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TW200703710A - Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them - Google Patents

Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them

Info

Publication number
TW200703710A
TW200703710A TW094126795A TW94126795A TW200703710A TW 200703710 A TW200703710 A TW 200703710A TW 094126795 A TW094126795 A TW 094126795A TW 94126795 A TW94126795 A TW 94126795A TW 200703710 A TW200703710 A TW 200703710A
Authority
TW
Taiwan
Prior art keywords
light emitting
led
making
monolayer
white light
Prior art date
Application number
TW094126795A
Other languages
Chinese (zh)
Inventor
Greg E Blonder
Edmar M Amaya
Original Assignee
Lamina Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lamina Ceramics Inc filed Critical Lamina Ceramics Inc
Publication of TW200703710A publication Critical patent/TW200703710A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8515Wavelength conversion means not being in contact with the bodies
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774Aluminates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W72/01515
    • H10W72/075
    • H10W72/5363
    • H10W72/5524
    • H10W72/884
    • H10W90/753
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)

Abstract

In accordance with the invention, an illumination device comprises a substrate having a surface and a cavity in the surface. At least one light emitting diode ("LED") is mounted within the cavity, and a monolayer comprising phosphor particles overlies the LED. The phosphor monolayer is adhered to the LED by a monolayer of transparent adhesive material. An optional optical thick layer of transparent material overlies the phosphor monolayer to encapsulate the LED and optionally to form a lens. Methods and apparatus for efficiently making the devices are disclosed.
TW094126795A 2005-07-01 2005-08-08 Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them TW200703710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2005/023360 WO2007005013A1 (en) 2005-07-01 2005-07-01 Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them

Publications (1)

Publication Number Publication Date
TW200703710A true TW200703710A (en) 2007-01-16

Family

ID=37604765

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126795A TW200703710A (en) 2005-07-01 2005-08-08 Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them

Country Status (5)

Country Link
EP (1) EP1899435A4 (en)
JP (1) JP2008545269A (en)
KR (1) KR101203672B1 (en)
TW (1) TW200703710A (en)
WO (1) WO2007005013A1 (en)

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US8253149B2 (en) 2008-01-17 2012-08-28 Foxsemicon Integrated Technology, Inc. Light emitting diode device
CN102714263A (en) * 2010-02-25 2012-10-03 韩国莱太柘晶电株式会社 Light emitting diode and method for manufacturing same
US8680550B2 (en) 2008-07-03 2014-03-25 Samsung Electronics Co., Ltd. Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
CN105990496A (en) * 2015-03-04 2016-10-05 光宝光电(常州)有限公司 LED package structure and manufacturing method thereof
TWI570950B (en) * 2008-07-01 2017-02-11 皇家飛利浦有限公司 Closed proximity collimator of light-emitting diode

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JP5141077B2 (en) * 2007-04-03 2013-02-13 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
DE102007017855A1 (en) * 2007-04-16 2008-10-23 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and optoelectronic component
TWI508331B (en) 2008-11-13 2015-11-11 Maven Optronics Corp System and method for forming a thin film phosphor layer of a fluorescent conversion type light-emitting element, and a thin film fluorescent layer for a fluorescent conversion type light-emitting element
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
TWI381556B (en) * 2009-03-20 2013-01-01 億光電子工業股份有限公司 Light-emitting diode package structure and manufacturing method thereof
DE102009022682A1 (en) * 2009-05-26 2010-12-02 Osram Opto Semiconductors Gmbh Method for producing a light-emitting diode
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
JP5380182B2 (en) 2009-07-03 2014-01-08 パナソニック株式会社 Light emitting device, surface light source, and liquid crystal display device
WO2011115515A1 (en) * 2010-03-16 2011-09-22 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for controlling the chromaticity of a light flow from a white led and device for implementing said method
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
GB2484332A (en) * 2010-10-07 2012-04-11 Power Data Comm Co Ltd LED encapsulation process and shield structure made thereby
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
DE102011009369A1 (en) * 2011-01-25 2012-07-26 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for its production
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
WO2012109225A1 (en) * 2011-02-07 2012-08-16 Cree, Inc. Components and methods for light emitting diode (led) lighting
US8907362B2 (en) 2012-01-24 2014-12-09 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
WO2013112435A1 (en) 2012-01-24 2013-08-01 Cooledge Lighting Inc. Light - emitting devices having discrete phosphor chips and fabrication methods
WO2013121051A1 (en) * 2012-02-16 2013-08-22 University College Cork, National University Of Ireland, Cork Micro -led array with filters
US9644817B2 (en) * 2013-02-09 2017-05-09 Hisham Menkara Phosphor sheets
CZ2013301A3 (en) 2013-04-22 2014-07-16 Crytur Spol. S R. O. White light emitting diode with monocrystalline luminophore and production method
CN110350069B (en) * 2013-07-24 2023-06-30 晶元光电股份有限公司 Light emitting die including wavelength conversion material and method of making same
WO2015119858A1 (en) 2014-02-05 2015-08-13 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
CZ307024B6 (en) * 2014-05-05 2017-11-22 Crytur, Spol.S R.O. A light source
JP6288061B2 (en) * 2015-12-10 2018-03-07 日亜化学工業株式会社 Method for manufacturing light emitting device
JP6508368B2 (en) * 2018-02-07 2019-05-08 日亜化学工業株式会社 Light emitting device
US11362243B2 (en) * 2019-10-09 2022-06-14 Lumileds Llc Optical coupling layer to improve output flux in LEDs

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US6193908B1 (en) * 1997-02-24 2001-02-27 Superior Micropowders Llc Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
JP3282176B2 (en) * 1997-07-14 2002-05-13 日亜化学工業株式会社 Method of forming light emitting diode
JP2001127346A (en) 1999-10-22 2001-05-11 Stanley Electric Co Ltd Light emitting diode
JP3640153B2 (en) * 1999-11-18 2005-04-20 松下電工株式会社 Illumination light source
DE10010638A1 (en) * 2000-03-03 2001-09-13 Osram Opto Semiconductors Gmbh Making light emitting semiconducting body with luminescence conversion element involves applying suspension with solvent, adhesive, luminescent material
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
JP4450547B2 (en) * 2002-08-29 2010-04-14 日亜化学工業株式会社 Method for manufacturing light emitting device
US20040166234A1 (en) * 2003-02-26 2004-08-26 Chua Bee Yin Janet Apparatus and method for coating a light source to provide a modified output spectrum
US20040188696A1 (en) * 2003-03-28 2004-09-30 Gelcore, Llc LED power package
US6831302B2 (en) * 2003-04-15 2004-12-14 Luminus Devices, Inc. Light emitting devices with improved extraction efficiency
JP2005136006A (en) * 2003-10-28 2005-05-26 Matsushita Electric Works Ltd Light-emitting device and producing device using it

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8253149B2 (en) 2008-01-17 2012-08-28 Foxsemicon Integrated Technology, Inc. Light emitting diode device
TWI570950B (en) * 2008-07-01 2017-02-11 皇家飛利浦有限公司 Closed proximity collimator of light-emitting diode
US8680550B2 (en) 2008-07-03 2014-03-25 Samsung Electronics Co., Ltd. Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
US8963187B2 (en) 2008-07-03 2015-02-24 Samsung Electronics Co., Ltd. Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
TWI499076B (en) * 2008-07-03 2015-09-01 三星電子股份有限公司 Wavelength-converting LED chip and light-emitting device including the same
US9287470B2 (en) 2008-07-03 2016-03-15 Samsung Electronics Co., Ltd. Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
CN102714263A (en) * 2010-02-25 2012-10-03 韩国莱太柘晶电株式会社 Light emitting diode and method for manufacturing same
CN102714263B (en) * 2010-02-25 2015-11-25 韩国莱太柘晶电株式会社 Light-emitting diode and manufacture method thereof
CN105990496A (en) * 2015-03-04 2016-10-05 光宝光电(常州)有限公司 LED package structure and manufacturing method thereof
CN105990496B (en) * 2015-03-04 2018-11-16 光宝光电(常州)有限公司 LED encapsulation structure and its manufacturing method

Also Published As

Publication number Publication date
KR101203672B1 (en) 2012-11-23
EP1899435A4 (en) 2010-06-02
KR20080090379A (en) 2008-10-08
WO2007005013A1 (en) 2007-01-11
EP1899435A1 (en) 2008-03-19
JP2008545269A (en) 2008-12-11

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