TW200801831A - Exposure apparatus, exposure method, and exposure system - Google Patents
Exposure apparatus, exposure method, and exposure systemInfo
- Publication number
- TW200801831A TW200801831A TW96105788A TW96105788A TW200801831A TW 200801831 A TW200801831 A TW 200801831A TW 96105788 A TW96105788 A TW 96105788A TW 96105788 A TW96105788 A TW 96105788A TW 200801831 A TW200801831 A TW 200801831A
- Authority
- TW
- Taiwan
- Prior art keywords
- exposure
- liquid
- exposure apparatus
- oxygen
- substrate
- Prior art date
Links
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 3
- 239000001301 oxygen Substances 0.000 abstract 3
- 229910052760 oxygen Inorganic materials 0.000 abstract 3
- 239000007789 gas Substances 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000007872 degassing Methods 0.000 abstract 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
An exposure apparatus has a projection optical system configured to project an image of a reticle pattern onto a reticle pattern onto a substrate, and exposed the substrate and the projection optical system. The exposure apparatus includes an oxygen removal unit configured to reduce dissolved oxygen in the liquid by bringing the liquid into contact with a gas other than oxygen, and a degassing unit configured to reduce a dissolved gas in the liquid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006037423 | 2006-02-15 | ||
| JP2006353587 | 2006-12-28 | ||
| JP2007026405A JP2008182167A (en) | 2006-02-15 | 2007-02-06 | Exposure apparatus, exposure method, and exposure system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200801831A true TW200801831A (en) | 2008-01-01 |
Family
ID=39725814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96105788A TW200801831A (en) | 2006-02-15 | 2007-02-15 | Exposure apparatus, exposure method, and exposure system |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2008182167A (en) |
| TW (1) | TW200801831A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4490459B2 (en) | 2007-06-29 | 2010-06-23 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
| US8629970B2 (en) | 2008-01-23 | 2014-01-14 | Asml Netherlands B.V. | Immersion lithographic apparatus with immersion fluid re-circulating system |
| NL2003820A (en) * | 2008-12-22 | 2010-06-23 | Asml Netherlands Bv | Fluid handling structure, table, lithographic apparatus, immersion lithographic apparatus, and device manufacturing methods. |
| TW201227178A (en) * | 2010-11-02 | 2012-07-01 | Nikon Corp | Liquid supply apparatus, liquid supply method, management apparatus, management method, exposure apparatus, exposure method, device fabricating system, device fabricating method, program and recording medium |
-
2007
- 2007-02-06 JP JP2007026405A patent/JP2008182167A/en active Pending
- 2007-02-15 TW TW96105788A patent/TW200801831A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008182167A (en) | 2008-08-07 |
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