TW200806731A - A film and a release film - Google Patents

Abstract

The present invention relates to a film containing a layer formed of a specific 4-methyl-1-penterne-based copolymer and having a specific thickness and a specific thermal shrinkage rate. According to the present invention, a film that is excellent in thermal resistance and release property is provided, and in particular, a release film that is suitable for use in manufacturing a laminated article by press molding is provided. Also, when the film of the present invention is used as a release film in the steps of heating and pressing in the manufacture of flexible printed substrates, the adhesion between a metal plate and a cover layer and the exudation of the adhesive to adhere to other parts can be avoided, no voids are formed in the non-printed portion on the substrate, and the exposed portion such as the circuit terminal is not contaminated by the exudation of the molten adhesive. Further, since no creases occur on the release film, no voids are formed by the poor fitting of the release film and thus a flexible printed substrate having good appearance can be obtained.

Description

200806731 IX. Description of the invention: [Technical field to which the invention pertains] :: A film containing a film which is superior in heat resistance and release property by a 4-methyl-p-pentene-based copolymer, and by pressurization Film formation. The release film which is suitable for use in the second or sheet-like laminate is as follows: the cover layer 2 of the protective layer is heated and pressurized to adhere thereto: When the "talk" is formed on the surface of the circuit, the release film is suitable for use. [Prior Art] = Jinsheng is a raw material film or sheet that holds a plurality of raw materials, and when the laminate is pressed by a door, 'in order to prevent the metal plate or the like and the obtained laminate from being used as two Type film. In addition, it is required to have high heat resistance and excellent release property for the release film. "The film is used as a flexible printed circuit board (hereinafter also referred to as the field (10). ACM material used for film and aircraft parts is made of release film and rigid printed circuit board. (4) film = type film, release film for molding, and rubber sheet. 3L 'release film for special adhesive tape Etc.: The substrate and the cover layer of the circuit are usually formed by thermal hardening = adhesive (4). On the single side of the substrate, the cover layer is only adhered to the single side of the substrate on which the circuit is formed. In the case where the board is provided with two or more layers of circuits, the cover layer is adhered to the 312XP/invention manual (supplement)/96-10/96123220 6 200806731 base ► board ^ on both sides. See, 'iV n The coverage of the hardening type of adhesive = mouth = calendar. Then 'to prevent this between the cover layer and the metal plate, the FPC manufacturing release film is used to hold the 耆 耆, and will be - as a FPC manufacturing use: For film. Women, four ethylene sulphur - six propylene Polymer, #二 = film using polytetraethylene-based polymer; film of polymethylpental oxide, etc., f-seeking fluorine on the surface of the circuit forming the FPC, shape-inferior + forming the non-printing part of the circuit: L is different:: When the layer is covered, the gap will be formed in the non-printing part, and it will be sealed. (10) The reduction of the circuit life is significantly reduced in the FPC, in order to connect with other parts. The "connection" is the shank of the circuit that forms the circuit. The ρ is not covered by the cover layer = the part of the terminal part is covered and coated on the cover 2::Do not be heated and added Melting occurs when the adhesive is applied, and the terminal portion of the terminal is formed to form a coating layer of the adhesive, which is a problem of the cause of poor connection. In addition, the thermal expansion ratio with respect to the substrate and the cover layer to the conventional cover layer is large. When the second system is used for the adhesion of the cover layer, the surface of the release film will be opened. Therefore, the part of the hair-sensing grade will be affected by the release film and the release film. The problem of gaps between the two, due to the transfer of sensitive texture to FPC' The problem of FPC having a sufficient appearance can not be obtained. 312XP/Invention Manual (Supplement)/96_1〇/9612322〇7 200806731 In Patent Document 1 and Patent Document 2, there is disclosed a release type for the purpose of solving the above problems. However, in the step of heating and pressurizing the delamination film on the circuit for adhering the cover layer to the surface of the substrate, the effect of suppressing wrinkles in the enamel may not be sufficient, and it may not be obtained. The problem of the FPC that satisfies the appearance of the invention. Patent Document 1 Japanese Patent Laid-Open No. Hei. No. 175247 (Patent Document 2) Japanese Patent Laid-Open No. 2003-21 No. 602 (Invention) (Problems to be Solved by the Invention) The invention provides a film suitable for a release film, in particular, a heating and M step suitable for manufacturing an FPC, which can prevent the adhesion of the cover plate and the adhesive agent from flowing out to adhere to other parts, The portion which is not formed in the terminal portion of the circuit is contaminated without being melted and discharged, and the film is produced. Small-sized wrinkled release film (the means to solve the problem) This: In order to solve the above problems, the author and others have studied hard. 3 is formed by a specific 4-methyl-1-pentene copolymer, ^: A film having a specific thickness composition and a heat shrinkage rate can solve the above-mentioned problem τ4, and the present invention has been completed. The invention provides the following: π] a film characterized by having at least one layer (1) formed of an olefinic copolymer, the fluorenylmethyl group, the 1-pentene system having 95 5 mass [99·5 mass% of the: 4 olefin copolymer r group 〜1, pentene 312XP / invention manual (supplement) / 96-10/96123220 8 200806731 constituent unit and 0.5 mass% ~ 4 5 mass The number of carbon atoms with a carbon number of 3 to 20 is less than that of methyl 1-pentene. The composition of the second is early, and the layer of acne is 40//m~90//ΙΠ And the thermal shrinkage of the film as a whole is 1% to 5%. [2] The above-mentioned layer (A) of at least one layer of the above [n film of the above-mentioned layer u) is the outermost layer. =上上:[ί]::Γ, which contains multiple layers, having the outermost layer on both sides of the film according to _50°c~15(rc soft layer 2(A). [5] as above </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; (6) The film according to the above [3] or [4] wherein the soft polyolefin is selected from the group consisting of terpenes, propylene, butene, pentene, hexene and methylpentene. [7] The film of the above [3] or [4], wherein the soft polyolefin is selected from the group consisting of copolymers of ethylene and acrylic acid, copolymerization of ethylene and methacrylic acid §| a human body, a copolymer of ethylene and acrylic acid, a copolymer of ethylene and methacrylic acid, and a copolymer of a part of the ionic crosslinks thereof. [8] The film according to any one of the above [3] to [7] Wherein, the above layer (a) whole 312XP / invention specification (supplement) / 96-10/96123220 9 200806731 body thickness is the overall thickness of the film &lt; 25% ~ 8〇%. [9] as above [2] ~ (8) Secondary-item a film, wherein at least one of the surface of the film formed is formed by the embossing process, and the film of any one of the above [1] to Μ3 is extruded. The film obtained by the method of opening or co-extrusion molding is a film of any one of the above (1) to (1), which has a specific 4_methyl group. A film having a specific thickness and a heat shrinkage ratio, which is a layer of pentene, is excellent in heat and release property, and is therefore suitable as a release film. It is used as a release film in the production of FPC. It can prevent the metal plate and the 'cover layer, the adhesive layer, and the adhesive agent from flowing out and sticking to other parts when the heat is pressed and pressed, and the: the two sides do not form a gap in the non-fourth part. The exposed portion of the terminal portion of the circuit, etc., is contaminated by the melt and flow of the adhesive agent. In addition, when the cover layer is adhered by heat and pressure, wrinkles are not formed on the release film, so that voids are not formed due to poor tracking. Can effectively improve the enemy pattern The Fpc molding industry which is inferior in appearance is extremely valuable. Further, the layer containing a specific soft polyolefin imparts good cushioning properties for causing the release liner to follow the unevenness of the substrate surface on which the circuit is formed, and There is less spillage during crucible and pressurization, and it does not cause Fpc 312XP/invention manual (supplement)/96-10 due to its adhesion to the substrate surface on which the circuit is formed and the metal plate used for heating /96123220 10 200806731 Problems such as reduction in product yield and workability. [Embodiment] The film of the present invention has a layer (1) formed by a combination, and the heat shrinkage of the layer (1) 敕 2 4: base + pentylene copolymer film as a whole The rate is .5%. The sub-group is 4〇&quot;~90", and [4-f-based-1-pentene-based copolymer] 4-the 彳-彳 p ^ 95.5 used in the present invention 9.5 quality 'from pentene 4 = "polymer" means a composition that has a composition of 〇 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖 咖. Preferably, the constituent unit of pentene is 96 t, and the original Shilu original cylinder other than 4-methyl-1-pentene. Berry / 〇 〇 Berry% and come in! The quality of the mass run is from two degrees, the constituent unit of the smoke is 97% by mass to 98% by mass, and the constituent unit of the olefin having the atomic number of 3 to 20 from 4 soils and -pentene is 2 masses of soil ^ The carbon of the present invention is used in the production of the FPC of the film of the present invention. When the two phases are used in the manufacture of FPC, the number of carbon atoms other than 4-methyl-1-pentane is 3~2. The unit is below the above upper limit value, and the structure of Xiaogong is more than the above lower limit value = film == followable circuit" brush portion _ brush portion caused by the 4-methyl + used in the invention The number of carbon atoms other than pentene 3 to olefin' may, for example, be at least 1-hydrocarbon selected from the group consisting of propylene, butene, hexene, diterpene, tetradecene and octadecene. Among these, 312XP/Invention Manual (Supplement)/96-10/96123220 11 200806731 is preferably 1- in terms of good copolymerizability with 4-mercapto+pentene and good boastability. Terpenes, tetradecene and hydrazine-octadecene. In the 4~methyl-1-pentene copolymer of the present invention, the flow rate of the entanglement according to the entanglement (temperature shoe 'load weight 5. 〇 kg) is 〇. 5g / l 〇 minutes ~ 200g / 10 minutes Preferably, it is 5 g / 1 〇 minutes ~ 1 〇〇 g / i 〇 points, more preferably 10g &quot; 0 points ~ 50g / 10 j. When the melt flow rate is 200 g/10 minutes or less, sufficient mechanical strength can be obtained. On the other hand, when the melt flow rate is 0.5 g/10 minutes or more, good formability can be obtained, which is preferable. The melting point (Tm) of the 4-methyl+pentene copolymer used in the present invention is preferably 22 (rc~24 (range of rc, more preferably 225 °C to 24 (TC) Further, the softening temperature of the domain obtained by measuring according to ASTM D1 525 is preferably in the range of 1600 cc to 2 Torr (the range of rc, more preferably in the range of ° to 200 ° C.) 4-A used in the present invention. The ketone-1-pentene copolymer is produced by a conventional method, and is not particularly limited as long as the polymerization catalyst and the polymerization method. As the catalyst, for example, a Ziegler type catalyst (according to the carrier or the unloaded) a combination of a titanium-containing compound and an aluminum compound), a Phillips-type catalyst based on a chromium oxide-supporting catalyst, and a Kalinsky-type catalyst (based on a supported or unsupported metallocene-type compound) An organoaluminum compound, in particular, a combination with an aluminoxane. The polymerization method may, for example, be a polymerization method in the presence of the above catalyst, a vapor phase fluidized bed polymerization method, or a solution. Polymerization method, or high pressure bulk polymerization method with a pressure of 2 〇Mp^ and a polymerization temperature of 100 ° C or higher. 12XP/Invention Description Book (supplement) /96-10/96123220 12 200806731 More specifically, it can be like n 士宙i,, special open... 战号公:专::^ 记录, in the presence of catalyst, 1, 1G5G22 5 tiger The number of atoms in the publication (10) pentene and other carbons of the methyl group + the pentyl group are derived from the single layer film of the above layer (α) which is used in the present invention. (1) Outside: a film of a cow It may also be a multilayer film, except for the above layer 1 5rc; 5:7 has a layer (8) formed of a soft poly-smoke having a domain softening temperature of 50 0150 c according to ASTM D1525, wherein the layer (A) is the most [Soft Polyolefin] Soft polyolefin refers to a property of imparting softness to a release film when the film of the present invention is used as a release film for heating and pressurization. ASTM D1 525 has a softening temperature of 5 (rc ~ 150 ° C, preferably 60 ° c ~ 150 ° C, more preferably 7 (rc ~ 15 (rc; according to ASTM D1238 (temperature 260 ° C, load 5 The value of the melt flow rate of Okg) is 0.5 g/10 min to 2 〇〇g/l 〇, preferably 5 g/1 〜 min to 1 〇〇 g/i 〇 minutes; the melting point measured by DSC ( Tm)g 8(rc~24〇 c. More preferably ι 〇〇〇 C ～ 240. i When the multilayer film of the present invention is used as a release film for FPC production, the soft polyolefin is used to impart so-called cushioning properties to the release film. When manufacturing FPC, the above soft polyolefin will improve the tracking followability of the substrate surface on which the circuit is formed, and prevent the adhesive self-covering pen 312XP/invention specification (supplement)/96-10/96123220 13 200806731 layer The end faces flow out onto the circuit. The soft polyolefin satisfying the above conditions may, for example, be a monomer or a copolymer of a rare slave selected from the group consisting of ethylene, monopropyl, butene, pentene, hexene, and methylpentene; a copolymer of acrylic acid vinegar, a copolymer of ethylene and methacrylic acid, a copolymer of ethylene and acrylic acid, a copolymer of ethylene and methacrylic acid, and a partial ion thereof; For example, a soft polyolefin such as the one disclosed in Japanese Laid-Open Patent Publication No. Hei No. Hei. These may be used singly or in combination of two or more of them, which are particularly suitable for use by having a moderately-occurring conjugated ketone-butylene-1 copolymer, ethylene propylene and propylene. Moreover, these soft women can also be used as a layer of two or more layers. According to the order of 1 layer, these soft poly-hydrocarbons can also be easily obtained by the market. The trade name of the company is: TA_ XR, San Niu 'σ 二井化

POLYCHEMICAL (share) system name: evej?Le 0NT

[Film of the invention] The film of the present invention has a layer (1) formed by at least one layer, and the 4_f group is copolymerized with 95.5% by mass to 99.5% by mass of the copolymerization system and 0.5% by mass to 4% by weight. 5 mass% of the constituent units of the olefin composed of 4 = ~pentene and having a monoatomic number of 3 to 20: carbon other than yt-pentene: m~9_; and the overall heat shrinkage ratio of the film is 曰]%~=body The thickness is 40# 312 χΡ / invention specification (supplement) / 96-10/96123220 200806731 The film of the present invention is characterized in that m, /, has the above layer (A). Therefore, the present invention is a single-layer film formed only of the above layer (1) and a multilayer thin film having at least one layer (A). The use of the above-mentioned multilayer film as a release liner is superior to Wei, and therefore it is preferred that the layer (1) of the phantom layer is the outermost without impairing the object of the present invention, and the layer (a) may also contain, for example, polyethylene. A fluorine-based resin, a polyphenylene sulfide, a polyester, or the like is a polymer other than the 4-f-based + pentacene-based copolymer, but 9 〇% by mass to 100 皙 4 4, and ^ s ^ 〇, methyl The mono-pentaylene copolymer is more preferably 95% by mass or more preferably 1% by mass. In the case of using the multilayer film of the present invention as a release film for FPC production, in particular, in the case where the surface of the substrate on which the circuit is formed has a large undulation difference and a better cushioning property is required, it is preferable to further The multilayer film of the layer (B) formed of the soft polyolefin, and the layer (B) may be a multilayer of 2 ^ or more. The layer (B) may also contain, for example, polydecyl propylene, polyethylene terephthalate (pET), poly(p-butylene dicarboxylate) (PBT), within the scope not impairing the object of the present invention. Such as polyacetic acid, polyamine-6, polyamine publication, 6, decylamine 11, polydecylamine 12 and other polyamines, but layer (B) preferably contains 9 〇 mass ° / ◦ ~ 100 % by mass of soft polyolefin, more preferably 95% by mass to 1% by mass of Bentley 100% by mass. $0 As a multilayer film of the present invention, it may have a layer without damaging the object of the present invention. Α) and the layer (C) other than the layer (Β). 'The resin which can be used for the layer (C)' is preferably heat-resistant 312ΧΡ/invention specification (supplement)/96-10/96123220 15 200806731 The resin may, for example, be a polyolefin such as polypropylene; a polyester such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT); and polyamine. -6. Polyamides such as polyamide-6, 6, polyamide 11, polyamide 12. These resins are readily available from the market. For example, PRIMEPOLYPRO, manufactured by PR I ME POLYMER, Mitsubishi The product name of the plastic product is N0VAPET, and the product name of the product is AMILANE, etc. The resin may be used singly or in combination of two or more. As the multilayer film of the present invention, for example, : a laminate of two layers of layer (A) / layer (B) and layer (A) / layer (C); layer (A) / layer (B) / layer (C), layer (A) / layer ( C) / layer (A) and layer (A) / layer (B) / layer (A) three-layer structure. In order to use the step of omitting the identification of the back of the film, it is preferred to have at least 2 The layer (A) above the layer, and the two layers of the layer (A) are the outermost layers on both sides of the film, and in order to obtain good cushioning properties, it is preferable to contain the layer (B). Particularly preferred is the layer (A)/ The three-layer film of the layer (B)/layer (A). In the multilayer film of the present invention, the layer (A) functions as a release layer, and the layer (B) functions as a buffer layer. Further, the layer (B) Because of the moderate cushioning property, in the process of manufacturing the FPC, the coating of the non-printing portion of the cover layer is surely carried out, and the formation of the FPC which is completely void-free and integrated can be achieved. In the case where the layer (A) is one layer, the thickness of the layer (A) is preferably from 40/m to 90/m, more preferably from 40/m to 80/m. Further, the present invention In the multilayer film, when the layer (A) is two or more layers 312XP/invention specification (supplement)/96-10/96123220 16 200806731, the above layer (A) overall thickness is preferably 4M-m. "One" is more preferably = when the layer (A) is set to the outermost layer on both sides, it is preferable if the layer (1) is thick. ^ That is, if the severity of CL is not less than the above lower limit value, the degree of stability of CL can be prevented, and the cushioning property can be maintained. 3) The thickness is 3〇~1〇0(4), preferably (4)(10). The thickness of the layer (B) on the right side is preferably the lower limit, and if the upper limit is the upper limit, the amount of overflow of the layer (8) during the buffering process can be reduced, so that the order heating and the present invention are In the multilayer film, the ratio with respect to the overall thickness is preferably 3 〇; the degree is in the case of a plurality of thin enamels containing the above layer (8); the thickness of the above layer (1) of the overall thickness of the film is better: In addition, it is possible to prevent the occurrence of crepe, and it is preferable if the above-mentioned limit is buffering. & below the eye value can maintain the thermal shrinkage of the film as a whole: 1% to 5%, preferably more than 1.5^2. 5%. If the heat shrinkage rate is 1% or more, the film of the invention will not wrinkle on the surface of the film when the cover layer is adhered to the enamel, and the heat shrinkage rate of the 1 bond film is 5% or less. When the cover layer is adhered, it is preferable if no gap occurs between the films. Circuit surface and release type The heat shrinkage rate of the film of the present invention means that the film of the present invention is heated 312XP/invention specification (supplement)/9(4)/9612322〇17 200806731 when it is shrunk, relative to the film length before heating , the ratio of shrinkage of the film. That is, the film length Li measured at room temperature before heating is taken out after being placed in a gas atmosphere at a temperature of 170 ° C for 3 minutes, and then cooled at room temperature for 30 minutes. The part of u is = degree L2, and the value obtained by the following formula (1) is taken as the heat shrinkage rate. Further heat shrinkage rate (%) = (L1-L2) / Llxl 〇〇 (1) Formula: U: film length before heating, Cffl; L2: length of the portion of the L1 after heating, cm) The heat shrinkage rate of the film of the invention is the value P in the direction in which the film is stretched, and the length in the direction in which the film is also measured at the heat shrinkage rate. Tm / film-extended extending direction Example ^ is used to extrude the film of the present invention into: Immediately and continuously using the shape of the extension when the extension is light, and the length of the P extrusion in the th direction. In addition, the extension of the ° axis, the extension of the two vehicles can be carried out for each time (10), and the heat shrinkage rate of the two-times can be performed for each of the "squares; the extension. The extrusion direction of the mold which occurs on the surface of the film by the biaxial stretching is determined flat. The direction of the line can be easily obtained from the die line. In addition, at least one of the surface of the film of the present invention, preferably the surface layer formed by the layer (A), is roughened according to JIS B0601. \,, after processing the film is better than 0. Bu with m,; y: 〇. 〇 Bu 20", the surface roughness of the surface layer is the upper soil. 1~2#m. The film properties. In the inner circumference, a good release type is obtained. 311 〇/96! 23220 18 200806731 In addition, in the film of the present invention, the temperature is 15 Torr. The elastic modulus of the underarm U,) 乂 ^ is 1. 5xl 〇 7~8. 5xl 〇 7MPa range. Here, the temperature 15 (the number of turns in rc (E,) is the temperature in the direction of extension 15 〇. The dynamic bedding density of the underarms. Specifically, it can be cut from the film of the present invention. The sample having a length of G. 13_ and a direction of 5 Å in the direction of the vertical extension 'uses a dynamic storage elastic modulus measuring device, for example, a ta company, according to the measured temperature - 15 〇 2 〇〇 t:, the heating rate is 3. /min: j疋 pull type. The conditions of stretching and measuring the frequency of i Hz are measured to obtain a temperature of 15 (the modulus of elasticity (E,) at TC.) When the film of the film is used as a release film for FPC production. The release film when heated with == sticky...PC is close to 150 ° C. Thus, if,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The release film can be prevented from being sensitive, and the release film can have good cushioning properties. The right side is the upper side. [The method for producing the film of the present invention] The film of the present invention has at least a layer. The layer (A) formed by the combination, the 4_dipentene oxime, and the amount of the mixture of 95.5 mass% to 99.5f Bit...mass...quality is: =--戍 的 构成 ” ” ” ” 〇 〜 〜 〜 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The degree of heat shrinkage of 40// 溥 溥 溥 脰 1 1 1 本 本 本 本 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本For the film, the layer is combined with the heating pressure r, etc.: 312XP / invention book (supplement) / 5) 6-10/96123220 19 200806731 The extrusion molding method using the τ font device or the mold hole for adjusting the slit portion of the mold = The forming method is made by making the thickness of each layer of the film, and can be widened: after the wide and wide film is easily and uniformly controlled, since the width of the width can be easily widened, the τ word mold is used to match various shapes. : The molding method is suitable as a release liner for the production of FPC; in addition, if it is a co-extrusion molding method, it may be mixed at the same time. Laminated film. Therefore, the adhesion strength is also good. When manufacturing a single-layer film formed only by layer (1), a single layer is attached. In the extrusion molding machine of the type, the extruder and the crucible are set to 260 to 33 (rc and extruded). In terms of production, the layer (A) / layer (8) / layer (A) is produced. When the above-mentioned 3 = bismuth film is formed, for example, two types of three-layer τ-type extrusion molding machines can be used, and the temperature of the extruder and the stencil mold can be set to 23 〇 to 3, and extrusion molding can be performed. In addition, the multilayer film can be integrated into a plurality of layers by an adhesive, and a film of an urethane-based, isocyanate-based or epoxy-based adhesive can be applied as a film between the layers. These pieces need to be pressure-bonded to form. Further, as another method, a maleic anhydride-grafted polyethylene or a maleic anhydride-grafted polypropylene-like adhesive resin may be simultaneously formed between the respective resin layers in a film form and each resin layer. Extrusion, lamination. Further, a method of thermally forming a film or sheet in advance in the above-described order may be employed as a method of hot-pressing 312 ΧΡ / invention specification (supplement) / 96-10/96123220 20 200806731 or hot rolling. - In addition, the film having a heat shrinkage ratio of 1% to 5% of the present invention can be obtained by stretching a film of the above layer (A) and (4) extending the film in the case of a single layer film; In the case of a multilayer film, a multilayer film having the layer (8) formed of the above soft polyolefin and at least one layer of the layer (4) as the outermost layer can be obtained by stretching the film. Further, as the stretching method, a conventional method can be suitably employed, and the stretching can be carried out by a method such as a tenter method or a roll stretching method. For example, when the multilayer film formed of the above layer (layer) / layer (8) / layer (layer) is stretched, the heat shrinkage ratio in the extending direction is 1% to 5%, and the film is stretched. C, preferably 10 (TC~15 (the range of rc. In addition, (4) ^ = the extension ratio of the amount is extended, the stretching ratio is usually U, preferably 2A4%. Further, the extension can be uniaxially extended or double extended It is carried out sequentially or simultaneously. The crucible is further oriented/specifically, and the thin material of the present invention is stretched using a roll according to the raw material film obtained by extrusion or coextrusion method. The raw material film obtained by the method or the co-extrusion molding method is contacted and passed through the surface of the surface at which the circumferential speed of the rotation is different, so that the raw material film; the roller (four) of the contact speed (m/min) is later compared with the original (four) Broadcasting, the light peripheral speed (m/min) is faster, that is, the speed of the film of the present invention = the speed of the surface f through the light surface that is first contacted, thereby When the film passes between the two or more Li Kun, 3 catches 312XP/invention manual (supplement)/96] 〇/96123220 21 200806731 The surface of the roll used by Kyash is a mirror roll, or embossing can be used lightly. In the case of a rug roller, the embossing depth is preferably processed to have an average thickness (Ra) of i "m~2 〇〇/im, Roll 2 〇〇 quot rt: rt: exemplified by the manufacture of the above-mentioned thin fruit formed by the layer (A) / layer (8) / layer (A), 4 cases, showing an example of the manufacturing apparatus of the film of the present invention In Fig. 4, a methyl-1-7-1 silk composite and a soft polyolefin which are respectively melted by two extruders are extruded through a multi-manifold type three-layer T-shaped crucible 21, and The cooling roll 22 is temporarily cooled to 5 (rc 15 〇 C ' to form a film. Secondly, the film is heated at a temperature of 5 〇. (1) 〇〇.. = Γ heating, followed by a temperature of 5 rC 〜 2, C of the first 丽 2 ,: The person is the second embossing roller 25 to perform embossing treatment, and at the same time, the material of the second embossing roller is used for the material of the 11th, that is, the film is passed through the second pressing roller 27 and the second &gt; 1_25 The speed between: the first between the first pressing roller 26 and the J embossing roller 24, the second enamel film in the first embossing cage 9 skull and hunting this to the thin and brother 2 of the present invention When extending between, it is possible to obtain a range of round 〇〇 C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C Knife m/knife. Also, if it is heat shrink Not less than 1% of the gluten m to prevent the release of the pound amine only total #. Not '1 u of the consumption of 'in order to stop the natural contraction of Wei Lai's official, can also be used in (4) processing 312xp / invention manual (supplement) / 96 -10/961232: 20 22 2UU8U6731 The temperature of the resin is full, and the film is tempered twice. The second step is carried out. The process of stretching the film and the stretching step of the film can be carried out separately. In the natural stretching step 4 of the film, in order to prevent the forming line from being tempered, the forming step and stretching may be carried out at a temperature not exceeding the melting point of the resin. The other two: Of course, you can also implement thin marketers continuously. γ ',,. The device for performing such a step is a [release film] release film which is superior in heat resistance and release property, and can be suitably used as a machine-iron article: Γ言' can be used, for example, for FPC manufacturing. Type film, aerospace:: from::: release film for rigid materials, rigid printed substrate: release film for semiconductor sealing materials, release film for FRP molding, release film for hardening of / / film material, special adhesive tape Release film, etc. Among these, the film of the present invention can be suitably used for a release film for FPC production. In the production of FPC, a step of holding a substrate and a cover layer of a circuit on a metal plate and heating and pressurizing it is carried out by using a thermosetting type adhesive. In this step, in order to avoid the occurrence of adhesion between the cover layer and the metal sheet during heating and pressurization, the release film of the present invention is used in the middle. Figure 1 is a cross-sectional view showing a multilayer film of the present invention. Further, Fig. 2 is a cross-sectional view of a release film of the present invention in a state of being pressed at the time of forming an FPC, 312 ΧΡ / invention specification (supplement) / 96-10/96123220 23 200806731 by using the release film of the present invention. The gap between the non-printing department will be intimately connected and integrated by the king of the company. In Fig. 2, 8 is a film of the present invention, and 9 is an FPC. The "Shaft of the Moon" film is formed by the coating layer during the press forming, and the heat-curable adhesive of the main cloth is deformed before it starts to flow due to heating, and the cushioning property of the intermediate layer (B) The release property of the outermost layer (A) is superior, as shown in Fig. 3, the film 8 of the invention of the release film is adhered to the surface of the double layer 6 and the copper foil surface of the circuit, which does not occur. The adhesive flows out, and FPC molding can be performed in a state in which the exposed portion and the cover layer are clearly distinguished. Further, in the release film of the present invention, when the cover layer is adhered and pressure-molded, wrinkles are less likely to occur on the release film, so that the surface of the release film is not affected by the surface of the release film. The gap caused by the poor tracking is generated, and the crepe is not transferred to the Fpc, so that an FPC having an excellent appearance can be obtained. Further, when the cover layer is subjected to adhesion heating and press molding, since the layer (8) is less likely to overflow, the layer (β) adheres to the substrate surface on which the circuit is formed, and the heat and pressure forming portion does not occur. The use of the metal sheet causes problems such as a decrease in the yield of the FPC product and a decrease in workability. (Embodiment) The present invention is not limited by the following examples, which are explained in more detail by way of examples. [Measurement of Resin] (1) Measurement target 312XP / invention manual (supplement) / 96-10/96123220 200806731 Resin (4-mercapto-1-pentene copolymer, soft polyolefin) (2) Fractional flow Rate (mfr) The MFR of the resin was measured in accordance with ASTM D1238 at a load of 5 〇 kg and a temperature of 26 〇 ° C. (3) Density Resin twist is measured according to ASTM D1505 by density gradient tube method. (4) Melting point The melting point of the resin was measured by a DSC apparatus (manufactured by Seiko Instruments Co., Ltd.). Using a DSC apparatus (manufactured by Seiko Instruments Co., Ltd.), the temperature was raised by ίοc/min in air to a temperature higher than the melting point of each resin by 3 (rc), and the endothermic peak temperature at this time was taken as the melting point of the resin.纟, at a temperature higher than the temperature of _, 3 points, followed by 1 (rc / temperature to room temperature. (5) domain softening temperature P 1 / β ^ or gram weight μ degree is obtained by injection molding The flatness of each resin is measured according to ASTM D1525. [Measurement of film] (1) Heat shrinkage rate: When manufacturing a film, the extrusion molding machine or the mound is squeezed: Out: ΐSetting temperature and setting temperature of τ font are set to _ The width of the binding film that is formed by shaping is 6{)()mra. The position is cut out from the extrusion direction (hereinafter referred to as md square production, thinking In the direction (hereinafter referred to as TD direction), the length of the film is 30 cm 312XP / invention specification (supplement) / 96-10 / 96123220 25 200806731 as a test film. The MD at room temperature before heating will be described later. Directional sore% inflammation τ],, χ double / humiliation gland 17 (^ 夕 卞 白 μ white length weight is U (cm). The test film is temperature-rolled, After heating for 3 minutes, it was taken out and cooled at room temperature for 30 minutes. The room temperature of the test film after cooling was m. The value obtained by the following formula (1) was taken as the heat shrinkage rate (%) of the film = ( L1-L2)/Llxl〇〇(1), (2) Appearance wrinkles in the production of thin materials using an extrusion molding machine or machine with a τ-shaped mold. The set temperature of the extruder and the set temperature of the Τ-type mold are set to C. The film obtained by extrusion molding has a width of 600 mm, and a film having a length of 30 cm in the MD direction and a length of 21 cm in the TD direction is cut out every 5 m, and this is used as a test film. The position of 8 shown in Fig. 2 is subjected to a heating and pressurizing step. The conditions of the Xiao step are a temperature of 160 C, a pressure of 2 MPa, and a heating and addition time of 3 minutes. The epoxy adhesive having a flow start temperature of 80 C is 3 〇 "The thickness of η is applied to the cover layer. The cover layer formed by the polyimide film (thickness 25#... is adhered to the circuit surface formed on the substrate. Thereafter, the test film is taken out, and the second eye is viewed. The evaluation of the occurrence of wrinkles in the film was carried out. All of the 10 test films were visually observed. The case where wrinkles were not confirmed: 〇 Visually confirmed wrinkles on all 4 test films: Δ Visually confirm the wrinkles in 5 to 10 of all 10 test films: X month (3 ) Spillover amount 312XP / invention manual (supplement) / 96-10/96123220 26 200806731 The film is equipped with an extrusion molding machine or a co-extrusion molding machine with a τ word mold. The set temperature of the extruder and the τ font The set temperature is set to 29 〇C. The film obtained by extrusion molding has a width of 600 mm. From the arbitrary position of the film, the length of the / knife-out direction is 1 〇 cm, and the length of the film in the TD direction is 4 sheets, which is set to test thickness [S1]. A stainless steel plate (32 cm x 32 cm x 5 mm thick) was designated as [A], a buffer sheet of paper 1 〇 (30 cm x 3 〇 cm) was designated as [B], and an aluminum plate (3 〇 cm x 3 〇 cm x 〇 · 1 mm) was designated as [C]. As a sample for measuring the amount of overflow, it is used to sequentially overlap [] ([B]/[C]/[S1]/[C]/[B]/[A] from the bottom. Here, overlap with [ c] The sigma-type bismuth film [S1] 4 sheets are arranged side by side so as not to overlap each other. Next, the sample is heated and pressurized at a temperature of 18 rc, pressure 8 MPa for 10 minutes, and then held at a pressure of 5 MPa. Four test pieces of the test film [S1] were taken out from the cold portion to the room temperature for 3 minutes, and the length of the layer (B) overflowing from the end portion of the layer (A) of the four test films [S1] taken out was measured, respectively. The maximum value is taken as the amount of overflow. (4) Surface roughness (Ry) When manufacturing a film, an extrusion molding machine or a co-extrusion molding machine with a T-shaped mold is used. The setting temperature of the extruder and the setting of the Τ font are set. The temperature was set to 29 ° C. The width of the film obtained by extrusion molding was 6 mm. From any position of the film, a film having a length of 10 cm in the MD direction and a length of 丨〇 cm in the TD direction was cut out. This was used as a test film. From the center of the test film, 5 cm was used as a reference length in any direction, and the surface roughness of the surface layer of the film was determined according to JIS B〇6〇1. Specification (Supplement)/96-10/96123220 27 200806731 (5) The modulus of elasticity (£:') is evaluated by measuring the dynamic storage elastic modulus at 150 °C of the film. μ Extrusion molding using a T-shaped mold: or a common belt machine. The set temperature of the extruder and the temperature of τ ° ° C. The width of the film obtained by extrusion molding is set to 290 T line I 浔 waist Seen as 600mm. From the thin position ', the length of the MD direction is the length of the mTD direction: the film of 5 mm' is used as the test film. The dynamic storage elastic number measurement device (10) company 'RSA-11' The dynamic storage elastic modulus of the test film in the MD direction ΐ 1 ίο : 7 was measured. The measurement conditions were measurement temperature - 丨 50 to 200 C, and temperature increase rate 3. "Division, measurement mode: stretching constant frequency number 1 Hz. The above enthalpy results obtained the elastic modulus (E,) of the film of the temperature of 15 generations. [Example 1] In the production of a film, a three-layer multi-manifold type co-extruded extruder with a font was used. The machine and the third extruder will be (A1) 4-indenyl-p- pentene copolymer (1-decene content 2.4 mass) %, MFR: 25 g/l enthalpy, melting point 233 ° C) at a temperature of 300. (: plasticization was carried out. In addition, (B1) propylene-butene copolymer (density 〇.89 g/ in a second extruder) Cm3, mfr: 30 g/10 min, melting point ii (TC, domain softening temperature 78 χ:, butene content 20 mol%) plasticized at a temperature of 3 ° C. Using A1 as layer (A), B1 was used as the layer (B), and co-extrusion was carried out to carry out a combination of a layer (Α)/layer (Β)/layer (Α) in a τ-type mold. Further, the composite (20 m/min) was pulled by a roll to produce a multilayer film comprising three layers. 312XP/Invention Manual (Supplement)/96-10/96123220 28 200806731, the surface of the obtained multilayer film was embossed with an average thickness (five) of 25 embossing. The circumferential speed of the second embossing prode that the multilayer film is in contact with is set to a peripheral temperature of the roll temperature of 13 (TC, embossing speed of 20 m/min, relative to the first contact of the multilayer film). 1.03 times. The composition of Al/Bl/Al = 25/7G/25/zm is applied by setting the ratio of the two circumferential speeds to 1 〇 3 L ', the total thickness is 12 〇//m, and the MD direction (extension direction) a multilayer film having an elastic modulus (E,) of 5 xi 〇 7 MPa and a heat shrinkage ratio of 2.1%. Next, the obtained multilayer film is placed in the twisting and pressing steps shown in Fig. 2, and the cover is The layer is adhered to the circuit surface formed on the substrate to form an FPC. The temperature is set at 16 (rc, pressure 2 MPa, heating and pressurization time), and the cover layer is formed of a polyimide film having a thickness of Μ. Further, the epoxy-based adhesive having a flow start temperature of 8 Å was applied to the cover layer in a thickness of 0.5. The FPC was formed so that the cover layer was completely adhered to the substrate body to the remaining portion of the air. Evaluation, wrinkles did not occur on the multilayer film enamel film used in the adhesion of the cover layer χ The obtained printed substrate was also good in appearance. The evaluation results are shown in Table 1. [Example 2] In addition to the substitution of Β1, (Β2) ethylene·ethyl acrylate copolymer (mfr: 27 g/10 min, melting point) 90t;, the softening temperature of the domain gram is 7 〇. 〇, the content of C is 15 moles«, and the remaining layers are manufactured in the same order as in Example 1 in the same manner as in Example 1. 312XP/Invention Manual (Supplement)/96- 10/96123220 29 200806731 Next, the cover layer was adhered to the circuit surface formed on the substrate by heating and pressurizing the multilayer film under the same conditions as in Example 1. Evaluation was carried out as in Example 1. It is shown in Table 1. [Example 3] In addition to the substitution of B1, (B3) propylene·bubutene·4-mercapto-i-pentene copolymer (36 mol% of propylene content, 14 mol of butene content) was used. %, 4-mercapto-1-pentene content 50 mol%, density 〇.88〇g/cm3, MFR: 27g/1〇, domain softening temperature 80°C) 50% by mass and linear low Density polyethylene (starting degree, 0·92g/cm, MFR: 15g/l 〇, field softening temperature 1〇〇. 〇) 5 〇Berry / ◦ A multi-sound film was produced in the same order as in Example 以外 except for the blend (MFR: 20 g/l enthalpy, domain softening temperature 85 〇). Heating and twisting were carried out under the same conditions as in Example 而, and the overcoat layer was occupied by electricity formed on the substrate. Evaluation was carried out as in Example 1, and the results are shown in Table i. [Example 4] The multilayer film was produced in the same order as in Example 1 by changing the extrusion amount of the first extruder and the third extruder so that the thickness of the layer (A) was 2 (^mm). /', secondly, by heating and pressurizing the multilayered layer under the same conditions as in the example, the covering layer is formed on the circuit surface 312XP formed on the substrate/invention specification (supplement)/96-10/ 96123220 200806731 The evaluation was carried out as in the example, and the results are shown in the table [Example 5] except that by changing the thickness of the first extrusion (a) m π "and the extrusion amount of the extruder 3, the layer was applied. Example i. The multilayer film was produced in the same order, and the read piece according to Table 1 was adhered to the substrate by forming the film on the substrate by pressing the film: heat and pressure. The evaluation was performed and the results are shown in the table. [Example 6] Releasing: A multilayer film was produced in the same order as in Example 1 except that the first extruder was used, and the thickness of the layer (1) was 50/m. . Next, the multilayer film was heated and pressurized under the same conditions as in Example 1, and the cover layer was adhered to the circuit surface formed on the substrate. 0 Evaluation was carried out as in Example 1, and the results are shown in Table i. . [Example 7] Except for the substitution of A1, (A2) 4-methyl-1-pentene-based copolymer (1-decene content: 1% by mass, MFR: 25 g/10 minutes, melting point: 238 ° C), The multilayer film was produced in the same manner as in Example 1 under the conditions shown in Table 1. Next, 'heating and pressurizing the multilayer film according to the same conditions as in Example 1' to adhere the cover layer to the circuit surface 312XP formed on the substrate/invention specification (supplement)/96-10/96123220 31 200806731 on. Evaluation was carried out as in Example 1, and the results are shown in Table 1. [Example 8] - In addition to the substitution A1 (A3M-methyl-p-pentene-based copolymer (dimer content: 4.0% by mass, MFR: 27 g/1 〇, Hyun 229. 〇, 其余, The conditions shown in Table 1 were carried out in the same order as in Example 。. Next, the cover film was adhered to the substrate by heating and pressurizing the same according to the same conditions as in Example ,. On the circuit, the evaluation was carried out as in Example 1. The results are shown in Table 1. [Example 9] In addition to the substitution A1, the (A4) A4: 4-mercapto-monopentene-based copolymer tetradecene was contained in an amount of 2% by mass. , MFR ·· 22g/10 min, melting point 232. (3), except that the multilayer film was produced in the same order as in Example 依 according to the conditions shown in Table 1. 曰 / Next 'by adhering this multilayer film to Example 1 Heating and pressurization were carried out under the same conditions, and the cover layer was adhered to the circuit surface formed on the substrate. Evaluation was carried out as in Example 1, and the results are shown in Table 1. 3 UXP/Invention Manual (Supplement)/96- 10/96123220 32 06 800 2 (5 Example 9L 1-14焯03 Ξ A/B/A 25/70/25 L〇CD cva 0·1&gt; 〇5χ107 Example 8 1-decene-inch CO SA/B/AI 25/70/25 I LO ◦_r-H od 0·1&gt; 〇4x107 Example 7 丨卜癸晞T-HSA/B/ A | 25/70/25 CJ5 rH 0.1&gt; 〇 6x107 1 Example 6 I 1-癸 〇 j 1 1 - &lt;S CO o (XI 1 ο 2χ108 Example 5 癸 癸 od 3 A/B/A; 35/70/35 ◦·r-H 0.1&gt; 〇6χ107 Example 4 1-decene inch cvi S 1 A/B/A | | 20/70/20 | LO CD* CSJ od L 〇,!&gt; ” 4.5x107 Example 3 1 癸 CN CN CNl SS Τ&quot;Η | A/B/A | | 25/ 70/25 | 卜 cz&gt; oo 1 0·1&gt; ” 〇 3x107 Example 2 1-decene od function &quot;Η | A/B/A | | 25/70/25 | ◦·· I 0·1&gt; 1 〇1.7x107 Example 1 1-癸 τ τ^Η | A/B/A | | 25/70/25 | LO ◦· rH oi 丨〇.!&gt; 1 〇5χ107 I 1 1 1 1 1 ί 1 1 1 1 1 1 1 e 3 S 3 1 ! 1 comonomer type comonomer content 丨 layer (A) layer (Β) layer (A) layer constituting each layer thickness surface roughness (Ry) heat shrinkage rate overflow Appearance enemy pattern elastic modulus (Ε,) j «1 T 4 film structure rne 0ΖΖ296/0Ι-96/ff®i)_&amp;^_s®/dx(NI e 200806731 [Comparative Example 1] except by changing the The thickness of the extrusion (A) is 5". The extrusion amount of the extrusion machine is used to make the multilayer film 2 in the same order as in the first example, and the conditions shown in Table 2 are implemented. Next, by heating and pressurizing the multilayer town, the same conditions as those of the above are carried out. ^盍Layer material (4) The circuit surface on the slab is "Equipped with Example 1 and evaluated. It is shown in Table 2. [Comparative Example 2] The conditions shown in Table 2 were the same as those in Example 1 except that the thickness of the first extrusion (1) was changed to 5 〇Λ Γ extrusion amount. A multilayer film was produced in the same order. Next, the cover layer was adhered to the circuit surface formed on the substrate by heating and pressurizing the multilayer film under the same conditions as in Example 1 as in Example 1. The results are shown in Table 2. [Comparative Example 3] In addition to the substitution A1, the (A5)4-mercapto-p-pentene copolymer (1 癸 dilute i 5 · 0% by mass, MFR: 24 g/10 min, dissolved A multilayer thin film was produced in the same manner as in Example 1 except for the conditions shown in Table 2. Next, the multilayer film was heated and pressurized under the same conditions as in Example 1. Adhesive layer is adhered to the circuit surface formed on the substrate 312 χΡ / invention manual (supplement) / 96-10/96123220 34 200806731 Evaluation was carried out as in Example 1, and the results are shown in Table 2. [Comparative Example 4] X except for the substitution of A1, (A5) 4-mercapto-p-pentene-based copolymer (polydecene 3 1 5 · 0 mass 〇 / 〇, MFR: 24 g / 1 〇, melting point 226 〇 c And, instead of B1, except for B2, the remaining layers were produced in the same order as in Example 1 except for the conditions shown in Table 2. /, by using the same conditions as in Example 1 under the same conditions as in Example 1, and applying pressure to adhere the coating layer to the circuit surface formed on the substrate as in Example 1, the results are shown in the table. 2. [Comparative Example 5]: (A5) 4-methyl-p-pentene-based copolymer (A5) 4-methyl-p-pentene-based copolymer (A5), MFR: 24 g/1 (^, melting point, and taken at the factory) B1 uses B3, and the other layers are produced in the same order as in the embodiment according to the conditions shown in Table 2. Next, 'by heating and pressurizing the multilayer film under the same conditions as in the example 将" The layer adhered to the circuit surface formed on the substrate was evaluated as in Example 1. The results are shown in Table 2. [Comparative Example 6] In addition to the substitution A1, (A6) 4-methyl-1-indenyl-p-pentene copolymer was used. (1-decene contains 1 0.2% by mass, MFR: 25e*/1fl 八KZ ton/10 minutes, melting point 241 °C), 〆, 余 according to the conditions shown in Table 2 to the disk sinus you 々丨 &film; r 、 , λ 铋 Example 1 in the same order to produce a multilayer thin 312 ΧΡ / invention instructions (supplement) / 96-10 / 96132220 200806731 Next, by heating and pressurizing the multilayer film under the same conditions as in Example 1, The cover layer was adhered to the circuit surface formed on the substrate. Evaluation was carried out as in Example 1, and the results are shown in Table 2. [Comparative Example 7] Substituting A1 using (A7) 4-methyl-1-pentene-based copolymer (1-nene containing 10 minus, MFR: 22 g/10 min, melting point 221 ° C), except for Table 2 A multilayer film was produced in the same manner as in Example i. Next, the cover film was adhered to the circuit surface formed on the substrate by heating and pressurizing the multilayer film under the same conditions as in Example 1. The evaluation was carried out, and the results are shown in Table 2. [Comparative Example 8] The (A8)4-indenyl-fluorene-pentene copolymer was used in addition to the substitution A1 (ethylene content: 2% by mass, MFR: 26 g/10 minutes, melting point 241) A multilayer film was produced in the same manner as in Example 1 except for the conditions shown in Table 2. Next, the cover layer was adhered by heating and pressurizing the multilayer film under the same conditions as in Example 丨. The surface was formed on the substrate. The evaluation was carried out as in Example 1. The results are shown in Table 2. [Comparative Example 9] Except that the peripheral speeds of the first embossing roll and the second embossing roll were set to be the same An unstretched multilayer film was produced in the same manner as in Example 1. 曰/ 31 2Χρ/Invention Manual (Supplement)/96-10/96123220 36 200806731 Next, the film is adhered to the circuit surface formed on the substrate by heating and pressurizing the film under the same conditions as in Example ,. The flexible printed circuit board was evaluated by visual observation, and the wrinkle was transferred onto the flexible printed circuit board to form an appearance of the problem. Table 2. [Comparative Example 10] The same procedure as in Example 1 was carried out except that the second embossing speed was set to 1.15 times with respect to the peripheral speed of the first embossing roll, and was extended by 15% in the MD direction. A multilayer film is produced. Then, by heating and pressurizing the multilayer film under the same conditions as in the first embodiment, the cover layer is adhered to the flexible printed circuit board-based cover layer formed on the circuit surface formed on the substrate. The poorness of the substrate body is poor 'the presence of air is present. χ, due to uneven stretching: The sample is transferred onto a flexible printed circuit board, which is not good outside the flexible printed circuit board. The evaluation results are shown in Table 2. [Comparative Example 11] A multilayer film was produced in the same manner as in the example except that a single layer film having a thickness of 2 was used as the layer 2, except that the first extruder was used. The multilayer film was heated and pressurized under the same conditions as in Example 1, and the cover layer was adhered to the circuit surface formed on the substrate. 0 Evaluation was carried out as in Example 1, and the results are shown in Table 2. 312ΧΡ/Invention Manual (Supplement)/96-10/96123220 200806731 [Comparative Example 12] The thickness of the machine layer (A) is set to 150//Π1. The conditions shown in Table 2 are the same as in Example 1 except that only A multilayer film was produced in the following order except for the first extruded single layer film. Next, the multilayer film was heated and pressurized under the same conditions as in Example 1 to adhere the cover layer to the circuit surface formed on the substrate. The evaluation was carried out as in Example 1. The results are shown in Table 2.

312XP/Invention Manual (supplement)/96-10/96123220 38 7306 800 2 (3⁄4 Comparative Example 12丨1-癸妇丨CN1* τ-Η 1 1 s τ-Η &lt;NI 〇oo r—4 1 〇 2xl08 than the car example 11 1-women's inch Cvl 1 1 CO Q· CNI od 1 X 2xl08 丨 than car case 10 1-癸 thin SA/B/A 25/70/25 LO 〇· CO τ-Η 0.1&gt; X 5xl07 than car example 9 1-decene oi r-Η S ; A/B/A 25/70/25 LO CD -0.3 0·1&gt; X 5xl07 ! than car case 8 S CN1 3 A /B/A 25/70/25 CO O' (Nl* m CD 〇9xl07 than vehicle example 7 1-癸烨〇ti 3 A/B/A 25/70/25 oo 〇* (Nl t-H 〇 · X 1.5x107 L Comparative Example 6 L-terpene (Nl CD 53 A/B/A 25/70/25 o OO rH CO CD 〇 8. 5x107 丨比龄 J5 1-decene m SA/B/A 25 /70/25 CO 〇· 〇〇rH o.i&gt; 1 &lt;1 1. 5xl07 than vehicle example 4 | 1-decene LO Ϊ3 A/B/A 25/70/25 CO 〇· LO t-H 0.1&gt;&lt;] lxlO7 Comparative Example 3 1-decene LO ΙΛ S ΙΛ A/B/A 25/70/25 CO o rH cvi L0·1〉—&lt;] 3.5x107 Comparative Example 2 1- Daughter-in-law c&lt ;i S 1 i A/B/A 50/70/50 CO ◦' oo 1—H CD 〇9xl07 Comparative Example 1 1-癸妇寸 oi τ-Η Ξ A/B /A [5/70/5 oo &lt;=5 CO od L°^&gt;JX lxlO7 § 1 ! To % 1 1 | 1 1 1 1 I ts draw j 1 comonomer type comonomer content layer (A Layer (B) 1 layer (A) 1 layer constituting each layer thickness surface roughness (Ry) heat shrinkage rate overflow amount outer ridge elastic modulus (E,) 4-mercapto-1-pentene copolymer film structure 6rn 0CN&lt;NSI96/0I-96/ffsi)_&amp;^is micro/dx (Nlro 200806731 (industrial availability) The present invention contains a specific 4-methyl-p-pentamethylene copolymer The film having a specific thickness and a heat shrinkage ratio is superior in both heat and release properties, and thus is suitably used as a release film. You Li: When manufacturing FPC, by using it as a release film, the adhesion between the cover layers and the adhesive flow out and adhered to it: = 2, when forming, no gap is formed in the non-printing portion. Electricity: End::; The exposed part of the injury* is not contaminated by the melted out of the adhesive. Due to the heating and pressurization, the cover 芸 勤 I 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The resulting void formation efficiency improves the appearance of FPC which is defective in appearance due to wrinkle transfer, so that it can be suitably used as a release film for FPC production. In addition, when the release film of money is used as a film having a polyolefin and a layer in the production of FPC, the release film is excellent, and the puncturing property can follow the unevenness of the surface of the FPC, and when heated and pressurized. The adhesion of the adhesive agent is less than that of the Fpc product which is caused by the adhesion of the adhesive and the metal plate used for the twisting and pressurization; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a film of the present invention. Fig. 2 is a cross-sectional view showing an example of a state in which a flexible printed circuit board is molded by using the film of the present invention. Fig. 3 is a cross-sectional view showing an example of a terminal exposed portion of a substrate of a flexible printed circuit 312XP/invention specification (supplement)/96-10/96123220 200806731 formed by using the film of the present invention. Fig. 4 is a view showing an example of a manufacturing apparatus for a film of the present invention. [Main element symbol description] 1 2 A layer formed of a 4-methyl-1-pentene copolymer (a) a layer formed of a soft polyolefin ( β) 3 Metal plate for heating and pressurization 4 Non-recording steel plate 5 Release film (single layer) 6 Cover layer 7 Thermosetting adhesive 8 applied to the cover layer Film 9 of the present invention Flexible printed circuit board 10 Circuit copper foil 11 Flexible printed circuit board circuit portion 20 Extruder 21 Multi-manifold type 3-layer co-extrusion τ-type mold 22 Cooling roller 23 Heating roller 24 First embossing roller 25 Second embossing pro 26 1st pressing roller 27 2nd pressing roller 312XP / invention manual (supplement) /96-10/96123220 41

Claims (1)

200806731 X. Patent application scope · 1 · A film characterized in that it has at least one layer (1) formed by a private::copolymer, and the haihe&quot; Mass %~99. 5 mass% of constituent units derived from m μ :: and 0.5 mass% to 4.5 mass% 2~ = constituent units of dilute hydrocarbons having 3 to 20 carbon atoms; A = 40//m ~90/zm; and ^ the body heat shrinkage film overall heat shrinkage rate of 1% ~ 5%. Layer = the film of the patent range η, which is the film of the above-mentioned layer (4) of the patent application range w, which contains a plurality of layers, the plurality of layers (1), further having a softening temperature according to The layer (A) which is at least one layer of a layer formed of a soft polyolefin of 5rc iron is the outermost layer. The film 1 of the first aspect of the patent includes a plurality of layers (8) and at least (A) formed of a soft polyolefin having a softening temperature of 50 〇C to 150 according to ASTM D1525; And the two layers of the above layer (A) are the outermost layers on both sides of the film. The film of any one of items j to 3 of the patent application, wherein the olefin having a carbon number of 3 to 20 other than 4 fluorenyl + pentene is selected from the group consisting of octene, 1-(four), and At least one of the fourteenth and eighteenthene. 6. For example, the film of the third paragraph of the patent scope, the soft polythene 312XP / invention sun book (supplement V96-10/96123220 42 200806731 1 olefin, propylene, butadiene, pentane, hexene and hydrazine a polymer obtained by (co)polymerization of a olefin, a film of the third or fourth aspect of the hydrocarbon oxime. Among them, a soft polyolefin::==acid cool copolymer, ethylene and sulfhydryl a combination of acrylic acid and dilute acid; a combination of two: a combination of a mixture of ethylene and a methyl group; a copolymer of the parent layer of the above-mentioned layer (Α), a thick film of the above-mentioned layer, wherein 9. For example, applying the patent heart #2 film to the film of the film/face of the film formed by the above layer (4), wherein, at least one of the film-forming surfaces is subjected to dust spots. Patent range No. 9 to 9 - obtained by extrusion molding or co-extrusion molding. The bond film of the item is 1 ϊ · A release film obtained from the film of Shanshi-Xiang. Patent application range 1 to 1. 312 ΧΡ / invention manual (supplement) / 96-10/96123220 43