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TW200727438A - Multi-layered anisotropic conductive film - Google Patents

Multi-layered anisotropic conductive film

Info

Publication number
TW200727438A
TW200727438A TW095144901A TW95144901A TW200727438A TW 200727438 A TW200727438 A TW 200727438A TW 095144901 A TW095144901 A TW 095144901A TW 95144901 A TW95144901 A TW 95144901A TW 200727438 A TW200727438 A TW 200727438A
Authority
TW
Taiwan
Prior art keywords
conductive
mount layer
anisotropic conductive
conductive film
layered anisotropic
Prior art date
Application number
TW095144901A
Other languages
Chinese (zh)
Inventor
Sang-Wook Woo
Hyuk-Soo Moon
Chul-Jong Han
Yong-Seok Han
Jeong-Beom Park
Original Assignee
Ls Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd filed Critical Ls Cable Ltd
Publication of TW200727438A publication Critical patent/TW200727438A/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F5/00—Sewerage structures
    • E03F5/02—Manhole shafts or other inspection chambers; Snow-filling openings; accessories
    • E03F5/021—Connection of sewer pipes to manhole shaft
    • H10W72/073—

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Hydrology & Water Resources (AREA)
  • Public Health (AREA)
  • Water Supply & Treatment (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

A multi-layered anisotropic conductive film includes a non-conductive mount layer constructed by a first insulating adhesive; a conductive mount layer stacked on one surface of the non-conductive mount layer and the conductive particles are dispersed into a second insulating adhesive with faster solidifying rate than the first insulating adhesive; and a separating film coupled to one surface of the non-conductive mount layer, wherein the coupled surface is corresponding to the surface contacted to the conductive mount layer. The multi-layered anisotropic conductive film avoids electrode damage of the connected component caused by heat, and furthermore, the improved solidifying rate increases control strength to the conductive particles.
TW095144901A 2006-01-04 2006-12-04 Multi-layered anisotropic conductive film TW200727438A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060001021A KR100713333B1 (en) 2006-01-04 2006-01-04 Multilayer anisotropic conductive film

Publications (1)

Publication Number Publication Date
TW200727438A true TW200727438A (en) 2007-07-16

Family

ID=38251262

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144901A TW200727438A (en) 2006-01-04 2006-12-04 Multi-layered anisotropic conductive film

Country Status (4)

Country Link
JP (1) JP4513024B2 (en)
KR (1) KR100713333B1 (en)
CN (1) CN100507683C (en)
TW (1) TW200727438A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398881B (en) * 2007-09-20 2013-06-11 Dexerials Corp Anisotropic conductive film and manufacturing method for the same, and connected structure having the anisotropic conductive film

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5200744B2 (en) * 2008-08-01 2013-06-05 住友電気工業株式会社 Adhesive and electrode connection method using the same
CN101877335B (en) * 2009-04-30 2012-07-25 玮锋科技股份有限公司 Gradient anisotropic conductive adhesive film and its manufacturing method
JP5558140B2 (en) * 2009-06-10 2014-07-23 デクセリアルズ株式会社 Insulating resin film, joined body using the same, and manufacturing method thereof
JP5567893B2 (en) * 2010-04-28 2014-08-06 デクセリアルズ株式会社 Connection method and connection device
JP5695881B2 (en) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 Electronic component connection method and connection structure
KR101351617B1 (en) * 2010-12-23 2014-01-15 제일모직주식회사 Anisotropic conductive film
JP5685473B2 (en) 2011-04-06 2015-03-18 デクセリアルズ株式会社 Anisotropic conductive film, method for manufacturing bonded body, and bonded body
CN102650763B (en) * 2011-08-26 2015-01-07 北京京东方光电科技有限公司 Liquid crystal display and manufacturing method thereof and monitor
KR101479658B1 (en) * 2011-11-18 2015-01-06 제일모직 주식회사 Anisotropic conductive film with easy pre-bonding process
KR102541899B1 (en) * 2014-02-04 2023-06-14 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film and method for producing same
KR102024608B1 (en) * 2017-01-11 2019-09-24 엘지전자 주식회사 Sensor
JP7013649B2 (en) * 2017-01-27 2022-02-01 昭和電工マテリアルズ株式会社 Adhesive composition, film-like adhesive, connection structure and its manufacturing method
JP7185252B2 (en) * 2018-01-31 2022-12-07 三国電子有限会社 Method for producing connection structure
CN109799660A (en) * 2019-03-20 2019-05-24 武汉华星光电技术有限公司 Liquid crystal display device
KR20240115267A (en) * 2021-11-29 2024-07-25 가부시끼가이샤 레조낙 A wiring forming member, a method of forming a wiring layer using a wiring forming member, and a wiring forming member
WO2025146946A1 (en) * 2024-01-05 2025-07-10 삼성전자주식회사 Electrical connection member and electronic device comprising same

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPS61195179A (en) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd Anisotropically conductive adhesive sheet
JPS63310581A (en) * 1987-06-12 1988-12-19 Canon Inc Film body for electric connection
JPH03107888A (en) * 1989-09-21 1991-05-08 Sharp Corp Circuit board connection structure
JPH04366630A (en) * 1991-06-13 1992-12-18 Sharp Corp Anisotropic conductive adhesive tape
JPH06103819A (en) * 1992-09-21 1994-04-15 Hitachi Chem Co Ltd Anisotropic conductive adhesive film
JPH06139824A (en) * 1992-10-27 1994-05-20 Oki Electric Ind Co Ltd Anisotropic conducting film
JP4032439B2 (en) * 1996-05-23 2008-01-16 日立化成工業株式会社 Connection member, electrode connection structure and connection method using the connection member
KR19990048959A (en) * 1997-12-11 1999-07-05 김영환 Liquid crystal panel
JP3995942B2 (en) * 2002-01-29 2007-10-24 旭化成株式会社 Method for producing conductive adhesive sheet having anisotropy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398881B (en) * 2007-09-20 2013-06-11 Dexerials Corp Anisotropic conductive film and manufacturing method for the same, and connected structure having the anisotropic conductive film

Also Published As

Publication number Publication date
KR100713333B1 (en) 2007-05-04
JP2007182062A (en) 2007-07-19
CN100507683C (en) 2009-07-01
JP4513024B2 (en) 2010-07-28
CN1996132A (en) 2007-07-11

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