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TW200708218A - Process for producing junction structure - Google Patents

Process for producing junction structure

Info

Publication number
TW200708218A
TW200708218A TW095127332A TW95127332A TW200708218A TW 200708218 A TW200708218 A TW 200708218A TW 095127332 A TW095127332 A TW 095127332A TW 95127332 A TW95127332 A TW 95127332A TW 200708218 A TW200708218 A TW 200708218A
Authority
TW
Taiwan
Prior art keywords
electrode
circuit member
adhesive
junction structure
cure
Prior art date
Application number
TW095127332A
Other languages
Chinese (zh)
Inventor
Motohiro Arifuku
Kouji Kobayashi
Yasushi Gotou
Tooru Fujinawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200708218A publication Critical patent/TW200708218A/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H10W72/073—
    • H10W72/07331—
    • H10W72/354—
    • H10W72/90—
    • H10W72/9415—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Liquid Crystal (AREA)

Abstract

This invention provides a process for producing a junction structure. In the process, an adhesive (20) is temporarily bonded onto a first circuit member comprising a first electrode (13) provided on a first substrate (12). A second circuit member (30) comprising a second electrode (32) provided on a second substrate is disposed on the first circuit member so that the first electrode (13) faces the second electrode (32) through the adhesive (20). The second circuit member (30) is heated under pressure in the direction of connection between the first electrode (13) and the second electrode (32) to cure the adhesive (20) interposed between the first electrode (13) and the second electrode (32). An energy wave (51) is applied to an uncured part (23) in the adhesive stuck out from the outer periphery of the second circuit member (30) to cure this part (23).
TW095127332A 2005-08-04 2006-07-26 Process for producing junction structure TW200708218A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005226090 2005-08-04

Publications (1)

Publication Number Publication Date
TW200708218A true TW200708218A (en) 2007-02-16

Family

ID=37708646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127332A TW200708218A (en) 2005-08-04 2006-07-26 Process for producing junction structure

Country Status (5)

Country Link
JP (1) JPWO2007015367A1 (en)
KR (1) KR20080031311A (en)
CN (1) CN101233608B (en)
TW (1) TW200708218A (en)
WO (1) WO2007015367A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5144102B2 (en) * 2007-03-30 2013-02-13 京セラディスプレイ株式会社 Method of mounting electronic circuit on substrate
CN101923414B (en) * 2010-08-13 2012-07-25 友达光电股份有限公司 Method for manufacturing electronic device
KR102078019B1 (en) * 2012-11-28 2020-02-18 엘지디스플레이 주식회사 Display device including hydrophobic adhesive means and bonding method for drive IC on panel using hydrophobic adhesive means
CN104794096A (en) * 2015-01-21 2015-07-22 李振华 Personal work system capable of being dynamically combined and adjusted
CN108901144A (en) * 2018-07-17 2018-11-27 天津瑞爱恩科技有限公司 Enhance the method for printed wiring board rigid-flex combined strength
CN112327128B (en) * 2020-11-06 2021-05-14 法特迪精密科技（苏州）有限公司 A test device and test method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153896A (en) * 1993-11-29 1995-06-16 Toshiba Corp Resin-sealed semiconductor device and manufacturing method thereof
JP2001156114A (en) * 1999-09-14 2001-06-08 Sony Chem Corp Anisotropic conductive connector and manufacturing method

Also Published As

Publication number Publication date
CN101233608A (en) 2008-07-30
KR20080031311A (en) 2008-04-08
CN101233608B (en) 2011-02-02
JPWO2007015367A1 (en) 2009-02-19
WO2007015367A1 (en) 2007-02-08

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