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TW200711100A - Multi-chip stacked structure - Google Patents

Multi-chip stacked structure

Info

Publication number
TW200711100A
TW200711100A TW094131227A TW94131227A TW200711100A TW 200711100 A TW200711100 A TW 200711100A TW 094131227 A TW094131227 A TW 094131227A TW 94131227 A TW94131227 A TW 94131227A TW 200711100 A TW200711100 A TW 200711100A
Authority
TW
Taiwan
Prior art keywords
package structure
chips
chip stacked
stacked structure
stacking
Prior art date
Application number
TW094131227A
Other languages
Chinese (zh)
Other versions
TWI321839B (en
Inventor
Chen-Jung Tsai
Chih-Wen Lin
Original Assignee
Macronix Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix Int Co Ltd filed Critical Macronix Int Co Ltd
Priority to TW094131227A priority Critical patent/TWI321839B/en
Publication of TW200711100A publication Critical patent/TW200711100A/en
Application granted granted Critical
Publication of TWI321839B publication Critical patent/TWI321839B/en

Links

Classifications

    • H10W90/24—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A multi-chip stacked package structure, including a leadframe base thin package structure with two or more chips in the stacking structure, is provided that is capable of including two or more stacked chips that reduce the total stacking thickness. The package structure also reduces stacking thickness by achieving of four or more chips into the area of a thin small outline package structure.
TW094131227A 2005-09-09 2005-09-09 Multi-chip stacked structure TWI321839B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094131227A TWI321839B (en) 2005-09-09 2005-09-09 Multi-chip stacked structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094131227A TWI321839B (en) 2005-09-09 2005-09-09 Multi-chip stacked structure

Publications (2)

Publication Number Publication Date
TW200711100A true TW200711100A (en) 2007-03-16
TWI321839B TWI321839B (en) 2010-03-11

Family

ID=45073890

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131227A TWI321839B (en) 2005-09-09 2005-09-09 Multi-chip stacked structure

Country Status (1)

Country Link
TW (1) TWI321839B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9418942B2 (en) 2013-12-10 2016-08-16 Amkor Technology, Inc. Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9418942B2 (en) 2013-12-10 2016-08-16 Amkor Technology, Inc. Semiconductor device
TWI608564B (en) * 2013-12-10 2017-12-11 艾馬克科技公司 Semiconductor device

Also Published As

Publication number Publication date
TWI321839B (en) 2010-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees