第2圖所示的第二實施例之 元件係給予相同如第2圖中的參考文字。在下文中，這些元 件的冗餘說明將被省略。 22 200816055 此實施例之RFID標籤1000係不設有包含在上述第二 實施例中的覆蓋構件，該晶片加強構件211沿著邊緣係完全 被一可撓性橡膠黏著劑1002所覆蓋。此外，該可撓性橡膠 黏著劑1002具有將該晶片加強構件211膠黏並固定至該基 5部111的作用。另外，此RFn>標籤1000中，該晶片加強構件 211係填滿有一環氧樹脂硬式罐封材料1〇〇1以致該環氧樹 脂硬式罐封材料901與該可撓性黏著劑1〇〇2對應根據本發 明之晶片加強構件與該邊緣覆蓋構件之範例。 此實施例的RFID標籤1〇〇〇中，該電路晶片113係由該晶 10片加強構件211所保護。此外，此電路晶片的保護係藉由填 滿該硬式罐封材料1001而被加強。另外，因為一對應根據 本發明之“該晶片加強構件的邊緣，，的一範例之晶片加強 構件211的邊緣係完全覆蓋有包含此邊緣與該天線112互相 交叉的一部分之可撓性橡膠黏著劑1〇〇2，此部份中的一彎 15 折應力的集中被抑制且因此該天線113的破裂被防止。換言 之，對於該電路晶片的一彎折應力被降低並且同時該天線 的破裂被防止。 接著，一種用於製造第10圖所示之RFID標籤1000的方 法將被說明。此外，在此，第10圖所示之元件將被參考而 20 無“第10圖”的說明。 第11圖是一圖，顯示一用於製造第1〇圖所示之RFID標 籤1000的RFID標藏製造方法。 同樣地在此製造方法中，首先，該電路晶片113係裝設 在該基部111上，在該基部111表面上該天線112被形成（步驟 23 200816055 S301)。因為裝設此電路晶片113係廣為人知，所以此處其 詳細說明將被省略。 步驟S301中，該電路晶片113被裝設。然後，該分配器 450將一可撓性熱固罐封材料1002施加至該基部111中以致 5 該可撓性熱固罐封材料1002圍繞該電路晶片113的周圍 (步驟S302)。接著，該架設工具500將該晶片加強構件211 運載至正好在該電路晶片113上面的一位置並將該晶片加 強構件211放在該基部111上，以致該電路晶片113被容置於 該晶片加強構件211中（步驟S303)。然後，該熱源600將該可 10撓性熱固黏著劑1〇〇2加熱以至於此可撓性熱固黏著劑被硬 化且該晶片加強構件211被膠黏且固定至基部m (步驟 S304)。隨後，該分配器450以該硬式熱故罐封材料1〇〇1填 充該晶片加強構件211，以致該硬式熱故罐封材料丨〇〇1覆蓋 在該晶片加強構件211内部的電晶體路晶片（步驟S3〇5)，並 15且該熱元6〇〇加熱並硬化該硬式熱固罐封材料1〇〇1而完成 該RFID標籤1〇〇〇 (步驟S306)。 經由一連串的這些程序，第1〇圖所示之rFID標籤 10900係容易地製造。 接著，根據本發明之RFID標籤的一第七實施例將被說 20 明。 第12圖是一顯示根據本發明之RFID標籤的第七實施 例之概要圖。 第12圖的部分(a)中，一RFID標籤11〇〇的一頂視圖，根 據本發明的RFID標籤之第七實施例係顯示在該1^1〇標籤 24 200816055 1100的一内部結構被看穿的一狀態。第12圖的部分(b)中， 一RFID標籤1100的一縱向橫截面被顯示。 此外，第12圖中，等於上述第1圖所示的第一實施例之 元件係給予相同如第1圖中的參考文字。在下文中，這些元 5 件的冗餘說明將被省略。 此實施例之RFID標籤11〇〇中，一鑲嵌物1110係設有一 晶片加強構件1111，其形狀係不同於根據該第一實施例的 晶片加強構件之形狀，並且該晶片加強構件1111係埋置於 覆蓋構件112〇中不接觸該基部m、該天線112及該電路 1〇晶片U3。第12圖所示之此鑲嵌物1110、該晶片加強構件 1111及該覆蓋構件112〇亦分別對應根據本發明之鑲嵌物、 晶片加強構件與覆蓋構件。 第12圖所示之加強構件1111，其既不膠合也不固定至 β亥基邛112，係隔開，像漂浮，在該電路晶片113上。此晶 15片加強構件1111亦防止該RFID標籤1100的形狀變化影響該 電路晶片113的周圍，因此防止該電路晶片112的剝落與破 裂等。此外，此實施例中，因為該晶片加強構件^丨丨不與 该天線112接觸，所以沒有彎折應力之集中在一限制部分並 且該天線112的破裂被防止。 2〇 接著，用於製造第12圖所示之RFID標籤的方法將被說 明。此外，於此，第12圖所示之元件將被參考而沒有“第 12圖”的說明。 此製造方法中，在該電路晶片113被裝設在該基部1^ 上後，在該基部111的表面上該天線112被形成，用於覆蓋 25 200816055 該鑲故物1110的覆蓋步驟係與配置該晶片加強構件⑴㈣ 時被執行。 第13圖是-圖’顯示該製造第12圖所示之RFID標鐵 1100的RFID標戴製造方法的覆蓋步驟之細節。 5 用於—件腿雜籤11嶋«步驟御轉於扣圖。 在以下將被說明的覆蓋步驟中，相同如第7圖所示之按 壓裝置700的按壓裝置被使用。因此，第13圖中，此按壓裝 置係顯示以相同如第7圖的符號。 首先’该鑲肷物1110除了遠晶片加強構^+ιηι以外的 ίο 一部分、形成該覆蓋構件1120的三個橡膠薄片1121至1123 以及該晶片加強構件1111係配置如下（步驟S4〇1)。首先，該 等二個橡膠溥片1121至1123的底橡膠薄片1121被放在該按 壓台710上’然後該镶嵌物1110的該部分1112被放在該底橡 膠薄片1121。隨後，該第二橡膠薄片1122被覆蓋在該鑲嵌 ^物H10的該部分1112上，並且該晶片加強構件mi被放在 一位置其中該晶片加強構件1111與該電路晶片n3將該橡 膠薄片1122爽在中間且彼此相對。然後，最後該頂橡膠薄 片1123被覆蓋。 於是，在該鑲後物1110之該部分1112、形成該覆蓋構 20件1120之該等三個橡膠薄片1121至1123以及該晶片加強構 件1111被放在該按壓台710上後，該按壓頭720下移到該頂 橡膠薄片1123上，並且被該按壓台710與該按壓頭720爽在 中間的該等三個橡膠薄片1121，1122與1123、該鑲嵌物1110 之該部分1112及該晶片加強構件1111被按壓並被加熱成為 26 200816055 一體（步驟S402)。藉此結合，第12圖所示iRFID標籤11〇〇 被完成。 經由一連串的這些程序，第12圖所示iRFID標籤11〇〇 係容易製造。 5 接著，根據本發明的一第八實施例將被說明。 第14圖是一顯示根據本發明之^^⑴標籤的第八實施 例之概要圖。 第U圖的部分(a)中，一rhd標籤1200的一頂視圖，根 據本發明的RFID標籤之第八實施例係顯示在該^^仍標籤 10丨2〇〇的一内部結構被看穿的一狀態。第14圖的部分(b)中， 一 RFID標籤1200的一縱向橫截面被顯示。 此外，第14圖中，等於上述第12圖所示的第七實施例 之元件係給予相同如第12圖中的參考文字。在下文中，這 些元件的冗餘說明將被省略。 15 此實施例之RFID標籤1200中，該鑲嵌物1210具有一結 構其中一底加強構件1121被增加至第12圖所示之第七實施 例的鑲嵌物，以致該底加強構件1121與該晶片加強構件 uu將該基部m爽在中間，並且該底加強構件1121係隔開 該基部111來放置。該鑲嵌物1210與該底加強構件以丨丨分別 2〇對應根據本發明之鑲嵌物與底加強構件之範例。此外，此 實施例的覆蓋構件1220亦填充該鑲嵌物121〇與該底加強構 件1211之_間隙。此覆&構件122G對應根據本發明的覆 蓋構件之範例。 14圖所不之RFID標籤1200具有一結構其中該電路晶 27 200816055 片的保護係因該底加強構件1211而被加強，同時維護上述 第七實施例中所獲得之天線破裂等的防止。 接著’用於製造苐14圖所示之此rfid標籤1200的方法 將被說明。此外，於此第14圖所示之元件將被參考而無“第 5 14圖”之說明。 此製造方法中，在該電路晶片113被裝設在該基部ln 上後，在該基部111的表面上該天線112被形成，用於覆蓋 該鑲嵌物1220的覆蓋步驟係與配置該晶片加強構件丨丨^同 時被執行。 10 第15圖是一圖’顯示該製造第14圖所示之rfid標籤 1200的RFID標籤製造方法的覆蓋步驟之細節。 同樣在第15圖中，用於一件RFID標籤1200的覆蓋步驟 係顯示於第13圖。 在以下將被說明的覆蓋步驟中，相同如第7圖所示之按 15壓裝置700的按壓裝置被使用。因此，第15圖中，此按壓裝 置係顯示以相同如第7圖與第13圖的參考文字。 首先，該鑲嵌物1210除了該晶片加強構件ini與該底 加強構件1211以外的一部分、四個橡膠薄片1221至1224、 該晶片加強構件1111、以及該底加強構件1211係配置如下 20 (步驟S501)。首先，該等四個橡膠薄片1221至1224的最底橡 膠薄片1221被放在該按壓台710上，然後該底加強構件1211 被放在該底橡膠薄片1221上。隨後，該第二橡膠薄片1222 係覆蓋在該底加強構件1211上，並且該鑲嵌物1210的該部 分1212被放在一位置其中該晶片加強構件12ιι與該電路晶 28 200816055 片113將該第二橡膠薄片1222夾在中間且有關該第二橡膠 薄片1222彼此相對。接著，該第三橡膠薄片1223被覆蓋在 該鑲嵌物1210的該部分1212上，該晶片加強構件mi被放 在一位置其中該晶片加強構件1111與該電路晶片H3將該 5弟二橡膠溥片1223夾在中間且彼此相對。然後，最後該頂 橡膠薄片1224被覆蓋。 於是’該鑲嵌物1110除了該晶片加強構件1111與該底 加強構件1211以外之該部分1212、四個橡膠薄片1221至 1224、該晶片加強構件mi、及該底加強構件被放在該按 10壓台710上。然後，該按壓頭720下移到該頂橡膠薄片1224 上，並且該等四個橡膠薄片1221至1224、該鑲嵌物1110之 該部分1112、該晶片加強構件mi及該底加強構件1211被 該按壓台710與該按壓頭720夾在中間並且被按壓且被加熱 成為一體（步驟S502)。藉此結合，第14圖所示之RF1D標籤 15 1200被完成。 經由一連串的這些程序，第14圖所示之RFID標籤1200 係容易製造。 另外，以上說明中，作為根據本發明的晶片加強構件 之範例，由纖維加強樹脂製成的晶片加強構件114被顯示但 20 該纖維加強樹脂的類型係不特定。根據本發明的纖維加強 數之可能是，例如，一FRP (纖維加強塑膠）或一玻璃環氧樹 脂。此外，根據本發明之晶片加強構件並不限於此纖維加 強數之並且可能是一熱可塑性塑膠或一熱固樹脂。 此外，在以上說明中，作為一用於將該晶片加強構件 29 200816055 膠合與固定至該基部111的黏著劑，該熱固黏著劑被示範， 但本發明並不限於此一範例。此黏著劑可能是一UV硬化黏 著劑、一厭氣黏著劑、一水分硬化黏著劑或一 2-部分黏著 劑。 5 此外，在以上說明中，屬於根據本發明的底加強構件 之範例，由一纖維加強樹脂製成的底加強構件312被示範作 為被膠合以便被固定在該鑲嵌物的底面上之底加強構件類 型的一範例，但該纖維加強樹脂的種類係不特定。