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TW200716967A - Method and system for automatic defect detection of articles in visual inspection machines - Google Patents

Method and system for automatic defect detection of articles in visual inspection machines

Info

Publication number
TW200716967A
TW200716967A TW095131607A TW95131607A TW200716967A TW 200716967 A TW200716967 A TW 200716967A TW 095131607 A TW095131607 A TW 095131607A TW 95131607 A TW95131607 A TW 95131607A TW 200716967 A TW200716967 A TW 200716967A
Authority
TW
Taiwan
Prior art keywords
defects
articles
inspecting
parameters
modified
Prior art date
Application number
TW095131607A
Other languages
Chinese (zh)
Inventor
Dotan Algranati
Oren Tropp
Roman Kagan
Original Assignee
Camtek Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Camtek Ltd filed Critical Camtek Ltd
Publication of TW200716967A publication Critical patent/TW200716967A/en

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Sorting Of Articles (AREA)

Abstract

There is provided a method for establishing a parameters setup for inspecting a plurality of articles by an automatic inspection system. The method includes inspecting a first article by the inspection system, applying an automatic defects detection method according to a given set of inspection parameters, receiving an initial map of defects and sorting uncovered defects into defect types according to a predetermined set of defect types. While sorting defects, if new defects not recognized by the inspection system are detected, adding the new defects to the initial map to be sorted and automatically setting the inspection parameters by means of applying computational dedicated algorithms, using a heuristic approach, to form a modified parameters setup. The modified parameters setup is then used for obtaining a modified map of detected defects, and the modified parameters setup for inspecting other of the plurality of articles. A system for establishing a parameters setup for inspecting a plurality of articles is also provided.
TW095131607A 2005-08-26 2006-08-28 Method and system for automatic defect detection of articles in visual inspection machines TW200716967A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71142505P 2005-08-26 2005-08-26
IL177689A IL177689A0 (en) 2005-08-26 2006-08-24 Method and system for automatic defect detection of articles in visual inspection machines

Publications (1)

Publication Number Publication Date
TW200716967A true TW200716967A (en) 2007-05-01

Family

ID=40035654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131607A TW200716967A (en) 2005-08-26 2006-08-28 Method and system for automatic defect detection of articles in visual inspection machines

Country Status (3)

Country Link
CN (1) CN101292263A (en)
IL (2) IL177689A0 (en)
TW (1) TW200716967A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479353B (en) * 2008-04-17 2015-04-01 3M Innovative Properties Co Method, system and computer-readable medium of inspection of webs
TWI849992B (en) * 2023-06-21 2024-07-21 友達光電股份有限公司 Method and device of adjusting automated optical inspection (aoi) parameter

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL213530A (en) * 2010-06-15 2016-03-31 Camtek Ltd Method and system for monitoring an operator of a printed circuit board verification station
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
CN105334216A (en) * 2014-06-10 2016-02-17 通用电气公司 Method and system used for automatic parts inspection
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
DE102016211606A1 (en) * 2016-06-28 2017-12-28 Robert Bosch Gmbh Method and system for identifying a product
CN111712769B (en) * 2018-03-06 2023-08-01 欧姆龙株式会社 Method, device, system and storage medium for setting lighting conditions
EP3745298B1 (en) * 2019-05-28 2022-05-25 SCHOTT Schweiz AG Classification method and system for high-throughput transparent articles
CN111060520B (en) * 2019-12-30 2021-10-29 歌尔股份有限公司 Product defect detection method, device and system
CN114199897A (en) * 2020-09-18 2022-03-18 联策科技股份有限公司 Parameter setting method and intelligent system of visual inspection system
CN115482184A (en) * 2021-06-15 2022-12-16 昆山宸泽测控科技有限公司 An Information Analysis Method Based on AOI Visual Inspection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479353B (en) * 2008-04-17 2015-04-01 3M Innovative Properties Co Method, system and computer-readable medium of inspection of webs
TWI849992B (en) * 2023-06-21 2024-07-21 友達光電股份有限公司 Method and device of adjusting automated optical inspection (aoi) parameter

Also Published As

Publication number Publication date
CN101292263A (en) 2008-10-22
IL189710A0 (en) 2008-06-05
IL189710A (en) 2013-07-31
IL177689A0 (en) 2006-12-31

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