[go: up one dir, main page]

TW200741337A - Method for imprinting 3-D circuit patterns on curved surface - Google Patents

Method for imprinting 3-D circuit patterns on curved surface

Info

Publication number
TW200741337A
TW200741337A TW095114236A TW95114236A TW200741337A TW 200741337 A TW200741337 A TW 200741337A TW 095114236 A TW095114236 A TW 095114236A TW 95114236 A TW95114236 A TW 95114236A TW 200741337 A TW200741337 A TW 200741337A
Authority
TW
Taiwan
Prior art keywords
imprinting
technique
circuit patterns
curved substrate
imprint
Prior art date
Application number
TW095114236A
Other languages
English (en)
Other versions
TWI322331B (zh
Inventor
Min-Hsiung Hon
Kuan-Zong Fung
Ing-Chi Leu
Chi-Feng Liu
Chau-Nan Hong
Original Assignee
Univ Nat Cheng Kung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Cheng Kung filed Critical Univ Nat Cheng Kung
Priority to TW095114236A priority Critical patent/TW200741337A/zh
Publication of TW200741337A publication Critical patent/TW200741337A/zh
Application granted granted Critical
Publication of TWI322331B publication Critical patent/TWI322331B/zh

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW095114236A 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface TW200741337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095114236A TW200741337A (en) 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095114236A TW200741337A (en) 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface

Publications (2)

Publication Number Publication Date
TW200741337A true TW200741337A (en) 2007-11-01
TWI322331B TWI322331B (zh) 2010-03-21

Family

ID=45073941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114236A TW200741337A (en) 2006-04-21 2006-04-21 Method for imprinting 3-D circuit patterns on curved surface

Country Status (1)

Country Link
TW (1) TW200741337A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414647B (zh) * 2010-09-27 2013-11-11 私立中原大學 製作次微米圖樣化藍寶石基板之方法
CN108008599A (zh) * 2017-12-27 2018-05-08 青岛天仁微纳科技有限责任公司 用于三维曲面纳米级压印的方法、装置及模具制备方法
CN112817209A (zh) * 2020-12-28 2021-05-18 山东大学 一种可实现异形曲面压印的压印设备及使用方法
CN113238456A (zh) * 2016-08-25 2021-08-10 李永春 一种采用具厚度变化的可挠式模仁的压印方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104360580A (zh) * 2014-10-28 2015-02-18 北京航空航天大学 一种曲面上微结构滚压成型制造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414647B (zh) * 2010-09-27 2013-11-11 私立中原大學 製作次微米圖樣化藍寶石基板之方法
CN113238456A (zh) * 2016-08-25 2021-08-10 李永春 一种采用具厚度变化的可挠式模仁的压印方法
CN113238456B (zh) * 2016-08-25 2024-02-20 李永春 一种采用具厚度变化的可挠式模仁的压印方法
CN108008599A (zh) * 2017-12-27 2018-05-08 青岛天仁微纳科技有限责任公司 用于三维曲面纳米级压印的方法、装置及模具制备方法
CN108008599B (zh) * 2017-12-27 2024-01-26 青岛天仁微纳科技有限责任公司 用于三维曲面纳米级压印的方法、装置及模具制备方法
CN112817209A (zh) * 2020-12-28 2021-05-18 山东大学 一种可实现异形曲面压印的压印设备及使用方法

Also Published As

Publication number Publication date
TWI322331B (zh) 2010-03-21

Similar Documents

Publication Publication Date Title
TW200737157A (en) Imprinting method and imprinting apparatus
TW200734706A (en) Patterning substrates employing multiple chucks
ATE433134T1 (de) Imprint-lithographieverfahren, gerät hierfür, sowie verfahren zur herstellung eines halbleiterchips
TW200741341A (en) Resist composition, method for forming resist pattern using the same, array substrate fabricated using the same and method of fabricating the array substrate
EP1594002A2 (en) Method for manufacturing large area stamp for nanoimprint lithography
WO2012027050A3 (en) Mask for near-field lithography and fabrication the same
WO2009004560A3 (en) A method for forming a patterned layer on a substrate
EP2584408A3 (en) Imprint method and imprint apparatus
MY149332A (en) Apparatus for pattern replication with intermediate stamp
TW200848956A (en) Devices and methods for pattern generation by ink lithography
TW200720839A (en) Hierarchical nanopatterns by nanoimprint lithography
WO2010086850A3 (en) Process for producing a photomask on a photopolymeric surface
ATE501464T1 (de) Nanoimprint lithographie in mehrschichtsystemem
Lan Large-area nanoimprint lithography and applications
CN101446759A (zh) 纳米压印用二次压印模板的制作方法及其二次压印模板
SG140481A1 (en) A method for fabricating micro and nano structures
TW200628399A (en) Mold and process for production of substrates having transferred micropatterns thereon
EP2026131A3 (en) Lithography meandering order
WO2008060266A3 (en) Nanotemplate arbitrary-imprint lithography
TW200506538A (en) Resist pattern thickening material, process for forming resist pattern using the same, and process for manufacturing semiconductor device using the same
CN102279517A (zh) 纳米压印方法
TW200632544A (en) Apparatus for forming fine pattern on substrate
WO2009082150A3 (en) Forming method of magnetic pattern and manufacturing method of patterned media using the same
TW200741337A (en) Method for imprinting 3-D circuit patterns on curved surface
JP2008527736A5 (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees