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TW200801109A - Solder-resistant flexible thermal-set epoxy resin system - Google Patents

Solder-resistant flexible thermal-set epoxy resin system

Info

Publication number
TW200801109A
TW200801109A TW095128691A TW95128691A TW200801109A TW 200801109 A TW200801109 A TW 200801109A TW 095128691 A TW095128691 A TW 095128691A TW 95128691 A TW95128691 A TW 95128691A TW 200801109 A TW200801109 A TW 200801109A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
phr
solder
resin system
resistant flexible
Prior art date
Application number
TW095128691A
Other languages
English (en)
Inventor
Syh-Tau Yeh
Yao-Ming Chen
Original Assignee
Teamchem Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teamchem Company filed Critical Teamchem Company
Publication of TW200801109A publication Critical patent/TW200801109A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1472—Fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW095128691A 2006-06-22 2006-08-04 Solder-resistant flexible thermal-set epoxy resin system TW200801109A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/425,718 US20070299218A1 (en) 2006-06-22 2006-06-22 Solder-resistant flexible thermosetting epoxy resin system

Publications (1)

Publication Number Publication Date
TW200801109A true TW200801109A (en) 2008-01-01

Family

ID=38874342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128691A TW200801109A (en) 2006-06-22 2006-08-04 Solder-resistant flexible thermal-set epoxy resin system

Country Status (3)

Country Link
US (1) US20070299218A1 (zh)
CN (1) CN101092502A (zh)
TW (1) TW200801109A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385191B (zh) * 2008-12-30 2013-02-11 Ind Tech Res Inst 熱硬化型防焊膜組成物
US8420745B2 (en) 2008-12-30 2013-04-16 Industrial Technology Research Institute Thermally curable solder resist composition
US9279057B2 (en) 2014-05-06 2016-03-08 Taiflex Scientific Co., Ltd. Thermally curable solder-resistant ink and method of making the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5644242B2 (ja) * 2009-09-09 2014-12-24 大日本印刷株式会社 貫通電極基板及びその製造方法
JP6199405B2 (ja) * 2012-11-06 2017-09-20 現代自動車株式会社Ｈｙｕｎｄａｉ Ｍｏｔｏｒ Ｃｏｍｐａｎｙ 高耐熱吸遮音材の成形方法
KR101377356B1 (ko) 2012-12-26 2014-03-25 주식회사 두산 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박
CN107738493B (zh) * 2017-09-19 2019-08-23 佛山市桐立建材科技有限公司 焊接铝制蜂窝芯以及特种粘胶剂的制作方法
CN107459797A (zh) * 2017-09-19 2017-12-12 株洲时代新材料科技股份有限公司 一种高柔韧性聚酯环氧浸渍树脂及其制备方法
CN109504031A (zh) * 2018-10-31 2019-03-22 安徽绿之态新材料有限公司 一种纤维素/三聚氰胺甲醛复合树脂及其制备方法
CN111500238B (zh) * 2020-06-19 2021-10-15 昆明耐维科技有限公司 一种用于超声波实时断轨监测系统的保护胶及其制备方法
CN116003965B (zh) * 2021-10-22 2024-07-23 中国石油化工股份有限公司 一种预浸料增韧层

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465542A (en) * 1982-02-19 1984-08-14 Mitsui Petrochemical Industries, Ltd. Adhesive composition
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
US4762747A (en) * 1986-07-29 1988-08-09 Industrial Technology Research Institute Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom
US5260130A (en) * 1989-09-29 1993-11-09 Shin-Etsu Chemical Co., Ltd. Adhesive composition and coverlay film therewith
US5401793A (en) * 1991-03-20 1995-03-28 Dainippon Ink And Chemicals, Inc. Intumescent fire-resistant coating, fire-resistant material, and process for producing the fire-resistant material
US5536855A (en) * 1994-03-04 1996-07-16 National Starch And Chemical Investment Holding Corporation Process for preparing glycidyl esters for use in electronics adhesives
US20010018122A1 (en) * 2000-01-20 2001-08-30 Shin-Etsu Chemical Co., Ltd. Adhesive composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385191B (zh) * 2008-12-30 2013-02-11 Ind Tech Res Inst 熱硬化型防焊膜組成物
US8420745B2 (en) 2008-12-30 2013-04-16 Industrial Technology Research Institute Thermally curable solder resist composition
US9279057B2 (en) 2014-05-06 2016-03-08 Taiflex Scientific Co., Ltd. Thermally curable solder-resistant ink and method of making the same

Also Published As

Publication number Publication date
US20070299218A1 (en) 2007-12-27
CN101092502A (zh) 2007-12-26

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