TW200728068A - A manufacturing method for copper-clad laminated plate - Google Patents
A manufacturing method for copper-clad laminated plateInfo
- Publication number
- TW200728068A TW200728068A TW095131015A TW95131015A TW200728068A TW 200728068 A TW200728068 A TW 200728068A TW 095131015 A TW095131015 A TW 095131015A TW 95131015 A TW95131015 A TW 95131015A TW 200728068 A TW200728068 A TW 200728068A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- copper
- surface treatment
- manufacturing
- laminated plate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 7
- 239000011889 copper foil Substances 0.000 abstract 7
- 238000000034 method Methods 0.000 abstract 6
- 229920001721 polyimide Polymers 0.000 abstract 3
- 239000012756 surface treatment agent Substances 0.000 abstract 3
- 239000004642 Polyimide Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 2
- 239000002243 precursor Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The purpose of this invention is to provide a manufacturing method for copper-clad laminated plate that is capable of improving the adhesion force between the copper foil and the polyimide resin. The manufacturing method is used to form a resin layer on a surface-treated copper foil so as to obtain the copper-clad laminated plate; the method comprises the following processes: a process for soft-etching the copper foil with an acid water solution, a surface treatment process for treating the surface of the copper foil by using a treating liquid to dissolve organic surface treatment agent that has at least one kind of functional group belong to amino group or sulfhydryl (Thiol) group and has a function of improving the adhesion force between the copper foil and the resin layer, a washing process for partially dissolving and removing the surface layer of the organic surface treatment agent on the copper foil by using an organic solvent that is capable of dissolving the organic surface treatment agent, an adhering and laminating process for closely adhering a film of a polyimide precursor onto the surface-treated copper foil, and an imidizing process for imidizing the polyimide precursor.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005268870A JP4804847B2 (en) | 2005-09-15 | 2005-09-15 | Method for producing copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200728068A true TW200728068A (en) | 2007-08-01 |
| TWI318169B TWI318169B (en) | 2009-12-11 |
Family
ID=37936992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095131015A TW200728068A (en) | 2005-09-15 | 2006-08-23 | A manufacturing method for copper-clad laminated plate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4804847B2 (en) |
| TW (1) | TW200728068A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110217512A1 (en) * | 2008-09-01 | 2011-09-08 | Sekisui Chemical Co., Ltd. | Laminated body and method for producing laminated body |
| JP5191367B2 (en) * | 2008-12-08 | 2013-05-08 | 三井化学株式会社 | Polyimide metal foil laminate and manufacturing method thereof |
| EP3033929A1 (en) * | 2013-08-16 | 2016-06-22 | Enthone, Inc. | Adhesion promotion in printed circuit boards |
| JP7351115B2 (en) * | 2019-07-04 | 2023-09-27 | 株式会社リコー | Coating device and image forming device |
| US10697082B1 (en) * | 2019-08-12 | 2020-06-30 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08856B2 (en) * | 1992-10-28 | 1996-01-10 | 岩手県 | Adhesion method between metal and organic materials such as rubber, plastic and paint |
| JP4016078B2 (en) * | 2000-01-18 | 2007-12-05 | 株式会社東亜電化 | Printed wiring board manufacturing method and multilayer printed wiring board |
| JP2001257469A (en) * | 2000-03-13 | 2001-09-21 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
| JP4574064B2 (en) * | 2001-05-29 | 2010-11-04 | 富士通株式会社 | Substrate having multilayer wiring layer and manufacturing method thereof |
| JP2005015596A (en) * | 2003-06-25 | 2005-01-20 | Shin Etsu Chem Co Ltd | Polyimide-based precursor resin solution composition sheet |
| JP4699059B2 (en) * | 2004-03-25 | 2011-06-08 | 新日鐵化学株式会社 | Copper foil surface treatment method and copper clad laminate production method |
-
2005
- 2005-09-15 JP JP2005268870A patent/JP4804847B2/en not_active Expired - Fee Related
-
2006
- 2006-08-23 TW TW095131015A patent/TW200728068A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007076243A (en) | 2007-03-29 |
| JP4804847B2 (en) | 2011-11-02 |
| TWI318169B (en) | 2009-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |