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TW200734151A - Mold structure - Google Patents

Mold structure

Info

Publication number
TW200734151A
TW200734151A TW095108203A TW95108203A TW200734151A TW 200734151 A TW200734151 A TW 200734151A TW 095108203 A TW095108203 A TW 095108203A TW 95108203 A TW95108203 A TW 95108203A TW 200734151 A TW200734151 A TW 200734151A
Authority
TW
Taiwan
Prior art keywords
mold
adjusting
mold core
core
holder
Prior art date
Application number
TW095108203A
Other languages
Chinese (zh)
Other versions
TWI318598B (en
Inventor
Wen-Ssu Chiu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW95108203A priority Critical patent/TWI318598B/en
Publication of TW200734151A publication Critical patent/TW200734151A/en
Application granted granted Critical
Publication of TWI318598B publication Critical patent/TWI318598B/en

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention provides a mold structure including a mold plate and a mold core. The mold plate includes a receiving portion, which receive the mold core. The mold structure also includes a mold holder and an adjusting assembly. The mold holder has a cavity defined thereon, which receive the mold plate therewith the mold core. The mold holder also has a sidewall, which has an adjusting hole defined therein connecting with the cavity. The adjusting assembly includes an adjusting element and an adjusting block and an elastic element. The adjusting block engages with the mold core to drive the mold core to move in relative with the mold plate in the receiving portion. The elastic element provides a restoring force to move the mold core.
TW95108203A 2006-03-10 2006-03-10 Mold structure TWI318598B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95108203A TWI318598B (en) 2006-03-10 2006-03-10 Mold structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95108203A TWI318598B (en) 2006-03-10 2006-03-10 Mold structure

Publications (2)

Publication Number Publication Date
TW200734151A true TW200734151A (en) 2007-09-16
TWI318598B TWI318598B (en) 2009-12-21

Family

ID=45073512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95108203A TWI318598B (en) 2006-03-10 2006-03-10 Mold structure

Country Status (1)

Country Link
TW (1) TWI318598B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415731B (en) * 2008-06-06 2013-11-21 Hon Hai Prec Ind Co Ltd Tool and method for taking out module core
CN110884071A (en) * 2019-12-24 2020-03-17 上海亿泊材料应用技术有限公司 an injection mold
TWI869355B (en) * 2018-10-22 2025-01-11 荷商貝西荷蘭有限公司 Mould and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415731B (en) * 2008-06-06 2013-11-21 Hon Hai Prec Ind Co Ltd Tool and method for taking out module core
TWI869355B (en) * 2018-10-22 2025-01-11 荷商貝西荷蘭有限公司 Mould and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
CN110884071A (en) * 2019-12-24 2020-03-17 上海亿泊材料应用技术有限公司 an injection mold

Also Published As

Publication number Publication date
TWI318598B (en) 2009-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees