TW200703710A - Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them - Google Patents
Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making themInfo
- Publication number
- TW200703710A TW200703710A TW094126795A TW94126795A TW200703710A TW 200703710 A TW200703710 A TW 200703710A TW 094126795 A TW094126795 A TW 094126795A TW 94126795 A TW94126795 A TW 94126795A TW 200703710 A TW200703710 A TW 200703710A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- led
- making
- monolayer
- white light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/5363—
-
- H10W72/5524—
-
- H10W72/884—
-
- H10W90/753—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
Abstract
In accordance with the invention, an illumination device comprises a substrate having a surface and a cavity in the surface. At least one light emitting diode ("LED") is mounted within the cavity, and a monolayer comprising phosphor particles overlies the LED. The phosphor monolayer is adhered to the LED by a monolayer of transparent adhesive material. An optional optical thick layer of transparent material overlies the phosphor monolayer to encapsulate the LED and optionally to form a lens. Methods and apparatus for efficiently making the devices are disclosed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2005/023360 WO2007005013A1 (en) | 2005-07-01 | 2005-07-01 | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200703710A true TW200703710A (en) | 2007-01-16 |
Family
ID=37604765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094126795A TW200703710A (en) | 2005-07-01 | 2005-08-08 | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1899435A4 (en) |
| JP (1) | JP2008545269A (en) |
| KR (1) | KR101203672B1 (en) |
| TW (1) | TW200703710A (en) |
| WO (1) | WO2007005013A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8253149B2 (en) | 2008-01-17 | 2012-08-28 | Foxsemicon Integrated Technology, Inc. | Light emitting diode device |
| CN102714263A (en) * | 2010-02-25 | 2012-10-03 | 韩国莱太柘晶电株式会社 | Light emitting diode and method for manufacturing same |
| US8680550B2 (en) | 2008-07-03 | 2014-03-25 | Samsung Electronics Co., Ltd. | Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip |
| CN105990496A (en) * | 2015-03-04 | 2016-10-05 | 光宝光电(常州)有限公司 | LED package structure and manufacturing method thereof |
| TWI570950B (en) * | 2008-07-01 | 2017-02-11 | 皇家飛利浦有限公司 | Closed proximity collimator of light-emitting diode |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5141077B2 (en) * | 2007-04-03 | 2013-02-13 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| DE102007017855A1 (en) * | 2007-04-16 | 2008-10-23 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component and optoelectronic component |
| TWI508331B (en) | 2008-11-13 | 2015-11-11 | Maven Optronics Corp | System and method for forming a thin film phosphor layer of a fluorescent conversion type light-emitting element, and a thin film fluorescent layer for a fluorescent conversion type light-emitting element |
| US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
| US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| TWI381556B (en) * | 2009-03-20 | 2013-01-01 | 億光電子工業股份有限公司 | Light-emitting diode package structure and manufacturing method thereof |
| DE102009022682A1 (en) * | 2009-05-26 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Method for producing a light-emitting diode |
| US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
| US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
| US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
| JP5380182B2 (en) | 2009-07-03 | 2014-01-08 | パナソニック株式会社 | Light emitting device, surface light source, and liquid crystal display device |
| WO2011115515A1 (en) * | 2010-03-16 | 2011-09-22 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Method for controlling the chromaticity of a light flow from a white led and device for implementing said method |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
| GB2484332A (en) * | 2010-10-07 | 2012-04-11 | Power Data Comm Co Ltd | LED encapsulation process and shield structure made thereby |
| US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
| DE102011009369A1 (en) * | 2011-01-25 | 2012-07-26 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for its production |
| TW201251140A (en) | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| WO2012109225A1 (en) * | 2011-02-07 | 2012-08-16 | Cree, Inc. | Components and methods for light emitting diode (led) lighting |
| US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| WO2013112435A1 (en) | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
| WO2013121051A1 (en) * | 2012-02-16 | 2013-08-22 | University College Cork, National University Of Ireland, Cork | Micro -led array with filters |
| US9644817B2 (en) * | 2013-02-09 | 2017-05-09 | Hisham Menkara | Phosphor sheets |
| CZ2013301A3 (en) | 2013-04-22 | 2014-07-16 | Crytur Spol. S R. O. | White light emitting diode with monocrystalline luminophore and production method |
| CN110350069B (en) * | 2013-07-24 | 2023-06-30 | 晶元光电股份有限公司 | Light emitting die including wavelength conversion material and method of making same |
| WO2015119858A1 (en) | 2014-02-05 | 2015-08-13 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| CZ307024B6 (en) * | 2014-05-05 | 2017-11-22 | Crytur, Spol.S R.O. | A light source |
| JP6288061B2 (en) * | 2015-12-10 | 2018-03-07 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
| JP6508368B2 (en) * | 2018-02-07 | 2019-05-08 | 日亜化学工業株式会社 | Light emitting device |
| US11362243B2 (en) * | 2019-10-09 | 2022-06-14 | Lumileds Llc | Optical coupling layer to improve output flux in LEDs |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6193908B1 (en) * | 1997-02-24 | 2001-02-27 | Superior Micropowders Llc | Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| JP3282176B2 (en) * | 1997-07-14 | 2002-05-13 | 日亜化学工業株式会社 | Method of forming light emitting diode |
| JP2001127346A (en) | 1999-10-22 | 2001-05-11 | Stanley Electric Co Ltd | Light emitting diode |
| JP3640153B2 (en) * | 1999-11-18 | 2005-04-20 | 松下電工株式会社 | Illumination light source |
| DE10010638A1 (en) * | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Making light emitting semiconducting body with luminescence conversion element involves applying suspension with solvent, adhesive, luminescent material |
| MY131962A (en) * | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| US6576488B2 (en) * | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
| JP4450547B2 (en) * | 2002-08-29 | 2010-04-14 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
| US20040166234A1 (en) * | 2003-02-26 | 2004-08-26 | Chua Bee Yin Janet | Apparatus and method for coating a light source to provide a modified output spectrum |
| US20040188696A1 (en) * | 2003-03-28 | 2004-09-30 | Gelcore, Llc | LED power package |
| US6831302B2 (en) * | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
| JP2005136006A (en) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Works Ltd | Light-emitting device and producing device using it |
-
2005
- 2005-07-01 JP JP2008519247A patent/JP2008545269A/en active Pending
- 2005-07-01 KR KR1020087002836A patent/KR101203672B1/en not_active Expired - Fee Related
- 2005-07-01 EP EP05769328A patent/EP1899435A4/en not_active Withdrawn
- 2005-07-01 WO PCT/US2005/023360 patent/WO2007005013A1/en not_active Ceased
- 2005-08-08 TW TW094126795A patent/TW200703710A/en unknown
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8253149B2 (en) | 2008-01-17 | 2012-08-28 | Foxsemicon Integrated Technology, Inc. | Light emitting diode device |
| TWI570950B (en) * | 2008-07-01 | 2017-02-11 | 皇家飛利浦有限公司 | Closed proximity collimator of light-emitting diode |
| US8680550B2 (en) | 2008-07-03 | 2014-03-25 | Samsung Electronics Co., Ltd. | Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip |
| US8963187B2 (en) | 2008-07-03 | 2015-02-24 | Samsung Electronics Co., Ltd. | Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip |
| TWI499076B (en) * | 2008-07-03 | 2015-09-01 | 三星電子股份有限公司 | Wavelength-converting LED chip and light-emitting device including the same |
| US9287470B2 (en) | 2008-07-03 | 2016-03-15 | Samsung Electronics Co., Ltd. | Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip |
| CN102714263A (en) * | 2010-02-25 | 2012-10-03 | 韩国莱太柘晶电株式会社 | Light emitting diode and method for manufacturing same |
| CN102714263B (en) * | 2010-02-25 | 2015-11-25 | 韩国莱太柘晶电株式会社 | Light-emitting diode and manufacture method thereof |
| CN105990496A (en) * | 2015-03-04 | 2016-10-05 | 光宝光电(常州)有限公司 | LED package structure and manufacturing method thereof |
| CN105990496B (en) * | 2015-03-04 | 2018-11-16 | 光宝光电(常州)有限公司 | LED encapsulation structure and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101203672B1 (en) | 2012-11-23 |
| EP1899435A4 (en) | 2010-06-02 |
| KR20080090379A (en) | 2008-10-08 |
| WO2007005013A1 (en) | 2007-01-11 |
| EP1899435A1 (en) | 2008-03-19 |
| JP2008545269A (en) | 2008-12-11 |
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