TW200706599A - Room temperature curable organopolysiloxane composition - Google Patents
Room temperature curable organopolysiloxane compositionInfo
- Publication number
- TW200706599A TW200706599A TW095116595A TW95116595A TW200706599A TW 200706599 A TW200706599 A TW 200706599A TW 095116595 A TW095116595 A TW 095116595A TW 95116595 A TW95116595 A TW 95116595A TW 200706599 A TW200706599 A TW 200706599A
- Authority
- TW
- Taiwan
- Prior art keywords
- room temperature
- temperature curable
- curable organopolysiloxane
- organopolysiloxane composition
- pts
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 title abstract 3
- 239000000413 hydrolysate Substances 0.000 abstract 2
- 229910000077 silane Inorganic materials 0.000 abstract 2
- -1 silane compound Chemical class 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 150000002430 hydrocarbons Chemical group 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 238000004383 yellowing Methods 0.000 abstract 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
To provide a room temperature curable organopolysiloxane composition without getting a yellowing color change of the composition over time between before and after the curing, and suitable as a sealing material for construction and a material used for the bonding or sealing of electric/electronic parts. This room temperature curable organopolysiloxane composition having the little color change is characterized by comprising (A) 100 pts.mass diorganopolysiloxane of which molecular terminals are blocked by hydroxy, an alkoxy or an alkenoxy group, (B) 0.5-30 pts.mass silane compound having a group expressed by general formula (1) [wherein, R1, R2 are each H or a substituted or non-substituted monovalent hydrocarbon group] or its partial hydrolysate and (C) 0.1-30 pts.mass silane compound other than the (B) component, without containing a primary amine group in its molecule, or its partial hydrolysate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005141166A JP4821958B2 (en) | 2005-05-13 | 2005-05-13 | Room temperature curable organopolysiloxane composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200706599A true TW200706599A (en) | 2007-02-16 |
| TWI389981B TWI389981B (en) | 2013-03-21 |
Family
ID=37537138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95116595A TWI389981B (en) | 2005-05-13 | 2006-05-10 | Room temperature hardened organopolysiloxane composition |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4821958B2 (en) |
| CN (1) | CN1952001B (en) |
| TW (1) | TWI389981B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5062430B2 (en) * | 2007-04-12 | 2012-10-31 | 信越化学工業株式会社 | Room temperature fast-curing organopolysiloxane composition and curing method thereof |
| JP4840602B2 (en) * | 2007-09-21 | 2011-12-21 | 信越化学工業株式会社 | Method for curing room temperature curable organopolysiloxane composition |
| EP2756211B1 (en) * | 2011-09-16 | 2019-04-24 | ELKEM SILICONES France SAS | Method and composition for sealing and assembling components of a power train |
| JP5644800B2 (en) * | 2012-03-29 | 2014-12-24 | 信越化学工業株式会社 | Two-component mixed organopolysiloxane composition |
| EP3135679B1 (en) * | 2014-04-25 | 2019-10-30 | Shin-Etsu Chemical Co., Ltd. | Use of bis (alkoxysilyl-vinylene) group-containing silicon compounds as a curing agent for room temperature curable organopolysiloxane compositions |
| EP3156458B1 (en) * | 2014-06-16 | 2019-06-26 | Shin-Etsu Chemical Co., Ltd. | Room-temperature-curable organopolysiloxane composition, and moulded product comprising cured product of said room-temperature-curable organopolysiloxane composition |
| JP6217584B2 (en) * | 2014-10-17 | 2017-10-25 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
| JP6699119B2 (en) * | 2015-01-22 | 2020-05-27 | 株式会社リコー | Element and power generator |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61209266A (en) * | 1985-03-13 | 1986-09-17 | Shin Etsu Chem Co Ltd | Room temperature curing organopolysiloxane composition |
| JPS62232459A (en) * | 1986-04-02 | 1987-10-12 | Shin Etsu Chem Co Ltd | Room temperature curable organopolysiloxane composition |
| JPH0686574B2 (en) * | 1989-02-03 | 1994-11-02 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
| JPH0841345A (en) * | 1994-08-03 | 1996-02-13 | Toshiba Silicone Co Ltd | Room temperature curable polyorganosiloxane composition |
| US6635353B2 (en) * | 2001-06-18 | 2003-10-21 | Vision-Ease Lens, Inc. | Aminosilane coating composition and process for producing coated articles |
| JP3748054B2 (en) * | 2001-06-28 | 2006-02-22 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
| JP4410452B2 (en) * | 2001-10-12 | 2010-02-03 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
-
2005
- 2005-05-13 JP JP2005141166A patent/JP4821958B2/en not_active Expired - Fee Related
-
2006
- 2006-05-10 TW TW95116595A patent/TWI389981B/en not_active IP Right Cessation
- 2006-05-12 CN CN2006101646350A patent/CN1952001B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1952001B (en) | 2011-01-19 |
| TWI389981B (en) | 2013-03-21 |
| JP4821958B2 (en) | 2011-11-24 |
| CN1952001A (en) | 2007-04-25 |
| JP2006316186A (en) | 2006-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |