TW200814348A - Laser diode with extra optical confinement layers - Google Patents
Laser diode with extra optical confinement layers Download PDFInfo
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- TW200814348A TW200814348A TW95132326A TW95132326A TW200814348A TW 200814348 A TW200814348 A TW 200814348A TW 95132326 A TW95132326 A TW 95132326A TW 95132326 A TW95132326 A TW 95132326A TW 200814348 A TW200814348 A TW 200814348A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000005253 cladding Methods 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 156
- 239000000463 material Substances 0.000 claims description 14
- 230000001629 suppression Effects 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 229910000951 Aluminide Inorganic materials 0.000 claims description 2
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- QYHNIMDZIYANJH-UHFFFAOYSA-N diindium Chemical compound [In]#[In] QYHNIMDZIYANJH-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 208000001130 gallstones Diseases 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
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Abstract
Description
200814348 九、發明說明: 【發明所屬之技術領域】 一種用 本發明是有關於一種固態發光元件,特別是指 於光通信的雷射二極體。 【先前技術】 用於光通信的傳輸光源可分為DFB雷射二極體( Distdbuted-feedback LD)與 Fp 雷射二極體二種其中, DFB雷射二極體是利用光柵技術於光腔中選定特定波長共 振’為單-縱向模態的發光’主要應用在高迷與長距離^ 傳輸應用,但是其製程較為複雜、價格較為高昂;*沖雷 射二極體為多縱模發光’因為有較大的輸出光譜線寬=200814348 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a solid state light emitting device, and more particularly to a laser diode for optical communication. [Prior Art] The transmission source for optical communication can be divided into two types: DFB laser diode (Disdbuted-feedback LD) and Fp laser diode. The DFB laser diode uses grating technology in the optical cavity. The selected specific wavelength resonance 'single-single-mode luminescence' is mainly used in high- and long-distance transmission applications, but its process is more complicated and the price is higher; *rushing laser diode is multi-longitudinal mode illumination' Because there is a larger output spectral line width =
UneWidth)’㈣除了主要發光波長之外,還伴隨著強度較 弱的其他波長,也因此在傳輸中會具有較大的色散現象產 生,而適用於短距離與低速的傳輪應用,㈣其製作成本 較低、價格相對較低廉,因此廣泛的被應用在區域網路傳 輸中。 ’ 參閱圖卜傳統的雷射二極體1;|脊狀波導的結構形式 ,包含-層基材11、-層形成在該層基材U上的光褐限結 構2,及兩片用以提供電能的電極12。 忒基材11經過施體(doner)摻雜而可導電。 該光偈限結構2具有—層與該層基材11連接而使其他 層體易於蟲晶成長的緩衝層21 (buffer 一…、一層自該層 緩衝層2i向上蟲日日日形成的^批覆層22 (η·—㈣二 )、一層形成在該層n型批覆層22上的下侷限層23、一層 200814348 开> 成在该下侷限層23上的主動層單元24、一層形成在談主 動層單元24上的上侷限層25、一層形成在該上侷限層25 上且包括一中央區261與一將該中央區261環圍其中之外 圍區262的蝕刻停止層26 ( etching-stop iaye:r),及一層自 該中央區261向上形成的p型批覆層27 (卜cladding iayer) οUneWidth) '(4) In addition to the main illuminating wavelength, it is accompanied by other wavelengths with weaker intensity, so it will have a larger dispersion phenomenon in transmission, and it is suitable for short-distance and low-speed transmission applications. (4) Its production Low cost and relatively low price, so it is widely used in regional network transmission. 'See the conventional laser diode 1;|the structure of the ridge waveguide, comprising a layer substrate 11, a layer of light browning structure 2 formed on the layer substrate U, and two sheets for An electrode 12 that provides electrical energy. The tantalum substrate 11 is doped with a donor to conduct electricity. The optical limiting structure 2 has a buffer layer 21 in which a layer is connected to the layer substrate 11 to facilitate the growth of other layers, and a layer of buffer is formed from the buffer layer 2i. Layer 22 (η·—(4) 2), a lower confinement layer 23 formed on the n-type cladding layer 22, and a layer of 200814348 open onto the active layer unit 24 on the lower confinement layer 23, forming a layer An upper confinement layer 25 on the active layer unit 24, a layer formed on the upper confinement layer 25 and including a central region 261 and an etch stop layer 26 (the etching-stop iaye) surrounding the peripheral region 262 of the central region 261 :r), and a layer of p-type cladding layer 27 formed from the central region 261 upwards (卜cladding iayer) ο
該同時配合參閱圖2、圖3,蝕刻停止層26主要在製 程中用跟絕蝕刻過程的繼續以成形出預冑態樣的層體, 進而使該雷射二極H 1 I脊狀波導的結構形式;上、下侷 限層25、23配合該η、ρ型批覆層22、27’並呈脊狀導的 結構形式而成折射率漸變分限異質結構(graded index separate confinement hetero-structure ; GRINSCH) M U 為侷限載子(carrier)與光場(〇ptical field)Referring to FIG. 2 and FIG. 3 at the same time, the etch stop layer 26 is mainly used in the process to form a layer of the pre-defective layer by the continuation of the etching process, thereby making the laser diode P 1 I ridge waveguide The structural form; the upper and lower confinement layers 25, 23 cooperate with the η, p-type cladding layers 22, 27' and have a ridge-like structure to form a graded index separate confinement hetero-structure (GRINSCH) MU is a limited carrier and light field (〇ptical field)
"…六球丞柯及該P型批覆層27相 連接並形成歐姆接觸,而可用以對^ 電能,而供注入該層主動層單元24 主動層單元24形成-具有大能隙且折射率小的波導區,作 而可用以對該層主動層單元24提供"...six ball and the P-type cladding layer 27 are connected and form an ohmic contact, which can be used to inject the active layer unit 24 into the active layer unit 24 to form - having a large energy gap and a refractive index a small waveguide region, which can be used to provide the active layer unit 24
6 200814348 /卉犧牲載子注入主動層單元24的:·效益,因此需要較大的 臣品界電流值提供較多的載子密度才能導致居量反轉( Population inversi〇n)形成雷射,特別是載子注入主動層單 元24時較易隨溫度上升發生溢流(〇verfi〇w )現象而會降 低載子於主動層單元24的復合效率。 除此之外,由於雷射二極體i的光侷限結構,是採用 折射率漸變分限異質結構來形成光場的侷限,因此並無法 有效縮小雷射光場分佈的面積,這也使得傳統的雷射二極 體1並無法到達l〇Gb/s的操作速率。 而為了配合現今光纖網路頻寬的需求,須將區域的低 速光纖網路與長距離的光纖高速傳輸網路做一連接一利用6 200814348 / plant Sacrificial carrier injection into the active layer unit 24: · Benefits, therefore requires a larger material boundary current value to provide more carrier density to cause population inversi〇n to form a laser, In particular, when the carrier is injected into the active layer unit 24, it is easier to overflow with the temperature (〇verfi〇w) phenomenon, which reduces the recombination efficiency of the carrier to the active layer unit 24. In addition, due to the optical confinement structure of the laser diode i, the refractive index is gradually limited to form a limitation of the light field, and thus the area of the laser light field distribution cannot be effectively reduced, which also makes the conventional mine The diode 1 does not reach the operating rate of l〇Gb/s. In order to meet the needs of today's fiber-optic network bandwidth, it is necessary to make a connection between the regional low-speed fiber network and the long-distance fiber-optic high-speed transmission network.
電子式色散補償(Electronic Dispersi〇n Compensation ; EDC )技術作為訊號色散補償,是最受矚目的技術之一,但在 此技術的實施下,必須需要能直接做高速調變的雷射光源 ’因此’假若能將傳統較低廉的雷射二極體1的操作速率 進一步的提升到lOGb/s,則將非常適用於這樣的傳輸應用 之中,而有助於技術的發展。 【發明内容】 本發明之目的,即在提供一操作速率能達1〇Gb/see以 上且適用光通信之電子式色散補償技術的雷射二極體。 於疋’本發明具有特殊光侷限結構的雷射二極體,包 含一層基材、一層特殊光侷限結構,及兩片電極。 該特殊光侷限結構形成在該基材上,並具有一層與該 基材連接的第一型批覆層、一層形成在該第一型批覆層上 7 200814348 白勺下偈限单元、、一 @ JI4 L> v T侷限單元上且具有多重量 一 μ &子的絲層單元、—層形成在該主動層單 限單元,及一層形成在該上飼限單元上的第二 支批"層’該下揭限單元包括-層由具有高折射率係數的 材料構成且與該第一枣拙F思4 默的 4錄覆層連接的下光侷 限單元包括一 Μ呈古一 士 士广t n θ,、有中央區與-環圍該中央區的蝕刻停 由曰’及-層由具有高折射率係數的材料構成且形成在該 中央區上的上光揭限層,該第二型批覆層對應連接在上光 揭限層上使該雷射二極體呈脊狀波導的結構,且該上、下 光侷限層褐限水平方向光場,並補償垂直方向的光場偏移 0 片電極分別與該第一、二型批覆層形成歐姆接觸 ,用以對該主動層提供電能。 本發明的功效在於採用载子抑制層降低载子的溢流現 象’並利用由高折射係數材料構成之上、下光侷限層減少 光場的分佈面積’藉此提高元件的高頻特性響應,進而提 幵元件細作速率至l〇Gb/sec以上〇 【貫施方式】 有關本發明之前述及其他技術内容、特點與功效,在 以下配合參考圖式之一個較佳實施例的詳細說明中,將可 清楚的呈現。 在本發明被詳細描述之前,要注意的是,在以下的說 明内容中,類似的元件是以相同的編號來表示。 參閱圖4,本發明一種具有特殊光侷限結構的雷射二極 8 200814348 體3 一較佳實施例,屬脊狀波導的結構形式,包含一層基材 31、一層形成在該層基材31上的特殊光褐限結構4,及兩片 該層基材31經過施體摻雜而可導電,在本例中是以填 化銦(InP)為材料構成的基板(substrate)。Electronic Dispersi Compensation (EDC) technology is one of the most eye-catching technologies for signal dispersion compensation. However, in the implementation of this technology, a laser source capable of directly performing high-speed modulation must be required. 'If the operating rate of the traditional lower laser diode 1 is further increased to 10 Gb/s, it will be very suitable for such transmission applications, and contribute to the development of technology. SUMMARY OF THE INVENTION It is an object of the present invention to provide a laser diode having an electronic dispersion compensation technique capable of operating at a rate of 1 〇 Gb/see and suitable for optical communication. In the invention, the laser diode having a special optical confinement structure comprises a substrate, a special optical confinement structure, and two electrodes. The special optical confinement structure is formed on the substrate, and has a first type of coating layer connected to the substrate, a layer of a lower limit unit formed on the first type of coating layer 7 200814348, and a @ JI4 a layer unit on the L<vT confined unit and having a weight of one μ & a layer formed in the active layer single-limit unit, and a layer of a second batch formed on the upper feeding unit The lower limit unit includes a layer consisting of a material having a high refractive index coefficient and connected to the first recording layer of the first layer of the film, including a Μ 古 古 古 士 士 广θ, an etch stop having a central region and a central region surrounded by a 曰' and a layer formed of a material having a high refractive index coefficient and formed on the central region, the second type of coating The layer is correspondingly connected to the glazing uncovering layer to make the laser diode have a ridge waveguide structure, and the upper and lower optical confinement layers are limited to the horizontal direction light field, and compensate the vertical field light field offset 0 pieces. An electrode is in ohmic contact with the first and second type of cladding layers respectively for Movable layer provides electrical power. The effect of the present invention is to reduce the overflow phenomenon of the carrier by using the carrier suppression layer and to reduce the distribution area of the light field by using the high refractive index material to form the upper and lower optical confinement layers, thereby improving the high frequency characteristic response of the element. Further, the above-mentioned and other technical contents, features, and effects of the present invention are described in the following detailed description of a preferred embodiment of the present invention with reference to the detailed description of the preferred embodiment of the present invention. Will be clearly presented. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 4, a laser diode 8 200814348 body 3 having a special optical confinement structure is a structural embodiment of a ridge waveguide, comprising a substrate 31 and a layer formed on the layer substrate 31. The special light brown limit structure 4, and the two layers of the substrate 31 are electrically doped by donor doping, in this case, a substrate made of indium (InP).
該特殊光揭限結構4以金屬有機氣相化學沉積技術( m〇CVD)自該層基材31向上蟲晶形成,具有—層與該層基 材31連接而使後續層體易於蠢晶成長的緩衝層41、一層自 »亥層緩衝層41向上磊晶形成的第一型批覆層42、一層形成 在該層第-型批覆層42上的下侷限單元43、_層形^在該 下揭限早兀43上的主動層單元44、—層形成在該主動層單 兀:4上的上侷限單元45,及一層形成在該上侷限單元45上 的,二型批覆層46,其中,該第一、二型批覆層42、46分 別是以經過換雜的麟化錮(Inp)構成的η、p型批覆層( n/p-cladding layer )。 孩層主動層單元44以砷化鋁鎵銦(A1GaInAs)構成, 具有由數個壓縮型應力量子井441與伸張型應力障壁M2組 成的多重量子井而可產生光子,該產生的光場再經由該上、 下侷限單元45、43產生最佳的侷限效果。 、该下侷限單元43包括一層與該第一型批覆層42上界面 連接的的下光偈限層431,及_層形成在該下光侷限層 上並m動層單兀44下界面連接的載子抑制層纽。 该上偈限單元45包括一層與該主動層單元44上界面連 接的載子抑制層451、—層形成在該載子抑㈣451上且具 200814348 有一中央區4521與一將該中央區4521環圍其中之外圍區 4522的蝕刻停止層452,及一層自該中央區4521向上形成 的上光侷限層453。The special light uncovering structure 4 is formed by the metal organic vapor phase chemical deposition technique (m〇CVD) from the layer substrate 31, and has a layer connected to the layer substrate 31 to make the subsequent layer easy to grow. The buffer layer 41, a first type of cladding layer 42 formed by epitaxy upward from the layer of the buffer layer 41, and a lower layer of the layer 43 formed on the first layer of the layer of the layer 42, the layer is formed under the layer An active layer unit 44 on the early stage 43 is formed, an upper limit unit 45 formed on the active layer unit 4, and a second type blanket layer 46 formed on the upper limit unit 45, wherein The first and second type cladding layers 42 and 46 are respectively n-type p-cladding layers composed of a modified lining (Inp). The active layer unit 44 is made of aluminum gallium indium arsenide (A1GaInAs) and has a plurality of quantum wells composed of a plurality of compressive stress quantum wells 441 and tensile stress barriers M2 to generate photons, and the generated light field is further The upper and lower limit units 45, 43 produce the best limiting effect. The lower confinement unit 43 includes a lower optical confinement layer 431 interfacing with the first type of cladding layer 42, and a layer is formed on the lower optical confinement layer and connected by the m-layer layer 44. Carrier suppression layer. The upper threshold unit 45 includes a layer of a carrier suppression layer 451 interposed on the active layer unit 44. The layer is formed on the carrier (4) 451 and has a central region 4521 and a central region 4521 surrounded by 200814348. The etch stop layer 452 of the peripheral region 4522 and a glazing confinement layer 453 formed upward from the central region 4521.
該上、下光偈限| 453、431分別是以具有高折射係數 的填化銦鎵石申(InGaAsP)構《,厚度介於〇〇5〜〇•一,且 能隙介於G.9eV〜1.3eV,而可㈣水平方向的光場,並可因 〜餘削了止層452在製程中阻絕触刻過程的繼續,而使上光 侷限層453與第二型批覆層46成形出預定態樣,進而使該 雷射二極體3呈脊狀波導的結構形式,而以上、下光倡限層 453、431補償垂直方向光場的偏移。 該二層载子抑制層432、451分別以純”(w^成’厚度介於㈣以防止载子溢流,降低 田射-極體3在高溫操作時的臨限電流值,並提昇電子—電 洞的復合率以增加雷射二極體3的共振頻率。 ^片電極32分別與該基材31及該特殊絲限結構4。-型批覆層46相連接並形成歐姆接觸,用以對該主 動層早元44提供電能,以注入載子。 由雷射共振頻率與關係式可知 frThe upper and lower optical limits | 453, 431 are respectively filled with indium gallium (InGaAsP) with a high refractive index, the thickness is between 〇〇5~〇•1, and the energy gap is between G.9eV ~1.3eV, and (4) the light field in the horizontal direction, and the continuation of the etch process can be blocked in the process by the etch stop layer 452, so that the glazing confinement layer 453 and the second type cladding layer 46 are formed to be predetermined. In this way, the laser diode 3 is in the form of a ridge waveguide, and the upper and lower optical limiting layers 453 and 431 compensate for the shift of the vertical light field. The two-layer carrier suppression layers 432 and 451 are respectively pure "(w) into a thickness of (four) to prevent carrier overflow, reduce the threshold current value of the field-polar body 3 during high-temperature operation, and enhance electrons - The recombination rate of the holes increases the resonance frequency of the laser diode 3. The sheet electrodes 32 are respectively connected to the substrate 31 and the special wire-limiting structure 4 - type cladding layer 46 and form an ohmic contact for The active layer early 44 supplies electrical energy to inject the carrier. From the laser resonance frequency and relationship, the fr
vgT d 2πvgT d 2π
Ith 其中’ ^ g是光傳播速率 Γ是整體雷射三極體3料限因子 dg/dn是微分增益值 Nw是量子井441數目 10 200814348 441厚度 dw是單一量子井 的寬度)Ith where ' ^ g is the light propagation rate Γ is the overall laser triode 3 material limit factor dg / dn is the differential gain value Nw is the number of quantum wells 441 10 200814348 441 thickness dw is the width of a single quantum well)
Wact是主動層單元44厚度(在此為脊狀波導結構 L是光腔的長度 光侷限層453因為具有高折射率值,因此可提升對應於 中央區4521與外圍區4522結構的折射率差值而形成較大的 水平光場的侷限’同時,下光侷限層431可針對垂直光場的 {私作補^冑免上光侷限層453的高折射率值導致垂直方 向,光場向上偏移,而可有效提升對雷射光場的侷限性( ^;)’減小光場分佈面積,進—步提升雷射的共振頻率值 10Gb/s的操作速率。 參閱圖4、81 5,與傳統的雷射二極體1不同的是,本 發明具有特殊光侷限結構4的雷射二極體3並不採用「僅 以n、P型批覆層22、27配合上、下侷限層23、25形成折 射率漸變分限異質結構」對光產生侷限;而是省略此上、 下侷限層23 25的結構,以增加對載子的揭限性進而降低 臨界電流,並改採用具有高折射率之磷化姻鎵石申材料組成 上、下侷限單元45、43的上、下光揭限層453、431,用以 ^效減少雷射光場的分佈面積,且同時以位於該層主動層 早兀44上、下兩界面之能障較高的載子抑制層432、451 降低高溫操作時的臨限電流值和提升電子-電洞的復合率 以增加微分增益值’而有助於解決熱效應與載子堆積導致 臨界電流劣化的問題’且此同時,本發明所採用的上、下 先褐限層州、431兩旁亦成折射率漸變分限異質結構而可 11 200814348 更加提昇7G件高頻特性的響應,進而將操作速率提升至 10Gb/sec 以上。 上述,本叙明為具有特殊光褐限結構4的雷射二極 體3主要是以具有高折射率的磷化銦鎵砷材料建構上、下 光侷限層453、431,以提升水平方向的光場侷限,並對垂 直光場的位移做補償,並同時採用砷化鋁鎵銦材料建構主 動層單元44,並配合於其上、下界面以能隙較大之鋁化銦Wact is the thickness of the active layer unit 44 (here, the ridge waveguide structure L is the length of the optical cavity. The light confinement layer 453 has a high refractive index value, so that the refractive index difference corresponding to the structure of the central region 4521 and the peripheral region 4522 can be improved. The limitation of forming a large horizontal light field is also 'the lower light confinement layer 431 can be directed to the vertical light field by the high refractive index value of the vertical light field 453, and the light field is shifted upward. , can effectively improve the limitations of the laser light field ( ^;) 'reduce the light field distribution area, and further increase the laser's resonant frequency value of 10Gb / s operation rate. See Figure 4, 81 5, and the traditional The difference in the laser diode 1 is that the laser diode 3 having the special optical confinement structure 4 of the present invention does not use "only the n, P type cladding layers 22, 27 are combined with the upper and lower confinement layers 23, 25 The formation of a refractive index gradient-limited heterostructure has a limitation on light; instead, the structure of the upper and lower confinement layers 23 25 is omitted to increase the uncovering property of the carrier and thereby lower the critical current, and to adopt a phosphorus having a high refractive index. The dowry gallstone application material consists of upper and lower limit units 4 5, 43 upper and lower light exposure limit layers 453, 431, used to reduce the distribution area of the laser light field, and at the same time, the energy barrier of the upper and lower interfaces of the active layer of the layer is higher. The sub-suppression layers 432, 451 reduce the threshold current value during high-temperature operation and increase the recombination rate of the electron-hole to increase the differential gain value' to help solve the problem of thermal effect and carrier current accumulation leading to critical current degradation. The upper and lower first brown-limit states and the 431s used in the present invention also have a refractive index grading and a heterogeneous structure, and 11 200814348 further enhances the response of the high-frequency characteristics of the 7G piece, thereby increasing the operation rate to 10 Gb/sec or more. In the above, the laser diode 3 having the special light brown limit structure 4 is mainly constructed with upper and lower optical confinement layers 453 and 431 of an indium gallium arsenide material having a high refractive index to enhance the horizontal direction. The light field is limited, and the displacement of the vertical light field is compensated. At the same time, the active layer unit 44 is constructed by using aluminum gallium arsenide material, and the indium aluminide with a larger energy gap is matched with the upper and lower interfaces.
碎材料建構的載子抑制層432、451,藉料化輯銦材料 具有較大的導電帶井深比(c〇nducti〇n _ )及 能隙較大之绅化㈣銦材料的配合,而可有效抑制注入到 主動層單元44的電子產生溢流現象,避免電子_電洞的累 積而進-步導致的熱效應和臨界電流劣化問題,降低元件 操作時的臨限電流值並提升電子和電洞的復合率,以獲得 ,高的共振頻率(relaxation —加―),進而提 幵几件的操作速率達l〇Gb/sec,而適用於改進舊型多模光 纖網,以銜接新型高速光纖網路之電子式色散補償技術中 ’確貫達到本發明的創作目的。 惟以上所述者,僅為本發明之較佳實施例而已,當不 能以此限定本發明實施之範圍’即大凡依本發明申請:利 乾圍及發明說明内容所作之簡單的等效變化與修飾, 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一剖視示意圖,說明一 圖2是一能帶圖,說明圖1 習知的雷射二極體; 之雷射二極體的能帶狀況 12 200814348 圖3是一折射率分布圖,說明圖1之雷射二極體的頻 帶; 圖4是一剖視示意圖,說明本發明之具有特殊光侷限 結構的雷射二極體的一較佳實施例; 圖5是一能帶圖,說明圖4之本發明雷射二極體的能 帶狀況; 圖6是一折射率分布圖,說明圖4之本發明雷射二極 體的頻帶。 13 200814348The carrier suppression layer 432, 451 of the fragmented material has a larger conductive well depth ratio (c〇nducti〇n _ ) and a larger energy gap (indium) indium material, but Effectively suppressing the electron injection overflow phenomenon injected into the active layer unit 44, avoiding the accumulation of electrons and holes, and the thermal effect and critical current degradation caused by the step-by-step, reducing the threshold current value during the operation of the component and increasing the electrons and holes. The recombination rate, to obtain, high resonance frequency (relaxation - plus -), and then to improve the operating rate of several pieces of l 〇 Gb / sec, and is suitable for improving the old multi-mode optical fiber network to connect the new high-speed optical fiber network In the electronic dispersion compensation technology of Lu's, the creative purpose of the present invention is achieved. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto. Modifications are within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a diagram of a band diagram illustrating the conventional laser diode of the laser diode of FIG. 1; the energy band condition of the laser diode 12 200814348 FIG. Is a refractive index profile illustrating the frequency band of the laser diode of FIG. 1; FIG. 4 is a cross-sectional view showing a preferred embodiment of the laser diode of the present invention having a special optical confinement structure; 5 is a band diagram illustrating the energy band condition of the laser diode of the present invention of FIG. 4; and FIG. 6 is a refractive index profile illustrating the frequency band of the laser diode of the present invention of FIG. 13 200814348
【主要元件符號說明】 1 雷射二極體 4 特殊光侷限結構 11 基材 41 緩衝層 12 電極 42 第一型批覆層 2 光侷限結構 43 下侷限單元 21 緩衝層 431 下光侷限層 22 η型批覆層 432 載子抑制層 23 下侷限層 44 主動層單元 24 主動層單元 441 量子井 241 多重量子井 442 障壁 25 上侷限層 45 上侷限單元 26 餘刻停止層 451 載子抑制層 261 中央區 452 餘刻停止層 262 外圍區 4521 中央區 27 P型批覆層 4522 外圍區 3 雷射二極體 453 上光侷限層 31 基材 46 第二型批覆層 32 電極 14[Main component symbol description] 1 Laser diode 4 Special optical confinement structure 11 Substrate 41 Buffer layer 12 Electrode 42 First type cladding layer 2 Optical confinement structure 43 Lower confinement unit 21 Buffer layer 431 Lower optical confinement layer 22 η type Overlay 432 carrier suppression layer 23 lower confinement layer 44 active layer unit 24 active layer unit 441 quantum well 241 multiple quantum well 442 barrier 25 upper confinement layer 45 upper confinement unit 26 residual stop layer 451 carrier suppression layer 261 central region 452 Remaining stop layer 262 Peripheral area 4521 Central area 27 P type cladding layer 4522 Peripheral area 3 Laser diode 453 Luminescence confinement layer 31 Substrate 46 Second type cladding layer 32 Electrode 14
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