形成此 類型的底加強構件的一纖維加強樹脂可能是一FRp或一破 10璃環氣樹脂。另外，上述類型的底加強構件並不限於由此 纖維加強數之製成者，並且可能是，例如，一熱塑性塑膠 或一熱固塑膠。 此外，在以上說明中，屬於根據本發明的底加強構件 之範例，作為被安排與該鑲嵌物隔開的底加強構件之類型 15的一範例，由塑膠薄片製成的底加強構件420被示範。但此 發明並不在此限。此類型被安排與該鑲嵌物隔開的底加強 構件可能是一個形成有一由尼龍（一註冊商標）製成的網。 此外，在以上說明中，作為一根據本發明的覆蓋構件 2〇之範例，該橡膠覆蓋構件120被示範，但該橡膠的種類係非 特疋。然而，形成根據本發明之覆蓋構件的一橡膠可能是， 例如，氨基鉀酸酯橡膠，矽橡膠或氟橡膠。 此外，在以上說明中，作為該晶片加強構件的一範例， ^中-開Π被形成來容置該晶片之晶片加強構件113被示 範。然而，本發明並不在此限。根據本發明之晶片加強構 30 200816055 5 件可能是’例如’ ~無此開口但僅具有-板狀外表並被配 置以覆蓋該電路晶片的晶片加強構件。 另外，在以上說明中，作為根據本發明的邊緣覆蓋構 L的橡膠黏著劑被示範，但該橡膠的種 類並非特定H形成根據本發明之邊緣覆蓋構件的橡 膠可冑b疋，例如，氨基鉀酸酯橡膠或矽橡膠。 • 此外’在以上說明中，作為根據本發明的邊緣覆蓋構 件的-In例’完全覆蓋該硬式罐封材料9Gl的可撓黏著劍與 該晶片覆蓋構件被示範。然而，本發明並不在此限。根據 10 本發明之邊緣覆蓋構件可能^覆蓋，例如，該邊緣與該天 線互相交又的一部分。 【圖式簡單*說^明】 第1圖是一顯示根據本發明2RF1D標籤的一第一實施 例之概要圖； 15 第2圖是一顯示根據本發明iRFID標籤的一第二實施 • 例之概要圖； 第3圖是一顯示根據本發明之RF j D標籤的一第三實施 例之概要圖； 〜 20 第4圖是一顯示根據本發明之RFID標籤的一第四實施 例之概要圖； 第5圖是一流程圖，其顯示一種用於製造第4圖所示之 第四實施例的RFID標籤400的RFID標籤製造方法作為根據 本發明的RFID標籤製造方法的一示範實施例； 第6圖是一顯示第5圖所示之流程圖中的準備步驟（少 31 200816055 驟110)之細節圖； 第7圖是一顯示第5圖所示之流程圖中的覆蓋步驟（步 驟120)細節之圖； 第8圖是一顯示根據本發明之rFID標籤的一第五實施 5 例之概要圖； 第9圖是一圖，顯示一用於製造第8圖所示之RFID標藏 900的RF1D標籤製造方法； 第10圖是一顯示根據本發明之RFID標籤的一第六實 施例之概要圖； 10 第11圖是一圖，顯示一用於製造第10圖所示之RFID標 籤1000的RFID標籤製造方法； 第12圖是一顯示根據本發明之^^仍標籤的一第七實 施例之概要圖； 第13圖是一圖，顯示該製造第12圖所示之RHD標籤 15 1100的RFID標籤製造方法的覆蓋步驟之細節； 弟14圖是一顯示根據本發明之rfid標籤的一第八實 施例之概要圖；及 苐15圖是一圖，顯示該製造第14圖所示之RFiD標籤 1200的RFID標籤製造方法的覆蓋步驟之細節。 20 【主要元件符號說明】 100· · .RFID標籤 113···電路晶片 110···鑲嵌物 114…晶片加強構件 m···基部 115…熱固黏著劑 112…天線 120· _·橡膠覆蓋構件 32 200816055 121424...橡膠薄片 901...硬式環氧樹脂罐封材料 200…RFID標籤 卯2…可撓性橡膠黏著劑 210…鑲嵌物 1000·. .RFID 標籤 211...晶片加強構件 1001...環氧樹脂硬式罐封材料 300…RFID標籤 1002…可撓性橡膠黏著劑 310…鑲嵌物 1100· "RFID 標籤 311...晶片;強構件 1110…鑲嵌物 312...底加強構件 1111...晶片办^強構件 400…RFID標籤 1112...部分 410…鑲嵌物 1120···覆蓋構件 411...晶片加強構件 1121-1123...橡膠薄片 420…底加強構件 1200...RFID標籤 450...分配器 1210…鑲嵌物 500...架設工具 1211...底加強構件 600...熱源 1220···覆蓋構件 700...按壓裝置 1221-1224...橡膠薄片 710···按壓台 S110，S120···步驟 720...按壓頭 S111-S114··•步驟 800...切割器 S201_205…步驟 900...RFID 標籤 S301-306···步驟 33A state in which an internal structure of 15 is seen through. In part (b) of Fig. 4, a longitudinal cross section of the RFID tag 400 is shown. Further, in the same manner in Fig. 4, the elements of the first party & example shown in the above-mentioned second drawing are given the same reference numerals as in Fig. 1. In the following, redundant descriptions of these components will be omitted. In the RFID tag 400 of this embodiment, an inlay 410 includes a wafer reinforcing member 4'' and a bottom reinforcing member 42G which are equal to the wafer reinforcing member 211 of the second embodiment, and is configured such that the wafer reinforcing member 4ΐ The bottom reinforcing member 420 loses the base portion 1U in the middle and is disposed opposite to each other with respect to the base portion (1). However, the bottom reinforcing member 42 of the present embodiment is different in the system. 16 200816055 The third embodiment described above is that it is separated from the base lu. Further, the bottom reinforcing member according to this embodiment is neither made of the same material of the reinforcing member 411 nor has the same shape as the reinforcing member 411, unlike the bottom reinforcing member of the second embodiment. The reinforcing member 42 of this embodiment is formed by a plastic sheet having a bendable flexibility and an expansion inhibiting, and the bottom reinforcing member 420 has a width sufficient to protect a region wider than the wafer reinforcing member 411. shape. A cover member 12A made of a rubber extends between the bottom reinforcing member 420 and the base portion 111. The inlay 41'' shown in Fig. 4 and the wafer intensifying member 411 correspond to examples of the inlay and the indicia reinforcing member according to the present invention, respectively. Further, the bottom reinforcing member 420 corresponds to an example of the bottom reinforcing member according to the present invention. The RFID tag 400 shown in Fig. 4 is arranged such that the protection of the circuit wafer is reinforced by the bottom reinforcing member 420 while preserving the prevention of cracking of the antenna or the like similar to the RFID tag 300 of the third embodiment. Next, an embodiment of the RFID tag manufacturing method according to the present invention will be described. The following description of an RFID tag manufacturing method for manufacturing the rhD tag 400 of the fourth embodiment shown in Fig. 4 will be described as an embodiment of the RFID tag manufacturing method according to the present invention. Here, the 20 digits shown in Figure 4 will be referred to without the description of Figure 4. Fig. 5 is a flow chart showing an RFID tag manufacturing method for manufacturing the RFID tag 400 of the fourth embodiment shown in Fig. 4 as an exemplary embodiment of the RFID tag manufacturing method according to the present invention. The RFID tag manufacturing method shown by the flowchart of FIG. 5 includes a preparation step (step S110) for preparing the inlay 410, and a covering step for covering the inlay 410 (step S120). ). The preparation step (step S110) and the covering step (step S120) respectively correspond to an example of the preparation step and the covering step according to the present invention. 5 First, the preparation step (step S110) will be explained. Fig. 6 is a view showing the details of the preparation step (step 110) in the flowchart shown in Fig. 5. First, in this preparation step (step S110), the circuit wafer 113 is mounted on the base 111 on the surface on which the antenna 112 is formed. Since the frame 10 is well known in the art, the detailed description herein will be omitted. The circuit chip 113 is mounted in step S111, and then the distributor 450 will heat-bond the body to the memory 1 1 5 It is applied to the base 11 1 such that the circuit wafer is buried in the thermosetting adhesive 115 (step S112). Next, a set of 15 500 carries the wafer reinforcing member 411 to a position just above the circuit wafer cassette 3 and places the wafer reinforcing member 411 on the base 111 to allow the circuit wafer 113 to be placed. The wafer reinforcing member 411 (step S113) ° then a heat source 600 heats the thermoset adhesive body 115 such that the thermosetting adhesive U5 is hardened and the inlay 400 is completed (step S114). 20 Next, the overlay step (step S120) shown in Fig. 5 will be explained. Fig. 7 is a view showing details of the covering step (step 120) in the flowchart shown in Fig. 5. In this covering step (step S120), the three-piece RFID tag 400 is executed in one program. 18 200816055 In this covering step (step S120), a pressing device 700 is used. A pressing table 71 of the pressing device 700 is sandwiched by a pressing head 42 〇 a target to be pressed and heats the target. After the insert 410 is obtained in the preparation step (step sn), a pressing and heating program of 5 or less (step S121) is performed as follows. First, a bottom rubber sheet 121 of the four rubber sheets 121 to 124 is placed on the pressing table 710. The adhesive sheets 121 to 127 form a covering member 120 covering the insert 410, and the above-described three-piece bottom reinforcing member 42 is arranged on the bottom rubber sheet 121. Subsequently, the second rubber sheet 122 is overlaid on the bottom reinforcing member 420 of the second member. Then, the three-piece inserts 410 are placed such that each of the inlays and each of the bottom reinforcing members sandwich the rubber sheets 420 and are opposed to each other. Next, the third rubber sheet 123 is overlaid on the three-piece inlay 410. Here, as shown in Fig. 7, the third rubber sheet 123 is provided with a slit 15 to accommodate the wafer reinforcing member 411 in each of the inlays 410, respectively. This rubber sheet 123 is placed so that each wafer reinforcing member 411 is accommodated in each opening. This third rubber sheet corresponds to an example of the spacer according to the present invention. And finally, the top rubber sheet 124 is overlaid on the third rubber sheet 123. Then, after the four rubber sheets 121 to 124, the bottom reinforcing member 420, and the insert 410 are placed on the pressing table 710, the pressing head 720 is moved down onto the top rubber sheet 124. Then, in the pressing device 400, the four rubber sheets 121 to 124, the bottom reinforcing member 420, and the insert 410 are sandwiched by the pressing table 710 and the pressing head 720 so as to be pressed and heated by 19 200816055. By this pressing and heating, the four rubber sheets 121 to 124 are integrated so that the bottom reinforcing members 420 for the three pieces of the RFID tag 400 and the inlays 410 are buried inside. Then, a series of five-piece RFID tags 400 in which the bottom reinforcing members 420 and the inlaid 410 are covered with the rubber covering members 12 are formed. Following the procedure of step S121, a cutter 800 is moved down between the respective inlays 410 to cut the continuous rFId tag 400 to obtain three separate RFID tags 400 (step S122). According to the RFID tag manufacturing method shown in the above and Fig. 3, it is possible to easily manufacture the RFID tag 400 having a structure in which the user can withstand a rough environment. Further, in the kRFID label manufacturing method, in the step S121 shown in FIG. 7, the third rubber sheet 123 is provided with an opening for accommodating the wafer reinforcing member, and the wafer reinforcing member 411 is used. Around it, it forms a projection of the inlay 41, which is filled with the rubber 15 sheet 123. Thus, the shape finally obtained by the RFID tag 400 is flattened. Next, a fifth embodiment of the RFID tag according to the present invention will be explained. Fig. 8 is a schematic view showing a fifth embodiment of the RFID tag according to the present invention. In a part (4) of Fig. 8, a top view of an RFID tag_, the fifth embodiment of the RFID tag according to the present invention is shown in a state in which the RnD tag_ is seen through. In part (b) of Fig. 8, a longitudinal cross section of the RHD label 900 is shown. Similarly, in the Fig. 5, the components of the first embodiment 20 200816055 shown in Fig. 1 are given the same reference numerals as in Fig. 1. In the following, redundant description of these elements will be omitted. The RFID tag 900 of this embodiment is not provided with a wafer reinforcing member made of a fiber-reinforced resin and the covering member, both of which are provided in all of the first to fourth embodiments. The circuit wafer 113 is covered with a hard epoxy resin potting material 901 and is covered with a flexible rubber adhesive 902 throughout its periphery. Here, the hard epoxy encapsulating material 9〇1 corresponds to an example of the wafer reinforcing member according to the present invention and the flexible rubber adhesive 902 corresponds to an example of the edge covering member according to the present invention. The lamp of this embodiment is still in the label 900, and the circuit chip 113 is protected by the hard potting material 901. In addition, since the edge of the hard epoxy encapsulant 901 corresponding to an example of the "edge of the wafer reinforcing member" according to the present invention is completely covered with a flexible rubber including a portion of the edge and the antenna 112 intersecting each other Adhesive 9〇2, the concentration of a bending stress 15 in this portion is suppressed and thus the cracking of the antenna 113 is prevented. In other words, also in the RFID tag 9A shown in Fig. 8, for the circuit wafer, the test stress is lowered and at the same time the crack of the antenna is prevented. Next, a method for manufacturing the iRnD tag 900 shown in Fig. 8 will be explained. Further, the elements shown in Fig. 8 will be referred to without the description of "Fig. 20". Fig. 9 is a view showing a method of manufacturing an RFID tag for manufacturing the rFID tag 900 shown in Fig. 8. In the manufacturing method, first, the circuit wafer 113 is mounted on the base portion 111, and the antenna 112 is formed on the surface of the base portion 111 (step S2〇1). 21 200816055 Since the circuit chip 113 is widely known, its detailed description will be omitted. In step S201, the circuit chip U3 is mounted. Then, the dispenser 450 applies the hard thermosetting potting material 901 to the base portion 111 so that the 5 circuit wafer 113 is buried in the hard potting material 9〇1 (step S202). The heat source 600 heats the hard thermosetting pot sealing material 9〇1 to harden the hard thermosetting potting material 901 (step S203). Then, the heat source 600 covers the edge of the hard potting material 9〇1 with the flexible thermosetting adhesive 902 (step S204). Then, the thermal element 600 heats the flexible thermosetting adhesive 9〇2 to harden the 10 flexible thermosetting adhesive 9〇2, and the RFID tag 900 is completed (step S205) 〇 via a series of these The RHD tag 900 shown in Fig. 8 is easily manufactured. Next, a sixth embodiment of the RFID tag according to the present invention will be described. Fig. 10 is a schematic view showing a sixth embodiment of the 111 〇 label according to the present invention. In part (a) of Fig. 10, a top view of an RFID tag 1〇〇〇, a sixth embodiment of the RFID tag according to the present invention is shown in the internal structure of the RFm tag 20 10(H) being seen through status. In the portion (8) of the first section, the longitudinal cross section of the RFID tag 1000 is displayed. Further, the elements in the second embodiment shown in Fig. 1 are given the same reference numerals as in Fig. 2. In the following, redundant descriptions of these elements will be omitted. 22 200816055 The RFID tag 1000 of this embodiment is not provided with the covering member included in the second embodiment described above, and the wafer reinforcing member 211 is completely covered by a flexible rubber adhesive 1002 along the edge system. Further, the flexible rubber adhesive 1002 has a function of adhering and fixing the wafer reinforcing member 211 to the base portion 51. In addition, in the RFn> label 1000, the wafer reinforcing member 211 is filled with an epoxy resin hard potting material 1〇〇1 such that the epoxy resin hard potting material 901 and the flexible adhesive 1〇〇2 Corresponding to the example of the wafer reinforcing member and the edge covering member according to the present invention. In the RFID tag 1A of this embodiment, the circuit chip 113 is protected by the crystal 10 piece reinforcing member 211. Moreover, the protection of this circuit wafer is enhanced by filling the hard potting material 1001. In addition, since a portion of the wafer reinforcing member 211 corresponding to the edge of the wafer reinforcing member according to the present invention is completely covered with a flexible rubber adhesive including a portion of the edge and the antenna 112 intersecting each other. 1〇〇2, the concentration of the 15-fold stress in this portion is suppressed and thus the crack of the antenna 113 is prevented. In other words, a bending stress for the circuit wafer is lowered and at the same time the crack of the antenna is prevented. Next, a method for manufacturing the RFID tag 1000 shown in Fig. 10 will be explained. Further, here, the elements shown in Fig. 10 will be referred to and 20 will be described without "Fig. 10". Figure 1 is a diagram showing an RFID tag manufacturing method for manufacturing the RFID tag 1000 shown in Fig. 1. Also in this manufacturing method, first, the circuit chip 113 is mounted on the base 111. The antenna 112 is formed on the surface of the base 111 (step 23 200816055 S301). Since the circuit chip 113 is widely known, its detailed description will be omitted herein. In step S301, the circuit The sheet 113 is mounted. Then, the dispenser 450 applies a flexible thermosetting potting material 1002 to the base 111 such that the flexible thermoset potting material 1002 surrounds the periphery of the circuit wafer 113 (steps) S302) Next, the erecting tool 500 carries the wafer reinforcing member 211 to a position just above the circuit wafer 113 and places the wafer reinforcing member 211 on the base 111, so that the circuit wafer 113 is accommodated. The wafer reinforcing member 211 is in the step (step S303). Then, the heat source 600 heats the 10 flexible thermosetting adhesive 1〇〇2 so that the flexible thermosetting adhesive is hardened and the wafer reinforcing member 211 is Adhesively and fixed to the base m (step S304). Subsequently, the dispenser 450 fills the wafer reinforcing member 211 with the hard heat sealing material 1〇〇1 so that the hard heat sealing material 丨〇〇1 is covered The transistor chip wafer inside the wafer reinforcing member 211 (step S3〇5), and 15 and the heat element 6〇〇 heats and hardens the hard thermosetting can sealing material 1〇〇1 to complete the RFID tag 1〇〇 〇 (step S306). Through a series of these procedures The rFID tag 10900 shown in Fig. 1 is easily manufactured. Next, a seventh embodiment of the RFID tag according to the present invention will be described. Fig. 12 is a view showing the RFID tag according to the present invention. A schematic view of a seventh embodiment. In a part (a) of Fig. 12, a top view of an RFID tag 11A, a seventh embodiment of the RFID tag according to the present invention is displayed on the 1^1 tag 24 A state in which an internal structure of 200816055 1100 is seen through. In part (b) of Fig. 12, a longitudinal cross section of an RFID tag 1100 is displayed. Further, in Fig. 12, the elements of the first embodiment shown in Fig. 1 are given the same reference numerals as in Fig. 1. In the following, redundant descriptions of these elements will be omitted. In the RFID tag 11 of this embodiment, an inlay 1110 is provided with a wafer reinforcing member 1111 having a shape different from that of the wafer reinforcing member according to the first embodiment, and the wafer reinforcing member 1111 is embedded. The base m, the antenna 112, and the circuit 1 〇 the wafer U3 are not contacted in the covering member 112A. The inlay 1110, the wafer reinforcing member 1111, and the covering member 112A shown in Fig. 12 also correspond to the inlay, the wafer reinforcing member, and the covering member according to the present invention, respectively. The reinforcing member 1111 shown in Fig. 12 is neither glued nor fixed to the β-base 112, and is spaced apart, like floating, on the circuit wafer 113. The crystal 15 sheet reinforcing member 1111 also prevents the shape change of the RFID tag 1100 from affecting the periphery of the circuit wafer 113, thereby preventing peeling, cracking, and the like of the circuit wafer 112. Further, in this embodiment, since the wafer reinforcing member is not in contact with the antenna 112, no bending stress is concentrated in a limited portion and cracking of the antenna 112 is prevented. 