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TW200715924A - Sticking device and sticking method for thin sheet film - Google Patents

Sticking device and sticking method for thin sheet film

Info

Publication number
TW200715924A
TW200715924A TW095125299A TW95125299A TW200715924A TW 200715924 A TW200715924 A TW 200715924A TW 095125299 A TW095125299 A TW 095125299A TW 95125299 A TW95125299 A TW 95125299A TW 200715924 A TW200715924 A TW 200715924A
Authority
TW
Taiwan
Prior art keywords
release film
film
sticking
coverlay
sucked
Prior art date
Application number
TW095125299A
Other languages
Chinese (zh)
Other versions
TWI298992B (en
Inventor
Fan Lin
Hiroki Takagi
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200715924A publication Critical patent/TW200715924A/en
Application granted granted Critical
Publication of TWI298992B publication Critical patent/TWI298992B/zh

Links

Landscapes

  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Registering Or Overturning Sheets (AREA)
  • Advancing Webs (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

To peel off a release film and stick a thin sheet film continuously in a short time by a simple mechanism without causing waving, wrinkle, and positional deviation on the film when peeling off the release film from a soft base material in which the release film is stuck to a bonded layer side of the film and sticking the film to an another base material continuously. The soft base material 3a cut like a sheet is sucked and fixed on a positioning table 9 by putting the release film 2 on an upper side. When one end of the release film 2 is sucked and lifted by a partial suction pad 8a, the release film 2 is rolled and raised from a coverlay 1 sucked and fixed on the positioning table 9. This release film 2 is nipped and held by a chuck mechanism 11, and gas is jetted from a nozzle 12 between the release film 2 and the coverlay 1 to peel the release film 2 off the coverlay 1.
TW095125299A 2005-10-12 2006-07-11 Sticking device and sticking method for thin sheet film TW200715924A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005297577A JP4524241B2 (en) 2005-10-12 2005-10-12 Thin plate film sticking apparatus and sticking method

Publications (2)

Publication Number Publication Date
TW200715924A true TW200715924A (en) 2007-04-16
TWI298992B TWI298992B (en) 2008-07-11

Family

ID=38017671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125299A TW200715924A (en) 2005-10-12 2006-07-11 Sticking device and sticking method for thin sheet film

Country Status (3)

Country Link
JP (1) JP4524241B2 (en)
CN (1) CN1948004B (en)
TW (1) TW200715924A (en)

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JP4371276B2 (en) * 2006-11-27 2009-11-25 Jpテック株式会社 Pasting device
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KR100969505B1 (en) 2007-11-30 2010-07-09 바이옵트로 주식회사 Coverlay separating means and coverlay welding apparatus having the same
JP4895240B2 (en) 2010-06-24 2012-03-14 Necエンジニアリング株式会社 Film sticking device and sticking method
JP5727726B2 (en) * 2010-07-06 2015-06-03 アピックヤマダ株式会社 Separator peeling method, separator peeling device, tape sticking method, and tape sticking device
CN102179990B (en) * 2011-01-26 2014-05-21 海信容声(广东)冰箱有限公司 A device and method for pasting vacuum insulation panels
TWI585028B (en) * 2013-01-30 2017-06-01 斯克林集團公司 Detaching apparatus and detaching method
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JP6080647B2 (en) * 2013-03-28 2017-02-15 株式会社Screenホールディングス Peeling device
CN103496610B (en) * 2013-10-14 2015-12-23 吴江市博众精工科技有限公司 A kind of film stripping machine structure
CN103616976B (en) * 2013-11-29 2017-01-04 深圳市宇顺电子股份有限公司 One chip capacitance plate and the alignment method of one chip capacitance plate flexible print circuit board
CN103693257A (en) * 2013-12-20 2014-04-02 江南大学 Mobile film uncovering mechanism
CN103770440B (en) * 2013-12-31 2017-10-10 宁波宏协承汽车部件有限公司 A kind of online dyestripping tool of PE films
JP6246605B2 (en) * 2014-01-28 2017-12-13 株式会社Screenホールディングス Peeling apparatus and peeling method
WO2015170210A1 (en) * 2014-05-03 2015-11-12 Semiconductor Energy Laboratory Co., Ltd. Separation apparatus for thin film stacked body
CN105060000B (en) * 2015-07-22 2016-10-12 昆山杰士德精密工业有限公司 VHB gum sheet stock dyestripping mechanism
CN105437724B (en) * 2015-12-29 2017-07-04 广州达意隆包装机械股份有限公司 Automatically gum film device is torn
JP6644578B2 (en) * 2016-02-17 2020-02-12 日東電工株式会社 Optical film transport and recovery apparatus, optical film manufacturing system, and optical film transport and recovery method
WO2017164294A1 (en) * 2016-03-23 2017-09-28 株式会社新川 Detachment device
CN107686007B (en) * 2017-08-16 2019-08-20 武汉华星光电半导体显示技术有限公司 Glass substrate separation method and glass substrate separator
US10374161B2 (en) 2017-08-16 2019-08-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Glass substrate separation method and glass substrate separation device
CN108231637A (en) * 2017-12-19 2018-06-29 南京联信自动化科技有限公司 A kind of continuous feeding device of automatic laminating machine
CN108257906B (en) * 2018-01-16 2021-05-04 京东方科技集团股份有限公司 Air blowing device, adsorption machine table and flexible substrate bearing system
JP7020189B2 (en) * 2018-03-02 2022-02-16 トヨタ自動車株式会社 Film transfer device, film transfer method, and film pasting device
CN108697005A (en) * 2018-06-12 2018-10-23 欣兴同泰科技(昆山)有限公司 A kind of automatic vacation of cover film picks
CN109263243B (en) * 2018-11-23 2020-09-11 东莞华贝电子科技有限公司 Tear type paper device and have its tear type paper equipment that leaves
JP6916223B2 (en) * 2019-01-30 2021-08-11 日機装株式会社 Peeling device
CN110356907B (en) * 2019-07-22 2023-09-01 深圳市信宇人科技股份有限公司 Method and system for continuous sheet production and feeding of hydrogen fuel cell CCM membrane electrodes
JP7149238B2 (en) * 2019-08-09 2022-10-06 Towa株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
KR102256369B1 (en) * 2019-09-11 2021-05-27 주식회사 디에이테크놀로지 Picking-up And Placing Apparatus And Method for Manufacturing Cell Stack of Secondary Battery
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KR102661995B1 (en) * 2020-07-14 2024-05-02 주식회사 엘지에너지솔루션 Apparatus for removing tape
CN111846477B (en) * 2020-07-31 2024-12-06 北京兆维电子(集团)有限责任公司 Automatic labeling machine
CN112008962B (en) * 2020-09-23 2022-02-15 江苏创源电子有限公司 Automatic pad pasting equipment of CVL
CN113879641B (en) * 2021-09-30 2023-09-29 歌尔股份有限公司 Film stripping equipment for sheet materials
CN114032044A (en) * 2021-11-16 2022-02-11 东莞市金恒晟新材料科技有限公司 Alcohol-resistant release film
CN115816979A (en) * 2022-03-01 2023-03-21 思恩半导体科技(苏州)有限公司 Film tearing method and device for flexible base material
CN115231349A (en) * 2022-07-21 2022-10-25 东莞市硅翔绝缘材料有限公司 A device and method for precise lamination of long board cover films to ensure the consistency of expansion and contraction
CN115231306B (en) * 2022-09-19 2022-12-02 常州皓之鼎高分子材料有限公司 Feeding process and device for environment-friendly anti-static foam cutting machine
CN115602860B (en) * 2022-12-12 2023-03-10 山东华滋自动化技术股份有限公司 Membrane electrode gasket laminating equipment and laminating process thereof
CN115636279B (en) * 2022-12-23 2023-04-07 北京环都拓普空调有限公司 Stripping device for sheet material
CN115903291B (en) * 2023-03-14 2023-05-23 江苏瑞恩新材料有限公司 Adhesive tape release film stripping device
CN119581371B (en) * 2024-11-27 2025-10-10 江苏盘古半导体科技股份有限公司 A device for layering multi-layer products

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000095430A (en) * 1998-09-18 2000-04-04 Ricoh Co Ltd Wet image transfer device
JP3629194B2 (en) * 2000-09-27 2005-03-16 株式会社 日立インダストリイズ Film sticking method

Also Published As

Publication number Publication date
TWI298992B (en) 2008-07-11
CN1948004A (en) 2007-04-18
JP2007106531A (en) 2007-04-26
CN1948004B (en) 2012-04-04
JP4524241B2 (en) 2010-08-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees