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TW200734429A - Isotropically conductive adhesive sheet and circuit board - Google Patents

Isotropically conductive adhesive sheet and circuit board

Info

Publication number
TW200734429A
TW200734429A TW096101304A TW96101304A TW200734429A TW 200734429 A TW200734429 A TW 200734429A TW 096101304 A TW096101304 A TW 096101304A TW 96101304 A TW96101304 A TW 96101304A TW 200734429 A TW200734429 A TW 200734429A
Authority
TW
Taiwan
Prior art keywords
conductive adhesive
circuit board
adhesive sheet
isotropically conductive
isotropically
Prior art date
Application number
TW096101304A
Other languages
Chinese (zh)
Inventor
Tsunehiko Terada
Masayuki Totouge
Syohei Morimoto
Original Assignee
Tatsuta System Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta System Electronics Co Ltd filed Critical Tatsuta System Electronics Co Ltd
Publication of TW200734429A publication Critical patent/TW200734429A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)

Abstract

An isotropically conductive adhesive sheet that realizes simplification of the step of bonding a metallic reinforcing plate to a main body of circuit board and imparting of conduction reliability and electromagnetic shielding effect to the circuit board; and a circuit board obtained by the use of the isotropically conductive adhesive sheet. Isotropically conductive adhesive sheet (1) includes mold release film (2) and, superimposed on a surface thereof, isotropically conductive adhesive layer (3). Numeral 5 refers to a main body of circuit board (bonded portion only shown), 6 to an insulating layer, 7 to an electrode of copper, etc., and 8 to a reinforcing plate. The isotropically conductive adhesive layer (3) consists of a binder containing conductive particles (4). The conductive particles (4) consist of a metal powder, or low-melting-point metal powder, having an average particle diameter of 5 to 50 μm and are added in an amount of 150 to 250 parts by weight per 100 parts by weight of binder.
TW096101304A 2006-01-13 2007-01-12 Isotropically conductive adhesive sheet and circuit board TW200734429A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006006404A JP2007189091A (en) 2006-01-13 2006-01-13 Isotropic conductive bonding sheet and circuit substrate

Publications (1)

Publication Number Publication Date
TW200734429A true TW200734429A (en) 2007-09-16

Family

ID=38256249

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101304A TW200734429A (en) 2006-01-13 2007-01-12 Isotropically conductive adhesive sheet and circuit board

Country Status (3)

Country Link
JP (1) JP2007189091A (en)
TW (1) TW200734429A (en)
WO (1) WO2007080842A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557207B (en) * 2012-07-11 2016-11-11 Tatsuta Densen Kk A hardened conductive adhesive composition, an electromagnetic wave shielding film, and a conductive property Adhesive film, bonding method and its circuit board
TWI669721B (en) * 2014-03-19 2019-08-21 日商迪睿合股份有限公司 Anisotropic conductive adhesive

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5280034B2 (en) * 2007-10-10 2013-09-04 日東電工株式会社 Double-sided adhesive tape or sheet for printed circuit board and printed circuit board
JP5195061B2 (en) * 2008-06-16 2013-05-08 株式会社デンソー Conductive adhesive and member connecting method using the same
JP5521227B2 (en) * 2009-01-26 2014-06-11 タツタ電線株式会社 Conductive adhesive sheet, electromagnetic shielding material provided with the same, and printed wiring board
JP2011178986A (en) * 2010-02-02 2011-09-15 Nitto Denko Corp Adhesive composition for production of semiconductor device and adhesive sheet for production of semiconductor device
JP4996727B2 (en) 2010-08-31 2012-08-08 株式会社東芝 Electronic devices and flexible printed wiring boards
JP5395854B2 (en) 2011-08-11 2014-01-22 タツタ電線株式会社 Printed wiring board and printed wiring board manufacturing method
WO2014132951A1 (en) 2013-02-26 2014-09-04 タツタ電線株式会社 Reinforcing member for flexible printed wiring substrate, flexible printed wiring substrate, and shield printed wiring substrate
JP5681824B1 (en) 2013-10-01 2015-03-11 株式会社フジクラ Wiring board assembly and manufacturing method thereof
JP5736026B2 (en) * 2013-11-13 2015-06-17 タツタ電線株式会社 Conductive adhesive sheet, wiring board including the same, and method for producing conductive adhesive sheet
WO2016032006A1 (en) 2014-08-29 2016-03-03 タツタ電線株式会社 Reinforcing member for flexible printed wiring board, and flexible printed wiring board provided with same
JP6467701B2 (en) * 2014-10-28 2019-02-13 信越ポリマー株式会社 Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof
JP2016157781A (en) * 2015-02-24 2016-09-01 株式会社巴川製紙所 Conductive adhesive sheet, shield printed wiring board and electronic apparatus
JP5854248B1 (en) 2015-05-27 2016-02-09 東洋インキＳｃホールディングス株式会社 Conductive adhesive, and conductive adhesive sheet and electromagnetic wave shielding sheet using the same
CN110235530A (en) * 2017-02-13 2019-09-13 拓自达电线株式会社 Printed wiring board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01206575A (en) * 1988-02-15 1989-08-18 Shin Etsu Polymer Co Ltd Hot bond type connector with adhesive
JP3157344B2 (en) * 1993-04-27 2001-04-16 三洋電機株式会社 Method for manufacturing conductive sheet and display device
JP4684439B2 (en) * 2001-03-06 2011-05-18 富士通株式会社 Conductive particles, conductive composition, and method for manufacturing electronic device
JP4403360B2 (en) * 2003-02-28 2010-01-27 Ｄｉｃ株式会社 Conductive adhesive sheet
DE112004001768B4 (en) * 2003-09-26 2019-11-21 Hitachi Chemical Co., Ltd. Mixed conductive powder and its use
JP4843979B2 (en) * 2004-03-30 2011-12-21 住友ベークライト株式会社 Circuit board
JP4538266B2 (en) * 2004-05-21 2010-09-08 ソニーケミカル＆インフォメーションデバイス株式会社 Adhesive film, method for producing substrate with adhesive, and method for producing adhesive film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557207B (en) * 2012-07-11 2016-11-11 Tatsuta Densen Kk A hardened conductive adhesive composition, an electromagnetic wave shielding film, and a conductive property Adhesive film, bonding method and its circuit board
TWI669721B (en) * 2014-03-19 2019-08-21 日商迪睿合股份有限公司 Anisotropic conductive adhesive

Also Published As

Publication number Publication date
WO2007080842A1 (en) 2007-07-19
JP2007189091A (en) 2007-07-26

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