2 Next, a method for manufacturing the RFID tag shown in Fig. 12 will be explained. Further, here, the elements shown in Fig. 12 will be referred to without the description of "Fig. 12". In the manufacturing method, after the circuit wafer 113 is mounted on the base portion 1, the antenna 112 is formed on the surface of the base portion 111 for covering 25 200816055. The covering step and configuration of the mounting 1110 The wafer reinforcement member (1) (4) is executed. Fig. 13 is a view showing the details of the steps of covering the RFID target manufacturing method of the RFID target 1100 shown in Fig. 12; 5 For the legged miscellaneous 11嶋«Steps to turn to the buckle map. In the covering step which will be described below, the pressing means of the pressing device 700 which is the same as that shown in Fig. 7 is used. Therefore, in Fig. 13, the pressing device displays the same symbols as in Fig. 7. First, the embossing 1110 is a portion other than the far-wafer reinforcing structure, the three rubber sheets 1121 to 1123 forming the covering member 1120, and the wafer reinforcing member 1111 are arranged as follows (step S4〇1). First, the bottom rubber sheets 1121 of the two rubber sheets 1121 to 1123 are placed on the pressing table 710' and then the portion 1112 of the inlay 1110 is placed on the bottom rubber sheet 1121. Subsequently, the second rubber sheet 1122 is overlaid on the portion 1112 of the insert H10, and the wafer reinforcing member mi is placed in a position in which the wafer reinforcing member 1111 and the circuit wafer n3 cool the rubber sheet 1122 In the middle and opposite each other. Then, finally, the top rubber sheet 1123 is covered. Then, after the portion 1112 of the insert 1110, the three rubber sheets 1121 to 1123 forming the cover 20 1120, and the wafer reinforcing member 1111 are placed on the pressing table 710, the pressing head 720 The three rubber sheets 1121, 1122 and 1123, the portion 1112 of the inlay 1110, and the wafer reinforcing member which are moved down onto the top rubber sheet 1123 and which are pressed by the pressing table 710 and the pressing head 720 1111 is pressed and heated to become 26 200816055 (step S402). By this combination, the iRFID tag 11A shown in Fig. 12 is completed. Through a series of these procedures, the iRFID tag 11 shown in Fig. 12 is easy to manufacture. 5 Next, an eighth embodiment according to the present invention will be explained. Fig. 14 is a schematic view showing an eighth embodiment of the label (1) according to the present invention. In a part (a) of FIG. U, a top view of a rhd tag 1200, an eighth embodiment of the RFID tag according to the present invention is shown in an internal structure of the tag 10丨2〇〇 being seen through a state. In part (b) of Fig. 14, a longitudinal cross section of an RFID tag 1200 is shown. Further, in Fig. 14, the elements of the seventh embodiment shown in Fig. 12 are given the same reference numerals as in Fig. 12. In the following, redundant descriptions of these components will be omitted. In the RFID tag 1200 of this embodiment, the inlay 1210 has a structure in which a bottom reinforcing member 1121 is added to the inlay of the seventh embodiment shown in Fig. 12, so that the bottom reinforcing member 1121 is reinforced with the wafer. The member uu cools the base m in the middle, and the bottom reinforcing member 1121 is placed apart from the base 111. The inlay 1210 and the bottom reinforcing member are respectively exemplified by the inlaid and bottom reinforcing members according to the present invention. In addition, the covering member 1220 of this embodiment also fills the gap between the inlay 121 〇 and the bottom reinforcing member 1211. This cover & member 122G corresponds to an example of a cover member according to the present invention. The RFID tag 1200 shown in Fig. 14 has a structure in which the protection of the circuit crystal 27 200816055 is reinforced by the bottom reinforcing member 1211 while maintaining the prevention of the antenna rupture or the like obtained in the seventh embodiment described above. Next, the method for manufacturing the RFID tag 1200 shown in Fig. 14 will be explained. Further, the elements shown in Fig. 14 will be referred to without the description of "Fig. 5 14". In the manufacturing method, after the circuit wafer 113 is mounted on the base ln, the antenna 112 is formed on the surface of the base 111, and the covering step for covering the inlay 1220 and the wafer reinforcing member are disposed.丨丨^ is executed at the same time. 10 Fig. 15 is a view showing details of the covering procedure of the RFID tag manufacturing method of the rfid tag 1200 shown in Fig. 14. Also in Fig. 15, the covering step for one piece of RFID tag 1200 is shown in Fig. 13. In the covering step which will be described below, the pressing device of the pressing device 700 which is the same as that shown in Fig. 7 is used. Therefore, in Fig. 15, the pressing means displays the reference characters which are the same as those of Figs. 7 and 13. First, the inlay 1210 is disposed as follows except for a portion other than the wafer reinforcing member ini and the bottom reinforcing member 1211, the four rubber sheets 1221 to 1224, the wafer reinforcing member 1111, and the bottom reinforcing member 1211 (step S501). . First, the bottom rubber sheet 1221 of the four rubber sheets 1221 to 1224 is placed on the pressing table 710, and then the bottom reinforcing member 1211 is placed on the bottom rubber sheet 1221. Subsequently, the second rubber sheet 1222 is overlaid on the bottom reinforcing member 1211, and the portion 1212 of the inlay 1210 is placed in a position in which the wafer reinforcing member 12I and the circuit crystal 28 200816055 piece 113 is the second The rubber sheets 1222 are sandwiched and the second rubber sheets 1222 are opposed to each other. Next, the third rubber sheet 1223 is covered on the portion 1212 of the inlay 1210, and the wafer reinforcing member mi is placed in a position where the wafer reinforcing member 1111 and the circuit wafer H3 are used to bond the 5th rubber sheet 1223 is sandwiched in the middle and opposite each other. Then, finally, the top rubber sheet 1224 is covered. Thus, the portion 1112 except the wafer reinforcing member 1111 and the bottom reinforcing member 1211, the four rubber sheets 1221 to 1224, the wafer reinforcing member mi, and the bottom reinforcing member are placed at the pressing pressure. On stage 710. Then, the pressing head 720 is moved down onto the top rubber sheet 1224, and the four rubber sheets 1221 to 1224, the portion 1112 of the inlay 1110, the wafer reinforcing member mi, and the bottom reinforcing member 1211 are pressed. The stage 710 is sandwiched by the pressing head 720 and pressed and heated to be integrated (step S502). By this combination, the RF1D tag 15 1200 shown in Fig. 14 is completed. Through a series of these procedures, the RFID tag 1200 shown in Fig. 14 is easy to manufacture. Further, in the above description, as an example of the wafer reinforcing member according to the present invention, the wafer reinforcing member 114 made of a fiber-reinforced resin is shown but the type of the fiber-reinforced resin is not specific. The fiber reinforcement number according to the present invention may be, for example, an FRP (fiber reinforced plastic) or a glass epoxy resin. Further, the wafer reinforcing member according to the present invention is not limited to this fiber reinforcing number and may be a thermoplastic plastic or a thermosetting resin. Further, in the above description, as an adhesive for bonding and fixing the wafer reinforcing member 29 200816055 to the base portion 111, the thermosetting adhesive is exemplified, but the present invention is not limited to this example. This adhesive may be a UV hardening adhesive, an anaerobic adhesive, a moisture hardening adhesive or a 2-part adhesive. Further, in the above description, as an example of the bottom reinforcing member according to the present invention, the bottom reinforcing member 312 made of a fiber-reinforced resin is exemplified as a bottom reinforcing member which is glued to be fixed on the bottom surface of the inlay. An example of a type, but the type of the fiber-reinforced resin is not specific. A fiber-reinforced resin forming this type of bottom reinforcing member may be an FRp or a broken glass ring gas resin. Further, the bottom reinforcing member of the above type is not limited to the manufacturer of the fiber reinforcing number, and may be, for example, a thermoplastic or a thermosetting plastic. Further, in the above description, as an example of the bottom reinforcing member according to the present invention, as an example of the type 15 of the bottom reinforcing member arranged to be spaced apart from the inlay, the bottom reinforcing member 420 made of