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TW200738124A - Liquid-cooled heat radiating module - Google Patents

Liquid-cooled heat radiating module

Info

Publication number
TW200738124A
TW200738124A TW096121128A TW96121128A TW200738124A TW 200738124 A TW200738124 A TW 200738124A TW 096121128 A TW096121128 A TW 096121128A TW 96121128 A TW96121128 A TW 96121128A TW 200738124 A TW200738124 A TW 200738124A
Authority
TW
Taiwan
Prior art keywords
liquid
radiating module
pressure
cooling fin
fin set
Prior art date
Application number
TW096121128A
Other languages
Chinese (zh)
Inventor
Yun-Yu Ye
qi-neng Xiao
Original Assignee
Xigmatek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xigmatek Co Ltd filed Critical Xigmatek Co Ltd
Priority to TW096121128A priority Critical patent/TW200738124A/en
Publication of TW200738124A publication Critical patent/TW200738124A/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention is a liquid-cooled heat radiating module comprising a liquid-cooled head, a pressure radiating module, and a plurality of bendable pipes connected between the pressure radiating module and the liquid-cooled head, where a cooling fin set, on which a plurality of cooling fins with flow channels for the flow of a liquid with heat conducting effect are deployed, and a pressure water tank, which is assembled on the cooling fin set and has a container connecting with the flow channels of the cooling fin set and a pressure unit for applying driving force on the liquid to force the liquid into the pipes and continue circulating, are modulized on the pressure radiating module. The present invention effectively modulizes conventional cooling fin set, water tank, and pressure unit to reduce the unit size and make installation of the unit inside the casing of a computer or electronic device easier and more convenient.
TW096121128A 2007-06-12 2007-06-12 Liquid-cooled heat radiating module TW200738124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096121128A TW200738124A (en) 2007-06-12 2007-06-12 Liquid-cooled heat radiating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096121128A TW200738124A (en) 2007-06-12 2007-06-12 Liquid-cooled heat radiating module

Publications (1)

Publication Number Publication Date
TW200738124A true TW200738124A (en) 2007-10-01

Family

ID=57913741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096121128A TW200738124A (en) 2007-06-12 2007-06-12 Liquid-cooled heat radiating module

Country Status (1)

Country Link
TW (1) TW200738124A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657548B (en) * 2018-05-24 2019-04-21 技嘉科技股份有限公司 Heat dissipation device for dissipating heat from heat-generating source
US10375856B2 (en) 2016-01-14 2019-08-06 Cooler Master Co., Ltd. Liquid cooling system
CN111182766A (en) * 2019-12-27 2020-05-19 河北工业大学 Liquid cooling heat dissipation assembly for cooling high-voltage motor driver
TWI765466B (en) * 2020-03-27 2022-05-21 雙鴻科技股份有限公司 Liquid cooling head device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10375856B2 (en) 2016-01-14 2019-08-06 Cooler Master Co., Ltd. Liquid cooling system
TWI657548B (en) * 2018-05-24 2019-04-21 技嘉科技股份有限公司 Heat dissipation device for dissipating heat from heat-generating source
CN111182766A (en) * 2019-12-27 2020-05-19 河北工业大学 Liquid cooling heat dissipation assembly for cooling high-voltage motor driver
TWI765466B (en) * 2020-03-27 2022-05-21 雙鴻科技股份有限公司 Liquid cooling head device

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