TW200815545A - Dispersion for application of a metal layer - Google Patents

Dispersion for application of a metal layer Download PDF

Info

Publication number: TW200815545A
Authority: TW; Taiwan
Prior art keywords: dispersion; component; weight; components; acid
Prior art date: 2006-08-03

Application number

TW096128429A

Other languages

English (en)

Chinese (zh)

Inventor

Rene Lochtman

Jurgen Kaczun

Norbert Schneider

Jurgen Pfister

Norbert Wagner

Christoffer Kieburg

Ketan Joshi

Original Assignee

Basf Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-08-03

Filing date

2007-08-02

Publication date

2008-04-01

2007-08-02 Application filed by Basf Ag filed Critical Basf Ag

2008-04-01 Publication of TW200815545A publication Critical patent/TW200815545A/zh

Links

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229910052751 metal Inorganic materials 0.000 title claims abstract description 61
239000002184 metal Substances 0.000 title claims abstract description 61
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229920001778 nylon Polymers 0.000 description 1
OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
229940049964 oleate Drugs 0.000 description 1
235000021313 oleic acid Nutrition 0.000 description 1
238000005457 optimization Methods 0.000 description 1
235000005985 organic acids Nutrition 0.000 description 1
229920000620 organic polymer Polymers 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
VVRQVWSVLMGPRN-UHFFFAOYSA-N oxotungsten Chemical compound [W]=O VVRQVWSVLMGPRN-UHFFFAOYSA-N 0.000 description 1
238000007649 pad printing Methods 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
150000002942 palmitic acid derivatives Chemical class 0.000 description 1
239000012188 paraffin wax Substances 0.000 description 1
230000035515 penetration Effects 0.000 description 1
GIDBEKINLBHYLA-UHFFFAOYSA-I pentachlororuthenium Chemical compound Cl[Ru](Cl)(Cl)(Cl)Cl GIDBEKINLBHYLA-UHFFFAOYSA-I 0.000 description 1
VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
FHHJDRFHHWUPDG-UHFFFAOYSA-L peroxysulfate(2-) Chemical compound [O-]OS([O-])(=O)=O FHHJDRFHHWUPDG-UHFFFAOYSA-L 0.000 description 1
125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
STIABRLGDKHASC-UHFFFAOYSA-N phthalic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C1=CC=CC=C1C(O)=O STIABRLGDKHASC-UHFFFAOYSA-N 0.000 description 1
238000000053 physical method Methods 0.000 description 1
239000004014 plasticizer Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000767 polyaniline Polymers 0.000 description 1
238000006068 polycondensation reaction Methods 0.000 description 1
229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
239000009719 polyimide resin Substances 0.000 description 1
229920002959 polymer blend Polymers 0.000 description 1
229920000307 polymer substrate Polymers 0.000 description 1
229920000417 polynaphthalene Polymers 0.000 description 1
229940068965 polysorbates Drugs 0.000 description 1
229920000909 polytetrahydrofuran Polymers 0.000 description 1
229920002451 polyvinyl alcohol Polymers 0.000 description 1
229920001289 polyvinyl ether Polymers 0.000 description 1
229910000027 potassium carbonate Inorganic materials 0.000 description 1
RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
ONQDVAFWWYYXHM-UHFFFAOYSA-M potassium lauryl sulfate Chemical compound [K+].CCCCCCCCCCCCOS([O-])(=O)=O ONQDVAFWWYYXHM-UHFFFAOYSA-M 0.000 description 1
229940116985 potassium lauryl sulfate Drugs 0.000 description 1
OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
HDMGAZBPFLDBCX-UHFFFAOYSA-M potassium;sulfooxy sulfate Chemical compound [K+].OS(=O)(=O)OOS([O-])(=O)=O HDMGAZBPFLDBCX-UHFFFAOYSA-M 0.000 description 1
239000002243 precursor Substances 0.000 description 1
239000003755 preservative agent Substances 0.000 description 1
230000002335 preservative effect Effects 0.000 description 1
KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
SMWWQUDLEJXCHT-UHFFFAOYSA-N propa-1,2-dienyl acetate Chemical compound CC(=O)OC=C=C SMWWQUDLEJXCHT-UHFFFAOYSA-N 0.000 description 1
235000019260 propionic acid Nutrition 0.000 description 1
YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
239000008262 pumice Substances 0.000 description 1
HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
150000003242 quaternary ammonium salts Chemical class 0.000 description 1
IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
229920005604 random copolymer Polymers 0.000 description 1
238000007670 refining Methods 0.000 description 1
239000012779 reinforcing material Substances 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
235000009566 rice Nutrition 0.000 description 1
238000005096 rolling process Methods 0.000 description 1
239000005060 rubber Substances 0.000 description 1
229910052707 ruthenium Inorganic materials 0.000 description 1
238000005488 sandblasting Methods 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
239000000565 sealant Substances 0.000 description 1
ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
239000004208 shellac Substances 0.000 description 1
229940113147 shellac Drugs 0.000 description 1
235000013874 shellac Nutrition 0.000 description 1
235000015170 shellfish Nutrition 0.000 description 1
239000000344 soap Substances 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
239000012312 sodium hydride Substances 0.000 description 1
229910000104 sodium hydride Inorganic materials 0.000 description 1
235000019333 sodium laurylsulphate Nutrition 0.000 description 1
229940045872 sodium percarbonate Drugs 0.000 description 1
CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000007614 solvation Methods 0.000 description 1
239000001570 sorbitan monopalmitate Substances 0.000 description 1
235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
229940031953 sorbitan monopalmitate Drugs 0.000 description 1
229960005078 sorbitan sesquioleate Drugs 0.000 description 1
239000000600 sorbitol Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
238000003892 spreading Methods 0.000 description 1
230000007480 spreading Effects 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
239000007858 starting material Substances 0.000 description 1
239000008117 stearic acid Substances 0.000 description 1
235000003702 sterols Nutrition 0.000 description 1
238000003756 stirring Methods 0.000 description 1
210000002784 stomach Anatomy 0.000 description 1
239000011115 styrene butadiene Substances 0.000 description 1
229920001909 styrene-acrylic polymer Polymers 0.000 description 1
239000005720 sucrose Substances 0.000 description 1
150000005846 sugar alcohols Chemical class 0.000 description 1
239000011593 sulfur Substances 0.000 description 1
229910052717 sulfur Inorganic materials 0.000 description 1
238000005987 sulfurization reaction Methods 0.000 description 1
239000004291 sulphur dioxide Substances 0.000 description 1
235000010269 sulphur dioxide Nutrition 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
238000012360 testing method Methods 0.000 description 1
238000005979 thermal decomposition reaction Methods 0.000 description 1
229930192474 thiophene Natural products 0.000 description 1
210000003813 thumb Anatomy 0.000 description 1
239000011135 tin Substances 0.000 description 1
ZCIHMQAPACOQHT-ZGMPDRQDSA-N trans-isorenieratene Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/c1c(C)ccc(C)c1C)C=CC=C(/C)C=Cc2c(C)ccc(C)c2C ZCIHMQAPACOQHT-ZGMPDRQDSA-N 0.000 description 1
238000012546 transfer Methods 0.000 description 1
229910052723 transition metal Inorganic materials 0.000 description 1
150000003624 transition metals Chemical class 0.000 description 1
125000005270 trialkylamine group Chemical group 0.000 description 1
JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
125000005289 uranyl group Chemical group 0.000 description 1
239000002966 varnish Substances 0.000 description 1
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
238000005406 washing Methods 0.000 description 1
239000001993 wax Substances 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Inorganic Chemistry (AREA)
Nanotechnology (AREA)
Manufacturing & Machinery (AREA)
Dispersion Chemistry (AREA)
Physics & Mathematics (AREA)
Mathematical Physics (AREA)
Theoretical Computer Science (AREA)
Crystallography & Structural Chemistry (AREA)
Laminated Bodies (AREA)
Paints Or Removers (AREA)

TW096128429A 2006-08-03 2007-08-02 Dispersion for application of a metal layer TW200815545A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
EP06118399		2006-08-03

Publications (1)

Publication Number	Publication Date
TW200815545A true TW200815545A (en)	2008-04-01

Family

ID=38658410

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096128429A TW200815545A (en)	2006-08-03	2007-08-02	Dispersion for application of a metal layer

Country Status (2)

Country	Link
TW (1)	TW200815545A (de)
WO (1)	WO2008015167A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102648246A (zh) *	2009-11-25	2012-08-22	Kme德国两合公司	用于向金属或合金层涂覆碳/锡混合物的方法
TWI450907B (zh) *	2012-06-26	2014-09-01	Far Eastern New Century Corp	製造導電聚合物分散液的方法、由其形成之導電聚合物材料及利用該導電聚合物材料之固態電容
TWI629310B (zh) *	2016-12-29	2018-07-11	財團法人工業技術研究院	電熱材料組合物及電熱紡織品
US10287443B2 (en)	2016-12-29	2019-05-14	Industrial Technology Research Institute	Electrothermal material composition and electrothermal textile

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DE102008063030A1 (de) *	2008-12-23	2010-06-24	Bundesdruckerei Gmbh	Sicherheits- und/oder Wertdokument mit einer leitfähigen Struktur und Verfahren zu dessen Herstellung
US8895651B2 (en)	2010-02-16	2014-11-25	Basf Se	Composition for printing a seed layer and process for producing conductor tracks
EP2537401A1 (de) *	2010-02-16	2012-12-26	Basf Se	Zusammensetzung zum drucken einer keimschicht und verfahren zur herstellung von leiterbahnen
JP5649511B2 (ja)	2011-05-13	2015-01-07	株式会社秀峰	アンテナおよび通信機器並びにアンテナの製造方法
DE102014210138A1 (de) *	2014-05-27	2015-12-03	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Verwendung von Metallpigmenten in einer flüssigen Polymerformulierung

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DE3040784C2 (de) *	1980-10-29	1982-11-18	Schildkröt Spielwaren GmbH, 8057 Eching	Verfahren zum Aufbringen eines metallischen Überzuges und hierfür geeigneter Leitlack
US5098771A (en) *	1989-07-27	1992-03-24	Hyperion Catalysis International	Conductive coatings and inks
US6576336B1 (en) *	1998-09-11	2003-06-10	Unitech Corporation, Llc	Electrically conductive and electromagnetic radiation absorptive coating compositions and the like
US6440331B1 (en) *	1999-06-03	2002-08-27	Electrochemicals Inc.	Aqueous carbon composition and method for coating a non conductive substrate

2007
- 2007-07-27 WO PCT/EP2007/057753 patent/WO2008015167A1/de not_active Ceased
- 2007-08-02 TW TW096128429A patent/TW200815545A/zh unknown

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102648246A (zh) *	2009-11-25	2012-08-22	Kme德国两合公司	用于向金属或合金层涂覆碳/锡混合物的方法
CN102648246B (zh) *	2009-11-25	2016-08-03	Kme德国两合公司	用于向金属或合金层涂覆碳/锡混合物的方法
TWI450907B (zh) *	2012-06-26	2014-09-01	Far Eastern New Century Corp	製造導電聚合物分散液的方法、由其形成之導電聚合物材料及利用該導電聚合物材料之固態電容
TWI629310B (zh) *	2016-12-29	2018-07-11	財團法人工業技術研究院	電熱材料組合物及電熱紡織品
US10287443B2 (en)	2016-12-29	2019-05-14	Industrial Technology Research Institute	Electrothermal material composition and electrothermal textile

Also Published As

Publication number	Publication date
WO2008015167A1 (de)	2008-02-07

Publication	Publication Date	Title
TW200815545A (en)	2008-04-01	Dispersion for application of a metal layer
TW200825206A (en)	2008-06-16	Process for application of metal layer on a substrate
TW200806127A (en)	2008-01-16	Method for producing electrically conductive surfaces on a support
CN101970720B (zh)	2014-10-15	施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物
TWI311162B (en)	2009-06-21	Catalyst composition and deposition method
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