[go: up one dir, main page]

TW200715426A - Device and method for picking up semiconductor chip - Google Patents

Device and method for picking up semiconductor chip

Info

Publication number
TW200715426A
TW200715426A TW095130646A TW95130646A TW200715426A TW 200715426 A TW200715426 A TW 200715426A TW 095130646 A TW095130646 A TW 095130646A TW 95130646 A TW95130646 A TW 95130646A TW 200715426 A TW200715426 A TW 200715426A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
adhesive sheet
tacky adhesive
picking
picked
Prior art date
Application number
TW095130646A
Other languages
Chinese (zh)
Other versions
TWI396241B (en
Inventor
Makoto Ohta
Noriaki Konishi
Yasuo Iwaki
Koichi Shiga
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200715426A publication Critical patent/TW200715426A/en
Application granted granted Critical
Publication of TWI396241B publication Critical patent/TWI396241B/en

Links

Classifications

    • H10P72/0428—
    • H10P72/0446—
    • H10P72/0442—
    • H10P72/78—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

A device for picking up a semiconductor chip stuck on a tacky adhesive sheet. The device comprises a backup body (1) having an upper surface formed on the sucking surface of the tacky adhesive sheet (2) holdingly sucking the peripheral portion of the semiconductor chip (3) to be picked up, a push-up shaft (23) vertically drivingly installed in the backup body and having a lower suction nozzle body (27) pressing the portion of the tacky adhesive sheet where the semiconductor chip to be picked up is stuck to push up the semiconductor chip from the upper surface of the backup body, and a suction nozzle body (4) suckingly holding the upper surface of the semiconductor chip to be picked up to pick up the semiconductor chip pushed up by the push-up shaft from the tacky adhesive sheet.
TW095130646A 2005-08-31 2006-08-21 A semiconductor wafer picking device TWI396241B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005251229 2005-08-31

Publications (2)

Publication Number Publication Date
TW200715426A true TW200715426A (en) 2007-04-16
TWI396241B TWI396241B (en) 2013-05-11

Family

ID=37808599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130646A TWI396241B (en) 2005-08-31 2006-08-21 A semiconductor wafer picking device

Country Status (5)

Country Link
JP (1) JP5201990B2 (en)
KR (1) KR100990418B1 (en)
CN (1) CN100565831C (en)
TW (1) TWI396241B (en)
WO (1) WO2007026497A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI768321B (en) * 2019-04-19 2022-06-21 南韓商細美事有限公司 Die ejector and apparatus for picking up dies including the same
TWI844024B (en) * 2021-07-22 2024-06-01 韓商细美事有限公司 Die ejection device and die binding equipment having the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5227117B2 (en) * 2008-08-29 2013-07-03 芝浦メカトロニクス株式会社 Semiconductor chip pickup device and pickup method
JP5107408B2 (en) * 2010-08-31 2012-12-26 東京エレクトロン株式会社 Pickup method and pickup device
CN103369942B (en) * 2012-03-28 2017-08-18 富泰华工业（深圳）有限公司 Fetching device
JP2014011416A (en) * 2012-07-03 2014-01-20 Panasonic Corp Pickup device and method for semiconductor chip
JP6368407B2 (en) * 2016-08-04 2018-08-01 日本ファインテック株式会社 Chip peeling apparatus and chip peeling method
KR102635493B1 (en) * 2020-11-04 2024-02-07 세메스 주식회사 Apparatus for transferring die in bonding equipment and method thereof
CN119581385B (en) * 2025-02-08 2025-06-03 微见智能封装技术(深圳)有限公司 A head binding assembly, eutectic equipment and chip mounting method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3613838B2 (en) * 1995-05-18 2005-01-26 株式会社デンソー Manufacturing method of semiconductor device
JP3209736B2 (en) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 Pellet pickup device
JP3748375B2 (en) * 2000-11-24 2006-02-22 シャープ株式会社 Semiconductor chip pickup device
JP3945632B2 (en) * 2002-02-06 2007-07-18 シャープ株式会社 Chip pickup device, manufacturing method thereof, and semiconductor manufacturing device
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
JP2004186352A (en) * 2002-12-03 2004-07-02 Renesas Technology Corp Semiconductor device and its manufacturing method
JP4230178B2 (en) * 2002-07-03 2009-02-25 富士通マイクロエレクトロニクス株式会社 Semiconductor chip peeling apparatus and method
JP2004259811A (en) * 2003-02-25 2004-09-16 Shinkawa Ltd Die pick-up method and device
JP4574251B2 (en) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI768321B (en) * 2019-04-19 2022-06-21 南韓商細美事有限公司 Die ejector and apparatus for picking up dies including the same
TWI844024B (en) * 2021-07-22 2024-06-01 韓商细美事有限公司 Die ejection device and die binding equipment having the same
US12381099B2 (en) 2021-07-22 2025-08-05 Semes Co., Ltd. Die ejecting apparatus for bonding equipment

Also Published As

Publication number Publication date
TWI396241B (en) 2013-05-11
KR20080039444A (en) 2008-05-07
KR100990418B1 (en) 2010-10-29
JP5201990B2 (en) 2013-06-05
WO2007026497A1 (en) 2007-03-08
CN101253613A (en) 2008-08-27
CN100565831C (en) 2009-12-02
JPWO2007026497A1 (en) 2009-03-26

Similar Documents

Publication Publication Date Title
WO2004008499A8 (en) Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
TW200514178A (en) Apparatus and method for removing semiconductor chip and apparatus for feeding semiconductor chips
KR101596461B1 (en) Apparatus and Method for Chip Detaching
TW569355B (en) Ablation means for adhesive tape, ablation device for adhesive tape, ablation method for adhesive tape, pick-up device for semiconductor chip, pick-up method for semiconductor chips, manufacturing method and device for semiconductor device
WO2008129976A1 (en) Method for manufacturing chip with adhesive
EP1864922A3 (en) Method for removing the top plastic board from a stack and device for removing the top plastic board
KR100996151B1 (en) Pick-up device and pick-up method of semiconductor die
TW200715426A (en) Device and method for picking up semiconductor chip
MY139597A (en) Film peeling method and film peeling device
EP1548821A3 (en) Dicing die-bonding film
MY160284A (en) Adhesive, adhesive sheet, and process for producing electronic components
EP1983575A3 (en) Method for manufacturing bonded substrate
EP1884889A3 (en) Semiconductor device
CN1948004A (en) Sticking device and method of sheet style thin film
WO2009072388A1 (en) Socket
KR20050059996A (en) Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same
KR20140015851A (en) Chip ejector and chip removal method using the same
MY147978A (en) Wafer cutting method
EP1840941A3 (en) Semiconductor device and manufacturing method thereof
JP2010212509A5 (en)
MY139253A (en) Apparatus for mounting of semi-conductor chips and method for stripping of a semi-conductor chip from a film
TW594297B (en) Substrate assembling device
CN103377974B (en) Method and device for peeling, picking and placing crystal grains
TW200725759A (en) Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method
WO2011138684A3 (en) Pick and bond method and apparatus for transferring adhesive element to substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees