[go: up one dir, main page]

TW200730085A - Heat sink - Google Patents

Heat sink

Info

Publication number
TW200730085A
TW200730085A TW096106019A TW96106019A TW200730085A TW 200730085 A TW200730085 A TW 200730085A TW 096106019 A TW096106019 A TW 096106019A TW 96106019 A TW96106019 A TW 96106019A TW 200730085 A TW200730085 A TW 200730085A
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
heat generating
generating element
present
Prior art date
Application number
TW096106019A
Other languages
English (en)
Other versions
TWI323637B (zh
Inventor
jian-an Zhou
wen-xiong Chen
Jia-Hao Lin
Original Assignee
Acbel Polytech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acbel Polytech Inc filed Critical Acbel Polytech Inc
Priority to TW096106019A priority Critical patent/TW200730085A/zh
Priority to CN200720004779.XU priority patent/CN201146092Y/zh
Publication of TW200730085A publication Critical patent/TW200730085A/zh
Application granted granted Critical
Publication of TWI323637B publication Critical patent/TWI323637B/zh

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW096106019A 2007-02-16 2007-02-16 Heat sink TW200730085A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096106019A TW200730085A (en) 2007-02-16 2007-02-16 Heat sink
CN200720004779.XU CN201146092Y (zh) 2007-02-16 2007-04-02 散热装置及运用该散热装置的具有散热功能的电子组件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096106019A TW200730085A (en) 2007-02-16 2007-02-16 Heat sink
CN200720004779.XU CN201146092Y (zh) 2007-02-16 2007-04-02 散热装置及运用该散热装置的具有散热功能的电子组件

Publications (2)

Publication Number Publication Date
TW200730085A true TW200730085A (en) 2007-08-01
TWI323637B TWI323637B (zh) 2010-04-11

Family

ID=50156495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106019A TW200730085A (en) 2007-02-16 2007-02-16 Heat sink

Country Status (2)

Country Link
CN (1) CN201146092Y (zh)
TW (1) TW200730085A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471085B (zh) * 2012-03-15 2015-01-21 Futaba Electric Co Ltd 散熱型電阻及其散熱模組

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202551603U (zh) * 2012-04-23 2012-11-21 深圳市晶福源电子技术有限公司 自带散热器的器件
CN105376998B (zh) * 2015-11-19 2018-04-13 重庆华万伦电器有限公司 弹力夹夹持式铝合金散热片
US11289981B2 (en) * 2018-08-17 2022-03-29 Tai-Her Yang Frame device of iron core of static electrical machine having outwardly-extended heat dissipation fins and/or heat dissipation hole
TWI705224B (zh) * 2019-06-06 2020-09-21 海韻電子工業股份有限公司 變壓器的散熱結構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471085B (zh) * 2012-03-15 2015-01-21 Futaba Electric Co Ltd 散熱型電阻及其散熱模組

Also Published As

Publication number Publication date
CN201146092Y (zh) 2008-11-05
TWI323637B (zh) 2010-04-11

Similar Documents

Publication Publication Date Title
LTPA2020539I1 (lt) 1'-Pakeistieji karba-nukleozidų analogai, skirti antivirusiniam gydymui
DE502007003871D1 (de) Stromschiene mit Wärmeableitung
EP2181399A4 (en) COMPOSITE STUFFED FLOWS
FI20126259A7 (fi) Hermeettisesti suljettu optoelektroninen komponentti
EP2377174A4 (en) THERMOELECTRIC HIGH-TEMPERATURE AND HIGH-PERFORMANCE MODULE
FI20080295A0 (fi) Jäähdytyselementti sähkökoneeseen
GB201212820D0 (en) Heat sink with multiple vapor chambers
MX2009012045A (es) Formulaciones termofijas pirorretardadas.
GB2508991A (en) Subsea electrical architectures
GB201114436D0 (en) Fixing means
GB201020916D0 (en) Subsea heat exchanger
FI20075497A0 (fi) Jäähdytyselementti
GB201019279D0 (en) Dissipating heat within housings for electrical components
GB201212923D0 (en) Improved apparatus
TW200730085A (en) Heat sink
TWI368722B (en) Heat dissipation structure
TWI365521B (en) Semiconductor package structure with heat sink
MX2011005611A (es) Sintesis y formas de sales novedosas de (r)-5-((e)-2-(pirrolidin-3 -il-vinil)pirimidina.
TWI365520B (en) Heat dissipation package for heat generation element
MX366750B (es) Disipador térmico endotérmico para herramientas de fondo del pozo.
TWI348885B (en) Heat dissipation module
TWI340229B (en) Heat dissipation fin, heat dissipation module and method for assembling the same
IN2012DN05215A (zh)
GB201109032D0 (en) Heat dissipating thermally stable reflectors
GB0702585D0 (en) Cooling system for power tools

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees