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TW200704831A - Electroplating bath - Google Patents

Electroplating bath

Info

Publication number
TW200704831A
TW200704831A TW095107051A TW95107051A TW200704831A TW 200704831 A TW200704831 A TW 200704831A TW 095107051 A TW095107051 A TW 095107051A TW 95107051 A TW95107051 A TW 95107051A TW 200704831 A TW200704831 A TW 200704831A
Authority
TW
Taiwan
Prior art keywords
electroplating bath
polyanions
anode
electrolyte
acid
Prior art date
Application number
TW095107051A
Other languages
Chinese (zh)
Other versions
TWI332533B (en
Inventor
Ulrich Schmergel
Jean Rasmussen
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of TW200704831A publication Critical patent/TW200704831A/en
Application granted granted Critical
Publication of TWI332533B publication Critical patent/TWI332533B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)

Abstract

The invention relates to an electroplating bath, in particular an acid electroplating bath, comprising an anode, a cathode and an electrolyte. In order to improve a generic electroplating bath, the invention proposes that the anode is bi-phase or multiphase and that the electrolyte contains more than 70 mg/l chloride as well as 5 to 5000 mg/l, preferably 200 to 1200 mg/l of at least one element from the group comprising molybdenum, vanadium, zirconium, tantalum, tungsten, hafnium or titanium in form of anions or polyanions of their oxy-acids or cations of their acid anhydrides or their hetero-polyanions.
TW095107051A 2005-04-27 2006-03-02 Electroplating bath TWI332533B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05009183A EP1717351A1 (en) 2005-04-27 2005-04-27 Galvanic bath

Publications (2)

Publication Number Publication Date
TW200704831A true TW200704831A (en) 2007-02-01
TWI332533B TWI332533B (en) 2010-11-01

Family

ID=34935798

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107051A TWI332533B (en) 2005-04-27 2006-03-02 Electroplating bath

Country Status (6)

Country Link
US (1) US20060272951A1 (en)
EP (1) EP1717351A1 (en)
JP (1) JP4404871B2 (en)
KR (1) KR100741198B1 (en)
CN (1) CN1854352B (en)
TW (1) TWI332533B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1712660A1 (en) * 2005-04-12 2006-10-18 Enthone Inc. Insoluble anode
EP1803837B2 (en) 2005-11-25 2024-10-23 MacDermid Enthone Inc. Process for cleaning of processing solutions
EP1961842A1 (en) * 2007-02-22 2008-08-27 Atotech Deutschland Gmbh Device and method for the electrolytic plating of a metal
EP2009147A1 (en) * 2007-06-20 2008-12-31 METAKEM Gesellschaft für Schichtchemie der Metalle GmbH Anode assembly for electroplating
US8940158B2 (en) * 2009-02-13 2015-01-27 Chlorking, Inc. System and method for chlorine generation and distribution
KR101828394B1 (en) * 2010-09-23 2018-02-12 선파워 코포레이션 A method for making electroplated substrates
US8221600B2 (en) 2010-09-23 2012-07-17 Sunpower Corporation Sealed substrate carrier for electroplating
US8221601B2 (en) 2010-09-23 2012-07-17 Sunpower Corporation Maintainable substrate carrier for electroplating
US8317987B2 (en) 2010-09-23 2012-11-27 Sunpower Corporation Non-permeable substrate carrier for electroplating
US9006147B2 (en) * 2012-07-11 2015-04-14 Faraday Technology, Inc. Electrochemical system and method for electropolishing superconductive radio frequency cavities
CN104073862A (en) * 2014-07-11 2014-10-01 张钰 Insoluble anode device for alkaline zinc-nickel alloy electroplating
CN105887144B (en) * 2016-06-21 2018-09-21 广东光华科技股份有限公司 Copper electrolyte and its copper plating process is electroplated
DE102019202899B3 (en) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aqueous formulation for producing a layer of gold and silver

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607706A (en) * 1967-08-04 1971-09-21 Ionics Method of making stable laminated cation-exchange membranes
US3832296A (en) * 1972-08-07 1974-08-27 Kennecott Copper Corp Electrowinning cell and method with provision for electrolyte circulation
US3857683A (en) 1973-07-27 1974-12-31 Mica Corp Printed circuit board material incorporating binary alloys
US4138510A (en) * 1973-09-27 1979-02-06 Firma C. Conradty Metal anode for electrochemical processing and method of making same
US4033837A (en) * 1976-02-24 1977-07-05 Olin Corporation Plated metallic cathode
JPS5626554A (en) * 1979-08-10 1981-03-14 Asahi Chem Ind Co Ltd Improved cation exchange membrane
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
JPH01150000A (en) * 1987-12-07 1989-06-13 Nippon Steel Corp Insoluble anode for electroplating
US5378347A (en) 1993-05-19 1995-01-03 Learonal, Inc. Reducing tin sludge in acid tin plating
DE19545231A1 (en) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Process for the electrolytic deposition of metal layers
DE19653681C2 (en) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
DE19834353C2 (en) * 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkaline zinc-nickel bath
KR100366631B1 (en) * 2000-09-27 2003-01-09 삼성전자 주식회사 Electrolyte for copper plating comprising polyvinylpyrrolidone and electroplating method for copper wiring of semiconductor devices using the same
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US20040060728A1 (en) 2001-01-04 2004-04-01 Philippe Steiert Method for producing electroconductive structures
JP2003105584A (en) * 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co Copper plating solution for embedding fine wiring and copper plating method using the same
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
DE10261493A1 (en) 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode for electroplating
EP1712660A1 (en) * 2005-04-12 2006-10-18 Enthone Inc. Insoluble anode

Also Published As

Publication number Publication date
CN1854352B (en) 2010-09-22
CN1854352A (en) 2006-11-01
KR20060113344A (en) 2006-11-02
US20060272951A1 (en) 2006-12-07
KR100741198B1 (en) 2007-07-19
JP2006307344A (en) 2006-11-09
EP1717351A1 (en) 2006-11-02
TWI332533B (en) 2010-11-01
JP4404871B2 (en) 2010-01-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees