200804025 九、發明說明： • 【發明所屬之技術領域】 本發明關於申請專利範圍第丨項的引文的一種將銲料 積層（Lotdepot)施到一基質上的方法，以及依申請專利範圍 第1項的引文的一種粉末狀軟銲材料。 ** ϋ 【先前技術】 、 在德專利DE 2〇〇4 026 490 A1已提到一種上述種類之 將鲜料施到底材上的方法，其中硬銲料，特別是以、川、200804025 IX. Description of the invention: • Technical field to which the invention pertains is a method for applying a solder deposit to a substrate in accordance with the citation of the scope of the patent application, and the method of claim 1 A powdered solder material of the citation. ** 先前 [Prior Art] A method of applying a fresh material to a substrate of the above type is described in German Patent No. 4 026 490 A1, in which hard solder, in particular,
Cu及A卜Zn基本銲料呈與不同合金成分造成的合金形成 利用一道熱喷程序施到底材上。在DE 2〇〇4 〇26 49〇 ^中 所述的-種喷覆程序為冷氣體喷覆，其中預熱的程序氣體 在一拉伐爾喷嘴中加速到超音速，其中氣體溫度遠低於使 用的銲接材料的熔解溫度。由喷嘴㈣的粉末狀薛接材料 達到局動能及較小的熱能。 ^在厂⑻2"40 A1提到一種將二部件鮮接的方法， 私 d彳件由難銲接的材料構成，且先覆以—可輝接 料如銅或銅合金的覆層。然後用冷氣體噴 π 、、 的；；f @ μ L 4 —銲料構成 ^⑼此覆層上，該銲料用於以後和另-部件銲接之 此外DE H)2 37 495 A1發表了 一種含 —種造成軟銲接合的方法，#接材枓及 材料含有多於0 00十成軟銲形成的銲接 各，夕孓ϋ·001重量〇/〇的鋁添加物。利 方面在軟銲料以及承載軟銲料的載體 用此方法’一 成鲜接時形成合金形式之所要的化學擴散區中造 π ，另一方面 5 200804025 在銲接過程結束後’可防止不想要之延續的化學交換作 用，因為軟鲜料中所含的銘在銲接過程 在鄰接到基質的界限面造成一屏障層或阻擔層。如= 的軟銲料由於銲接部分操作溫度升高而重新強熱或甚至液 化’使仔擴I速度升高且合金離析率升高日夺，則可防止 後擴散及合金過程發生。 ^ 刊用Μ 102 37 495 A1所述的方法製造銲料積Cu and Ab Zn basic solders are formed by alloying with different alloy compositions using a thermal spray procedure applied to the substrate. The spraying procedure described in DE 2〇〇4 〇 26 49〇^ is cold gas spraying, in which the preheated process gas is accelerated to supersonic speed in a Laval nozzle, wherein the gas temperature is much lower than The melting temperature of the solder material used. The powdered splicing material from the nozzle (4) achieves partial kinetic energy and less thermal energy. ^In the factory (8) 2 " 40 A1 mentioned a method of freshly joining two parts, the private d part is made of a material that is difficult to weld, and is first covered with a coating of a glazed material such as copper or copper alloy. Then, a cold gas is sprayed with π, , ;; f @ μ L 4 — the solder is formed on the cladding (9), and the solder is used for later and other-component soldering. Further, DE H) 2 37 495 A1, A method for causing a soft solder joint, #接材枓 and a material containing more than 90% of the welds formed by soldering, and the 添加 孓ϋ 001 weight 〇 / 〇 aluminum additive. In the soft solder and the carrier carrying the soft solder, the method is used to form a π in the desired chemical diffusion region in the form of an alloy. On the other hand, 5 200804025 can prevent unwanted continuation after the welding process. Chemical exchange, because the inclusions contained in the soft fresh material create a barrier or resistive layer in the welding process adjacent to the boundary surface of the substrate. If the soft solder of = is re-heated or even liquefied due to an increase in the operating temperature of the welded portion, the increase in the I speed and the increase in the alloy segregation rate prevent the post-diffusion and alloying processes from occurring. ^ Manufacture of solder product by the method described in 102 37 495 A1
曰今只能用由含銘的軟銲料構成之銲料槽或銲料珠才 !可能。#中在焊料積層及卫及製造時，保持細分佈的狀 X且利用周圍的軟㈣保護防止氧化。反之，其他鮮接 2研究中顯示不適合’例如，使用由粉末狀軟録料、 it —種㈣㈣統構成的銲料膏就不適合，因為 :在：：膏中造成粉末狀的…氧化，因此在造鲜接 曰^有金屬元素態的銘供形成所要之屏障層或阻擒層。 仁種限制，在處理時都声 的八…曰 補由於其性質而很有利 、3鋁車人鋅料對於電子電路 體，在商業上並不能應用。夕應用，例如作電路載 【發明内容】 基管卜LV制生 7如禾利用冷氣體噴覆施到一 、上以I Xe銲料積層用的銲 還含扒奸接材枓除了粉末狀軟銲料外 疋各舂末狀鋁，則也可得到一 137 QS λ 1 ^ 禋S鋁之車人銲料之在DE 102 7 95 A1中所述的性質。 以使鋁均勻分 已能確使粉末 利用本發明的方法，不需使用含^ 佈在銲接材料中’因為利用冷氣體嘴覆^ 6 200804025 、人L =末狀軟銲料充分混合。另方面，事實顯示，在該 覆時處理的銲接材料中的粉末狀铭的氧化沒有明 μΓ利影響’猜想大概是因為該粉末狀的紹由於在衝擊 =質時㈣速度而充分地強力變m使㈣子表面 則形成之乳化層粉碎’使金屬銘露出，目此在隨後録接 過程時有金屬！s可形成—屏障或阻播層。 研究顯示’在DE 102 37 495 A1所述之有利性質，用 务明的方法也可達成’且不必將料材料中的铭比例提 二比DE 1()2 37 495 A1㈣知辉接材料高，因此這種比例 且大於0.01重1 %且少5重量％，特別是可確知，在銲接 過程時形成的屏障層或阻擋層本身即使在該軟銲接合部由 於操作溫度升高*使部分、熔解情事保持較久時，也足夠防 止軟銲料與接合配件之間進—步持續的化學交換作用。 本發明-較佳特點在於：在冷氣體喷覆時使用的程序 ，體為1性氣體，它在冷空氣噴覆時的壓力及溫度條件 日：’不會和鋁反應’特別是能防止該鋁粒子之剝裂之表面 ，化的情事，直到該表面上的軟銲料層夠足以保護防止與 空氣的氧接觸為止。在冷氣體喷覆時，程序氣體的溫度調 整使它在軟㈣㈣解溫度以下以及也在紹㈣解溫度以 下’俾防止在冷氣體噴覆時，粉末狀銲接材㈣解的情事。 即使沒有熔解，在銲料積層中的個別粒子也能保持在。因 為例子在衝擊時由於微摩擦作用而局部發熱，這點在摩擦 點造成㈣粒子微熔接。這點是使該銲接㈣在作軟鲜接 時一直到以後熔解時為止都牢牢保持在基質上，且使粒子 7 200804025 充分附著。 依本發明另一特點，該粉末狀鋁及粉末狀軟銲材的粒 子大小在1〜100 # m間，其中它們宜具有相似的粒徑分佈。 俾使銲接材料量均句地混合，或在粉末混合物在該銲接材 •‘ 料供到程序氣體中時，在喷嘴内可能作轉向時，也能維持 這均勻混合。 所用軟銲料可為任何一般的軟銲料，但宜使用呈PbSn 。金、BiSii合金、SnAg合金或SnAgCu合金形式的軟銲 •料。 本务明在以下在一些實施例中配合圖式詳細說明。 【實施方式】 圖1中所示的喷覆喷嘴（2)用於利用冷氣體喷覆將至少 個由粕末狀銲接材料構成的銲料積層（4)施到一基質（8) 上，例如圖2〜圖4所示之電路載體（12)一電接點（1〇)上， 匕Ik後藉著銲料積層（4)熔解以及加壓，而被一電構件或電 φ 子構件（16)的一個或數個端子（14)與構件（16)銲接。 如圖1所示，該縱延伸的喷覆喷嘴（2)有一内空腔（18)， 其縱軸與喷覆噴嘴（2)的縱軸成共軸。空腔（18)有一背向基 貝（8)之變覓的後室部（2〇)及一長長延伸之噴嘴部（22)，該 喷嘴部沿著該噴覆噴嘴⑺的前侧端（24)[它朝向基質⑻]的 方向以小的錐形角度先變窄，並從一最大程度的束窄部 (Einschnururg)(26)起再略變寬一直到前侧端（2句的一喷嘴 出口開口（28)為止。有一注射管（32)從喷覆噴嘴（2)的後側 端（30)突伸出來到空腔（18)中，該空腔（18)在噴覆喷嘴（2)外 8 200804025 開口到供末狀銲接材料（6)用的一儲存容器（圖未示），且其 出口開口（34)係設在空腔（18)内該室部分（2〇)與喷嘴部分 (22)之間的一過渡區域（36)[它以較大的錐形角度變窄]的前 端上。該室部分（20)可在該噴覆喷嘴（2)的後側端（3〇)的附 近經一側邊的氣體供應開口（38)供以來自一適合的壓縮空 氣源的程序氣體（箭頭P)(它係在壓力之下者），該程序氣體 從氣體供應開口（3 8)流經一加熱元件（42)[它設在室部分（22) 中]的開口（40)然後在注射管（32)的出口開口（3 4)經喷嘴部 (22)流過去，其中由於過渡部（36)與喷嘴部（2〇錐形變窄， 故該氣體大大加速。如此，在注射管（32)的出口開口（34)產 生低壓，因此該粉末狀銲接材料（6)經注射管（32)從儲存室 合為吸出，經出口開口送至注射管（32)流過的程序氣體， 且在經開口（28)出來之前，在喷嘴部（22)内與程序氣體均勻 混合。 在儲存容器中所含的銲材料由一粉狀軟銲料構成，例 如由一鉍錫合金及粉末狀鋁構成，其中該二金屬材料的粉 末粒子（44)的顆料大小在約10# m及約50# m之間，且具 相似之粒徑分佈。軟銲粉末的比例約99重量％，而鋁粉比 例約1%重量[各相對於全部銲接材料（6)的重量]。在該軟 ~料合金内，麵比例56重量％，錫比例44重量％，但也 可使用具其他組成的軟銲料合金。 供到空腔（18)中的程序氣體由一種保護氣體或惰性氣 體構成’且宜為氮或氦，其溫度及壓力（例如在15〜35巴 之間）選設成使該供到氣流中的粉末端子（44)不含熔化，但 9 200804025 在衝擊到基貝（8)上之前溫度已升高。由於粒子（Μ)溫度升 高二故當衝擊到基質（8)上時，粒子（44)強力變形，因此， 先則鋁粒子與空氣的氧接觸在崔呂粒子上產生之表面氧化層 幸乂易破碎，适點使得隨後鋁與相鄰的軟銲粒子的軟銲料的 局部溶解作用由於微摩擦作用而更易發生。料，基質被 保護氣體或惰性氣體流過，迫使周圍空氣從銲接積層（4)的 區域流出，如此防止鋁粒子重新氧化的情事，且因此促使 I呂與軟銲料局部炼解。You can only use solder baths or solder beads made of soft solder containing Ming! In the case of solder build-up and soldering and manufacturing, it maintains a finely distributed shape X and uses the surrounding soft (four) protection to prevent oxidation. On the other hand, other fresh joint studies have shown that it is not suitable. For example, it is not suitable to use a solder paste composed of powdery soft recording material, it-type (four) (four) system, because: in the:: cream, it causes powdery...oxidation, so it is The fresh joints are in the form of metal elements to form the desired barrier layer or barrier layer. The restriction of the kind of kind, in the processing of the sound of the eight ... 曰 make up because of its nature is very favorable, 3 aluminum car people zinc material for electronic circuit body, can not be applied commercially. Evening application, for example, as a circuit load [invention] base tube LV production 7 such as the use of cold gas spray applied to a, I Xe solder laminate welding also contains smashed joints, except powdery soft solder The properties described in DE 102 7 95 A1 can also be obtained for a 137 QS λ 1 ^ 禋S aluminum car solder. In order to evenly divide the aluminum, it is possible to make sure that the powder is used in the method of the present invention, and it is not necessary to use a coating in the soldering material' because it is sufficiently mixed by using a cold gas nozzle, and the human L = the soft solder. On the other hand, the facts show that the oxidation of the powdery shape in the welding material treated at the time of the coating has no obvious influence on the 'conjecture' because the powdery shape is sufficiently strong due to the velocity at the impact = mass (four) speed. The emulsified layer formed by the (4) sub-surface is smashed to make the metal appear, so that there is metal in the subsequent recording process! s can form a barrier or a barrier layer. Studies have shown that the advantageous properties described in DE 102 37 495 A1 can also be achieved in a prudent manner, and that it is not necessary to increase the proportion of the material in the material to be higher than that of DE 1 () 2 37 495 A1 (four). Therefore, the ratio is more than 0.01% by weight and less than 5% by weight, and it is particularly known that the barrier layer or the barrier layer formed during the soldering process itself is partially melted even if the operating temperature is increased in the soft solder joint portion. When the situation is maintained for a long time, it is also sufficient to prevent a continuous chemical exchange between the soft solder and the joint fitting. The present invention - preferably characterized by the procedure used in the cold gas spraying, is a monogas, the pressure and temperature conditions of the cold air spray: "no reaction with aluminum", in particular, can prevent The surface of the aluminum particles is peeled off, until the soft solder layer on the surface is sufficient to protect against contact with oxygen in the air. In the case of cold gas spraying, the temperature of the program gas is adjusted so that it is below the soft (4) (iv) solution temperature and also under the (four) solution temperature to prevent the powdery solder material (4) from being solved during cold gas spray. Even without melting, individual particles in the solder laminate can remain. This is because the example causes local heat generation due to micro-friction during impact, which causes (4) micro-fusion of particles at the friction point. This is to ensure that the solder (4) is firmly held on the substrate until it is melted and softened, and the particles 7 200804025 are sufficiently adhered. According to another feature of the invention, the powdered aluminum and powdered solder material have a particle size between 1 and 100 #m, wherein they preferably have a similar particle size distribution.俾Make the amount of welding material mixed evenly, or maintain the uniform mixing when the powder mixture is in the nozzle when the material is supplied to the process gas. The soft solder used may be any general soft solder, but it is preferably PbSn. Soft soldering in the form of gold, BiSii alloy, SnAg alloy or SnAgCu alloy. The present invention is described in detail below in conjunction with the drawings in some embodiments. [Embodiment] The spray nozzle (2) shown in Fig. 1 is used to apply at least one solder laminate (4) composed of a solder-like solder material to a substrate (8) by cold gas spraying, for example, 2 to the circuit carrier (12) shown in Fig. 4, an electrical contact (1〇), 匕Ik is melted and pressurized by the solder laminate (4), and is electrically connected to an electrical component or an electrical component (16). One or more terminals (14) are welded to the member (16). As shown in Figure 1, the longitudinally extending spray nozzle (2) has an inner cavity (18) whose longitudinal axis is coaxial with the longitudinal axis of the spray nozzle (2). The cavity (18) has a rear chamber portion (2〇) facing away from the base of the base shell (8) and a long extending nozzle portion (22) along the front side end of the spray nozzle (7) (24) [The direction toward the substrate (8)] is first narrowed at a small taper angle and is slightly widened from a maximum extent (Einschnururg) (26) to the front end (2 sentences) a nozzle outlet opening (28). An injection tube (32) projects from the rear side end (30) of the spray nozzle (2) into the cavity (18), the cavity (18) in the spray nozzle (2) Outer 8 200804025 Opening to a storage container (not shown) for the final soldering material (6), and its outlet opening (34) is provided in the cavity (18) in the chamber portion (2〇) On the front end of a transition region (36) [which is narrowed by a larger taper angle] with the nozzle portion (22). The chamber portion (20) may be at the rear end of the spray nozzle (2) Near the (3〇) gas supply opening (38) on one side is supplied with a program gas (arrow P) from a suitable source of compressed air (which is under pressure), the process gas is supplied from the gas supply opening (3 8) flow An opening (40) of a heating element (42) [which is disposed in the chamber portion (22)] then flows through the nozzle portion (22) at the outlet opening (34) of the injection tube (32), wherein due to the transition portion ( 36) and the nozzle portion (2〇 taper is narrowed, so the gas is greatly accelerated. Thus, a low pressure is generated at the outlet opening (34) of the injection tube (32), so the powdery solder material (6) is passed through the injection tube (32) The program gas is sucked from the storage chamber and sent to the injection tube (32) through the outlet opening, and is uniformly mixed with the program gas in the nozzle portion (22) before exiting through the opening (28). The solder material contained is composed of a powdery soft solder, for example, a tantalum tin alloy and powdered aluminum, wherein the powder particles of the two metal materials (44) have a particle size of about 10 # m and about 50 # m. There is a similar particle size distribution. The ratio of the solder powder is about 99% by weight, and the proportion of aluminum powder is about 1% by weight [relative to the weight of all the solder materials (6)]. , the surface ratio is 56% by weight, and the tin ratio is 44% by weight, but it can also be used as a soft solder alloy of other compositions. The process gas supplied to the cavity (18) is composed of a protective gas or an inert gas, and is preferably nitrogen or helium, and its temperature and pressure (for example, between 15 and 35 bar) are selected such that the gas is supplied to the gas stream. The powder terminal (44) does not contain melting, but 9 200804025 has increased in temperature before impacting on the base (8). Due to the elevated temperature of the particles (Μ), when impacting onto the substrate (8), the particles ( 44) Strong deformation, therefore, the contact between the aluminum particles and the oxygen of the air on the surface of the Cui Lu particles is easily broken, so that the local dissolution of the soft solder of the subsequent aluminum and the adjacent solder particles It is more likely to occur due to micro-friction. The substrate is flowed by a shielding gas or an inert gas, forcing the surrounding air to flow out of the region of the welded laminate (4), thus preventing the reoxidation of the aluminum particles, and thus promoting the partial refining of the Ilu and the soft solder.
申於軟銲料粒子也被程序氣體加熱，且當衝擊到基質 上時由於微摩擦而在表面發料，且與該基f或先前喷覆的 2銲料粒子局部地熔解，故產生一個層狀的銲料積層（句， 牢牢附在基貝(8)上’在銲料積層(4)中，鋁粒子均勻分佈， 且與軟銲料粒子以金屬方式接觸（而非以氧化層方式接 觸）。用此方式，當在基質（8)與其他金屬構件之間造成軟 銲接合部（46)時，該銘擴散到該軟銲料（它在銲接時溶解） 中。如此，在銲料凝固後，形成一屏障層或阻擔層，它可 確實防止軟銲料與相鄰的金屬構件之間繼續的合金化或擴 散的過程或不想要的化學交換作用。 別衣娄貝例如圖2〜圖5所示的電路載體（12)]要用 該銲料積層(4)[它利用冷空氣施覆施上去]與另一金屬構件 [例如圖2〜目5所示的電氣或電子件〇響接，則該鲜接 積層（4)被加熱超過軟銲料的炫點外，而在銲料積層⑷的區 域中的其他金屬構件（16)則被Μ向基f⑻。為此該另 件（16)宜有一與銲料積層（4)對立的表面，由一易銲接的材 200804025 料構成、’如銅或一鋼合金，但也可在此位置設以一由含鋁 的車人^料或一其他軟銲料構成的覆層，如此可使用該含鋁 之幸人鲜料當作連接元件用於電路及切換裝置中。 在士此所造成的軟銲接合部（46)，在銲接過程後，在 軟銲料與基質（8)或其他金屬構件（16)之間不會發生化學交 換作用。此一個銲接技術連金的金屬部分（8)(16)的材料與 卓人~料在録接過程之後，即使該部分MX〗在操作中受到 高操作溫度甚至重新熔解，也不再會受化學交換作用影 響。這點可再防止在溫度的負荷下，該軟銲接合部（46)與 接口對象（8)(16)的金屬，電氣及熱功能受不可逆的改變。 囷2 ,、、、員示車人#接合部（46)的一實施例，其中一電路 載體（12)與-電氣或電子構件（18)銲接，其中，—由含铭軟 鲜料構成的鲜料積層⑷[它利用冷氣體噴覆施到電路載體 (12)的三個平坦金屬接點（1〇)之一上]以其相反的寬側面平 平地與忒構件（16)之對立的寬侧面上的二個金屬端子（14)之 一銲接。另一金屬端子（14)利用二條「結合金屬絲」與該 另外二個金屬接點（10)連接。 圖3顯不另一實施例，其中一類似之電氣或電子構件 (16)的對立兌側面上的二金屬端子（14)與電路載體（12)的一 個對立的金屬接點（10)銲接。一如在前面的例子，各軟銲 連接部（46)由一含鋁之軟銲料構成，它呈銲料積層（4)方式 利用冷空氣喷覆施到接點（1 0)上。 在圖4中所示之實施例，電路載體（12)的上侧有二個 金屬（10)，相隔一段距離設置，該構件（16)的二端子（14)[它 200804025 們叹计成孚腳（50)形式]之一銲接到各一接點（ι〇)，其中軟 銲接口 αΡ (46)同樣利用一銲料積層（4)[它先前利用冷空氣噴 覆施上去，由一含鋁的軟銲料構成]造成。 在圖5中所示之實施例中，該電路載體（10)上側的二 、個金屬接點各利用—珠形的軟銲連接部（46)與構件（1 6)下側 •的一個對立的金屬端子（14)連接，此軟銲連接部（46)也由一 含軟銲料構成。 L圖式簡單說明】 圖1係利用冷氣體喷覆將由鋁軟銲料構成之銲料積層 施覆用的噴覆噴嘴的示意圖， 9 ，圖2係—電路載體及—電子構件（它利用含㈣軟銲料 鲜到該電路載體上）的側視圖， 垃/ 3係一電子構件的側視圖，它利用含銘的軟薛料鲜 接在一電路載體的平面接點之間， 圖4係一電路載體及另一構件 接刭兮Φ * 再1干1匕利用含鋁的軟銲料銲 接到，亥電路載體上）的側視圖， 圖5係一電路載體及又一電子構 枓锂拉^ (利用含鋁的軟銲 科知接到該電路載體上）的側視圖。 于 【主要元件符號說明】 (2) 噴覆喷嘴 (4) 銲料積層 (8) 基質 ^10)電接點 ^12) 電路載體 12 200804025It is claimed that the soft solder particles are also heated by the program gas, and when they are impacted onto the substrate, they are emitted on the surface due to micro-friction, and partially melted with the base f or the previously sprayed 2 solder particles, thereby producing a layered Solder layering (sentence, firmly attached to the base shell (8)' In the solder laminate (4), the aluminum particles are evenly distributed and in contact with the soft solder particles in a metal manner (rather than in an oxide layer). By way of example, when a soft solder joint (46) is created between the substrate (8) and other metal members, the diffusion is spread into the soft solder (which dissolves during soldering). Thus, after the solder solidifies, a barrier is formed. a layer or a resistive layer which does prevent a process of continued alloying or diffusion between the soft solder and the adjacent metal member or an unwanted chemical exchange. The casing is as shown in Figs. 2 to 5 The carrier (12)] is to be spliced with the solder laminate (4) [which is applied by cold air application] and another metal member [such as the electrical or electronic components shown in Figs. 2 to 5, The laminate (4) is heated beyond the sleek point of the soft solder, while in the solder The other metal member (16) in the region of the layer (4) is then deflected toward the base f(8). For this purpose, the component (16) preferably has a surface opposite the solder laminate (4), consisting of a solderable material 200804025, ' For example, copper or a steel alloy, but it is also possible to provide a coating made of aluminum-containing car material or a soft solder at this position, so that the aluminum-containing lucky material can be used as a connecting member. In the circuit and the switching device, the soft solder joint (46) caused by the soldering process does not undergo chemical exchange between the solder and the substrate (8) or other metal members (16) after the soldering process. A welding technique connects the metal part of the gold (8) (16) with the material and the material is not subject to chemical exchange even after the part of the MX is subjected to high operating temperature or even re-melting during operation. This effect can prevent the metal, electrical and thermal functions of the soft solder joint (46) and the interface object (8) (16) from irreversibly changing under temperature load. 囷2 , , , An embodiment of the vehicle operator #46 (46), wherein a circuit carrier 12) welding with - electrical or electronic components (18), wherein - a layer of fresh material (4) consisting of a soft material containing the same (using a cold gas spray applied to the three flat metal contacts of the circuit carrier (12) One of the two metal terminals (14) on the wide side opposite to the crucible member (16) is flatly welded with the opposite wide side. The other metal terminal (14) utilizes two "combinations" The wire is connected to the other two metal contacts (10). Figure 3 shows another embodiment in which a similar metal or electronic component (16) on the opposite side of the two metal terminals (14) and the circuit A pair of opposite metal contacts (10) of the carrier (12) are soldered. As in the previous example, each solder joint (46) consists of a soft solder containing aluminum which is cooled in a solder layer (4). Air spray is applied to the joint (10). In the embodiment shown in Figure 4, the upper side of the circuit carrier (12) has two metals (10) spaced apart by a distance, and the two terminals (14) of the member (16) [it 200804025 One of the feet (50) forms is soldered to each of the contacts (ι), wherein the soft solder joints αΡ (46) are also coated with a solder layer (4) [which was previously applied by cold air spray, from an aluminum containing The composition of the soft solder] caused. In the embodiment shown in FIG. 5, the two metal contacts on the upper side of the circuit carrier (10) each utilize a bead-shaped solder joint (46) and a lower side of the member (16). The metal terminals (14) are connected, and the solder joint (46) is also composed of a soft solder. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a spray nozzle for coating a solder layer composed of aluminum soft solder by cold gas spraying, and Fig. 2 is a circuit carrier and an electronic component (it uses (4) soft Side view of the solder on the circuit carrier, a side view of the electronic component of the 3/3 electronic component, which is spliced between the planar contacts of a circuit carrier using a soft-snow material containing the inscription, FIG. 4 is a circuit carrier And another component connection Φ * 1 dry 1 匕 using a soft solder containing aluminum soldered to the side of the circuit carrier, Figure 5 is a circuit carrier and another electronic structure lithium pull ^ A side view of the aluminum solder joint is known to be attached to the circuit carrier. [Description of main component symbols] (2) Spray nozzle (4) Solder layer (8) Substrate ^10) Electrical contact ^12) Circuit carrier 12 200804025
(14) 端子 (16) 構件 (18) 内空腔 (20) 後空部 (22) 喷嘴部 (24) 前側端 (26) 束窄部 (28) 出口開口 (30) 後側端 (32) 注射管 (34) 出口開口 (37) 過渡部 (38) 氣體供應開 (40) 開口 (42) 加熱元件 (44) 粉末端子 (46) 軟銲接合部(14) Terminal (16) Member (18) Inner cavity (20) Rear space (22) Nozzle section (24) Front side end (26) Narrow part (28) Outlet opening (30) Rear side end (32) Injection tube (34) Outlet opening (37) Transition (38) Gas supply open (40) Opening (42) Heating element (44) Powder terminal (46) Soft solder joint