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TW200731054A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200731054A
TW200731054A TW095104527A TW95104527A TW200731054A TW 200731054 A TW200731054 A TW 200731054A TW 095104527 A TW095104527 A TW 095104527A TW 95104527 A TW95104527 A TW 95104527A TW 200731054 A TW200731054 A TW 200731054A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
heat
dissipation device
base plate
electronic element
Prior art date
Application number
TW095104527A
Other languages
Chinese (zh)
Other versions
TWI310895B (en
Inventor
Liang-Hui Zhao
Yi-Qiang Wu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95104527A priority Critical patent/TWI310895B/en
Publication of TW200731054A publication Critical patent/TW200731054A/en
Application granted granted Critical
Publication of TWI310895B publication Critical patent/TWI310895B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device for dissipating heat from an electronic element includes a heat spreader contacting with the electronic element, a conducting member having a lower base plate thermally contacting with the heat spreader and an upper base plate with a plurality of first fins and a connecting portion interconnecting the lower and upper base plate, and a plurality of second fins mounted on the conducting member. The heat of the electronic element is continuously transferred to the top of the conducting member and quickly dissipated by the first and second fins to ambient air. The heat dissipation efficiency of the heat dissipation device can thus be improved.
TW95104527A 2006-02-10 2006-02-10 Heat dissipation device TWI310895B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95104527A TWI310895B (en) 2006-02-10 2006-02-10 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95104527A TWI310895B (en) 2006-02-10 2006-02-10 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200731054A true TW200731054A (en) 2007-08-16
TWI310895B TWI310895B (en) 2009-06-11

Family

ID=45072329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95104527A TWI310895B (en) 2006-02-10 2006-02-10 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI310895B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116804888A (en) * 2022-03-24 2023-09-26 春鸿电子科技(重庆)有限公司 Heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116804888A (en) * 2022-03-24 2023-09-26 春鸿电子科技(重庆)有限公司 Heat dissipation device

Also Published As

Publication number Publication date
TWI310895B (en) 2009-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees