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TW200802560A - Apparatus for and method of processing substrate - Google Patents

Apparatus for and method of processing substrate

Info

Publication number
TW200802560A
TW200802560A TW096107248A TW96107248A TW200802560A TW 200802560 A TW200802560 A TW 200802560A TW 096107248 A TW096107248 A TW 096107248A TW 96107248 A TW96107248 A TW 96107248A TW 200802560 A TW200802560 A TW 200802560A
Authority
TW
Taiwan
Prior art keywords
substrate
bath
buffer bath
micro
micro bubbles
Prior art date
Application number
TW096107248A
Other languages
English (en)
Other versions
TWI329341B (zh
Inventor
Ayumi Higuchi
Kenichiro Arai
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200802560A publication Critical patent/TW200802560A/zh
Application granted granted Critical
Publication of TWI329341B publication Critical patent/TWI329341B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D5/00—Liquid processing apparatus in which no immersion is effected; Washing apparatus in which no immersion is effected
    • H10P95/00—
    • H10P50/613—
    • H10P52/00—
    • H10P72/0416—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
TW096107248A 2006-03-22 2007-03-02 Apparatus for and method of processing substrate TW200802560A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006078529 2006-03-22
JP2007004276A JP4869957B2 (ja) 2006-03-22 2007-01-12 基板処理装置

Publications (2)

Publication Number Publication Date
TW200802560A true TW200802560A (en) 2008-01-01
TWI329341B TWI329341B (zh) 2010-08-21

Family

ID=38533557

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107248A TW200802560A (en) 2006-03-22 2007-03-02 Apparatus for and method of processing substrate

Country Status (4)

Country Link
US (1) US7841788B2 (zh)
JP (1) JP4869957B2 (zh)
KR (1) KR100860170B1 (zh)
TW (1) TW200802560A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750592B (zh) * 2019-02-20 2021-12-21 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5448385B2 (ja) * 2008-07-30 2014-03-19 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法
JP5183382B2 (ja) * 2008-09-18 2013-04-17 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP5666086B2 (ja) * 2008-12-25 2015-02-12 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ シリコンウェハ洗浄装置
JP2013157443A (ja) * 2012-01-30 2013-08-15 Siltronic Ag 洗浄方法
JP6037649B2 (ja) * 2012-04-26 2016-12-07 芝浦メカトロニクス株式会社 微細気泡発生装置、微細気泡発生方法、基板処理装置、および基板処理方法
JP5872382B2 (ja) 2012-05-24 2016-03-01 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ 超音波洗浄方法
JP6038623B2 (ja) * 2012-12-07 2016-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
WO2015136872A1 (ja) * 2014-03-10 2015-09-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび配管洗浄方法
KR101607521B1 (ko) 2014-07-08 2016-03-31 세메스 주식회사 기판 처리 장치 및 방법
CN104353088A (zh) * 2014-09-30 2015-02-18 东南大学 一种脂质气泡的制备方法
JP6356727B2 (ja) * 2016-05-27 2018-07-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN107138498A (zh) * 2017-07-18 2017-09-08 重庆达娃实业有限公司 玻璃薄片的简易清洗装置及其工作过程
JP7352913B2 (ja) * 2018-03-20 2023-09-29 株式会社島津製作所 ファインバブル供給装置及びファインバブル分析システム
JP7368264B2 (ja) * 2019-02-20 2023-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
JP7561539B2 (ja) * 2019-12-26 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN114902380A (zh) 2019-12-26 2022-08-12 株式会社斯库林集团 基板处理装置以及基板处理方法
JP7408445B2 (ja) * 2020-03-17 2024-01-05 キオクシア株式会社 半導体製造装置および半導体装置の製造方法

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JPS6328125A (ja) * 1986-07-22 1988-02-05 Matsushita Electric Ind Co Ltd 信号切換装置
JPH06320124A (ja) * 1993-03-15 1994-11-22 Hitachi Ltd 超音波洗浄方法およびその洗浄装置
DE4316096C1 (de) 1993-05-13 1994-11-10 Wacker Chemitronic Verfahren zur naßchemischen Behandlung scheibenförmiger Werkstücke
US5340437A (en) 1993-10-08 1994-08-23 Memc Electronic Materials, Inc. Process and apparatus for etching semiconductor wafers
JPH07326570A (ja) 1994-05-30 1995-12-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3662317B2 (ja) * 1995-11-21 2005-06-22 富士写真フイルム株式会社 感光材料処理装置の液補充方法及び感光材料処理装置
JP4253914B2 (ja) * 1999-04-19 2009-04-15 栗田工業株式会社 ガス溶解洗浄水の評価装置
KR20010036625A (ko) 1999-10-11 2001-05-07 윤종용 세정수단의 순환세정시스템
JP4003441B2 (ja) * 2001-11-08 2007-11-07 セイコーエプソン株式会社 表面処理装置および表面処理方法
JP2003205230A (ja) * 2002-01-16 2003-07-22 Fuji Photo Film Co Ltd 攪拌タンク
JP2005093873A (ja) * 2003-09-19 2005-04-07 Ebara Corp 基板処理装置
JP3592702B1 (ja) * 2003-08-12 2004-11-24 エス・イー・エス株式会社 基板処理方法及び基板処理装置
WO2005071138A1 (ja) * 2004-01-23 2005-08-04 Ebara Corporation 基板処理方法及び触媒処理液及び基板処理装置
JP4365254B2 (ja) * 2004-04-05 2009-11-18 三菱電機株式会社 洗浄方法
KR100577563B1 (ko) * 2004-04-07 2006-05-08 삼성전자주식회사 반도체 소자 제조장비에서의 감광액 공급방법 및 감광액공급장치
JP2005296786A (ja) * 2004-04-12 2005-10-27 Mitsubishi Electric Corp 洗浄装置
US7392814B2 (en) * 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
JP2006192372A (ja) * 2005-01-13 2006-07-27 Shinka Jitsugyo Kk 洗浄物保持具、これを用いた洗浄物保持装置、洗浄装置、洗浄物洗浄方法
JP4019154B2 (ja) * 2005-01-13 2007-12-12 国立大学法人 筑波大学 マイクロバブル発生装置、マイクロバブル発生装置用渦崩壊用ノズル、マイクロバブル発生装置用旋回流発生用翼体、マイクロバブル発生方法およびマイクロバブル応用装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750592B (zh) * 2019-02-20 2021-12-21 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
JP2007288134A (ja) 2007-11-01
JP4869957B2 (ja) 2012-02-08
US7841788B2 (en) 2010-11-30
TWI329341B (zh) 2010-08-21
KR100860170B1 (ko) 2008-09-24
KR20070095776A (ko) 2007-10-01
US20070223916A1 (en) 2007-09-27

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