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TW200728792A - Image pickup device mounting structure - Google Patents

Image pickup device mounting structure

Info

Publication number
TW200728792A
TW200728792A TW095140162A TW95140162A TW200728792A TW 200728792 A TW200728792 A TW 200728792A TW 095140162 A TW095140162 A TW 095140162A TW 95140162 A TW95140162 A TW 95140162A TW 200728792 A TW200728792 A TW 200728792A
Authority
TW
Taiwan
Prior art keywords
image pickup
pickup device
mounting structure
device mounting
circuit board
Prior art date
Application number
TW095140162A
Other languages
English (en)
Inventor
Hitoshi Tanaka
Kunihiko Shimizu
Makio Oishi
Original Assignee
Pentax Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentax Corp filed Critical Pentax Corp
Publication of TW200728792A publication Critical patent/TW200728792A/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW095140162A 2005-11-02 2006-10-31 Image pickup device mounting structure TW200728792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005318983A JP4668036B2 (ja) 2005-11-02 2005-11-02 撮像素子のｆｐｃに対する取り付け構造

Publications (1)

Publication Number Publication Date
TW200728792A true TW200728792A (en) 2007-08-01

Family

ID=37995149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140162A TW200728792A (en) 2005-11-02 2006-10-31 Image pickup device mounting structure

Country Status (4)

Country Link
US (1) US7645981B2 (zh)
JP (1) JP4668036B2 (zh)
KR (1) KR20070047721A (zh)
TW (1) TW200728792A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573277A (zh) * 2010-10-08 2012-07-11 Lg伊诺特有限公司 三维图像采集装置及其制造方法
TWI558196B (zh) * 2012-08-16 2016-11-11 鴻海精密工業股份有限公司 影像感測器模組及取像模組

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* Cited by examiner, † Cited by third party
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KR100517612B1 (ko) * 2003-03-31 2005-09-28 엘지전자 주식회사 증기분사식 드럼세탁기
JP5084480B2 (ja) * 2007-12-10 2012-11-28 キヤノン株式会社 光電変換素子ユニット及び撮像装置
JP4991644B2 (ja) * 2008-06-25 2012-08-01 シャープ株式会社 回路基板の固定方法および電子部品
EP2312828B1 (en) * 2008-07-18 2013-05-29 Panasonic Corporation Imaging device
JP5246791B2 (ja) * 2009-04-22 2013-07-24 株式会社ジャパンディスプレイウェスト バックライトユニット
CN102802497B (zh) * 2009-06-25 2015-03-25 奥林巴斯医疗株式会社 摄像单元
JP5075944B2 (ja) * 2010-06-10 2012-11-21 株式会社東芝 電子機器
JP5584034B2 (ja) * 2010-07-20 2014-09-03 パナソニック株式会社 撮像ユニットおよび撮像素子取付構造
JP2012034070A (ja) * 2010-07-29 2012-02-16 Casio Comput Co Ltd 基板の接着方法、基板の実装構造、電子機器、及び基板
JP5696391B2 (ja) * 2010-07-29 2015-04-08 カシオ計算機株式会社 基板の接着方法、集合部品、電子機器、及び基板
JP5864890B2 (ja) * 2011-04-26 2016-02-17 キヤノン株式会社 撮像装置
CN103813070A (zh) * 2012-11-14 2014-05-21 鸿富锦精密工业（深圳）有限公司 取像装置
KR101454312B1 (ko) * 2014-03-21 2014-10-23 (주)드림텍 모바일 기기의 서브 기판 고정방법 및 그 고정구조
CN105137564B (zh) * 2015-09-24 2019-11-12 南昌欧菲光电技术有限公司 摄像头模组
US10268234B2 (en) 2017-08-07 2019-04-23 Apple Inc. Bracket assembly for a multi-component vision system in an electronic device
US11445094B2 (en) 2017-08-07 2022-09-13 Apple Inc. Electronic device having a vision system assembly held by a self-aligning bracket assembly
KR102897964B1 (ko) * 2021-06-08 2025-12-09 삼성전자주식회사 카메라 모듈 및 그것을 포함하는 전자 장치
CN116095969A (zh) * 2023-03-14 2023-05-09 上海美维电子有限公司 补强板和pcb的压合定位用治具

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JPH01140871U (zh) * 1988-03-23 1989-09-27
JPH0753052Y2 (ja) 1989-05-22 1995-12-06 旭光学工業株式会社 レンズのフレキシブル基板取付構造
JP2508107Y2 (ja) 1990-06-01 1996-08-21 旭光学工業株式会社 レンズ鏡筒
US5581412A (en) 1993-12-27 1996-12-03 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed circuit board supporting structure of lens barrel
US5826126A (en) 1996-01-26 1998-10-20 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed circuit board housing structure for a camera
US6628339B1 (en) * 1999-06-14 2003-09-30 Eastman Kodak Company Image sensor mount for a digital camera
US7270274B2 (en) * 1999-10-04 2007-09-18 Hand Held Products, Inc. Imaging module comprising support post for optical reader
US6956615B2 (en) * 2000-01-28 2005-10-18 Pentax Corporation Structure for mounting a solid-state imaging device
JP3782652B2 (ja) 2000-08-31 2006-06-07 ペンタックス株式会社 ズームレンズ鏡筒のｆｐｃ配設構造
JP3682416B2 (ja) * 2001-04-27 2005-08-10 日本アビオニクス株式会社 光学素子とレンズアセンブリとの位置合わせ方法
JP2003046072A (ja) * 2001-07-27 2003-02-14 Fuji Photo Optical Co Ltd 固体撮像素子の取付構造
JP2003234557A (ja) * 2002-02-12 2003-08-22 Toray Eng Co Ltd 電子部品埋込み実装用基板の製造方法
JP2004104078A (ja) * 2002-06-28 2004-04-02 Sanyo Electric Co Ltd カメラモジュールおよびその製造方法
US7043154B2 (en) 2002-08-27 2006-05-09 Pentax Corporation Photographing lens having an optical element retracting mechanism
JP4204368B2 (ja) * 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
TWI395467B (zh) 2005-06-30 2013-05-01 Hoya Corp 成像裝置的可撓式印刷線路板配置
KR101188235B1 (ko) 2005-06-30 2012-10-05 호야 가부시키가이샤 촬상 장치의 플렉시블 인쇄회로기판 배열설치 구조

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573277A (zh) * 2010-10-08 2012-07-11 Lg伊诺特有限公司 三维图像采集装置及其制造方法
CN107065423A (zh) * 2010-10-08 2017-08-18 Lg伊诺特有限公司 三维图像采集装置及其制造方法
CN107065423B (zh) * 2010-10-08 2020-06-02 Lg伊诺特有限公司 三维图像采集装置及其制造方法
TWI558196B (zh) * 2012-08-16 2016-11-11 鴻海精密工業股份有限公司 影像感測器模組及取像模組

Also Published As

Publication number Publication date
US7645981B2 (en) 2010-01-12
JP2007128995A (ja) 2007-05-24
KR20070047721A (ko) 2007-05-07
US20070096234A1 (en) 2007-05-03
JP4668036B2 (ja) 2011-04-13

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