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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW94131271ApriorityCriticalpatent/TWI281205B/en
Publication of TW200710976ApublicationCriticalpatent/TW200710976A/en
Application grantedgrantedCritical
Publication of TWI281205BpublicationCriticalpatent/TWI281205B/en
A wafer cleaning process suitable for being performed on a wafer after an etching process is performed on the wafer, wherein the wafer possesses a wafer center, a wafer radius and a wafer circumference. The method comprises a step of dispensing a cleaning solution onto the wafer by a nozzle, while the nozzle is moving back and forth along a swing path over the wafer around the wafer center, wherein the wafer center is projected to a midpoint of the swing path.
TW94131271A2005-09-122005-09-12Wafer cleaning process and method for forming an opening
TWI281205B
(en)