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TW200731027A - Process for producing a substrate with metal wiring - Google Patents

Process for producing a substrate with metal wiring

Info

Publication number
TW200731027A
TW200731027A TW095136136A TW95136136A TW200731027A TW 200731027 A TW200731027 A TW 200731027A TW 095136136 A TW095136136 A TW 095136136A TW 95136136 A TW95136136 A TW 95136136A TW 200731027 A TW200731027 A TW 200731027A
Authority
TW
Taiwan
Prior art keywords
substrate
reverse
resist pattern
metal
forming
Prior art date
Application number
TW095136136A
Other languages
Chinese (zh)
Inventor
Tomohiko Ushijima
Takeo Fujino
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Publication of TW200731027A publication Critical patent/TW200731027A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H10P76/202—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

Process for producing a substrate with metal wiring which comprises the steps of: (a) forming a coating film on the substrate by applying a positive-type photosensitive resin composition comprising (A) an alkali soluble resin, (B) a compound having quinonediazid group and (C) a solvent; (b) forming a photosensitive layer by drying the coating film under reduced pressure; (c) forming a reverse-tapered resist pattern by pattern exposing the photosensitive layer and subsequently developing the layer; (d) evaporating a metal onto the substrate having the reverse-tapered resist pattern obtained in the step (c); and (e) removing the reverse-tapered resist pattern together with the evaporated metal film thereon from the metal-evaporated substrate obtained in the step (d) by carrying out a lift-off operation. The substrate can be produced with low cost and in a high productivity using a substrate on which a reverse-tapered resist pattern obtained from general-purpose positive-type photoresist is formed.
TW095136136A 2005-09-30 2006-09-29 Process for producing a substrate with metal wiring TW200731027A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005288721 2005-09-30

Publications (1)

Publication Number Publication Date
TW200731027A true TW200731027A (en) 2007-08-16

Family

ID=37899946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136136A TW200731027A (en) 2005-09-30 2006-09-29 Process for producing a substrate with metal wiring

Country Status (5)

Country Link
JP (1) JP4978800B2 (en)
KR (1) KR20080057325A (en)
CN (1) CN101278239B (en)
TW (1) TW200731027A (en)
WO (1) WO2007037553A1 (en)

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EP2161973B1 (en) * 2007-05-24 2019-05-22 Princo Corp. A structure and manufacturing method of metal wiring on multilayered board
CN101312620B (en) * 2007-05-24 2011-06-22 巨擘科技股份有限公司 Manufacturing method and structure of multilayer substrate metal circuit
TWI354523B (en) 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
KR101674208B1 (en) * 2009-12-29 2016-11-23 엘지디스플레이 주식회사 Method for fabricating line and Method for fabricating liquid crystal display device of using the same
KR101920766B1 (en) 2011-08-09 2018-11-22 엘지디스플레이 주식회사 Method of fabricating the organic light emitting device
JP6056294B2 (en) * 2011-09-28 2017-01-11 大日本印刷株式会社 Pattern formation method
DE102013105972B4 (en) * 2012-06-20 2016-11-03 Lg Display Co., Ltd. A method of manufacturing an organic light emitting diode display device
US20150223345A1 (en) * 2012-09-25 2015-08-06 Toray Industries, Inc. Method of forming wiring pattern, and wiring pattern formation
US9448346B2 (en) 2012-12-19 2016-09-20 Viavi Solutions Inc. Sensor device including one or more metal-dielectric optical filters
US10197716B2 (en) 2012-12-19 2019-02-05 Viavi Solutions Inc. Metal-dielectric optical filter, sensor device, and fabrication method
US9568362B2 (en) 2012-12-19 2017-02-14 Viavi Solutions Inc. Spectroscopic assembly and method
CN103839794B (en) * 2014-02-25 2016-08-17 京东方科技集团股份有限公司 Transparency conductive electrode and the preparation method of array base palte
KR102240253B1 (en) * 2014-06-18 2021-04-13 비아비 솔루션즈 아이엔씨. Metal-dielectric optical filter, sensor device, and fabrication method
CN104319293A (en) * 2014-11-10 2015-01-28 京东方科技集团股份有限公司 Metallic oxide thin film transistor, array substrate, manufacturing method and display device
CN106711017B (en) * 2015-07-20 2020-08-04 潍坊星泰克微电子材料有限公司 Method for depositing metal features using photoresist
CN107731883A (en) * 2017-11-17 2018-02-23 深圳市华星光电半导体显示技术有限公司 OLED display and preparation method thereof
CN108389784B (en) * 2018-02-26 2019-04-30 清华大学 Preparation method of patterned metal layer
CN108585540A (en) * 2018-04-17 2018-09-28 信利光电股份有限公司 A kind of glass material manufacturing method for picture on surface, glass plate and electronic device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4115120A (en) * 1977-09-29 1978-09-19 International Business Machines Corporation Method of forming thin film patterns by differential pre-baking of resist
JPS6119128A (en) * 1984-07-05 1986-01-28 Sony Corp Pattern forming process
JPS61103151A (en) * 1984-10-27 1986-05-21 Dainippon Printing Co Ltd Patterning method for multilayer dielectric thin film
JPS61221747A (en) * 1985-03-27 1986-10-02 Mitsubishi Electric Corp Method for forming photosensitive resin film
JPH03235322A (en) * 1990-02-13 1991-10-21 Nec Corp Resist pattern forming method
JPH06275510A (en) * 1993-03-23 1994-09-30 Matsushita Electric Ind Co Ltd Fine pattern formation method
JP2973874B2 (en) * 1994-06-23 1999-11-08 信越化学工業株式会社 Pattern formation method
JP3287234B2 (en) * 1996-09-19 2002-06-04 信越化学工業株式会社 Positive resist composition for lift-off method and pattern forming method
JP2002267833A (en) * 2001-03-14 2002-09-18 Toray Ind Inc Method for manufacturing color filter for liquid crystal display
JP2003198009A (en) * 2001-12-28 2003-07-11 Sharp Corp Method for forming electrodes, method for manufacturing liquid crystal display device, and liquid crystal display device
JP2005338831A (en) * 2004-05-25 2005-12-08 Samsung Electronics Co Ltd Organic film photoresist composition for liquid crystal display device, spinless coating method thereof, organic film pattern forming method using the same, and liquid crystal display device manufactured thereby

Also Published As

Publication number Publication date
JPWO2007037553A1 (en) 2009-04-16
CN101278239A (en) 2008-10-01
JP4978800B2 (en) 2012-07-18
CN101278239B (en) 2011-11-16
WO2007037553A9 (en) 2007-05-31
KR20080057325A (en) 2008-06-24
WO2007037553A1 (en) 2007-04-05

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