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TW200801118A - Heat curable silicone composition - Google Patents

Heat curable silicone composition

Info

Publication number
TW200801118A
TW200801118A TW096105791A TW96105791A TW200801118A TW 200801118 A TW200801118 A TW 200801118A TW 096105791 A TW096105791 A TW 096105791A TW 96105791 A TW96105791 A TW 96105791A TW 200801118 A TW200801118 A TW 200801118A
Authority
TW
Taiwan
Prior art keywords
curable silicone
heat curable
epoxy
silicone composition
organohydrogenpolysiloxane
Prior art date
Application number
TW096105791A
Other languages
English (en)
Inventor
Naoki Yamakawa
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200801118A publication Critical patent/TW200801118A/zh

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041Lenses
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
TW096105791A 2006-02-20 2007-02-15 Heat curable silicone composition TW200801118A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006041927 2006-02-20

Publications (1)

Publication Number Publication Date
TW200801118A true TW200801118A (en) 2008-01-01

Family

ID=38198565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105791A TW200801118A (en) 2006-02-20 2007-02-15 Heat curable silicone composition

Country Status (7)

Country Link
US (1) US20070197742A1 (zh)
EP (1) EP1820824B1 (zh)
KR (1) KR101272403B1 (zh)
CN (1) CN101070429B (zh)
AT (1) ATE404635T1 (zh)
DE (1) DE602007000068D1 (zh)
TW (1) TW200801118A (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5136963B2 (ja) * 2008-03-24 2013-02-06 信越化学工業株式会社 硬化性シリコーンゴム組成物及び半導体装置
US8629222B2 (en) * 2008-03-28 2014-01-14 Mitsubishi Chemical Corporation Curable polysiloxane composition, and polysiloxane cured product, optical member, member for aerospace industry, semiconductor light-emitting device, illuminating device and image display device using the same
JP5840388B2 (ja) * 2011-06-01 2016-01-06 日東電工株式会社 発光ダイオード装置
CN102898840B (zh) * 2011-07-28 2015-07-08 北京科化新材料科技有限公司 绝缘硅橡胶组合物
JP5682497B2 (ja) 2011-07-29 2015-03-11 信越化学工業株式会社 表面実装型発光装置の製造方法及びリフレクター基板
CN103013125B (zh) * 2011-09-26 2015-07-08 北京科化新材料科技有限公司 一种绝缘硅橡胶组合物
US10030168B2 (en) 2012-05-14 2018-07-24 Momentive Performance Materials Inc. High refractive index material
JP6015864B2 (ja) * 2013-08-09 2016-10-26 横浜ゴム株式会社 硬化性樹脂組成物
WO2016152073A1 (en) * 2015-03-20 2016-09-29 Dow Corning Toray Co., Ltd. Organopolysiloxane, production method thereof, and curable silicone composition
WO2017051084A1 (fr) * 2015-09-25 2017-03-30 Bluestar Silicones France Sas Composition silicone reticulable pour la realisation de revetements anti-adherents pour supports souples et additif promoteur d'accrochage contenu dans cette composition
CN106167621B (zh) * 2016-08-03 2019-10-29 深圳市安品有机硅材料有限公司 阻燃型室温硫化液体硅橡胶
JP6634988B2 (ja) * 2016-09-20 2020-01-22 信越化学工業株式会社 透明液状シリコーンゴム組成物
CN112218912A (zh) * 2018-06-12 2021-01-12 迈图高新材料日本合同公司 硅酮固化物的制备方法、硅酮固化物及光学用部件
JP7114510B2 (ja) * 2019-03-06 2022-08-08 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087585A (en) * 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4954580A (en) * 1987-12-01 1990-09-04 Ciba-Geigy Corporation Epoxysiloxanes
US5804616A (en) * 1993-05-19 1998-09-08 Ameron International Corporation Epoxy-polysiloxane polymer composition
FR2727119B1 (fr) * 1994-11-18 1997-01-03 Rhone Poulenc Chimie Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation
US6201092B1 (en) * 1998-02-04 2001-03-13 Shin-Etsu Chemical Co., Ltd. Addition curing type silicone compositions
JP4009067B2 (ja) * 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
EP1359198A1 (en) * 2002-05-03 2003-11-05 SigmaKalon Group B.V. Epoxy-modified polysiloxane resin based compositions useful for coatings
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物
JP4803339B2 (ja) 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4801320B2 (ja) * 2003-12-19 2011-10-26 東レ・ダウコーニング株式会社 付加反応硬化型オルガノポリシロキサン樹脂組成物
JP4300418B2 (ja) * 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
EP1749861B1 (en) * 2005-08-03 2014-08-20 Shin-Etsu Chemical Co., Ltd. Addition curable silicone resin composition for light emitting diode
JP4648146B2 (ja) * 2005-09-26 2011-03-09 信越化学工業株式会社 耐クラック性に優れた付加硬化型シリコーン組成物

Also Published As

Publication number Publication date
DE602007000068D1 (de) 2008-09-25
CN101070429B (zh) 2012-04-25
CN101070429A (zh) 2007-11-14
EP1820824B1 (en) 2008-08-13
KR20070083209A (ko) 2007-08-23
EP1820824A1 (en) 2007-08-22
US20070197742A1 (en) 2007-08-23
KR101272403B1 (ko) 2013-06-07
ATE404635T1 (de) 2008-08-15

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