a plastic sheet is exemplified. . However, this invention is not limited to this. The bottom reinforcing member of this type which is arranged to be spaced apart from the inlay may be a net formed of nylon (a registered trademark). Further, in the above description, as an example of the covering member 2'' according to the present invention, the rubber covering member 120 is exemplified, but the kind of the rubber is not special. However, a rubber forming the covering member according to the present invention may be, for example, a urethane rubber, a ruthenium rubber or a fluororubber. Further, in the above description, as an example of the wafer reinforcing member, the wafer reinforcing member 113 in which the middle-opening is formed to accommodate the wafer is shown. However, the invention is not limited thereto. The wafer reinforcement structure according to the present invention may be, for example, a wafer reinforcement member having no such opening but having only a plate-like appearance and configured to cover the circuit wafer. Further, in the above description, the rubber adhesive as the edge covering structure L according to the present invention is exemplified, but the kind of the rubber is not specific to form the rubber 胄b疋 of the edge covering member according to the present invention, for example, potassium amide Acid or rubber. • Further, in the above description, the -In Example of the edge covering member according to the present invention's a flexible adhering sword completely covering the hard potting material 9G1 and the wafer covering member are exemplified. However, the invention is not limited thereto. The edge covering member according to 10 invention may cover, for example, a portion of the edge that intersects the antenna. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a first embodiment of a 2RF1D tag according to the present invention; 15 FIG. 2 is a second embodiment of an iRFID tag according to the present invention. FIG. 3 is a schematic view showing a third embodiment of an RF j D tag according to the present invention; FIG. 4 is a schematic view showing a fourth embodiment of the RFID tag according to the present invention; FIG. 5 is a flowchart showing an RFID tag manufacturing method for manufacturing the RFID tag 400 of the fourth embodiment shown in FIG. 4 as an exemplary embodiment of the RFID tag manufacturing method according to the present invention; 6 is a detailed view showing a preparation step (less 31 200816055 step 110) in the flowchart shown in FIG. 5; and FIG. 7 is a display step (step 120) in the flowchart shown in FIG. 8 is a schematic view showing a fifth embodiment of the rFID tag according to the present invention; and FIG. 9 is a view showing a frame for manufacturing the RFID tag 900 shown in FIG. RF1D label manufacturing method; FIG. 10 is a view showing according to the present invention A schematic view of a sixth embodiment of an RFID tag; 10 FIG. 11 is a view showing a method of manufacturing an RFID tag for manufacturing the RFID tag 1000 shown in FIG. 10; and FIG. 12 is a view showing a method according to the present invention. ^^ is still a schematic view of a seventh embodiment of the label; FIG. 13 is a view showing details of the covering step of the RFID tag manufacturing method for manufacturing the RHD label 15 1100 shown in FIG. 12; A schematic view showing an eighth embodiment of the RFID tag according to the present invention; and FIG. 15 is a view showing details of the steps of covering the RFID tag manufacturing method of the RFiD tag 1200 shown in FIG. 20 [Description of main component symbols] 100··. RFID tag 113···Circuit wafer 110···Inlay 114... Wafer reinforcing member m···Base 115... Thermosetting adhesive 112... Antenna 120· _·Rubber covering Member 32 200816055 121424...rubber sheet 901...hard epoxy encapsulant material 200...RFID tag 卯2...flexible rubber adhesive 210...inlay 1000·. .RFID tag 211...wafer reinforcing member 1001...epoxy hard potting material 300...RFID tag 1002...flexible rubber adhesive 310...inlay 1100·"RFID tag 311...wafer; strong member 1110...inlay 312...bottom Reinforcing member 1111...Film member 400...RFID tag 1112...Part 410...Inlay 1120·· Cover member 411... Wafer reinforcing member 1121-1123...Rubber sheet 420...Bottom reinforcing member 1200...RFID tag 450...distributor 1210...inlay 500...suspension tool 1211...bottom reinforcing member 600...heat source 1220··covering member 700...pressing device 1221-1224. .. rubber sheet 710···pressing table S110, S120···Step 720...pressing head S111-S114· ·•Step 800...Cutter S201_205...Step 900...RFID Tag S301-306···Step 33