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TW200741165A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
TW200741165A
TW200741165A TW095114364A TW95114364A TW200741165A TW 200741165 A TW200741165 A TW 200741165A TW 095114364 A TW095114364 A TW 095114364A TW 95114364 A TW95114364 A TW 95114364A TW 200741165 A TW200741165 A TW 200741165A
Authority
TW
Taiwan
Prior art keywords
heat
container
evaporating
heat pipe
condensing
Prior art date
Application number
TW095114364A
Other languages
Chinese (zh)
Other versions
TWI279517B (en
Inventor
Tay-Jian Liu
Chao-Nien Tung
Chuen-Shu Hou
Chih-Hsien Sun
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95114364A priority Critical patent/TWI279517B/en
Application granted granted Critical
Publication of TWI279517B publication Critical patent/TWI279517B/en
Publication of TW200741165A publication Critical patent/TW200741165A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat pipe includes a heat-transferred sealed container and a pair of heat-collected sealed cases disposed on the container. The container includes an evaporating portion, a condensing portion and an adiabatic portion arranged between the evaporating and the condensing portions in a length direction of the container. The container defines a plurality of capillary structures in an inner wall thereof and is filled with a working liquid therein. The cases are respectively disposed on outer walls of the evaporating and condensing portions of the container. Heat dissipation efficiency of the heat pipe is greatly improved by big heat-absorbing and heat-dissipating areas of outsides of the heat-collected cases and a difference in temperature between the evaporating portion and the condensing portion of the heat pipe becomes smaller.
TW95114364A 2006-04-21 2006-04-21 Heat pipe TWI279517B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95114364A TWI279517B (en) 2006-04-21 2006-04-21 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95114364A TWI279517B (en) 2006-04-21 2006-04-21 Heat pipe

Publications (2)

Publication Number Publication Date
TWI279517B TWI279517B (en) 2007-04-21
TW200741165A true TW200741165A (en) 2007-11-01

Family

ID=38645434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95114364A TWI279517B (en) 2006-04-21 2006-04-21 Heat pipe

Country Status (1)

Country Link
TW (1) TWI279517B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9491865B1 (en) 2015-04-24 2016-11-08 Unimicron Technology Corp. Circuit board and method for manufacturing the same
TWI557956B (en) * 2015-02-04 2016-11-11 欣興電子股份有限公司 Circuit board and method for manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557956B (en) * 2015-02-04 2016-11-11 欣興電子股份有限公司 Circuit board and method for manufacturing the same
US9491865B1 (en) 2015-04-24 2016-11-08 Unimicron Technology Corp. Circuit board and method for manufacturing the same
US9883598B2 (en) 2015-04-24 2018-01-30 Unimicron Technology Corp. Circuit board and method for manufacturing the same
US10616992B2 (en) 2015-04-24 2020-04-07 Unimicron Technology Corp. Circuit board and method for manufacturing the same

Also Published As

Publication number Publication date
TWI279517B (en) 2007-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees