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TW200707507A - Substrate process for embedded component - Google Patents

Substrate process for embedded component

Info

Publication number
TW200707507A
TW200707507A TW094126672A TW94126672A TW200707507A TW 200707507 A TW200707507 A TW 200707507A TW 094126672 A TW094126672 A TW 094126672A TW 94126672 A TW94126672 A TW 94126672A TW 200707507 A TW200707507 A TW 200707507A
Authority
TW
Taiwan
Prior art keywords
embedded component
layer
embedded
substrate process
core layer
Prior art date
Application number
TW094126672A
Other languages
Chinese (zh)
Other versions
TWI264051B (en
Inventor
Ching-Fu Horng
Wu-Chou Hsu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94126672A priority Critical patent/TWI264051B/en
Application granted granted Critical
Publication of TWI264051B publication Critical patent/TWI264051B/en
Publication of TW200707507A publication Critical patent/TW200707507A/en

Links

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A substrate process for embedded component is provided. First, a first metal layer and an embedded component are provided. The first metal layer has at least a bump correspondingly connected with the embedded component. Next, the embedded component is placed into an embedded hole of a core layer, and the first layer is stack up the core layer. In addition, the first metal layer is patterned to form a circuit layer, and the embedded component is electrically connected to the circuit layer. Wherein, the core layer has at least a semi-solid dielectric layer for filling with the embedded hole in the laminating process. Therefore, the core layer can be connected with the embedded component well.
TW94126672A 2005-08-08 2005-08-08 Substrate process for embedded component TWI264051B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94126672A TWI264051B (en) 2005-08-08 2005-08-08 Substrate process for embedded component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94126672A TWI264051B (en) 2005-08-08 2005-08-08 Substrate process for embedded component

Publications (2)

Publication Number Publication Date
TWI264051B TWI264051B (en) 2006-10-11
TW200707507A true TW200707507A (en) 2007-02-16

Family

ID=37967247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94126672A TWI264051B (en) 2005-08-08 2005-08-08 Substrate process for embedded component

Country Status (1)

Country Link
TW (1) TWI264051B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672079B (en) * 2018-03-20 2019-09-11 Unimicron Technology Corp. Embedded component structure and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584711B (en) * 2010-03-16 2017-05-21 Unitech Printed Circuit Board Corp A multi - layer circuit board manufacturing method for embedded electronic components
TWI580330B (en) * 2010-03-16 2017-04-21 Unitech Printed Circuit Board Corp A multi - layer circuit board manufacturing method for embedded electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672079B (en) * 2018-03-20 2019-09-11 Unimicron Technology Corp. Embedded component structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI264051B (en) 2006-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees