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TW200739085A - Contact probe - Google Patents

Contact probe

Info

Publication number
TW200739085A
TW200739085A TW095149159A TW95149159A TW200739085A TW 200739085 A TW200739085 A TW 200739085A TW 095149159 A TW095149159 A TW 095149159A TW 95149159 A TW95149159 A TW 95149159A TW 200739085 A TW200739085 A TW 200739085A
Authority
TW
Taiwan
Prior art keywords
contact probe
inspected
property
plunger
contact
Prior art date
Application number
TW095149159A
Other languages
Chinese (zh)
Other versions
TWI325960B (en
Inventor
Toshio Kazama
Shigeki Ishikawa
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200739085A publication Critical patent/TW200739085A/en
Application granted granted Critical
Publication of TWI325960B publication Critical patent/TWI325960B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Provided is a contact probe capable of satisfying requirement of desired pitch between contact probes, and further satisfying various properties, such as loading property, abrasion-resistance property, electricity property etc., which are required for contact probe. For attaining this purpose, the contact probe provided in the present invention has a plunger 1 contacting an object to be inspected, a plunger 2 contacting a contact terminal 31 in the inspection apparatus side, and a wire 3 provided between the plungers 1, 2. The respective plunger 1, 2 having a selected desired property corresponding to said object to be inspected is assembled with the wire 3 having a selected desired property corresponding to said object to be inspected and are mechanically connected with each other using close coiling spring connectors 4, 5.
TW095149159A 2005-12-28 2006-12-27 Contact probe TW200739085A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005380378A JP4916719B2 (en) 2005-12-28 2005-12-28 Contact probe and contact probe mounting structure
PCT/JP2006/325755 WO2007077784A1 (en) 2005-12-28 2006-12-25 Contact probe

Publications (2)

Publication Number Publication Date
TW200739085A true TW200739085A (en) 2007-10-16
TWI325960B TWI325960B (en) 2010-06-11

Family

ID=38228139

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149159A TW200739085A (en) 2005-12-28 2006-12-27 Contact probe

Country Status (3)

Country Link
JP (1) JP4916719B2 (en)
TW (1) TW200739085A (en)
WO (1) WO2007077784A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103238077A (en) * 2010-11-29 2013-08-07 株式会社精研 tools for contact inspection
TWI424165B (en) * 2009-04-09 2014-01-21 Nhk Spring Co Ltd Contact probe and probe unit
TWI482973B (en) * 2009-04-03 2015-05-01 Nhk Spring Co Ltd Wire material for spring, contact probe, and probe unit

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864719B1 (en) 2007-07-23 2008-10-23 주식회사 오킨스전자 Test probe pins and test sockets containing them
JP4900843B2 (en) 2008-12-26 2012-03-21 山一電機株式会社 Electrical connection device for semiconductor device and contact used therefor
JP6011103B2 (en) * 2012-07-23 2016-10-19 山一電機株式会社 Contact probe and socket for semiconductor device provided with the same
JP6269337B2 (en) * 2014-06-16 2018-01-31 オムロン株式会社 Probe pin and electronic device using the same
JP6515516B2 (en) * 2014-12-12 2019-05-22 オムロン株式会社 Probe pin and electronic device provided with the same
KR102165662B1 (en) 2015-03-31 2020-10-14 가부시키가이샤 엔프라스 Sockets for electrical contacts and electrical components
KR101981522B1 (en) * 2017-11-06 2019-05-23 주식회사 오킨스전자 S-type PION pin, and test scoket with the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184678A (en) * 1982-04-21 1983-10-28 Mitsubishi Electric Corp Information retrieving device
JPS58184678U (en) * 1982-06-03 1983-12-08 ソニー株式会社 probe device
JP2980625B2 (en) * 1989-12-27 1999-11-22 日本発条株式会社 Conductive contact
JPH0510971A (en) * 1990-07-30 1993-01-19 Nhk Spring Co Ltd Conductive contact
JP2516245Y2 (en) * 1991-10-15 1996-11-06 株式会社ヨコオ Conductive contact pin
JP3025108U (en) * 1995-11-22 1996-06-11 日本電子材料株式会社 Probe and probe card using the same
JP4060919B2 (en) * 1997-11-28 2008-03-12 富士通株式会社 Electrical connection device, contact manufacturing method, and semiconductor test method
JP2005338065A (en) * 2004-04-26 2005-12-08 Koyo Technos:Kk Inspection jig and inspection equipment
JP2006153723A (en) * 2004-11-30 2006-06-15 Japan Electronic Materials Corp Vertical coil spring probe and probe unit using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482973B (en) * 2009-04-03 2015-05-01 Nhk Spring Co Ltd Wire material for spring, contact probe, and probe unit
TWI424165B (en) * 2009-04-09 2014-01-21 Nhk Spring Co Ltd Contact probe and probe unit
CN103238077A (en) * 2010-11-29 2013-08-07 株式会社精研 tools for contact inspection
CN103238077B (en) * 2010-11-29 2015-07-22 株式会社精研 tools for contact inspection
US9459283B2 (en) 2010-11-29 2016-10-04 Seiken Co., Ltd. Contact test device

Also Published As

Publication number Publication date
JP4916719B2 (en) 2012-04-18
JP2007178404A (en) 2007-07-12
WO2007077784A1 (en) 2007-07-12
TWI325960B (en) 2010-06-11

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