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TW200801854A - Composition and method for photoresist removal - Google Patents

Composition and method for photoresist removal

Info

Publication number
TW200801854A
TW200801854A TW096118815A TW96118815A TW200801854A TW 200801854 A TW200801854 A TW 200801854A TW 096118815 A TW096118815 A TW 096118815A TW 96118815 A TW96118815 A TW 96118815A TW 200801854 A TW200801854 A TW 200801854A
Authority
TW
Taiwan
Prior art keywords
composition
present
photoresist
photoresist removal
layer photoresist
Prior art date
Application number
TW096118815A
Other languages
English (en)
Other versions
TWI360028B (en
Inventor
Aiping Wu
John Anthony Marsella
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Publication of TW200801854A publication Critical patent/TW200801854A/zh
Application granted granted Critical
Publication of TWI360028B publication Critical patent/TWI360028B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • H10P50/287—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096118815A 2006-05-26 2007-05-25 Composition and method for photoresist removal TWI360028B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80908506P 2006-05-26 2006-05-26
US11/738,699 US8288330B2 (en) 2006-05-26 2007-04-23 Composition and method for photoresist removal

Publications (2)

Publication Number Publication Date
TW200801854A true TW200801854A (en) 2008-01-01
TWI360028B TWI360028B (en) 2012-03-11

Family

ID=38477099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096118815A TWI360028B (en) 2006-05-26 2007-05-25 Composition and method for photoresist removal

Country Status (5)

Country Link
US (1) US8288330B2 (zh)
EP (1) EP1860508B1 (zh)
JP (1) JP4373457B2 (zh)
KR (1) KR100903913B1 (zh)
TW (1) TWI360028B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI565836B (zh) * 2011-12-28 2017-01-11 Tokyo Ohka Kogyo Co Ltd Cleaning solution and anti-corrosion agent
TWI824164B (zh) * 2019-07-11 2023-12-01 德商馬克專利公司 光阻移除劑組合物及自基板移除光阻膜之方法

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KR100710579B1 (ko) * 2003-08-27 2007-04-24 가켄 테크 가부시키가이샤 땜납 플럭스 제거용 세정제 및 땜납 플럭스의 세정방법
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
JP4741315B2 (ja) * 2005-08-11 2011-08-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． ポリマー除去組成物
CN101487993A (zh) * 2008-01-18 2009-07-22 安集微电子（上海）有限公司 一种厚膜光刻胶清洗剂
TWI450052B (zh) * 2008-06-24 2014-08-21 黛納羅伊有限責任公司 用於後段製程操作有效之剝離溶液
US8658583B2 (en) * 2008-09-22 2014-02-25 Ekc Technology, Inc. Method for making a photoresist stripping solution comprising an organic sulfonic acid and an organic hydrocarbon solvent
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
US8614053B2 (en) 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
US8444768B2 (en) 2009-03-27 2013-05-21 Eastman Chemical Company Compositions and methods for removing organic substances
US20110253171A1 (en) * 2010-04-15 2011-10-20 John Moore Chemical Composition and Methods for Removing Epoxy-Based Photoimageable Coatings Utilized In Microelectronic Fabrication
FR2976290B1 (fr) * 2011-06-09 2014-08-15 Jerome Daviot Composition de solutions et conditions d'utilisation permettant le retrait et la dissolution complete de resines photo-lithographiques
US20130101460A1 (en) * 2011-10-25 2013-04-25 Baker Hughes Incorporated Inhibiting corrosion in aqueous films
WO2013066058A2 (ko) * 2011-11-04 2013-05-10 동우 화인켐 주식회사 자성체막 및 자성체막 잔류물 제거용 조성물
JP5924761B2 (ja) * 2011-12-28 2016-05-25 東京応化工業株式会社 洗浄液、及び防食剤
JP5993193B2 (ja) * 2012-04-25 2016-09-14 Ｄｉｃグラフィックス株式会社 平版印刷用湿し水濃縮組成物
US9029268B2 (en) 2012-11-21 2015-05-12 Dynaloy, Llc Process for etching metals
EP3268810B1 (en) * 2015-03-12 2022-07-06 Merck Patent GmbH Compositions and methods that promote charge complexing copper protection during low pka driven polymer stripping
CN108255025A (zh) * 2016-12-28 2018-07-06 安集微电子（上海）有限公司 一种清洗液
US10522557B2 (en) 2017-10-30 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Surface topography by forming spacer-like components
KR102448220B1 (ko) * 2018-01-25 2022-09-27 메르크 파텐트 게엠베하 포토레지스트 제거제 조성물
JP7377206B2 (ja) * 2018-01-25 2023-11-09 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング フォトレジストリムーバ組成物

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US4304681A (en) 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
US4401748A (en) 1982-09-07 1983-08-30 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US5049314A (en) * 1989-08-24 1991-09-17 Chute Chemical Company Paint stripping composition consisting essentially of NMP and ethyl-3-ethoxy propionate
US5139607A (en) 1991-04-23 1992-08-18 Act, Inc. Alkaline stripping compositions
US5622921A (en) * 1993-01-21 1997-04-22 Nowsco Well Service, Inc. Anionic compositions for sludge prevention and control during acid stimulation of hydrocarbon wells
US5585341A (en) * 1995-02-27 1996-12-17 Buckeye International, Inc. Cleaner/degreaser concentrate compositions
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US6261735B1 (en) 1998-11-24 2001-07-17 Silicon Valley Chemlabs, Inc. Composition and method for removing probing ink and negative photoresist from silicon wafers enclosures
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KR100835606B1 (ko) * 2002-12-30 2008-06-09 엘지디스플레이 주식회사 구리용 레지스트 제거용 조성물
EP1680806A4 (en) 2003-10-28 2008-07-30 Sachem Inc CLEANING SOLUTIONS AND MEDICAMENTS AND METHOD FOR THEIR USE
US7183245B2 (en) 2003-12-23 2007-02-27 General Chemical Performance Products, Llc Stripper for cured negative-tone isoprene-based photoresist and bisbenzocyclobutene coatings
JP4369284B2 (ja) 2004-04-19 2009-11-18 東友ファインケム株式会社 レジスト剥離剤
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof
US7049472B2 (en) 2004-07-26 2006-05-23 Air Products And Chemicals, Inc. Bis(3-alkoxyalkan-2-OL) sulfides, sulfones, and sulfoxides: new surface active agents
KR101232249B1 (ko) 2004-08-10 2013-02-12 간또 가가꾸 가부시끼가이샤 반도체 기판 세정액 및 반도체 기판 세정방법
JP4776191B2 (ja) 2004-08-25 2011-09-21 関東化学株式会社 フォトレジスト残渣及びポリマー残渣除去組成物、並びにそれを用いた残渣除去方法
US20060043070A1 (en) 2004-08-31 2006-03-02 Moore John C High temperature functioning stripper for cured difficult to remove photoresist coatings
US7341985B2 (en) 2004-10-08 2008-03-11 Air Products And Chemicals, Inc. 2-Hydroxy-3-alkoxypropyl sulfides, sulfones, and sulfoxides: new surface active agents
WO2006124201A2 (en) * 2005-05-13 2006-11-23 Sachem, Inc. Selective wet etching of oxides

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI565836B (zh) * 2011-12-28 2017-01-11 Tokyo Ohka Kogyo Co Ltd Cleaning solution and anti-corrosion agent
TWI824164B (zh) * 2019-07-11 2023-12-01 德商馬克專利公司 光阻移除劑組合物及自基板移除光阻膜之方法
US11994803B2 (en) 2019-07-11 2024-05-28 Merck Patent Gmbh Photoresist remover compositions

Also Published As

Publication number Publication date
US8288330B2 (en) 2012-10-16
KR20070113986A (ko) 2007-11-29
KR100903913B1 (ko) 2009-06-19
US20070272275A1 (en) 2007-11-29
TWI360028B (en) 2012-03-11
JP4373457B2 (ja) 2009-11-25
EP1860508B1 (en) 2012-12-05
EP1860508A3 (en) 2011-05-18
EP1860508A2 (en) 2007-11-28
JP2007328338A (ja) 2007-12-20

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