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TW200721927A - Method for making a circuit board, and circuit board - Google Patents

Method for making a circuit board, and circuit board

Info

Publication number
TW200721927A
TW200721927A TW095133428A TW95133428A TW200721927A TW 200721927 A TW200721927 A TW 200721927A TW 095133428 A TW095133428 A TW 095133428A TW 95133428 A TW95133428 A TW 95133428A TW 200721927 A TW200721927 A TW 200721927A
Authority
TW
Taiwan
Prior art keywords
resist pattern
layer
circuit board
substrate
supporting substrate
Prior art date
Application number
TW095133428A
Other languages
Chinese (zh)
Inventor
Teruaki Yagi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200721927A publication Critical patent/TW200721927A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This invention provides a method for making a circuit board. The method comprises the steps of forming an extra thin conductive metal layer on the surface of a supporting substrate, and forming a resist pattern on the surface of the extra-thin conductive metal layer, forming by electric plating a plating layer of the same thickness as the resist pattern over the surface of the extra-thin conductive metal layer that is not covered with the resist pattern, therefore, nodules are formed by electric plating on the surface of above said plating layer, and then placing a substrate film on the nodules, the substrate film having an insulation film and an adhesive agent layer on the insulation film so as to cause the adhesive agent layer to contact the nodule, to cause the nodules to intrude into the adhesive agent layer, Subsequently, the resist pattern and the plating layer formed on the supporting substrate are transferred to the substrate film side by peeling off the supporting substrate. Then, the resist pattern transferred to the supporting substrate is removed to form a conductive pattern made of copper on the surface of the substrate film. According to the present invention a conductive pattern can be formed to protrude from the surface of the insulation film, and the conductive pattern has a high peeling strength.
TW095133428A 2005-09-30 2006-09-11 Method for making a circuit board, and circuit board TW200721927A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005288043A JP2007103440A (en) 2005-09-30 2005-09-30 Wiring board manufacturing method and wiring board

Publications (1)

Publication Number Publication Date
TW200721927A true TW200721927A (en) 2007-06-01

Family

ID=38030128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133428A TW200721927A (en) 2005-09-30 2006-09-11 Method for making a circuit board, and circuit board

Country Status (3)

Country Link
JP (1) JP2007103440A (en)
KR (1) KR20070037323A (en)
TW (1) TW200721927A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501712B (en) * 2010-05-17 2015-09-21 Nitto Denko Corp Method of manufacturing printed circuit board
TWI563885B (en) * 2011-11-18 2016-12-21 Tanaka Precious Metal Ind Transfer substrate for forming metallic wiring and method for forming metallic wiring with the use of the transfer substrate
TWI703301B (en) * 2019-07-05 2020-09-01 華通電腦股份有限公司 The manufacture method of the heat dissipation component
CN114999764A (en) * 2019-03-04 2022-09-02 普利坚股份有限公司 Coil device and manufacturing method

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815274B1 (en) * 2007-07-12 2008-03-20 김영준 Color metal sticker using thin film, method for manufacturing the same, and portable electronic device using the same
KR100859008B1 (en) * 2007-08-21 2008-09-18 삼성전기주식회사 Wiring board manufacturing method
KR100979818B1 (en) * 2007-12-13 2010-09-06 삼성전기주식회사 Printed Circuit Board Manufacturing Method
KR101457528B1 (en) * 2008-05-15 2014-11-04 삼성디스플레이 주식회사 Imprinted substrate manufacturing method and imprinting method
KR100999919B1 (en) * 2008-09-08 2010-12-13 삼성전기주식회사 Printed Circuit Board Manufacturing Method
KR101034634B1 (en) 2008-12-01 2011-05-16 서울대학교산학협력단 Method of forming via pattern structure and measuring resistance of via pattern structure
KR102051117B1 (en) * 2012-09-18 2019-12-02 김정식 Method of manufacturing the printed electronic circuit boards utilizing photoresist pillars
KR101427388B1 (en) * 2013-06-21 2014-08-08 이을규 Reinforcing Substrate for Supporting Printed Circuit Board and Method for Processing for the Same
KR102412346B1 (en) * 2015-01-07 2022-06-22 성낙훈 Fine circuit board and its manufacturing method
JP6788268B2 (en) * 2016-02-22 2020-11-25 株式会社ダイワ工業 Manufacturing method of wiring board or wiring board material
CN110537393B (en) * 2017-04-17 2022-09-20 住友金属矿山株式会社 Conductive substrate and method for manufacturing conductive substrate
CN112185819A (en) * 2019-07-05 2021-01-05 华通电脑股份有限公司 Method for manufacturing heat radiation assembly
KR102539011B1 (en) * 2020-11-17 2023-06-02 주식회사 엔피테크놀로지 Manufacturing method of flexible printed circuit board
KR102425898B1 (en) * 2020-11-17 2022-07-28 주식회사 엔피테크놀로지 Manufacturing method of double side type flexible printed circuit board
KR102425897B1 (en) * 2020-11-17 2022-07-27 주식회사 엔피테크놀로지 Manufacturing method of flexible printed circuit board
KR102425900B1 (en) * 2020-11-17 2022-07-28 주식회사 엔피테크놀로지 Manufacturing method of double side flexible printed circuit board
KR102425899B1 (en) * 2020-11-17 2022-07-28 주식회사 엔피테크놀로지 Manufacturing method of flexible printed circuit board
CN114434894A (en) * 2022-02-21 2022-05-06 江西柔顺科技有限公司 Copper foil graphite film and preparation method thereof
CN114760768B (en) * 2022-06-10 2022-08-30 四川英创力电子科技股份有限公司 A kind of inner layer yin and yang copper printed circuit board processing method and printed circuit board
KR102730429B1 (en) * 2024-01-22 2024-11-15 주식회사 에이지에이세미콘 Method for connecting electrode pads of micro led and display apparatus manufactured by the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501842B2 (en) * 1987-09-26 1996-05-29 松下電工株式会社 Printed wiring board manufacturing method
JPH0265147A (en) * 1988-08-31 1990-03-05 Mitsui Mining & Smelting Co Ltd Ic chip mounting method
TW317575B (en) * 1994-01-21 1997-10-11 Olin Corp
JP3431556B2 (en) * 1999-12-07 2003-07-28 松下電器産業株式会社 Transfer medium, method of manufacturing the same, and method of manufacturing wiring board using transfer medium
JP4413522B2 (en) * 2002-04-25 2010-02-10 パナソニック株式会社 Wiring transfer sheet and manufacturing method thereof, and wiring board and manufacturing method thereof
JP2003332713A (en) * 2002-05-09 2003-11-21 Fujikura Ltd Adhesive-free flexible metal laminate, flexible wiring board using the same, and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501712B (en) * 2010-05-17 2015-09-21 Nitto Denko Corp Method of manufacturing printed circuit board
TWI563885B (en) * 2011-11-18 2016-12-21 Tanaka Precious Metal Ind Transfer substrate for forming metallic wiring and method for forming metallic wiring with the use of the transfer substrate
CN114999764A (en) * 2019-03-04 2022-09-02 普利坚股份有限公司 Coil device and manufacturing method
CN114999764B (en) * 2019-03-04 2025-06-17 普利坚股份有限公司 Coil device and manufacturing method
TWI703301B (en) * 2019-07-05 2020-09-01 華通電腦股份有限公司 The manufacture method of the heat dissipation component
US11183442B2 (en) 2019-07-05 2021-11-23 Compeq Manufacturing Co., Ltd. Manufacturing method of heat dissipation component

Also Published As

Publication number Publication date
KR20070037323A (en) 2007-04-04
JP2007103440A (en) 2007-04-19

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