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TW200719102A - Laser beam/uv irradiation peripheral exposure apparatus, and method therefor - Google Patents

Laser beam/uv irradiation peripheral exposure apparatus, and method therefor

Info

Publication number
TW200719102A
TW200719102A TW095137694A TW95137694A TW200719102A TW 200719102 A TW200719102 A TW 200719102A TW 095137694 A TW095137694 A TW 095137694A TW 95137694 A TW95137694 A TW 95137694A TW 200719102 A TW200719102 A TW 200719102A
Authority
TW
Taiwan
Prior art keywords
moving
laser beam
irradiation
stage
exposure apparatus
Prior art date
Application number
TW095137694A
Other languages
Chinese (zh)
Other versions
TWI324284B (en
Inventor
Haruyasu Kenmotsu
Hiroaki Sato
Yasuhito Ikeda
Masato Mori
Original Assignee
Orc Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orc Mfg Co Ltd filed Critical Orc Mfg Co Ltd
Publication of TW200719102A publication Critical patent/TW200719102A/en
Application granted granted Critical
Publication of TWI324284B publication Critical patent/TWI324284B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70458—Mix-and-match, i.e. multiple exposures of the same area using a similar type of exposure apparatus, e.g. multiple exposures using a UV apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides a laser beam/UV irradiation peripheral exposure apparatus that determines the moving speed of one stage to be an appropriate speed, and to provide a method therefor. The laser beam/UV irradiation peripheral exposure apparatus comprises a stage 2 holding a substrate; a moving and carrying mechanism 3 for moving the stage in a rotating direction about a vertical line perpendicular to the substrate plane, and in a moving direction and a direction perpendicular to the moving direction; a laser beam unit 5, disposed on the moving path of the moving and carrying mechanism and above the substrate and for irradiating the substrate with a laser beam; a UV irradiation unit 9 that irradiates a peripheral region with a light containing UV rays from an irradiation port; and a control means for controlling the moving and carrying mechanism, in matching with either a first moving speed for making the stage move upon irradiation with a laser beam or a second moving speed for making the stage move upon irradiating with a light that contains UV rays.
TW095137694A 2005-11-04 2006-10-13 Laser beam/uv irradiation peripheral exposure apparatus, and method therefor TW200719102A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005321256 2005-11-04
JP2006246265A JP4491444B2 (en) 2005-11-04 2006-09-12 Laser beam / ultraviolet irradiation peripheral exposure apparatus and method

Publications (2)

Publication Number Publication Date
TW200719102A true TW200719102A (en) 2007-05-16
TWI324284B TWI324284B (en) 2010-05-01

Family

ID=38209772

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137694A TW200719102A (en) 2005-11-04 2006-10-13 Laser beam/uv irradiation peripheral exposure apparatus, and method therefor

Country Status (3)

Country Link
JP (1) JP4491444B2 (en)
KR (1) KR100947079B1 (en)
TW (1) TW200719102A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011013512A (en) * 2009-07-03 2011-01-20 Orc Manufacturing Co Ltd Peripheral exposure apparatus
CN110716392A (en) * 2018-07-12 2020-01-21 东莞市多普光电设备有限公司 A semi-automatic exposure machine based on the production of large substrates

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294500A (en) * 1999-04-09 2000-10-20 Nikon Corp Peripheral exposure apparatus and method
JP2000294501A (en) * 1999-04-09 2000-10-20 Nikon Corp Peripheral exposure apparatus and method
JP3091460B1 (en) * 1999-12-10 2000-09-25 東レエンジニアリング株式会社 Exposure equipment
JP4342663B2 (en) * 1999-12-20 2009-10-14 株式会社オーク製作所 Peripheral exposure equipment
JP2001201862A (en) * 2000-01-19 2001-07-27 Nikon Corp Peripheral exposure equipment
JP3321733B2 (en) * 2000-09-20 2002-09-09 東レエンジニアリング株式会社 Exposure equipment
JP2002223072A (en) 2001-01-24 2002-08-09 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing multilayer printed wiring board
JP2002365811A (en) * 2001-06-08 2002-12-18 Mitsubishi Corp Exposure method and apparatus for photoresist coated substrate
JP3547418B2 (en) * 2001-10-25 2004-07-28 三菱商事株式会社 Method and apparatus for marking liquid crystal panel by laser beam
JP4014031B2 (en) 2002-06-05 2007-11-28 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP4664102B2 (en) * 2005-03-18 2011-04-06 東レエンジニアリング株式会社 Exposure apparatus and exposure method

Also Published As

Publication number Publication date
KR100947079B1 (en) 2010-03-10
JP2007148358A (en) 2007-06-14
TWI324284B (en) 2010-05-01
KR20070048612A (en) 2007-05-09
JP4491444B2 (en) 2010-06-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees