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TW200809713A - Heat-dissipating apparatus for a back light module of a liquid crystal display - Google Patents

Heat-dissipating apparatus for a back light module of a liquid crystal display Download PDF

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Publication number
TW200809713A
TW200809713A TW095128911A TW95128911A TW200809713A TW 200809713 A TW200809713 A TW 200809713A TW 095128911 A TW095128911 A TW 095128911A TW 95128911 A TW95128911 A TW 95128911A TW 200809713 A TW200809713 A TW 200809713A
Authority
TW
Taiwan
Prior art keywords
heat
backlight
circuit board
dissipating
panel display
Prior art date
Application number
TW095128911A
Other languages
Chinese (zh)
Other versions
TWI286721B (en
Inventor
Alex Horng
Te-Chen Liu
Original Assignee
Sunonwealth Electr Mach Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunonwealth Electr Mach Ind Co filed Critical Sunonwealth Electr Mach Ind Co
Priority to TW095128911A priority Critical patent/TWI286721B/en
Priority to JP2007011265A priority patent/JP2008041638A/en
Priority to GB0701544A priority patent/GB2440748A/en
Priority to DE102007006594A priority patent/DE102007006594A1/en
Priority to FR0753815A priority patent/FR2904749A1/en
Application granted granted Critical
Publication of TWI286721B publication Critical patent/TWI286721B/en
Publication of TW200809713A publication Critical patent/TW200809713A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A heat-dissipating apparatus for a back light module of a liquid crystal display comprises at least one back light unit, at least one printed circuit board and at least one heat-dissipating board. The back light unit and the printed circuit board are combined to form a back light set. The back light unit provides a light emitting device and a heat-dissipating portion attached to an end thereof so as to absorb heat generated from the light emitting device. The printed circuit board is mounted on a rear surface of the heat-dissipating board, and the heat-dissipating portion of the back light unit is also attached to the rear surface of the heat-dissipating board through an assembling hole of the printed circuit board such that the heat-dissipating board dissipates the heat generated from the back light set.

Description

200809713 九、發明說明： λ. 【發明所屬之技術領域】 本發明係關於一種平面顯示器之背光源散熱裝置， ，別疋關於在一電路板開設至少一組裝孔，且至少一背光 之-導熱部係㈣該組纽直接賴於—散熱基板之 月面’以提升散熱效率之平面顯示器之背光源散熱裝置。 【先前技術】 習用平面顯示器之背光源散熱裝置，請參照第i圖 所TR，其包含數個背光單元6、一電路板7、一支撐框架 8及一散熱基板9。該背光單元6設置於該電路板7之一 側，且與該電路板7電性連接，以便藉由該電路板7控制 • 該背光單元6提供一背光源。該背光單元ό具有一基座61 . ^ 、一發光元件62及至少二極片63。該基座61係設有一 谷置空間〔未標示〕，以便容置定位該發光元件62及極 片63。該發光元件62係選自一發光二極體〔lED〕，以 提供足夠之光源。該極片63係由一導電金屬材質製成， 該極片63係穿設於該基座61之側面，且該極片63與該 發光元件62電性連接。 請再參照第1圖所示，該電路板7係選自一軟性印 刷電路板，該背光單元6利用該極片63電性連接於該電 ^ 路板7之一側。該支撐框架8設有一容置空間80，以供 容置該背光單元6及電路板7。該散熱基板9係由鋁或銅 等高導熱能力之金屬材質製成，其結合於該支撐框架8之 一側，以便該電路板7經由該容置空間8〇與該散熱基板 CAUwtaVPK Pat\PKlOI34. d〇c 06/08/07/0|；37 —5 — 200809713 9相互貼接。 當該背光單元6之發光元件62產生一背光源供一平 面顯示器〔未緣示，flat panel display〕形成影像時，該發 光元件62產生之熱能經由熱傳導方式傳遞至該電路板7 ’接著再由該散熱基板9之金屬材質間接吸收該電路板7 上之熱能。由於該高導熱能力之散熱基板9之一側設有數 個鰭片構造〔未標示〕，進而增加該散熱基板9與空氣之 熱交換面積，以便快速將所吸收之熱能釋放至大氣中，進 步達到快速冷卻降溫之功效。 一般而言，上述習用平面顯示器之背光源散熱裝置 ^有下列缺點，例如··由於該背光單元6並非直接接觸該 教熱基板9進行—熱交賴作，而必顧接透過該電路板 ^將該背光單元6產生之熱能傳導至概熱基板9進行散 …，以致大幅降低該背光單元6之散熱效率。再者，該電 7大部分係選自—軟性印刷電路板，其構造之材質必 限3有導熱成力較低之材質〔例如：玻璃纖維等〕，導致 電路板7之導熱效率’進而造成該背光單元6之散 低落。基於上述原因’其確實有必要進-步改良上 述白用平面顯示器之背光源散熱裝置。 ^於此’本發明改良上述之缺點，其係藉由在至 甩路板開設至少一組裝孔，且分別 一办 之一導熱部經由該組裝孔直接占μ '夕月 面，以接柄^ / 至少—散熱基板之背 楗升政熱效率。再者，該導熱 -基座的底部具有一預定高度差 如光早政 。亥預定高度差不小於於 C:\Limte\W P»t\PK丨則从奴 一 6 — 0Γι/ηβ/07/0|：37 1¾ 200809713 祕裝孔之厚度，以便該導熱部經由該組裝孔緊密的貼設 於該散熱基板之背面，進一步增進組裝可靠度。^此，: 發明確實能有效提升背光源散熱效率，進而延長^面頌示 器之使用壽命。 ' 【發明内容】 本發明之主要目的係提供一種平面顯示器之背光源 散熱裝置，其係藉由在至少一電路板開設至少一組裝孔， 讀別將至少-背光單元之-導熱部經由裝孔直接貼 ux於至>、一散熱基板之为面，使得本發明具有提升背光源 散熱效率之功效。 本發明之次要目的係提供一種平面顯示器之背光源 1嫌熱裝置，其中至少—背光單元之-導熱部相雜背光單 元之一基座的底部具有一預定高度差，以便該背光單元之 導熱部得以經由該組裝孔緊密的貼設於該散熱基板之背面 ，使得本發明具有提升背光源散熱效率及組裝可靠度之功 效。 根據本發明之平面顯示器之背光源散熱裝置，其包 含f少一背光單元、至少一電路板及至少一散熱基板。該背 光單元及電路板共同構成一背光源模組。該背光單元設有一 發光元件及一導熱部，該導熱部係設置於該發光元件之一 鳊，以吸收該發光元件產生之熱能。該電路板設置於該散 熱基板之背面，且該發光單元之導熱部係通過該電路板之 至少一組裝孔直接貼設於該·散熱基板之背面，以便該散熱 基板直接吸收及驅散該背光源模組產生之熱能。 C:\Unda\PK PfttVPKlOl^. doc200809713 IX. Description of the invention: λ. [Technical field of the invention] The present invention relates to a backlight heat sink of a flat panel display, in which at least one assembly hole is provided in a circuit board, and at least one backlight-heat conducting portion (4) The backlight of the flat-panel display that directly relies on the lunar surface of the heat-dissipating substrate to improve the heat dissipation efficiency. [Prior Art] For the backlight heat sink of the conventional flat panel display, refer to the TR of Fig. i, which includes a plurality of backlight units 6, a circuit board 7, a support frame 8, and a heat dissipation substrate 9. The backlight unit 6 is disposed on one side of the circuit board 7 and is electrically connected to the circuit board 7 to be controlled by the circuit board 7. The backlight unit 6 provides a backlight. The backlight unit has a base 61. ^, a light-emitting element 62 and at least a diode 63. The base 61 is provided with a valley space (not shown) for accommodating the light-emitting element 62 and the pole piece 63. The light-emitting element 62 is selected from a light-emitting diode [1ED] to provide a sufficient light source. The pole piece 63 is made of a conductive metal material. The pole piece 63 is disposed on the side of the base 61, and the pole piece 63 is electrically connected to the light emitting element 62. Referring to FIG. 1, the circuit board 7 is selected from a flexible printed circuit board, and the backlight unit 6 is electrically connected to one side of the circuit board 7 by the pole piece 63. The support frame 8 is provided with an accommodating space 80 for accommodating the backlight unit 6 and the circuit board 7. The heat-dissipating substrate 9 is made of a metal material having a high thermal conductivity such as aluminum or copper, and is coupled to one side of the support frame 8 so that the circuit board 7 passes through the accommodating space 8 and the heat-dissipating substrate CAUwtaVPK Pat\PKlOI34. D〇c 06/08/07/0|;37 —5 — 200809713 9 are attached to each other. When the light-emitting element 62 of the backlight unit 6 generates a backlight for a flat panel display to form an image, the heat generated by the light-emitting element 62 is transferred to the circuit board 7 via thermal conduction. The metal material of the heat dissipation substrate 9 indirectly absorbs the thermal energy on the circuit board 7. Since one side of the heat-dissipating substrate 9 having the high thermal conductivity is provided with a plurality of fin structures (not shown), the heat exchange area between the heat-dissipating substrate 9 and the air is increased, so that the absorbed heat energy is quickly released into the atmosphere, and the progress is achieved. The effect of rapid cooling and cooling. In general, the backlight heat sink of the above-mentioned conventional flat panel display has the following disadvantages, for example, because the backlight unit 6 does not directly contact the heat-treating substrate 9 to perform thermal processing, and must pass through the circuit board. The thermal energy generated by the backlight unit 6 is conducted to the heat-generating substrate 9 to disperse, so that the heat dissipation efficiency of the backlight unit 6 is greatly reduced. Furthermore, most of the electricity 7 is selected from a flexible printed circuit board, and the material of the structure is limited to 3 materials having a low thermal conductivity (for example, glass fiber, etc.), resulting in heat conduction efficiency of the circuit board 7 The backlight unit 6 is scattered. For the above reasons, it is indeed necessary to further improve the backlight heat sink of the above-mentioned white flat panel display. The present invention improves the above-mentioned disadvantages by providing at least one assembly hole in the circuit board, and one of the heat conducting portions directly occupies the surface of the moon through the assembly hole to handle the handle ^ / At least - the heat dissipation efficiency of the back of the heat sink substrate. Furthermore, the bottom of the thermally conductive-base has a predetermined height difference such as light early. The predetermined height difference is not less than C:\Limte\WP»t\PK丨 from slave one 6 — 0Γι/ηβ/07/0|:37 13⁄4 200809713 The thickness of the secret hole so that the heat transfer portion passes through the assembly hole Tightly attached to the back of the heat sink substrate further enhances assembly reliability. ^This,: The invention can effectively improve the heat dissipation efficiency of the backlight, thereby extending the service life of the surface display. The main purpose of the present invention is to provide a backlight heat sink device for a flat panel display, which is characterized in that at least one assembly hole is opened in at least one circuit board, and at least the heat conduction portion of the backlight unit is read through the hole. Directly attaching ux to >, a heat-dissipating substrate as the surface, so that the invention has the effect of improving the heat dissipation efficiency of the backlight. A secondary object of the present invention is to provide a backlight 1 thermal device of a flat display, wherein at least a bottom portion of a base of one of the backlight units has a predetermined height difference for the heat conduction of the backlight unit. The portion can be closely attached to the back surface of the heat dissipation substrate via the assembly hole, so that the invention has the effects of improving the heat dissipation efficiency and assembly reliability of the backlight. A backlight heat sink of a flat panel display according to the present invention includes a backlight unit, at least one circuit board, and at least one heat sink substrate. The backlight unit and the circuit board together form a backlight module. The backlight unit is provided with a light-emitting element and a heat-conducting portion disposed on one of the light-emitting elements to absorb heat generated by the light-emitting element. The circuit board is disposed on the back surface of the heat dissipation substrate, and the heat conduction portion of the light emitting unit is directly attached to the back surface of the heat dissipation substrate through at least one assembly hole of the circuit board, so that the heat dissipation substrate directly absorbs and disperses the backlight source The heat generated by the module. C:\Unda\PK PfttVPKlOl^. doc

0δ/0β/07/0|；37 PH 7 200809713 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明 顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式 ，作詳細說明如下： 請參照第2及4圖所示，本發明第一實施例之平面 顯示器之背光源散熱裝置較佳係用以結合於一平面顯示器 a〔 flat panel display，FPD〕之背面，該平面顯示器a較 仏可選自液晶顯示器〔liquid crystal display，LCD〕或電 漿顯示器〔plasma display pane卜PDP〕等，以便提供背 光之光線，同時進行散熱動作。 請參照第2及3圖所示，本發明第一實施例之平面 ^顯示器之背光源散熱裝置其係包含至少一背光源模組j、 一支撐框架2及至少一散熱基板3，該背光源模組丨與該 支撐框架2係緊密貼設於該散熱基板3之背面，以便對該 平面顯不器a進行散熱動作。該背光源模組丨具有至少一 3光單70 11及~電路板12，該背光單元11係與該電路 板12電性連接，藉由該電路板12控制該背光單元η之 發光動作，以提供一背光源。該電路板12較佳選自-軟 性印刷電路板，但亦可選自一硬性印刷電路板。該電路板 12開設至少—組裝孔m，以供該背光單元U透過該組 裝孔121與該散熱基板3相貼接。 請再參照第2及3圖所示，本發明第—實施例之支 撐框架2具有至少一容置空間2〇，且該支撐框架2之一 侧可用以、、、。σ „亥散熱基板3，及其另一側可用以結合該平 C:\Linda\PK Pat\PKIOI34. doc 〇 —8 — 06/08/07/01 200809713 面顯示界a 承- 導熱性金屬^詳言之，該支撐框架2較佳係選擇由一高 等，但亦可、要S金所製成，例如銘、銅、金、銀或其合金 該容置空門=擇由非金屬材料製成’例如塑膠或泡棉等。 該支撐框^ 2係對應該背光源模組1之形狀開設形成在 模組卜以^^亥容置空間20用以組襄容置該背光源 。 Μ背光源模組1不致凸出至該支撐框架2外 請再參两裳〇 熱基板3係由—3圖所示，本發明第—實施例之散 、金、銀或其二2導熱性金屬或合金所製成，例如銘、銅 槽道31、及^合金等。該散熱基板3之正面設有數個散熱 散埶AM自散熱則32。該散熱則32係相對於該 向凸設湘於該錢基板3之正面，且各 #道31^Γ、轉片32之間係形成該散熱槽道3卜該散熱 ^對於該散熱基板3之縱向排列形成。藉由該 六^^1，、及散熱‘讀片32增加該散熱基板3與空氣之熱 乂 \主貝，以驅散該散熱基板3所吸收之熱能。 °月再參知第2 & 3圖所示’本發明第-實施例之背 光元件η各設有一基座U1、一發光元件112貫至;;二導 接件113及-導熱部114。該基座U1之中心位置具有〆 容置空間〔未標示〕，其可供容設定位該發光元件112及 該導熱部114。該發光元件112較佳選自一發光二極體〔 LED〕，特別是-白光發光二極體。該導接件113係由〆 具高導電能力之金屬材質製成，例如銅、銀或其合金等， 該導接件113係穿設於該基座ηι之側面，其一端與位於 C:\Limla\PK Pat\PKIOI34.doc 〜9 200809713 忒基座111内之發光元件112電性連接，而該導接件113 之另一端用以電性連接該電路板12。該導熱部114係選 ^具向導熱能力之金屬或合金材質製成，例如鋁、銅、 至、銀或其合金等。該導熱部114選擇設置於該基座nl 氐P且其知與遠發光元件112相接觸。另外，該導 ^部114之另一端相對該基座U1之底部凸出且裸露於外 邓，该導熱部114與該基座in之底部形成一預定高度差 〔未軚示〕，該預定高度差不小於該電路板12之組裝孔 121之厚度，且該組裝孔121之直徑係大於該導熱部114 之直徑，以便該導熱部114恰可透過該組裝孔121貼接於 該散熱基板3之背面。 ’ v忽：清再參照第2至4圖所示’當使用本發明第一實施 例之平面顯示器之背光源散熱裝置時，將該支撐框架2之 一侧結合於該平面顯示器a之背面。該背光單元η之發 光元件112發射一背光源供該平面顯示器a形成影像，同 時該發光元件112亦產生廢熱。由於該背光單元η之導 熱部114對應穿過該電路板12之組裝孔121直接貼設於 該散熱基板3之背面，以致該背光單元11之導熱部114 藉由熱傳導方式吸收該廢熱之熱能，且經由該導熱部114 本身之高導熱能力，直接將熱能傳導至該散熱基板3。藉 此，本發明確實可有效提升該背光源模組1之散熱效率。 再者，請參照本案第5及6圖所示，本發明第一實 施例係另設有數個散熱風扇b’由於該散熱槽道31及散 熱鰭片32係相對該散熱基板3形成縱向排列，因此有利 200809713 於藉由熱空氣上升之對流原理產生熱對流，以增進散熱效 率。藉此，該散熱風扇b較佳係選擇設置於該散熱基板3 之下方，且該散熱風扇b之出風口〔未標示〕亦相對該散 熱槽道31之通道方向設置，以便藉由該扇熱風扇b加速 該散熱槽道31内之空氣對流，進而提昇該散熱基板3之 散熱效率。 請參照第7至8圖所示，其揭示本發明第二實施例 之平面顯示器之背光源散熱裝置。相較於第一實施例，第 二實施例之電路板12係進一步選擇直接成型於該散熱基 板3之背面，且該電路板12預留至少一組裝孔ι21，該 散熱基板3之背面經由該電路板12之組裝孔121而可供 v ^背光單元11之導熱部114直接貼設，藉此有效提昇該 背光源模組1之散熱效率。 另外，當本發明第一實施例或第二實施例之背光單 元11經由該組裝孔121貼設於該散熱基板3之背面時， 該該背光單元11之導熱部114的結合侧可預設一焊料層 〔未繪示〕，透過一表面黏著技 Technology，SMT〕製程加熱熔融該焊料層，藉此將該背 光早元11私固的結合於該散熱基板3之背面，以提升該 背光源模組1與該散熱基板3間之結合可靠度。另外，該 焊料層之材貝較佳係選自一具咼導熱能力之焊料〔例如： 錫膏等〕，進而增進該背光源模組i與該散熱基板3間之 熱傳導效率。 如上所述，相較於第1圖之習用平面顯示器之背光 200809713 源散熱裝置必須間接透過一電路板7將一背光單元6所產 生之熱能傳導至一散熱基板9進行熱交換動作，以致大幅 降低该發光單元6之散熱效率等缺點，第2圖之本發明藉 由在該電路板12開設該組裝孔121，且分別將該背光單 元η之導熱部114係經由該組裝孔121直接貼接於該散 熱基板3之背面，以提升該發光單元η之散熱效率。再 者’該導熱部m相對該背光單元u之基座lu的底部 具有-預定高度差’該預定高度差不小於於該組I孔121 之厚度，以便該導熱部114經由馳裝孔i2i緊密的貼接 於該散熱基板3之f面，增軌裝可靠度。龜，本發明 確實能有效提升背光熱料，進而延長平面顯示器之 丨使用壽命。 雖然本發明已利用上述較佳實施例揭示，料並非 =蚊本發明’任何熟f此技#者，在不脫發The above and other objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims. The following is a detailed description of the following: Referring to Figures 2 and 4, the backlight heat sink of the flat panel display of the first embodiment of the present invention is preferably used for bonding to a flat panel display (FPD). On the back side of the screen, the flat display a can be selected from a liquid crystal display (LCD) or a plasma display pane (PDP) to provide backlight light while performing heat dissipation. As shown in the second and third embodiments, the backlight heat sink of the plane display of the first embodiment of the present invention comprises at least one backlight module j, a support frame 2 and at least one heat dissipation substrate 3, the backlight The module 丨 and the support frame 2 are closely attached to the back surface of the heat dissipation substrate 3 to perform heat dissipation operation on the planar display device a. The backlight module 丨 has at least one optical unit 70 11 and a circuit board 12 , and the backlight unit 11 is electrically connected to the circuit board 12 , and the circuit board 12 controls the light-emitting action of the backlight unit η to Provide a backlight. The circuit board 12 is preferably selected from the group consisting of - a flexible printed circuit board, but may also be selected from a rigid printed circuit board. The circuit board 12 defines at least an assembly hole m for the backlight unit U to adhere to the heat dissipation substrate 3 through the assembly hole 121. Referring to Figures 2 and 3, the support frame 2 of the first embodiment of the present invention has at least one accommodating space 2 〇, and one side of the support frame 2 can be used for , , , . σ „海热基板板3, and the other side of it can be used to combine the flat C:\Linda\PK Pat\PKIOI34. doc 〇—8 — 06/08/07/01 200809713 Surface display area a bearing - thermal conductivity metal ^ In detail, the support frame 2 is preferably made of a higher grade, but may also be made of S gold, such as inscriptions, copper, gold, silver or alloys thereof, which are accommodated by non-metallic materials. 'For example, plastic or foam, etc. The support frame ^ 2 is corresponding to the shape of the backlight module 1 and is formed in the module to accommodate the backlight. The module 1 does not protrude to the support frame 2, please refer to the two hot plates 3, as shown in Figure 3, the first embodiment of the present invention, the dispersion of gold, silver or its two thermal conductive metals or alloys It is made of, for example, Ming, copper channel 31, and alloy, etc. The front surface of the heat-dissipating substrate 3 is provided with a plurality of heat-dissipating heat-dissipating AM self-heating 32. The heat-dissipating 32 is relatively convex with respect to the direction. The heat dissipating channel 3 is formed between the front surface of the substrate 3 and each of the turnouts 32, and the heat dissipation holes are formed in the longitudinal direction of the heat dissipation substrate 3. The six ^^1, and the heat-dissipating sheet 32 increase the heat-dissipating substrate 3 and the heat of the air to absorb the heat energy absorbed by the heat-dissipating substrate 3. See the second & The backlight elements η of the first embodiment of the present invention are each provided with a susceptor U1 and a light-emitting element 112; and two conductive members 113 and a heat-conducting portion 114. The central position of the susceptor U1 has a 〆 accommodating space. The light-emitting element 112 and the heat-conducting portion 114 are preferably disposed from a light-emitting diode (LED), in particular, a white light-emitting diode. The 113 is made of a metal material having a high electrical conductivity, such as copper, silver or an alloy thereof. The guiding member 113 is disposed on the side of the base ηι, and one end thereof is located at C:\Limla\PK Pat. \PKIOI34.doc ~ 9 200809713 The light-emitting element 112 in the susceptor 111 is electrically connected, and the other end of the conductive member 113 is electrically connected to the circuit board 12. The heat-conducting portion 114 is selected to guide the heat capability. Made of metal or alloy material, such as aluminum, copper, to, silver or alloys thereof, etc. The heat conducting portion 114 is selectively disposed on the The other end of the guiding portion 114 is protruded from the bottom of the base U1 and exposed to the outer Deng, and the heat conducting portion 114 and the base are in contact with each other. The bottom portion is formed with a predetermined height difference (not shown), the predetermined height difference is not less than the thickness of the assembly hole 121 of the circuit board 12, and the diameter of the assembly hole 121 is larger than the diameter of the heat conducting portion 114, so that the heat conducting portion 114 The rear surface of the heat dissipation substrate 3 can be attached through the assembly hole 121. Referring to Figures 2 to 4, when the backlight heat sink of the flat panel display of the first embodiment of the present invention is used, one side of the support frame 2 is bonded to the back surface of the flat display a. The light-emitting element 112 of the backlight unit η emits a backlight for the planar display a to form an image, and the light-emitting element 112 also generates waste heat. The heat conducting portion 114 of the backlight unit η is directly attached to the back surface of the heat dissipating substrate 3 through the assembly hole 121 of the circuit board 12, so that the heat conducting portion 114 of the backlight unit 11 absorbs the heat energy of the waste heat by heat conduction. And the thermal energy is directly transmitted to the heat dissipation substrate 3 via the high thermal conductivity of the heat conduction portion 114 itself. Therefore, the present invention can effectively improve the heat dissipation efficiency of the backlight module 1. In addition, as shown in the fifth and sixth embodiments of the present invention, the first embodiment of the present invention further includes a plurality of cooling fans b'. The heat dissipation channels 31 and the heat dissipation fins 32 are longitudinally arranged with respect to the heat dissipation substrate 3. Therefore, it is advantageous for 200809713 to generate heat convection by the convection principle of rising hot air to improve heat dissipation efficiency. Therefore, the heat dissipation fan b is preferably disposed below the heat dissipation substrate 3, and the air outlet (not shown) of the heat dissipation fan b is also disposed in the channel direction of the heat dissipation channel 31 so as to be heated by the fan. The fan b accelerates the convection of the air in the heat dissipation channel 31, thereby improving the heat dissipation efficiency of the heat dissipation substrate 3. Referring to Figures 7 through 8, there is disclosed a backlight heat sink for a flat panel display according to a second embodiment of the present invention. Compared with the first embodiment, the circuit board 12 of the second embodiment is further selected to be directly formed on the back surface of the heat dissipation substrate 3, and the circuit board 12 is reserved with at least one assembly hole ι 21 through which the back surface of the heat dissipation substrate 3 is The assembly hole 121 of the circuit board 12 can be directly attached to the heat conducting portion 114 of the backlight unit 11, thereby effectively improving the heat dissipation efficiency of the backlight module 1. In addition, when the backlight unit 11 of the first embodiment or the second embodiment of the present invention is attached to the back surface of the heat dissipation substrate 3 via the assembly hole 121, the bonding side of the heat conduction portion 114 of the backlight unit 11 can be preset. a solder layer (not shown) is heated and melted through a surface mount technology (SMT) process, thereby bonding the backlight early 11 to the back surface of the heat dissipation substrate 3 to enhance the backlight mode. The bonding reliability between the group 1 and the heat dissipation substrate 3. In addition, the material of the solder layer is preferably selected from a solder having a thermal conductivity (for example, solder paste), thereby improving the heat transfer efficiency between the backlight module i and the heat sink substrate 3. As described above, the backlight 200809713 source heat sink of the conventional flat panel display of FIG. 1 must indirectly transmit heat energy generated by a backlight unit 6 to a heat sink substrate 9 through a circuit board 7 for heat exchange operation, so as to be greatly reduced. In the second aspect of the present invention, the assembly hole 121 is formed in the circuit board 12, and the heat transfer portion 114 of the backlight unit η is directly attached to the heat transfer portion 114 of the backlight unit θ through the assembly hole 121. The back surface of the heat dissipation substrate 3 is used to improve the heat dissipation efficiency of the light emitting unit η. Furthermore, the heat conducting portion m has a predetermined height difference from the bottom of the susceptor lu of the backlight unit u. The predetermined height difference is not less than the thickness of the set of I holes 121, so that the heat conducting portion 114 is tightly coupled via the spigot hole i2i. The bump is attached to the f-plane of the heat dissipation substrate 3, and the rail is mounted with reliability. Turtle, the present invention can effectively improve the backlight hot material, thereby prolonging the service life of the flat panel display. Although the present invention has been disclosed using the above-described preferred embodiments, it is not a mosquito, and the invention is not a hair loss.

=和範目之内，當可作各較轉絲，㈣本發明之 保遵關當視後附之申請專顺_界定者為準。X C:\Linda\PK PaUPlUO丨34. docWithin the scope of the specification and the scope of the application, (4) the application of the invention shall be subject to the definition of the application. X C:\Linda\PK PaUPlUO丨34. doc

00/08/07/01:37 PK —12〜 200809713 【圖式簡單說明】 f 1 ® : f用平面顯示11之背光源散熱裂置之分解立 體圖。 第2圖：本發明第-實施例之平面顯示器之背光源散 熱裝置之分解立體及放大圖。 第3圖：本發明第一實施例之平面顯示器之背光源散 熱裝置之組合剖視圖。 第4圖：本發明第-實施例之平面顯示器之背光源散 熱裝置之分解立體圖。 第5圖：本發明第一實施例之平面顯示器之背光源散 熱裝置及散熱風扇之分解立體圖。 [:帛6圖.本發明第―實施例之平面顯示器之背光源散 熱裝置及賴風权組合剖視及示意圖。 第7圖：本發明第二實施例之平面顯示器之背光源散 熱裝置之分解立體圖。 帛8圖·本^月第—實施例之平面顯示器之背光源散 熱裝置之組合剖視圖。 【主要元件符號說明】 11背光單元 112發光元件 114導熱部 組裝孔 2〇 容置空間 1 背光源模組 111基座 ， 113導接件 ^ 12 電路板 2 支撐框架 C:\Linda\PK Pet\PKI0|34. doc00/08/07/01:37 PK —12～ 200809713 [Simple description of the diagram] f 1 ® : f Decomposes the internal view of the backlight of the flat panel display. Fig. 2 is an exploded perspective view and an enlarged view of a backlight heat sink of a flat panel display according to a first embodiment of the present invention. Fig. 3 is a sectional view showing the combination of a backlight heat sink of a flat panel display according to a first embodiment of the present invention. Fig. 4 is an exploded perspective view showing a backlight heat sink of the flat panel display of the first embodiment of the present invention. Fig. 5 is an exploded perspective view showing a backlight heat sink of a flat panel display and a heat dissipating fan according to a first embodiment of the present invention. [: Fig. 6 is a cross-sectional view and a schematic view of a backlight heat sink of a flat panel display according to a first embodiment of the present invention. Figure 7 is an exploded perspective view showing a backlight heat sink of a flat panel display according to a second embodiment of the present invention. Figure 8 is a cross-sectional view showing the combination of the backlight heat sink of the flat panel display of the present embodiment. [Description of main component symbols] 11 Backlight unit 112 Light-emitting element 114 Heat-conducting part assembly hole 2 〇 accommodating space 1 Backlight module 111 pedestal, 113-conductor ^ 12 Circuit board 2 Support frame C: \Linda\PK Pet\ PKI0|34. doc

06/08/07/01:37 PM 13 — 200809713 3 散熱基板 31 散熱槽道 32 散熱鰭片 6 背光單元 61 基座 62 發光元件 63 極片 7 電路板 8 支撐框架 80 容置空間 9 散熱基板 a 平面顯示器 b 散熱風扇06/08/07/01:37 PM 13 — 200809713 3 Heat-dissipating substrate 31 Heat-dissipating channel 32 Heat-dissipating fins 6 Backlight unit 61 Base 62 Light-emitting element 63 Pole piece 7 Circuit board 8 Support frame 80 accommodating space 9 Heat-dissipating substrate a Flat display b cooling fan

Claims (1)

200809713 十、申請專利範圍： 1、一種平面顯示器之背光源散熱裝置，其包含·· 至少一背光單元，其設有一發光元件及一導熱部，該 導熱部用以吸收該發光元件產生之熱能； 一電路板，其設有至少一組裝孔，且該電路板與該背 光單元電性連接，以構成一背光源模組； 至少一散熱基板，其中該電路板設置於該散熱基板之 背面，且該發光單元之導熱部係通過該電路板之組裝 孔直接貼設於該散熱基板之背面，以便該散熱基板吸 收及驅散該背光源模組產生之熱能。200809713 X. Patent application scope: 1. A backlight heat sink device for a flat panel display, comprising: at least one backlight unit, which is provided with a light emitting component and a heat conducting portion, wherein the heat conducting portion absorbs heat energy generated by the light emitting component; a circuit board, which is provided with at least one assembly hole, and the circuit board is electrically connected to the backlight unit to form a backlight module; at least one heat dissipation substrate, wherein the circuit board is disposed on the back surface of the heat dissipation substrate, and The heat conducting portion of the light emitting unit is directly attached to the back surface of the heat dissipating substrate through the assembly hole of the circuit board, so that the heat dissipating substrate absorbs and dissipates the heat energy generated by the backlight module. 、依申清專利範圍第1項所述之平面顯示器之背光源散 熱裝置’其中該背光單元另設有一基座，其用以容置 定位該發光元件及導熱部。 、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置，其中該背光單元另設有至少二導接件，該導 接件一端與該發光元件電性連接，其另一端與該電路 板電性連接，以便藉由該電路板控制該發光元件提供 一背光源。 4、依申請專利範圍第2項所述之平面顯示器之背光源散 熱裝置，其中該導熱部之一端相對該基座之底部凸出 且裸露於外部，且該導熱部與該基座之底部形成一預 定高度差’該預定高度差不小於該電路板之纟且牡孔的 厚度。 、衣 5、依申請專利範圍第1項所述之平面顯示器之背光源散 C:\Linde\PK Pat\PK10l34.doc —15 一 nfi/〇8/07/fl!:37 PM 200809713 熱裝置，其中4組裝孔之直徑大於該導熱部之直徑， 以便該導熱部恰可透過該組裝孔貼設於該散熱基板之 背面。 6、 依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置另包含一支撐框架，其對應該背光源模組之形 狀開設有至少一容置空間，以便組裝容置該背光源模 組。 7、 依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置，其中該電路板係直接成型於該散熱基板之背 面0 8、 依申請專利範圍第1項所述之平面顯示器之背光源散 Igg 熱裝置，其中該導熱部與該散熱基板之結合侧係設有 Λ 一焊料層。 9、 依申請專利範圍第8項所述之平面顯示器之背光源散 熱裝置，其中該焊料層係選自一錫膏。 10、 依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置，其中該散熱基板之正面設有數個散熱鰭片及 數個散熱槽道，該散熱鰭片及散熱槽道相對該散熱基 板之縱向形成延伸，該散熱槽道用以導引空氣由下而 上縱向％IL動’以驅散該散熱鱗片表面之熱能。 11、 依申請專利範圍第1項所述之平面顯示器之背光源散 熱裊置，其中該電路板選自一軟性印刷電路板及一硬 性印刷電路板之一。 12、 依申請專利範圍第丨項所述之平面顯示器之背光源散 C:\Linda\PK Pftt\PKI0134. doc 0€/0β/07/01:37 pm —16 — 200809713 熱裝置，其中該發光元件選自—發光二極體〔LED〕 13、依㈣專利範圍第6項所述之平面顯示器之背光源散 熱裝置’其中另設有數個散熱風扇，該散熱風扇設置 於該散熱基板之下方，以提昇該散熱基板之散熱效率 〇 依甲滑專利範圍 献狀罢廿丄 丨4〜丁囬賴不斋之背光源散 …衣置、巾該導熱部係設置於該發光元件 15、依申請專利範圍第i項所述之平面 ^一。〃中遠導熱部之材質係選自餘、鋼、金及銀The backlight heat sink of the flat panel display according to claim 1, wherein the backlight unit is further provided with a base for accommodating the light emitting element and the heat conducting portion. The backlight heat sink of the flat panel display according to the first aspect of the invention, wherein the backlight unit is further provided with at least two guiding members, one end of the connecting member is electrically connected to the light emitting element, and the other end thereof The circuit board is electrically connected to provide a backlight by controlling the light emitting element by the circuit board. 4. The backlight heat sink of the flat panel display according to claim 2, wherein one end of the heat conducting portion protrudes from the bottom of the base and is exposed to the outside, and the heat conducting portion forms a bottom portion of the base. A predetermined height difference 'the predetermined height difference is not less than the thickness of the circuit board and the thickness of the hole. , clothing 5, the backlight of the flat panel display according to the scope of claim 1 of the patent application C:\Linde\PK Pat\PK10l34.doc —15 a nfi/〇8/07/fl!:37 PM 200809713 thermal device, The diameter of the assembly hole is larger than the diameter of the heat conducting portion, so that the heat conducting portion can be attached to the back surface of the heat dissipation substrate through the assembly hole. 6. The backlight heat sink of the flat panel display according to claim 1 further includes a support frame, and at least one receiving space is formed corresponding to the shape of the backlight module, so as to assemble and receive the backlight module. group. 7. The backlight heat sink of the flat panel display according to claim 1, wherein the circuit board is directly formed on the back surface of the heat dissipation substrate. The backlight of the flat display according to claim 1 of the patent application scope The source-scattering Igg thermal device, wherein a bonding layer of the heat conducting portion and the heat dissipating substrate is provided with a solder layer. 9. The backlight heat sink of a flat panel display according to claim 8, wherein the solder layer is selected from a solder paste. The backlight heat sink of the flat panel display according to the first aspect of the invention, wherein the front surface of the heat dissipating substrate is provided with a plurality of heat dissipating fins and a plurality of heat dissipating channels, and the heat dissipating fins and the heat dissipating channels are opposite to the heat dissipating The longitudinal direction of the substrate is extended, and the heat dissipation channel is used to guide the air from the bottom to the upper longitudinal direction to dissipate the heat energy of the surface of the heat dissipation scale. 11. The backlight heat sink of a flat panel display according to claim 1, wherein the circuit board is selected from the group consisting of a flexible printed circuit board and a rigid printed circuit board. 12. The backlight of the flat panel display according to the scope of the patent application is C:\Linda\PK Pftt\PKI0134. doc 0€/0β/07/01:37 pm —16 — 200809713 Thermal device, wherein the light The component is selected from the group consisting of a light-emitting diode (LED). The backlight heat-dissipating device of the flat-panel display of the fourth aspect of the invention is further provided with a plurality of heat-dissipating fans, and the heat-dissipating fan is disposed under the heat-dissipating substrate. In order to improve the heat dissipation efficiency of the heat-dissipating substrate, the patent scope of the patent is released. 4~ Ding Hui Lai's backlight source is scattered... The heat-dissipating part is disposed on the light-emitting element 15, according to the patent application. The plane described in item i of the scope. The material of the heat transfer part of 〃中远 is selected from the balance of steel, gold and silver. C:\Linda\PI Pat\PKIOI34.doc 06/08/07/01:37 PH —17 —C:\Linda\PI Pat\PKIOI34.doc 06/08/07/01:37 PH —17 —
TW095128911A 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display TWI286721B (en)

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Application Number Priority Date Filing Date Title
TW095128911A TWI286721B (en) 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display
JP2007011265A JP2008041638A (en) 2006-08-07 2007-01-22 Heat dissipation device for backlight light source for flat panel display
GB0701544A GB2440748A (en) 2006-08-07 2007-01-26 Heat-dissipating device for a back light source in a flat panel display
DE102007006594A DE102007006594A1 (en) 2006-08-07 2007-02-09 Heat dissipation device for background light source for flat screens
FR0753815A FR2904749A1 (en) 2006-08-07 2007-03-14 THERMAL DISSIPATION DEVICE FOR BACKLIGHT SOURCE

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TW095128911A TWI286721B (en) 2006-08-07 2006-08-07 Heat-dissipating apparatus for a back light module of a liquid crystal display

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CN108337857A (en) * 2018-02-01 2018-07-27 深圳创维－Rgb电子有限公司 Fixed structure, fixing means and its television set of heat dissipation aluminum strip
CN108337857B (en) * 2018-02-01 2020-04-07 深圳创维－Rgb电子有限公司 Television receiver

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GB2440748A (en) 2008-02-13
JP2008041638A (en) 2008-02-21

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