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TW200729437A - Package casing for semiconductor chip and heat dissipation structure thereof - Google Patents

Package casing for semiconductor chip and heat dissipation structure thereof

Info

Publication number
TW200729437A
TW200729437A TW095138146A TW95138146A TW200729437A TW 200729437 A TW200729437 A TW 200729437A TW 095138146 A TW095138146 A TW 095138146A TW 95138146 A TW95138146 A TW 95138146A TW 200729437 A TW200729437 A TW 200729437A
Authority
TW
Taiwan
Prior art keywords
casing
heat dissipation
semiconductor chip
dissipation structure
package casing
Prior art date
Application number
TW095138146A
Other languages
Chinese (zh)
Inventor
Egbert Freiberg
Original Assignee
Creative Led Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Led Gmbh filed Critical Creative Led Gmbh
Publication of TW200729437A publication Critical patent/TW200729437A/en

Links

Classifications

    • H10W40/255—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H10W40/228—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10W70/682—
    • H10W70/685—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A package casing for semiconductor chip and heat dissipation structure thereof is provided. The heat dissipation structure is accomplished by reducing the thermal resistance to a cooling medium. The package casing is configured so that the bottom surface that is not connected to the necessary wiring plane can directly connect to the cooling bulk via an opening of the wiring plane. The casing consists of a layer of chip-carrier substrate and a layer of casing-carrier substrate, and the chip-carrier substrate and the casing-carrier substrate have electrical connection making the semiconductor chip contact with the wiring plane. The package casing preferably consists of ceramic or silicon material.
TW095138146A 2005-10-20 2006-10-17 Package casing for semiconductor chip and heat dissipation structure thereof TW200729437A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH16852005 2005-10-20

Publications (1)

Publication Number Publication Date
TW200729437A true TW200729437A (en) 2007-08-01

Family

ID=37563760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138146A TW200729437A (en) 2005-10-20 2006-10-17 Package casing for semiconductor chip and heat dissipation structure thereof

Country Status (3)

Country Link
EP (1) EP2033219A1 (en)
TW (1) TW200729437A (en)
WO (1) WO2007045112A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354684B2 (en) 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
EP3340293A1 (en) 2016-12-20 2018-06-27 Siemens Aktiengesellschaft Semiconductor module with support structure on the bottom
DE102018208256A1 (en) * 2018-05-25 2019-11-28 Volkswagen Aktiengesellschaft Power component and method of manufacturing the same
CN109671812A (en) * 2018-12-25 2019-04-23 江苏罗化新材料有限公司 A kind of heat sinking type chip grade LED encapsulation method and its encapsulating structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378247A (en) * 1989-08-22 1991-04-03 Oki Electric Ind Co Ltd Semiconductor chip heat radiation mounting structure
JP2541494B2 (en) * 1993-12-15 1996-10-09 日本電気株式会社 Semiconductor device
WO2001073843A1 (en) * 2000-03-29 2001-10-04 Rohm Co., Ltd. Semiconductor device
DE10117889A1 (en) 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leadframe used for a light emitting diode component comprises a chip assembly region, a wire connecting region, external electrical connecting strips, and a support part coupled with a thermal connecting part
US20040226688A1 (en) * 2003-04-30 2004-11-18 Arthur Fong Application specific apparatus for dissipating heat from multiple electronic components

Also Published As

Publication number Publication date
WO2007045112A1 (en) 2007-04-26
EP2033219A1 (en) 2009-03-11

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