[go: up one dir, main page]

TW200735265A - Method and apparatus for treating semiconductor substrates - Google Patents

Method and apparatus for treating semiconductor substrates

Info

Publication number
TW200735265A
TW200735265A TW096100241A TW96100241A TW200735265A TW 200735265 A TW200735265 A TW 200735265A TW 096100241 A TW096100241 A TW 096100241A TW 96100241 A TW96100241 A TW 96100241A TW 200735265 A TW200735265 A TW 200735265A
Authority
TW
Taiwan
Prior art keywords
semiconductor substrates
substrates
treating semiconductor
treating
furnace
Prior art date
Application number
TW096100241A
Other languages
English (en)
Inventor
Rainer Klaus Krause
Markus Schmidt
Gerd Pfeiffer
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200735265A publication Critical patent/TW200735265A/zh

Links

Classifications

    • H10P90/1914
TW096100241A 2006-01-09 2007-01-03 Method and apparatus for treating semiconductor substrates TW200735265A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06100155 2006-01-09

Publications (1)

Publication Number Publication Date
TW200735265A true TW200735265A (en) 2007-09-16

Family

ID=37734967

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100241A TW200735265A (en) 2006-01-09 2007-01-03 Method and apparatus for treating semiconductor substrates

Country Status (2)

Country Link
TW (1) TW200735265A (zh)
WO (1) WO2007080013A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1158581B1 (en) * 1999-10-14 2016-04-27 Shin-Etsu Handotai Co., Ltd. Method for producing soi wafer
JP2002110688A (ja) * 2000-09-29 2002-04-12 Canon Inc Soiの熱処理方法及び製造方法
US6483081B1 (en) * 2000-11-27 2002-11-19 Novellus Systems, Inc. In-line cure furnace and method for using the same
FR2827078B1 (fr) * 2001-07-04 2005-02-04 Soitec Silicon On Insulator Procede de diminution de rugosite de surface
FR2847714B1 (fr) * 2002-11-27 2005-02-18 Soitec Silicon On Insulator Procede et dispositif de recuit de tranche de semiconducteur

Also Published As

Publication number Publication date
WO2007080013A1 (en) 2007-07-19

Similar Documents

Publication Publication Date Title
SG136030A1 (en) Method for manufacturing compound material wafers and method for recycling a used donor substrate
TW200802615A (en) UV assisted thermal processing
WO2010068598A3 (en) A load lock for cooling wafers and a method of cooling the wafers
WO2011028349A3 (en) Remote hydrogen plasma source of silicon containing film deposition
SG142223A1 (en) Methods for characterizing defects on silicon surfaces, etching composition for silicon surfaces and process of treating silicon surfaces with the etching composition
TW200737346A (en) Sequential oxide removal using fluorine and hydrogen
TW200943389A (en) Selective formation of silicon carbon epitaxial layer
WO2011084706A3 (en) Apparatus and method for controlling semiconductor die warpage
SG135153A1 (en) Silicon single crystal wafer for igbt and method for manufacturing silicon single crystal wafer for igbt
TWI349964B (en) Exhaust equipment, substrate process equipment installed the exhaust equipment and method of exhausting
WO2008081724A1 (ja) 絶縁膜の形成方法および半導体装置の製造方法
JP2010161350A5 (ja) 半導体装置の製造方法及び基板処理装置
TW200644048A (en) Manufacturing method of semiconductor device
WO2009099284A3 (en) Substrate supporting unit, substrate processing apparatus, and method of manufacturing substrate supporting unit
TW201130042A (en) Substrate processing method and substrate processing apparatus
TWI347379B (en) Silicon wafer and method for producing same
MD20080228A (en) Method for low-emission drying of sugar beet chips
TW200943468A (en) Plasma processing device
WO2010088348A3 (en) Methods for forming conformal oxide layers on semiconductor devices
TW200723368A (en) Apparatus and method for manufacturing semiconductor device, and electronic apparatus
PL382902A1 (pl) Sposób i urządzenie do obróbki płaskich, kruchych podłoży
WO2011095560A3 (de) Verfahren und vorrichtung zur wärmebehandlung des scheibenförmigen grundmaterials einer solarzelle
TW200717686A (en) Apparatus and method for treating substrate
TW200729289A (en) Non-plasma method of removing photoresist from a substrate
WO2011139640A3 (en) Improved radiation heating efficiency by increasing absorption of a silicon containing material