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Application filed by King Yuan Electronics Co LtdfiledCriticalKing Yuan Electronics Co Ltd
Priority to TW95111425ApriorityCriticalpatent/TWI325500B/en
Publication of TW200736632ApublicationCriticalpatent/TW200736632A/en
Application grantedgrantedCritical
Publication of TWI325500BpublicationCriticalpatent/TWI325500B/en
Testing Of Individual Semiconductor Devices
(AREA)
Tests Of Electronic Circuits
(AREA)
Abstract
An apparatus with a flexible printed circuit board (PCB) for testing packaged integrated circuits is disclosed herein. The apparatus includes a connecting module, which electrically connects with a load board. The connecting module includes a flexible PCB positioned between an integrated circuit under test and the load board.
Film-type semiconductor package and method using test pads shared by output channels, and test device, semiconductor device and method using patterns shared by test channels