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TW200734435A - Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing - Google Patents

Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing

Info

Publication number
TW200734435A
TW200734435A TW095143163A TW95143163A TW200734435A TW 200734435 A TW200734435 A TW 200734435A TW 095143163 A TW095143163 A TW 095143163A TW 95143163 A TW95143163 A TW 95143163A TW 200734435 A TW200734435 A TW 200734435A
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
aqueous dispersion
kit
preparing
Prior art date
Application number
TW095143163A
Other languages
English (en)
Chinese (zh)
Inventor
Masayuki Motonari
Eiichirou Kunitani
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200734435A publication Critical patent/TW200734435A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H10P52/403—
    • H10W20/062—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095143163A 2005-11-24 2006-11-22 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing TW200734435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005338961 2005-11-24

Publications (1)

Publication Number Publication Date
TW200734435A true TW200734435A (en) 2007-09-16

Family

ID=38067099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143163A TW200734435A (en) 2005-11-24 2006-11-22 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method and the kit for preparing aqueous dispersion for chemical mechanical polishing

Country Status (3)

Country Link
JP (1) JPWO2007060869A1 (fr)
TW (1) TW200734435A (fr)
WO (1) WO2007060869A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5013732B2 (ja) * 2006-04-03 2012-08-29 Ｊｓｒ株式会社 化学機械研磨用水系分散体、化学機械研磨方法、化学機械研磨用キット、および化学機械研磨用水系分散体を調製するためのキット
JP5196112B2 (ja) * 2007-07-09 2013-05-15 Ｊｓｒ株式会社 化学機械研磨用水系分散体および多層回路基板の製造方法
JPWO2009028256A1 (ja) * 2007-08-31 2010-11-25 Jsr株式会社 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法
JPWO2009031389A1 (ja) * 2007-09-03 2010-12-09 Jsr株式会社 化学機械研磨用水系分散体およびその調製方法、化学機械研磨用水系分散体を調製するためのキット、ならびに半導体装置の化学機械研磨方法
JP2009164188A (ja) * 2007-12-28 2009-07-23 Fujimi Inc 研磨用組成物
JP5403922B2 (ja) * 2008-02-26 2014-01-29 富士フイルム株式会社 研磨液および研磨方法
JP5472585B2 (ja) 2008-05-22 2014-04-16 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP5495508B2 (ja) * 2008-05-23 2014-05-21 日揮触媒化成株式会社 研磨用粒子分散液およびその製造方法
KR20110090920A (ko) 2008-11-10 2011-08-10 아사히 가라스 가부시키가이샤 연마용 조성물 및 반도체 집적 회로 장치의 제조 방법
JP4990300B2 (ja) * 2009-01-14 2012-08-01 パナソニック株式会社 半導体装置の製造方法
JP5493526B2 (ja) * 2009-07-14 2014-05-14 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
JP5493528B2 (ja) * 2009-07-15 2014-05-14 日立化成株式会社 Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
TW201742900A (zh) * 2016-06-09 2017-12-16 日立化成股份有限公司 Cmp用研磨液及研磨方法
JP7161894B2 (ja) * 2018-09-04 2022-10-27 株式会社フジミインコーポレーテッド 研磨用組成物および研磨システム
CN115595585A (zh) * 2022-11-10 2023-01-13 江西省科学院应用物理研究所（Cn） 一种易氧化金属专用金相抛光剂的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253141B2 (ja) * 2000-08-21 2009-04-08 株式会社東芝 化学機械研磨用スラリおよび半導体装置の製造方法
JP2003077920A (ja) * 2001-09-04 2003-03-14 Nec Corp 金属配線の形成方法
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005045229A (ja) * 2003-07-04 2005-02-17 Jsr Corp 化学機械研磨用水系分散体および化学機械研磨方法
JP4336550B2 (ja) * 2003-09-09 2009-09-30 花王株式会社 磁気ディスク用研磨液キット
JP4667013B2 (ja) * 2003-11-14 2011-04-06 昭和電工株式会社 研磨組成物および研磨方法
JP2005302973A (ja) * 2004-04-12 2005-10-27 Jsr Corp 化学機械研磨用水系分散体及び化学機械研磨方法

Also Published As

Publication number Publication date
WO2007060869A1 (fr) 2007-05-31
JPWO2007060869A1 (ja) 2009-05-07

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