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TW200741169A - The structure of a heat dissipation device - Google Patents

The structure of a heat dissipation device

Info

Publication number
TW200741169A
TW200741169A TW095115170A TW95115170A TW200741169A TW 200741169 A TW200741169 A TW 200741169A TW 095115170 A TW095115170 A TW 095115170A TW 95115170 A TW95115170 A TW 95115170A TW 200741169 A TW200741169 A TW 200741169A
Authority
TW
Taiwan
Prior art keywords
dissipation
group
heat dissipation
heat
fins
Prior art date
Application number
TW095115170A
Other languages
Chinese (zh)
Inventor
qing-yuan Ruan
Original Assignee
Li Hong Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Li Hong Science & Technology Co Ltd filed Critical Li Hong Science & Technology Co Ltd
Priority to TW095115170A priority Critical patent/TW200741169A/en
Publication of TW200741169A publication Critical patent/TW200741169A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention provides a structure of a heat dissipation device. The principal structure of the heat dissipation device is the heat absorption plate made of a copper plate, which is used to substitute the original copper block and not only is without the problems of deformation and machined slots, it is low cost. The radiation fins are set with multiple close fit holes tightly assembled with conducting tubes to form a group of dissipation fins, and also has a group of slice holes and a tooth fringe to increase the dissipation effect. The dissipation fan is built with plastic prop stands against one side of the group of dissipation fins to blow towards the heat source. The plastic prop standis not only easy assembled but also has the effects of shock isolation and low noise. This device structure is novel and progressive, and also has the use value of industry.
TW095115170A 2006-04-28 2006-04-28 The structure of a heat dissipation device TW200741169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095115170A TW200741169A (en) 2006-04-28 2006-04-28 The structure of a heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095115170A TW200741169A (en) 2006-04-28 2006-04-28 The structure of a heat dissipation device

Publications (1)

Publication Number Publication Date
TW200741169A true TW200741169A (en) 2007-11-01

Family

ID=57914004

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115170A TW200741169A (en) 2006-04-28 2006-04-28 The structure of a heat dissipation device

Country Status (1)

Country Link
TW (1) TW200741169A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024125167B3 (en) * 2024-08-08 2025-09-11 Tsung-Hsien Huang CLAMPING DEVICE FOR MOUNTING A RADIATOR FAN AND ASSEMBLY OF AN ASSEMBLY WITH THE SAME

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024125167B3 (en) * 2024-08-08 2025-09-11 Tsung-Hsien Huang CLAMPING DEVICE FOR MOUNTING A RADIATOR FAN AND ASSEMBLY OF AN ASSEMBLY WITH THE SAME

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