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TW200802669A - Material receptacle for semiconductor device - Google Patents

Material receptacle for semiconductor device

Info

Publication number
TW200802669A
TW200802669A TW095123096A TW95123096A TW200802669A TW 200802669 A TW200802669 A TW 200802669A TW 095123096 A TW095123096 A TW 095123096A TW 95123096 A TW95123096 A TW 95123096A TW 200802669 A TW200802669 A TW 200802669A
Authority
TW
Taiwan
Prior art keywords
opening
container body
departure
guiding
semiconductor device
Prior art date
Application number
TW095123096A
Other languages
Chinese (zh)
Other versions
TWI304627B (en
Inventor
Hung-Wen Liu
Lien-Chen Chiang
Ming-Jeng Lin
Wen-Shan Tsai
Chin-Sung Tsai
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW095123096A priority Critical patent/TWI304627B/en
Publication of TW200802669A publication Critical patent/TW200802669A/en
Application granted granted Critical
Publication of TWI304627B publication Critical patent/TWI304627B/en

Links

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

This invention provides a material receptacle structure for semiconductor device, including: a container body formed with at least one opening, on which a departure guiding groove is disposed on the surface of the container body, and a carrier board is inserted in the container body; and a sliding lid disposed on the opening of the container body having a guiding board disposed thereon, whereby when the guiding board slides along the departure guiding groove to open the opening of the container body, the sliding lid is departure from the opening to avoid colliding with the carrier board; on the other hand, when the guiding board slides along the departure guiding groove to shut the opening of the container body, the sliding lid closes with the opening to prevent the carrier from sliding in the process of transportation.
TW095123096A 2006-06-27 2006-06-27 Material receptacle for semiconductor device TWI304627B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095123096A TWI304627B (en) 2006-06-27 2006-06-27 Material receptacle for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095123096A TWI304627B (en) 2006-06-27 2006-06-27 Material receptacle for semiconductor device

Publications (2)

Publication Number Publication Date
TW200802669A true TW200802669A (en) 2008-01-01
TWI304627B TWI304627B (en) 2008-12-21

Family

ID=44765460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123096A TWI304627B (en) 2006-06-27 2006-06-27 Material receptacle for semiconductor device

Country Status (1)

Country Link
TW (1) TWI304627B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI855776B (en) * 2023-07-17 2024-09-11 科風國際材料有限公司 Magazine with partition boards, and structure of the partition board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI855776B (en) * 2023-07-17 2024-09-11 科風國際材料有限公司 Magazine with partition boards, and structure of the partition board

Also Published As

Publication number Publication date
TWI304627B (en) 2008-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees