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TW200721209A - Interleaved three-dimensional on-chip differential inductors and transformers - Google Patents

Interleaved three-dimensional on-chip differential inductors and transformers

Info

Publication number
TW200721209A
TW200721209A TW095128479A TW95128479A TW200721209A TW 200721209 A TW200721209 A TW 200721209A TW 095128479 A TW095128479 A TW 095128479A TW 95128479 A TW95128479 A TW 95128479A TW 200721209 A TW200721209 A TW 200721209A
Authority
TW
Taiwan
Prior art keywords
interleaved
transformers
dimensional
chip differential
differential inductors
Prior art date
Application number
TW095128479A
Other languages
Chinese (zh)
Other versions
TWI408796B (en
Inventor
Mau-Chung Frank Chang
da-quan Huang
Original Assignee
Univ California
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California filed Critical Univ California
Publication of TW200721209A publication Critical patent/TW200721209A/en
Application granted granted Critical
Publication of TWI408796B publication Critical patent/TWI408796B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • H01F2017/002Details of via holes for interconnecting the layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00Variable inductances or transformers of the signal type
    • H01F21/12Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
    • H01F2021/125Printed variable inductor with taps, e.g. for VCO
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

Interleaved three-dimensional (3D) on-chip differential inductors and transformers are disclosed. The interleaved 3D on-chip differential inductors and transformers make the best use of multiple metal layers in mainstream standard processes, such as CMOS, BiCMOS and SiGe technologies.
TW095128479A 2005-08-04 2006-08-03 Interleaved three-dimensional on-chip differential inductors and transformers TWI408796B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70586805P 2005-08-04 2005-08-04
PCT/US2006/030382 WO2007019280A2 (en) 2005-08-04 2006-08-02 Interleaved three-dimensional on-chip differential inductors and transformers

Publications (2)

Publication Number Publication Date
TW200721209A true TW200721209A (en) 2007-06-01
TWI408796B TWI408796B (en) 2013-09-11

Family

ID=37727913

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128479A TWI408796B (en) 2005-08-04 2006-08-03 Interleaved three-dimensional on-chip differential inductors and transformers

Country Status (6)

Country Link
US (1) US8325001B2 (en)
JP (1) JP2009503909A (en)
KR (1) KR20080031153A (en)
CN (1) CN101142638A (en)
TW (1) TWI408796B (en)
WO (1) WO2007019280A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9373434B2 (en) 2013-06-20 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Inductor assembly and method of using same
TWI572007B (en) * 2014-10-06 2017-02-21 瑞昱半導體股份有限公司 Integral inductor structure
CN108172361A (en) * 2016-12-07 2018-06-15 荣笠企业股份有限公司 Resonance coil structure

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007019066A2 (en) * 2005-08-04 2007-02-15 Mau-Chung Frank Chang Phase coherent differential structures
JP2009021453A (en) * 2007-07-13 2009-01-29 Toko Inc Multilayer transformer
TWI397087B (en) 2007-11-05 2013-05-21 絡達科技股份有限公司 Inductance / transformer and its making method
US7463112B1 (en) 2007-11-30 2008-12-09 International Business Machines Corporation Area efficient, differential T-coil impedance-matching circuit for high speed communications applications
JP4893616B2 (en) * 2007-12-25 2012-03-07 セイコーエプソン株式会社 Inductor
KR101453071B1 (en) * 2008-05-14 2014-10-23 삼성전자주식회사 Transformer balun and integrated circuit including the same
US8143952B2 (en) 2009-10-08 2012-03-27 Qualcomm Incorporated Three dimensional inductor and transformer
JP5534442B2 (en) * 2009-10-16 2014-07-02 スミダコーポレーション株式会社 coil
US8143987B2 (en) * 2010-04-07 2012-03-27 Xilinx, Inc. Stacked dual inductor structure
US8786381B2 (en) * 2010-06-28 2014-07-22 Avago Technologies General Ip (Singapore) Pte. Ltd. Transformer structures for a power amplifier (PA)
CN102315197B (en) * 2010-07-09 2013-04-17 中国科学院微电子研究所 3D integrated circuit structure and method for detecting alignment of chip structures
JP5532422B2 (en) * 2010-07-30 2014-06-25 スミダコーポレーション株式会社 coil
US8723048B2 (en) * 2010-11-09 2014-05-13 Broadcom Corporation Three-dimensional coiling via structure for impedance tuning of impedance discontinuity
US9177715B2 (en) 2010-11-23 2015-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for inductive wireless signaling
WO2012087287A1 (en) * 2010-12-20 2012-06-28 Intel Corporation Integrated digital- and radio-frequency system-on-chip devices with integral passive devices in package substrates, and methods of making same
CN102169868B (en) * 2011-02-22 2012-11-14 华东师范大学 On-chip integrated inductor
CN102176453B (en) * 2011-03-17 2013-04-24 杭州电子科技大学 Vertical-structure on-chip integrated transformer
US9087838B2 (en) * 2011-10-25 2015-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for a high-K transformer with capacitive coupling
AT512064B1 (en) * 2011-10-31 2015-11-15 Fronius Int Gmbh HIGH-FLOW TRANSFORMER, TRANSFORMER ELEMENT, CONTACT PLATE AND SECONDARY WINDING, AND METHOD FOR PRODUCING SUCH A HIGH-SPEED TRANSFORMER
JP5459301B2 (en) * 2011-12-19 2014-04-02 株式会社村田製作所 High frequency transformer, high frequency component and communication terminal device
US9064631B2 (en) * 2012-01-13 2015-06-23 Taiwan Semiconductor Manufacturing Co., Ltd. Through-chip interface (TCI) structure for wireless chip-to-chip communication
US9391010B2 (en) * 2012-04-02 2016-07-12 Taiwan Semiconductor Manufacturing Co., Ltd. Power line filter for multidimensional integrated circuits
US9431473B2 (en) * 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
DE102013101768A1 (en) 2013-02-22 2014-08-28 Intel Mobile Communications GmbH Transformer and electrical circuit
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
WO2014136342A1 (en) * 2013-03-04 2014-09-12 株式会社村田製作所 Layered inductor element
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
CN205666116U (en) * 2013-05-23 2016-10-26 株式会社村田制作所 High-frequency transformers, high-frequency components and communication terminal devices
JP2015018862A (en) * 2013-07-09 2015-01-29 富士通株式会社 Double helical structure electronic component, method for manufacturing double helical structure electronic component, and multifunction sheet
US9831026B2 (en) 2013-07-24 2017-11-28 Globalfoundries Inc. High efficiency on-chip 3D transformer structure
US9251948B2 (en) 2013-07-24 2016-02-02 International Business Machines Corporation High efficiency on-chip 3D transformer structure
US9779869B2 (en) 2013-07-25 2017-10-03 International Business Machines Corporation High efficiency on-chip 3D transformer structure
US9171663B2 (en) 2013-07-25 2015-10-27 Globalfoundries U.S. 2 Llc High efficiency on-chip 3D transformer structure
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
CN104517941B (en) 2013-09-29 2018-12-28 澜起科技股份有限公司 Coil and application and preparation are in the method for the coil of inductance element
KR101983150B1 (en) * 2013-10-11 2019-05-28 삼성전기주식회사 Laminated Inductor And Manufacturing Method Thereof
US20150365738A1 (en) * 2014-01-09 2015-12-17 Rick Purvis Telemetry arrangements for implantable devices
AU2015204618A1 (en) * 2014-01-09 2016-07-21 Steven ARROYO Telemetry arrangements for implantable devices
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US9570233B2 (en) 2014-06-13 2017-02-14 Globalfoundries Inc. High-Q multipath parallel stacked inductor
US9865392B2 (en) 2014-06-13 2018-01-09 Globalfoundries Inc. Solenoidal series stacked multipath inductor
US9368271B2 (en) 2014-07-09 2016-06-14 Industrial Technology Research Institute Three-dimension symmetrical vertical transformer
TWI590269B (en) * 2014-07-09 2017-07-01 財團法人工業技術研究院 Three-dimensional symmetric vertical transformer
US20160064137A1 (en) * 2014-09-02 2016-03-03 Apple Inc. Capacitively balanced inductive charging coil
CN105575958B (en) * 2014-10-09 2019-03-15 瑞昱半导体股份有限公司 Integrated inductance structure
US10062494B2 (en) 2014-11-03 2018-08-28 Qorvo Us, Inc. Apparatus with 3D inductors
US9548158B2 (en) 2014-12-02 2017-01-17 Globalfoundries Inc. 3D multipath inductor
US20160248149A1 (en) * 2015-02-20 2016-08-25 Qualcomm Incorporated Three dimensional (3d) antenna structure
CN112614674B (en) * 2015-06-17 2025-05-06 华为技术有限公司 RF transformer that converts input RF signal into output RF signal
DE102015212220A1 (en) 2015-06-30 2017-01-05 TRUMPF Hüttinger GmbH + Co. KG RF amplifier arrangement
JP2016001751A (en) * 2015-08-25 2016-01-07 ルネサスエレクトロニクス株式会社 Transformer
US9634823B1 (en) 2015-10-13 2017-04-25 Kumu Networks, Inc. Systems for integrated self-interference cancellation
JP6676170B2 (en) 2015-12-16 2020-04-08 クム ネットワークス, インコーポレイテッドKumu Networks, Inc. Time delay filter
WO2017189592A1 (en) 2016-04-25 2017-11-02 Kumu Networks, Inc. Integrated delay modules
US10454444B2 (en) 2016-04-25 2019-10-22 Kumu Networks, Inc. Integrated delay modules
CN106449592B (en) * 2016-08-22 2018-12-07 杭州电子科技大学 A kind of differential inductor structure and its manufacture craft of high quality factor
US10103774B1 (en) 2017-03-27 2018-10-16 Kumu Networks, Inc. Systems and methods for intelligently-tuned digital self-interference cancellation
WO2019107236A1 (en) * 2017-11-28 2019-06-06 株式会社村田製作所 Inductor and transformer
US12288673B2 (en) 2017-11-29 2025-04-29 COMET Technologies USA, Inc. Retuning for impedance matching network control
US10425115B2 (en) 2018-02-27 2019-09-24 Kumu Networks, Inc. Systems and methods for configurable hybrid self-interference cancellation
US10868661B2 (en) 2019-03-14 2020-12-15 Kumu Networks, Inc. Systems and methods for efficiently-transformed digital self-interference cancellation
CN112117101B (en) * 2019-06-19 2022-11-22 瑞昱半导体股份有限公司 Inductive device
US10833685B1 (en) 2019-06-19 2020-11-10 International Business Machines Corporation Linearized wide tuning range oscillator using magnetic balun/transformer
US11114279B2 (en) 2019-06-28 2021-09-07 COMET Technologies USA, Inc. Arc suppression device for plasma processing equipment
US11527385B2 (en) 2021-04-29 2022-12-13 COMET Technologies USA, Inc. Systems and methods for calibrating capacitors of matching networks
TWI730788B (en) * 2019-07-08 2021-06-11 瑞昱半導體股份有限公司 Inductor device
US11596309B2 (en) 2019-07-09 2023-03-07 COMET Technologies USA, Inc. Hybrid matching network topology
JP6721146B1 (en) * 2019-08-05 2020-07-08 国立大学法人北海道大学 Planar coil and planar transformer
JP7763162B2 (en) * 2019-08-28 2025-10-31 コメット テクノロジーズ ユーエスエー インコーポレイテッド High power low frequency coil
US11670488B2 (en) 2020-01-10 2023-06-06 COMET Technologies USA, Inc. Fast arc detecting match network
US12027351B2 (en) 2020-01-10 2024-07-02 COMET Technologies USA, Inc. Plasma non-uniformity detection
US11887820B2 (en) 2020-01-10 2024-01-30 COMET Technologies USA, Inc. Sector shunts for plasma-based wafer processing systems
US11521832B2 (en) 2020-01-10 2022-12-06 COMET Technologies USA, Inc. Uniformity control for radio frequency plasma processing systems
US11830708B2 (en) 2020-01-10 2023-11-28 COMET Technologies USA, Inc. Inductive broad-band sensors for electromagnetic waves
US11469204B2 (en) * 2020-01-15 2022-10-11 Sumitomo Electric Device Innovations, Inc. Semiconductor device
US11961711B2 (en) 2020-01-20 2024-04-16 COMET Technologies USA, Inc. Radio frequency match network and generator
US11605527B2 (en) 2020-01-20 2023-03-14 COMET Technologies USA, Inc. Pulsing control match network
US20210233708A1 (en) * 2020-01-24 2021-07-29 Qorvo Us, Inc. Inductor trimming using sacrificial magnetically coupled loops
TWI715516B (en) * 2020-08-24 2021-01-01 瑞昱半導體股份有限公司 Inductor device
US12191342B2 (en) * 2021-02-09 2025-01-07 Mediatek Inc. Asymmetric 8-shaped inductor and corresponding switched capacitor array
US12057296B2 (en) 2021-02-22 2024-08-06 COMET Technologies USA, Inc. Electromagnetic field sensing device
US11923175B2 (en) 2021-07-28 2024-03-05 COMET Technologies USA, Inc. Systems and methods for variable gain tuning of matching networks
US11652444B2 (en) * 2021-09-20 2023-05-16 Apple Inc. Inductor topology for phase noise reduction
US12340939B2 (en) * 2021-10-29 2025-06-24 Texas Instruments Incorporated Symmetric air-core planar transformer with partial electromagnetic interference shielding
US12243717B2 (en) 2022-04-04 2025-03-04 COMET Technologies USA, Inc. Variable reactance device having isolated gate drive power supplies
US12040139B2 (en) 2022-05-09 2024-07-16 COMET Technologies USA, Inc. Variable capacitor with linear impedance and high voltage breakdown
US11657980B1 (en) 2022-05-09 2023-05-23 COMET Technologies USA, Inc. Dielectric fluid variable capacitor
US12051549B2 (en) 2022-08-02 2024-07-30 COMET Technologies USA, Inc. Coaxial variable capacitor
US12132435B2 (en) 2022-10-27 2024-10-29 COMET Technologies USA, Inc. Method for repeatable stepper motor homing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762971A (en) * 1952-04-30 1956-09-11 Sam E Parker Impedance measuring system
DE19944741C2 (en) * 1999-09-17 2001-09-13 Siemens Ag Monolithically integrated transformer
JP2002057042A (en) * 2000-08-09 2002-02-22 Soshin Electric Co Ltd Multilayer transformer
US6577219B2 (en) * 2001-06-29 2003-06-10 Koninklijke Philips Electronics N.V. Multiple-interleaved integrated circuit transformer
FR2839582B1 (en) * 2002-05-13 2005-03-04 St Microelectronics Sa INDUCTANCE AT MIDDLE POINT
US6759937B2 (en) * 2002-06-03 2004-07-06 Broadcom, Corp. On-chip differential multi-layer inductor
US20050077992A1 (en) * 2002-09-20 2005-04-14 Gopal Raghavan Symmetric planar inductor
US6967555B2 (en) * 2002-10-17 2005-11-22 Via Technologies Inc. Multi-level symmetrical inductor
TWI287239B (en) * 2002-12-10 2007-09-21 Univ Nat Central Symmetric three-dimension type inductor
FR2851078A1 (en) 2003-02-07 2004-08-13 St Microelectronics Sa INTEGRATED INDUCTANCE AND ELECTRONIC CIRCUIT INCORPORATING THE SAME

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9373434B2 (en) 2013-06-20 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Inductor assembly and method of using same
TWI572007B (en) * 2014-10-06 2017-02-21 瑞昱半導體股份有限公司 Integral inductor structure
US9748326B2 (en) 2014-10-06 2017-08-29 Realtek Semiconductor Corporation Structure of integrated inductor
US9875961B2 (en) 2014-10-06 2018-01-23 Realtek Semiconductor Corporation Structure of integrated inductor
US10147677B2 (en) 2014-10-06 2018-12-04 Realtek Semiconductor Corporation Structure of integrated inductor
CN108172361A (en) * 2016-12-07 2018-06-15 荣笠企业股份有限公司 Resonance coil structure
CN108172361B (en) * 2016-12-07 2020-05-15 荣笠企业股份有限公司 Resonance coil structure

Also Published As

Publication number Publication date
WO2007019280A2 (en) 2007-02-15
US8325001B2 (en) 2012-12-04
US20080272875A1 (en) 2008-11-06
KR20080031153A (en) 2008-04-08
TWI408796B (en) 2013-09-11
JP2009503909A (en) 2009-01-29
CN101142638A (en) 2008-03-12
WO2007019280A3 (en) 2007-05-24

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