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TW200712127A - The polysilicone composition for the use for stripping film - Google Patents

The polysilicone composition for the use for stripping film

Info

Publication number
TW200712127A
TW200712127A TW095123639A TW95123639A TW200712127A TW 200712127 A TW200712127 A TW 200712127A TW 095123639 A TW095123639 A TW 095123639A TW 95123639 A TW95123639 A TW 95123639A TW 200712127 A TW200712127 A TW 200712127A
Authority
TW
Taiwan
Prior art keywords
mass
parts
organic polysiloxane
stripping film
composition
Prior art date
Application number
TW095123639A
Other languages
Chinese (zh)
Other versions
TWI397556B (en
Inventor
Kenji Yamamoto
Tsutomu Nakajima
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200712127A publication Critical patent/TW200712127A/en
Application granted granted Critical
Publication of TWI397556B publication Critical patent/TWI397556B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
    • B01J23/42—Platinum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)

Abstract

The present invention relates to a polysilicone composition which modifies plastic film to improve its sealness as a stripping layer. The silicone composition of the present invention is characterized by the use of organic polysiloxane as major component to produce the stripping film, where for (A) 100 parts by mass of organic polysiloxane contains (B) dipheny alkyl derivative and 0.3 ~ 3 parts by mass of additive of organic polysiloxane derivative having at least one organic oxygen group, and (C) 0.1 ~ 2 parts by mass of isocyanurate which at least one of the substituted groups bond to nitrogen atom has epoxy group or trialkoxysilane group.
TW095123639A 2005-06-30 2006-06-29 Polyvinyl silicone composition for peeling film TWI397556B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191851A JP4646122B2 (en) 2005-06-30 2005-06-30 Silicone composition for release film

Publications (2)

Publication Number Publication Date
TW200712127A true TW200712127A (en) 2007-04-01
TWI397556B TWI397556B (en) 2013-06-01

Family

ID=37747982

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123639A TWI397556B (en) 2005-06-30 2006-06-29 Polyvinyl silicone composition for peeling film

Country Status (4)

Country Link
JP (1) JP4646122B2 (en)
KR (1) KR101225319B1 (en)
CN (1) CN1944538B (en)
TW (1) TWI397556B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494377B (en) * 2010-05-07 2015-08-01 Shinetsu Chemical Co Polyvinyl silicone composition for peeling film
TWI557184B (en) * 2011-10-17 2016-11-11 信越化學工業股份有限公司 Silicone release coating composition of condensation reaction curing type

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101348955B1 (en) * 2007-12-27 2014-01-08 코오롱인더스트리 주식회사 Release Film
JP4707729B2 (en) * 2008-03-31 2011-06-22 信越化学工業株式会社 Low viscosity UV curable silicone composition for release paper
JP4994292B2 (en) * 2008-04-09 2012-08-08 信越化学工業株式会社 Solvent-free silicone release agent composition for film and release film using the same
JP5108825B2 (en) * 2009-04-24 2012-12-26 信越化学工業株式会社 Silicone resin composition for optical semiconductor device and optical semiconductor device
JP5587148B2 (en) * 2010-03-09 2014-09-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Self-adhesive polyorganosiloxane composition
JP5834755B2 (en) * 2011-10-17 2015-12-24 信越化学工業株式会社 Method for forming peelable cured film
JP5729253B2 (en) * 2011-10-17 2015-06-03 信越化学工業株式会社 Condensation reaction curable silicone release coating composition
JP5810865B2 (en) * 2011-11-25 2015-11-11 信越化学工業株式会社 Condensation reaction curable primer composition for silicone adhesive
CN103946227B (en) * 2011-12-02 2017-09-26 Cp菲林公司 Catalyst for Thermally Cured Silicone Release Coatings
JP6331956B2 (en) * 2014-10-17 2018-05-30 信越化学工業株式会社 Organopolysiloxane composition for release sheet and release sheet
JP6664398B2 (en) * 2014-12-09 2020-03-13 コリア インスティチュート オブ インダストリアル テクノロジー Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition containing the same, cured product, use thereof, and method for producing alkoxysilyl compound
JP6691802B2 (en) * 2016-03-29 2020-05-13 アイカ工業株式会社 Silicone adhesive composition and adhesive tape
JP7283347B2 (en) * 2019-10-24 2023-05-30 信越化学工業株式会社 Room-temperature curing organopolysiloxane composition for long-life coolant seals, cured silicone rubber for cooling coolant oil seals, and cooling coolant oil seals
CN121195041A (en) * 2023-05-29 2025-12-23 信越化学工业株式会社 Organosilicon composition for release sheets and release sheets

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57137355A (en) * 1981-02-17 1982-08-24 Shin Etsu Chem Co Ltd Organopolysiloxane composition
JPS62240363A (en) * 1986-04-10 1987-10-21 Shin Etsu Chem Co Ltd Silicone composition for release film
JPH07119366B2 (en) * 1989-07-03 1995-12-20 東芝シリコーン株式会社 Adhesive silicone composition
JPH08208993A (en) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd Thermally conductive silicone composition
JP3518399B2 (en) * 1999-03-12 2004-04-12 信越化学工業株式会社 Room temperature curable organopolysiloxane composition
DE10103421A1 (en) * 2001-01-26 2002-08-14 Ge Bayer Silicones Gmbh & Co Polyorganosiloxane composition
DE10338478A1 (en) * 2003-08-21 2005-03-17 Wacker-Chemie Gmbh Self-adhesive addition-curing silicone compositions
JP2007002234A (en) * 2005-05-27 2007-01-11 Shin Etsu Chem Co Ltd Curable silicone rubber composition and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494377B (en) * 2010-05-07 2015-08-01 Shinetsu Chemical Co Polyvinyl silicone composition for peeling film
TWI557184B (en) * 2011-10-17 2016-11-11 信越化學工業股份有限公司 Silicone release coating composition of condensation reaction curing type

Also Published As

Publication number Publication date
CN1944538B (en) 2012-06-13
KR101225319B1 (en) 2013-01-22
CN1944538A (en) 2007-04-11
JP4646122B2 (en) 2011-03-09
TWI397556B (en) 2013-06-01
JP2007009072A (en) 2007-01-18
KR20070003612A (en) 2007-01-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees