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TW200733226A - Apparatus for treating substrates and method of treating substrates - Google Patents

Apparatus for treating substrates and method of treating substrates

Info

Publication number
TW200733226A
TW200733226A TW096101406A TW96101406A TW200733226A TW 200733226 A TW200733226 A TW 200733226A TW 096101406 A TW096101406 A TW 096101406A TW 96101406 A TW96101406 A TW 96101406A TW 200733226 A TW200733226 A TW 200733226A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
solution
supply pipe
hydrogen peroxide
sulfur acid
Prior art date
Application number
TW096101406A
Other languages
Chinese (zh)
Inventor
Nobuo Kobayashi
Koichi Higuchi
Yoshiaki Kurokawa
Takashi Arai
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006010027A external-priority patent/JP2007194351A/en
Priority claimed from JP2006015266A external-priority patent/JP4759395B2/en
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200733226A publication Critical patent/TW200733226A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

This invention relates to a treatment apparatus for effectively eliminating anti-resistant film disposed on a semiconductor chip, including a rotating platform for holding the semiconductor chip; a nozzle disposed in opposite to the semiconductor chip held by the rotating platform, mixing solution of sulfur acid and hydrogen peroxide and then applying the solution onto the semiconductor chip. The nozzle comprises a body with a longitudinal shape located along a radial direction of the semiconductor chip; a first supply pipe and a second supply pipe for supplying the solution of sulfur acid and hydrogen peroxide to the body; a first slit and curved-surface and a second slit and curved-surface for mixing the solution of sulfur acid and hydrogen peroxide from the first supply pipe and the second supply pipe, and applying the solution from the body all over the semiconductor chip in the radial direction.
TW096101406A 2006-01-18 2007-01-15 Apparatus for treating substrates and method of treating substrates TW200733226A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006010027A JP2007194351A (en) 2006-01-18 2006-01-18 Substrate processing apparatus and processing method
JP2006015266A JP4759395B2 (en) 2006-01-24 2006-01-24 Substrate processing apparatus and processing method

Publications (1)

Publication Number Publication Date
TW200733226A true TW200733226A (en) 2007-09-01

Family

ID=38501345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101406A TW200733226A (en) 2006-01-18 2007-01-15 Apparatus for treating substrates and method of treating substrates

Country Status (2)

Country Link
KR (1) KR20070076527A (en)
TW (1) TW200733226A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450326B (en) * 2009-06-23 2014-08-21 東京威力科創股份有限公司 Liquid processing device and liquid processing method
TWI550680B (en) * 2009-09-28 2016-09-21 尼康股份有限公司 Substrate pressurization device and its control method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450326B (en) * 2009-06-23 2014-08-21 東京威力科創股份有限公司 Liquid processing device and liquid processing method
TWI550680B (en) * 2009-09-28 2016-09-21 尼康股份有限公司 Substrate pressurization device and its control method

Also Published As

Publication number Publication date
KR20070076527A (en) 2007-07-24

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